Chip packaging structure

Abstract

The utility model discloses a chip packaging structure which comprises a protective shell, the bottom of the protective shell is fixedly connected with a base plate, the center of the top of the base plate is provided with a carrying groove used for installing an integrated circuit device, the outer side of the protective shell is fixedly connected with a plurality of rows of telescopic hoses, the inner part of each telescopic hose is provided with a pin, and the pin is provided with a plurality of pins. The pins penetrate through the side wall of the protection shell, the tail end of each telescopic hose is fixedly connected with a protection strip, an opening is formed in the bottom of each protection strip, and the pins are located in the protection strips. According to the utility model, through the arrangement of the protective strip, the top of the pin can be protected, the pin is prevented from being abraded during use, soldering tin can flow into the pin through the soldering tin port, the pin is convenient to weld, meanwhile, the abrasion of the pin caused by welding is also reduced, and the telescopic hose is utilized, so that the service life of the pin is prolonged. According to the chip packaging structure, the pins can be conveniently bent while the pins are protected, and the practicability of the chip packaging structure is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip packaging, in particular to a chip packaging structure. Background Art

[0002] Chip packaging refers to the process of installing the chip on the chip package. The chip package is usually made of materials such as plastic, metal or ceramic. It can protect the chip from the external environment and provide a connection between the chip and the external circuit. The chip packaging process includes steps such as chip pasting, wire bonding, package molding and package testing. Chip packaging is an important link in the semiconductor industry, which directly affects the performance, reliability and cost of the chip.

[0003] In the prior art, Chinese patent CN220776153U discloses a multi-layer chip packaging structure, which belongs to the field of chip packaging, and includes a packaging bottom plate, an adhesive plate, and a circuit substrate; a connecting plate is fixedly provided on the bottom surface of the circuit substrate, and the adhesive plate is arranged at the bottom of the connecting plate, and the opposite surfaces of the connecting plate and the adhesive plate are arranged and fixed with heat dissipation teeth, and the gaps between the heat dissipation teeth are filled with thermal conductive glue, and the connecting plate and the adhesive plate are glued together by thermal conductive glue. The utility model increases the surface area by staggered heat dissipation teeth to improve its heat capacity, and the gaps are filled with thermal conductive glue, which can conduct and dissipate the heat accumulated in the heat dissipation teeth while assisting the connection, thereby improving the heat dissipation performance of the packaging structure.

[0004] However, the multi-layer chip packaging structure provided in the above technical solution still has many disadvantages in actual application. For example, there is no protection measure for the chip pins, which makes it easy to damage the chip pins during maintenance or manual welding, thereby affecting the stability of the chip connection. Utility Model Content

[0005] The purpose of this section is to summarize some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and utility model name of this application to avoid blurring the purpose of this section, specification abstract and utility model name, and such simplifications or omissions cannot be used to limit the scope of the utility model.

[0006] In order to solve the problem that the existing chip packaging structure proposed in the above background technology has no protection measures for the chip pins, which makes it easy to damage the chip pins during maintenance or manual welding, thereby affecting the stability of the chip connection, the utility model adopts the following technical solution.

[0007] A chip packaging structure includes a protective shell, the bottom of which is fixedly connected to a pad, and a loading slot for installing an integrated circuit device is provided in the center of the top of the pad, a plurality of rows of telescopic hoses are fixedly connected to the outside of the protective shell, each of which is provided with a pin inside, and the pin passes through the side wall of the protective shell, and the pin is fixedly connected to the protective shell, and the end of each telescopic hose is fixedly connected to a protective strip, the bottom of the protective strip is provided with an opening, and the pin is located inside the protective strip.

[0008] Preferably, a solder opening is provided at the top of the protection strip, a gap is provided between the pin and the protection strip for solder to flow through, and the bottom surface of the pin is flush with the bottom surface of the protection strip.

[0009] Preferably, a plurality of grooves are arranged on the top of the protective shell, the plurality of grooves are located on the top of the protective shell and are distributed in a grid pattern, and bumps are arranged between adjacent grooves, and the bumps and the protective shell form an integrated structure.

