Frame for ultra-thin patch diode

Abstract

The utility model discloses a frame for an ultra-thin surface-mounted diode, which is applied to the field of diode frames and comprises an ultra-thin surface-mounted diode body, a positive electrode pin and a negative electrode pin, welding holes are formed in the positive electrode pin and the negative electrode pin, and range increasing holes are further formed in the negative electrode pin and the positive electrode pin. The welding hole is communicated with the range increasing hole; according to the ultrathin patch diode, the welding hole and the range increasing hole which are communicated with each other are respectively formed in the anode pin and the cathode pin, and the contact area of molten metal and the ultrathin patch diode body during welding is increased by the range increasing hole; the welding holes and the range increasing holes are filled with the metal material, the metal is heated and melted through the welding gun to form the molten metal, welding can be completed after the molten metal is cooled, and the welding difficulty of the ultrathin patch diode body, the positive electrode pin and the negative electrode pin is greatly reduced by adopting the mode.

Description

Technical Field

[0001] The utility model relates to the field of diode frames, in particular to a frame for ultra-thin patch diodes. Background Art

[0002] Ultra-thin chip diodes, also known as crystal diodes, or diodes for short, are electronic devices that conduct current in one direction.

[0003] The existing ultra-thin SMD diode needs to be welded to two pins. During welding, the metal material needs to be melted into liquid under the high temperature of the welding gun, and the liquid metal is adsorbed onto the pins and the ultra-thin SMD diode, and the welding is completed after cooling.

[0004] The ultra-thin SMD diode needs to be welded between the positive and negative pins. Since there is no liquid metal accommodation space between the positive and negative pins and the contact surface of the ultra-thin SMD diode, the molten metal liquid can only adhere to the pins and the surface of the ultra-thin SMD diode during welding. This method requires welding in all directions on the surface of the ultra-thin SMD diode, which makes welding more difficult. Moreover, there is no limiting structure after welding, and the positive and negative pins are easy to separate from the ultra-thin SMD diode.

[0005] In order to solve the above problems, we propose an ultra-thin chip diode frame. Utility Model Content

[0006] The utility model aims to provide a frame for an ultra-thin patch diode, which has the advantages of reducing the difficulty of welding and preventing the positive and negative electrodes and the ultra-thin patch diode from being separated after welding.

[0007] The above technical purpose of the utility model is achieved through the following technical solutions: a frame for an ultra-thin patch diode, including an ultra-thin patch diode body, a positive pin and a negative pin, the inside of the positive pin and the negative pin are both provided with welding holes, the inside of the negative pin and the positive pin are also provided with range-increasing holes, and the welding holes and the range-increasing holes are connected; the top of the positive pin and the bottom of the negative pin are respectively provided with an upper pressure plate and a lower clamping plate, the inside of the upper pressure plate and the lower clamping plate are both provided with threaded rods, and the surface of the threaded rods is threadedly connected with nuts.

[0008] By adopting the above technical scheme, by setting welding holes and range-increasing holes, when welding the ultra-thin patch diode body and the positive pin and the negative pin, welding can be carried out through the welding holes and the range-increasing holes, and the welding of the ultra-thin patch diode body and the positive pin and the negative pin is more convenient; by setting the upper pressure plate, the lower clamping plate, the threaded rod, the nut, the insulating part and the connecting part, the positive pin, the ultra-thin patch diode body and the negative pin can be locked after the positive pin and the negative pin are welded to the ultra-thin patch diode body, thereby playing a fixed limiting role.

[0009] The utility model is further configured as follows: one end of the threaded rod is fixedly connected with an insulating member, and the insulating member is specifically ceramic.

[0010] By adopting the above technical solution, the insulating part is provided with ceramic which is resistant to high temperature, heat-insulating and insulating, and will not affect the operation of the positive pin and the negative pin.

[0011] The utility model is further configured as follows: connecting pieces are provided inside the upper pressing plate and the lower clamping plate, and one end of the connecting piece close to the insulating piece is fixedly connected to the insulating piece.

[0012] The above technical solution is adopted to connect the supporting insulating member and the threaded rod through the setting of the connecting member.

[0013] The utility model is further configured as follows: a through slot one is provided inside the positive electrode pin, and the inside of the through slot one is sleeved with the surface of the threaded rod.

[0014] By adopting the above technical solution, through the provision of the through slot 1, it is convenient for the threaded rod to pass through the positive electrode pin and the nut thread for installation.

[0015] The utility model is further configured as follows: a second through slot is provided inside the negative electrode pin, and the inside of the second through slot is sleeved with the surface of the lower clamping plate.

[0016] By adopting the above technical solution, through the provision of the second through slot, it is convenient for another threaded rod to pass through the negative electrode pin and the nut thread for installation.