[0010] Preferably, a protective frame is fixedly connected to the outer side of the protective shell, the inner circle size of the protective frame matches the outer side size of the protective shell, and the protective frame is located above the telescopic hose.

[0011] Preferably, the interior of the protective frame is a hollow structure capable of accommodating cooling liquid, a liquid injection port is provided at the top of one side of the protective frame, and a sealing plug is threadedly connected to the liquid injection port of the protective frame.

[0012] Preferably, the bottom surface of the pad is flush with the bottom surface of the protective shell, and a plurality of rubber pads are fixedly connected to the bottom of the pad, and the plurality of rubber pads are evenly distributed in a ring shape about the vertical center line of the pad, and the vertical center line of the pad coincides with the vertical center line of the protective shell.

[0013] Preferably, the inside of the carrier slot is provided with adhesive, and the bottom surface of the adhesive is in contact with the bottom surface of the carrier slot, and the outside of the carrier slot is provided with a plurality of wiring grooves, and the positions of the plurality of wiring grooves correspond one-to-one to the positions of the plurality of pins.

[0014] Preferably, the vertical center lines of the protective shells of the multiple rows of telescopic hoses are evenly distributed in a ring shape, the plurality of pins are arranged in strips about four sides of the protective shell, and a seal is fixedly connected to the connection between the pad and the protective shell.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] The utility model can increase the contact area between the top of the protective shell and the outside world through the grooves and protrusions on the top of the protective shell, thereby further improving the heat dissipation capacity of the chip package, and can weld the chip package to the external circuit board through the pins. The provision of the protective strips can protect the tops of the pins to prevent wear on the pins during use. The solder opening can allow the solder to flow onto the pins, making it easier to weld the pins and also reducing the wear on the pins caused by welding. The telescopic hose can be used to protect the pins while facilitating bending the pins, thereby improving the practicality of the chip package. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the bottom three-dimensional structure of the utility model;

[0019] Figure 3 It is a partial three-dimensional structural schematic diagram of the utility model;

[0020] Figure 4 This is a schematic diagram of the three-dimensional structure of the pad of the utility model;

[0021] Figure 5 It is a schematic diagram of the three-dimensional structure of the protection strip of the utility model.

[0022] The corresponding relationship between the illustrations and component names in the figure is as follows:

[0023] 1. Protective shell; 2. Pad; 3. Loading slot; 4. Telescopic hose; 5. Pins; 6. Protective strip; 7. Solder port; 8. Groove; 9. Bump; 10. Protective frame; 11. Sealing plug; 12. Rubber pad; 13. Glue; 14. Wiring trough; 15. Seal. DETAILED DESCRIPTION

[0024] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0025] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0026] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not refer to the same embodiment, nor is it a separate or selective embodiment that is mutually exclusive with other embodiments. The present invention provides the following embodiments.

[0027] See also Figure 1-5 The utility model provides an embodiment: a chip packaging structure, including a protective shell 1, a pad 2 is fixedly connected to the bottom of the protective shell 1, and a loading slot 3 for installing an integrated circuit device is opened at the top center of the pad 2, a glue 13 is arranged inside the loading slot 3, and the bottom surface of the glue 13 is in contact with the bottom surface of the loading slot 3, and a plurality of wiring grooves 14 are arranged on the outside of the loading slot 3, and the positions of the plurality of wiring grooves 14 correspond to the positions of a plurality of pins 5 one by one. The integrated circuit device of the chip can be loaded through the loading slot 3, and the setting of the glue 13 makes the connection between the integrated circuit device and the loading slot 3 tighter. The wiring groove 14 is used to facilitate the precise docking between the connecting wires on the integrated circuit device and the pins 5, and can also limit the connecting wires.

[0028] In the present embodiment, the bottom surface of the pad 2 is flush with the bottom surface of the protective shell 1, and a plurality of rubber pads 12 are fixedly connected to the bottom of the pad 2. The plurality of rubber pads 12 are evenly distributed in a ring shape about the vertical center line of the pad 2, and the vertical center line of the pad 2 coincides with the vertical center line of the protective shell 1. The rubber pads 12 can be used to prop up the chip package on the external horizontal plane to prevent wear between the bottom of the pad 2 and the external horizontal plane. The coordinated use of the protective shell 1 and the pad 2 can protect the integrated circuit devices of the chip. Multiple rows of telescopic hoses 4 are fixedly connected to the outside of the protective shell 1, and pins 5 are provided inside each telescopic hose 4, and the pins 5 penetrate the side wall of the protective shell 1. The pins 5 are fixedly connected to the protective shell 1. The vertical center line of the protective shell 1 of the multiple rows of telescopic hoses 4 is evenly distributed in a ring shape, and the plurality of pins 5 are evenly distributed on the four sides of the protective shell 1. It is arranged in a strip shape, and a seal 15 is fixedly connected to the connection between the pad 2 and the protective shell 1. The setting of the seal 15 can play a sealing and protective role on the connection between the protective shell 1 and the pad 2. A protective frame 10 is fixedly connected to the outside of the protective shell 1. The inner circle size of the protective frame 10 coincides with the outer size of the protective shell 1. The protective frame 10 is located above the telescopic hose 4. The interior of the protective frame 10 is a hollow structure that can accommodate cooling liquid. A liquid injection port is opened on the top of one side of the protective frame 10, and a sealing plug 11 is threadedly connected to the liquid injection port of the protective frame 10. The protective frame 10 can be used to enhance the strength of the outer side of the protective shell 1, so that the protective shell 1 is not easily deformed. The sealing plug 11 can be rotated to open the liquid injection port of the protective frame 10, and coolant can be injected into the inside of the protective frame 10. The use of coolant can be beneficial to the heat dissipation of the protective frame 10.

[0029] In this embodiment, a plurality of grooves 8 are arranged on the top of the protective shell 1, and the plurality of grooves 8 are distributed in a grid pattern on the top of the protective shell 1, and bumps 9 are arranged between adjacent grooves 8, and the bumps 9 and the protective shell 1 form an integrated structure. Through the grooves 8 and the bumps 9 on the top of the protective shell 1, the contact area between the top of the protective shell 1 and the outside world can be increased, thereby further improving the heat dissipation capability of the chip package.

[0030] In this embodiment, the end of each telescopic hose 4 is fixedly connected to a protective strip 6, an opening is provided at the bottom of the protective strip 6, and the pin 5 is located inside the protective strip 6. A solder opening 7 is provided at the top of the protective strip 6. There is a gap between the pin 5 and the protective strip 6 for solder to flow through, and the bottom surface of the pin 5 is flush with the bottom surface of the protective strip 6. The chip package can be welded to an external circuit board through the pin 5. The provision of the protective strip 6 can protect the top of the pin 5 to prevent wear on the pin 5 during use. The solder opening 7 can allow solder to flow onto the pin 5, making it convenient to weld the pin 5 and reducing the wear on the pin 5 caused by welding. The telescopic hose 4 can be used to protect the pin 5 while facilitating bending the pin 5, thereby improving the practicality of the chip package.

[0031] Working principle: When using the present chip package, the integrated circuit device of the chip can be loaded through the loading slot 3 first. The setting of the adhesive 13 makes the connection between the integrated circuit device and the loading slot 3 tighter. The wiring groove 14 is used to facilitate the precise docking between the connecting wires on the integrated circuit device and the pins 5, and it can also limit the connecting wires. The rubber pad 12 can be used to prop up the present chip package on the external horizontal plane to prevent wear between the bottom of the pad 2 and the external horizontal plane. The protective shell 1 and the pad 2 can be used in combination to protect the integrated circuit device of the chip. The setting of the seal 15 can seal and protect the connection between the protective shell 1 and the pad 2. The protective frame 10 can enhance the strength of the outer side of the protective shell 1, making it difficult for the protective shell 1 to deform. The rotating sealing plug 11. The liquid injection port of the protective frame 10 can be opened, and coolant can be injected into the interior of the protective frame 10. The coolant can be used to dissipate heat for the protective frame 10. The groove 8 and the bump 9 on the top of the protective shell 1 can increase the contact area between the top of the protective shell 1 and the outside world, thereby further improving the heat dissipation capability of the chip package. The chip package can be welded to the external circuit board through the pin 5. The setting of the protective strip 6 can protect the top of the pin 5 to prevent wear on the pin 5 during use. The solder port 7 can be used to allow solder to flow onto the pin 5, making it easier to weld the pin 5 and reducing the wear on the pin 5 caused by welding. The telescopic hose 4 can be used to protect the pin 5 while facilitating bending the pin 5, thereby improving the practicality of the chip package.