[0017] The utility model is further configured as follows: the ultra-thin patch diode body is located between the positive pin and the negative pin, the side of the upper pressure plate close to the positive pin contacts the positive pin, and the side of the lower clamping plate close to the ultra-thin patch diode body contacts the lower clamping plate.

[0018] By adopting the above technical solution, the upper pressing plate contacts the positive pin, and the lower clamp contacts the ultra-thin patch diode body, so as to cover the top and welding hole of the positive pin and the welding hole at the bottom of the negative pin.

[0019] In summary, the utility model has the following beneficial effects:

[0020] 1. The utility model provides interconnected welding holes and range-increasing holes inside the positive pin and the negative pin, respectively, so that the range-increasing holes increase the contact area between the molten metal liquid and the ultra-thin SMD diode body during welding;

[0021] By filling the metal material into the welding hole and the range increase hole, the metal is heated by a welding gun to melt the metal to form a molten metal, and the welding can be completed after the molten metal cools down. This method will greatly reduce the difficulty of welding the ultra-thin SMD diode body and the positive and negative pins;

[0022] 2. The utility model sets an upper pressing plate and a lower clamping plate. After the positive pin, the ultra-thin SMD diode body and the negative pin are welded, the upper pressing plate and the lower clamping plate are respectively locked with the positive pin and the negative pin through two threaded rods, insulating parts, the ultra-thin SMD diode body and nuts to form a frame, which can limit the positive pin, the ultra-thin SMD diode body and the negative pin, ensure the stability of the positive pin, the ultra-thin SMD diode body and the negative pin after welding, and will not separate. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a three-dimensional diagram of the structure of the utility model;

[0024] Figure 2 It is a schematic diagram of the positive pin, the ultra-thin patch diode body and the negative pin of the utility model;

[0025] Figure 3 It is a schematic diagram of the utility model to increase the scope of the hole and the welding hole connection;

[0026] Figure 4 The utility model is a connection schematic diagram of a threaded rod, an insulating member and a connecting member.

[0027] Figure numerals: 1. Ultra-thin SMD diode body; 2. Positive pin; 3. Negative pin; 4. Welding hole; 5. Range increase hole; 6. Upper pressure plate; 7. Lower clamp; 8. Threaded rod; 9. Nut; 10. Insulator; 11. Connector; 12. Through slot one; 13. Through slot two. DETAILED DESCRIPTION

[0028] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0029] Embodiment 1:

[0030] refer to Figure 1 , Figure 2 , Figure 3 and Figure 4The frame for ultra-thin patch diodes comprises an ultra-thin patch diode body 1, a positive pin 2 and a negative pin 3, wherein welding holes 4 are provided inside the positive pin 2 and the negative pin 3, and range-increasing holes 5 are provided inside the negative pin 3 and the positive pin 2, and the welding holes 4 and the range-increasing holes 5 are connected; an upper pressing plate 6 and a lower clamping plate 7 are provided at the top of the positive pin 2 and the bottom of the negative pin 3, respectively, and threaded rods 8 are provided inside the upper pressing plate 6 and the lower clamping plate 7, and nuts 9 are threadedly connected on the surface of the threaded rods 8; by respectively providing mutually connected welding holes 4 and range-increasing holes 5 inside the positive pin 2 and the negative pin 3, the range-increasing holes 5 increase the contact area between the molten metal liquid and the ultra-thin patch diode body 1 during welding; by filling the metal material into the welding holes 4 and the range increase hole 5, the metal is heated by a welding gun to melt the metal to form a molten metal, and the welding can be completed after the molten metal cools down. This method will greatly reduce the difficulty of welding the ultra-thin SMD diode body 1 and the positive pin 2 and the negative pin 3; by setting the upper pressing plate 6 and the lower clamping plate 7, after the positive pin 2, the ultra-thin SMD diode body 1 and the negative pin 3 are welded, the upper pressing plate 6 and the lower clamping plate 7 are respectively locked with the positive pin 2 and the negative pin 3 by two threaded rods 8, an insulating member 10 and the ultra-thin SMD diode body 1 and a nut 9 to form a frame, which can limit the positive pin 2, the ultra-thin SMD diode body 1 and the negative pin 3, ensure the stability of the positive pin 2, the ultra-thin SMD diode body 1 and the negative pin 3 after welding, and will not cause separation.

[0031] Furthermore, one end of the threaded rod 8 is fixedly connected with an insulating part 10, which is specifically ceramic. Through the setting of the insulating part 10, the insulating part 10 uses ceramic to be resistant to high temperature, heat-insulating and insulating, and will not affect the operation of the positive pin 2 and the negative pin 3.