[0032] The above content is a further detailed description of the utility model in combination with specific implementation methods. It cannot be determined that the specific implementation of the utility model is limited to these descriptions. For ordinary technicians in the technical field to which the utility model belongs, without departing from the concept of the utility model, they can also make several simple deductions or substitutions, which should be regarded as belonging to the scope of protection determined by the claims submitted for the utility model.

Claims

1. A chip packaging structure, comprising a protective shell (1), characterized in that: The bottom of the protective shell (1) is fixedly connected to a pad (2), and a loading slot (3) for mounting an integrated circuit device is provided at the center of the top of the pad (2). The outer side of the protective shell (1) is fixedly connected to multiple rows of telescopic hoses (4), each telescopic hose (4) is provided with a pin (5) inside, and the pin (5) passes through the side wall of the protective shell (1), and the pin (5) is fixedly connected to the protective shell (1). The end of each telescopic hose (4) is fixedly connected to a protective strip (6), the bottom of the protective strip (6) is provided with an opening, and the pin (5) is located inside the protective strip (6).

2. The chip packaging structure according to claim 1, characterized in that: A solder opening (7) is provided on the top of the protection strip (6); a gap is provided between the pin (5) and the protection strip (6) for solder to flow through; and the bottom surface of the pin (5) is flush with the bottom surface of the protection strip (6).

3. The chip packaging structure according to claim 2, characterized in that: A plurality of grooves (8) are arranged on the top of the protective shell (1), the plurality of grooves (8) are located on the top of the protective shell (1) and are distributed in a mesh shape, and bumps (9) are arranged between adjacent grooves (8), and the bumps (9) and the protective shell (1) form an integrated structure.

4. The chip packaging structure according to claim 3, characterized in that: A protective frame (10) is fixedly connected to the outer side of the protective shell (1), the inner circle size of the protective frame (10) matches the outer side size of the protective shell (1), and the protective frame (10) is located above the telescopic hose (4).

5. The chip packaging structure according to claim 4, characterized in that: The interior of the protective frame (10) is a hollow structure capable of accommodating cooling liquid. A liquid injection port is provided at the top of one side of the protective frame (10), and a sealing plug (11) is threadedly connected to the liquid injection port of the protective frame (10).

6. The chip packaging structure according to claim 1, characterized in that: The bottom surface of the pad (2) is flush with the bottom surface of the protective shell (1), and a plurality of rubber pads (12) are fixedly connected to the bottom of the pad (2), and the plurality of rubber pads (12) are evenly distributed in a ring shape about the vertical center line of the pad (2), and the vertical center line of the pad (2) coincides with the vertical center line of the protective shell (1).

7. The chip packaging structure according to claim 1, characterized in that: The interior of the carrier slot (3) is provided with a glue stick (13), and the bottom surface of the glue stick (13) is in contact with the bottom surface of the carrier slot (3). The outside of the carrier slot (3) is provided with a plurality of wiring grooves (14), and the positions of the plurality of wiring grooves (14) correspond one-to-one to the positions of the plurality of pins (5).

8. The chip packaging structure according to claim 1, characterized in that: The vertical center line of the protective shell (1) of the multiple rows of telescopic hoses (4) is evenly distributed in a ring shape, the plurality of pins (5) are arranged in a strip shape on four sides of the protective shell (1), and a seal (15) is fixedly connected to the connection between the pad (2) and the protective shell (1).

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