[0032] Furthermore, a connecting piece 11 is provided inside the upper pressing plate 6 and the lower clamping plate 7 . One end of the connecting piece 11 close to the insulating piece 10 is fixedly connected to the insulating piece 10 . The connecting piece 11 is provided to connect and support the insulating piece 10 and the threaded rod 8 .

[0033] Furthermore, a through slot 12 is provided inside the positive pin 2, and the inside of the through slot 12 and the surface of the threaded rod 8 are sleeved. The provision of the through slot 12 facilitates the threaded rod 8 to pass through the positive pin 2 and the nut 9 for threaded installation.

[0034] Furthermore, a second through slot 13 is provided inside the negative pin 3, and the inside of the second through slot 13 is sleeved with the surface of the lower clamping plate 7. The setting of the second through slot 13 facilitates another threaded rod 8 to pass through the negative pin 3 and the nut 9 for threaded installation.

[0035] Furthermore, the ultra-thin patch diode body 1 is located between the positive pin 2 and the negative pin 3, the upper pressure plate 6 is in contact with the positive pin 2 on one side close to the positive pin 2, and the lower clamping plate 7 is in contact with the lower clamping plate 7 on one side close to the ultra-thin patch diode body 1, and the upper pressure plate 6 is in contact with the positive pin 2, and the lower clamping plate 7 is in contact with the ultra-thin patch diode body 1, so as to cover the top of the positive pin 2 and the welding hole 4 and the welding hole 4 at the bottom of the negative pin 3.

[0036] Brief description of the use process: When using, place the positive pin 2 on the top of the ultra-thin SMD diode body 1, so that the welding hole 4 and the range increase hole 5 inside the positive pin 2 correspond to the ultra-thin SMD diode body 1, put the metal material for welding inside the welding hole 4 and the range increase hole 5, heat and melt it with a welding gun to form molten metal, the molten metal and the positive pin 2 are in contact with the ultra-thin SMD diode body 1 and cool, and the welding of the positive pin 2 and the ultra-thin SMD diode body 1 is completed, and then the negative pin 3 and the ultra-thin SMD diode body 1 are welded according to the above operation;

[0037] Then, one of the two threaded rods 8 is passed through the lower clamping plate 7, the positive pin 2 and the upper clamping plate 6 in sequence upwards and is threadedly connected to the nut 9, and the other is passed through the upper clamping plate 6, the negative pin 3 and the lower clamping plate 7 in sequence downwards and is threadedly connected to the nut 9. The nut 9 and the threaded rod 8 are connected and locked to form a frame. The frame can be used to limit and lock the welded positive pin 2, the ultra-thin SMD diode body 1 and the negative pin 3 to avoid separation;

[0038] Finally, seal the glue and wait for it to dry.

[0039] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A frame for an ultra-thin SMD diode, comprising an ultra-thin SMD diode body (1), a positive electrode pin (2) and a negative electrode pin (3), characterized in that: The positive electrode pin (2) and the negative electrode pin (3) are both provided with welding holes (4), and the negative electrode pin (3) and the positive electrode pin (2) are also provided with range increasing holes (5), and the welding holes (4) and the range increasing holes (5) are connected; the top of the positive electrode pin (2) and the bottom of the negative electrode pin (3) are respectively provided with an upper pressing plate (6) and a lower clamping plate (7), and the upper pressing plate (6) and the lower clamping plate (7) are both provided with threaded rods (8), and the surfaces of the threaded rods (8) are threadedly connected with nuts (9).

2. The ultra-thin chip diode frame according to claim 1, characterized in that: One end of the threaded rod (8) is fixedly connected to an insulating member (10), and the insulating member (10) is specifically made of ceramic.

3. The ultra-thin chip diode frame according to claim 2, characterized in that: A connecting piece (11) is provided inside the upper pressing plate (6) and the lower clamping plate (7), and one end of the connecting piece (11) close to the insulating piece (10) is fixedly connected to the insulating piece (10).

4. The ultra-thin chip diode frame according to claim 1, characterized in that: A through slot (12) is provided inside the positive electrode pin (2), and the inside of the through slot (12) is sleeved on the surface of the threaded rod (8).

5. The ultra-thin SMD diode frame according to claim 1, characterized in that: A second through slot (13) is provided inside the negative electrode pin (3), and the inside of the second through slot (13) is sleeved with the surface of the lower clamping plate (7).

6. The ultra-thin chip diode frame according to claim 1, characterized in that: The ultra-thin patch diode body (1) is located between the positive pin (2) and the negative pin (3), the upper pressure plate (6) is in contact with the positive pin (2) on one side close to the positive pin (2), and the lower clamping plate (7) is in contact with the lower clamping plate (7) on one side close to the ultra-thin patch diode body (1).

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