Curing device for SMT patch processing

Abstract

The utility model discloses a curing device for SMT patch processing, which comprises a cooling box arranged inside a curing oven, a box cover is arranged on the opening end face of the cooling box, a plurality of positioning grooves are transversely arranged on the box cover, a plurality of cooling ports are arranged on the positioning grooves, transverse grooves are arranged on two sides of the positioning grooves, and the cooling ports are arranged in the transverse grooves. Grooves are formed in the positions, located at the four corners of the cooling opening, of the opposite faces of the transverse grooves, lifting rods for moving SMT patches upwards from the positioning grooves are arranged in the transverse grooves, the positions, right opposite to the grooves, of the lifting rods protrude to form protruding parts, the protruding parts are inserted into the grooves, shaft holes are formed in the protruding parts, and positioning rods are arranged in the shaft holes. The SMT patch curing device is simple in structure, the positioning rods can be sleeved with the fixing holes in the SMT patch so that the positioning effect on the SMT patch can be improved, wind energy generated by the heat dissipation mechanism can be blown to the bottom face of the SMT patch along the cooling openings, and therefore heat on the SMT patch can be rapidly driven to complete curing.

Description

Technical Field

[0001] The utility model relates to the technical field of SMT patches, in particular to a curing device for SMT patch processing. Background Art

[0002] SMT patch curing is to first melt the surface assembly patch glue to make the surface assembly components and circuit boards firmly bonded together, and then wait for the patch glue to cool and solidify naturally. After the processing is completed, the existing SMT patch curing box opens the door panel on the SMT patch curing box for cooling, resulting in slow cooling efficiency inside the curing box, long cooling time and low work efficiency. In view of the above situation, technical innovation is carried out on the basis of the existing curing device for SMT patch processing. Summary of the invention

[0003] The technical problem to be solved by the utility model is to provide a curing device for SMT patch processing, which can position the SMT patch to face the cooling port, and quickly cool the SMT patch by fully passing wind energy from under the SMT patch, so as to solve the problems raised in the above-mentioned background technology.

[0004] The utility model is realized through the following technical scheme: a curing device for SMT patch processing, comprising a cooling box placed inside a curing oven, a box cover is installed on the open end surface of the cooling box, a plurality of positioning grooves for placing SMT patches are transversely arranged on the box cover, a plurality of cooling ports are arranged on the positioning grooves, transverse grooves are arranged on both sides of the positioning grooves, grooves are arranged at the four corners of the cooling ports on the opposite sides of the transverse grooves, lifting rods for moving the SMT patches upward from the positioning grooves are arranged in the transverse grooves, the lifting rods are protruded at the positions opposite to the grooves to form convex parts, the convex parts are inserted into the grooves, shaft holes are arranged on the convex parts, positioning rods are arranged in the shaft holes, and a heat dissipation mechanism is installed at one end of the cooling box.

[0005] As a preferred technical solution, the heat dissipation mechanism includes a fixed plate and multiple heat dissipation fans. A mounting port is provided at one end of the cooling box, the fixed plate is installed in the mounting port, multiple air inlet holes are provided on the fixed plate, the heat dissipation fans are all installed in the air inlet holes, and multiple air outlet holes are provided on the other end of the cooling box.

[0006] As a preferred technical solution, one end of the positioning rod is installed in the transverse groove, and the other end protrudes from the axial hole and extends into the positioning groove.

[0007] As a preferred technical solution, both ends of the box cover are provided with side panels, both ends of the lifting rod are installed on the inner side surfaces of the side panels, and handles are installed on the outer side surfaces of the side panels.

[0008] As a preferred technical solution, the top surface of the lifting rod is arranged flush with the bottom surface of the positioning groove.

[0009] As a preferred technical solution, a plurality of guide plates distributed in an inclined shape are installed on the bottom surface of the cooling box.

[0010] As a preferred technical solution, a plurality of limit plates are installed on the top surface of the box cover, and the limit plates are arranged one on the left and one on the right.

[0011] The beneficial effects of the utility model are as follows: the utility model has a simple structure, the SMT patch can be placed in the positioning groove and covered above the cooling port, so that the bottom surface of the SMT patch is connected to the cooling box, and the fixing hole on the SMT patch can be sleeved on the positioning rod to increase the positioning effect of the SMT patch, and when cooling is needed, the cooling box and the SMT patch can be directly moved outward, and the wind energy generated by the heat dissipation mechanism can be blown along the cooling port onto the bottom surface of the SMT patch, thereby quickly driving the heat on the SMT patch to complete the curing, and after pulling the side plate upward, the lifting rod can be synchronously driven to move upward, and the SMT patch can be pushed out of the positioning rod and the positioning groove, which is convenient for taking and placing. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0014] Figure 2 It is a side view of the utility model;

[0015] Figure 3 This is a schematic diagram of the structure of the utility model after the lifting rod is removed;

[0016] Figure 4 It is a schematic diagram of the structure of the utility model after the box cover is scraped off.

[0017] Among them, 1. cooling box; 2. box cover; 3. positioning groove; 4. cooling port; 5. lifting rod; 6. positioning rod; 7. limit plate; 8. side plate; 9. handle; 10. fixing plate; 11. cooling fan; 12. air outlet; 13. horizontal groove; 14. guide plate; 15. convex part; 16. shaft hole. DETAILED DESCRIPTION

[0018] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0019] All features disclosed in this specification, or steps in all methods or processes disclosed, except mutually exclusive features and / or steps, can be combined in any manner.

[0020] Any feature disclosed in this specification (including any additional claims, abstract and drawings), unless otherwise stated, may be replaced by other equivalent or alternative features with similar purposes. That is, unless otherwise stated, each feature is only an example of a series of equivalent or similar features.

[0021] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the utility model is a curing device for SMT patch processing, comprising a cooling box 1 placed inside a curing oven, a box cover 2 is installed on the open end surface of the cooling box 1, a plurality of positioning grooves 3 for placing SMT patches are transversely arranged on the box cover 2, a plurality of cooling ports 4 are arranged on the positioning grooves 3, transverse grooves 13 are arranged on both sides of the positioning grooves 3, grooves are arranged at the four corners of the cooling ports 4 opposite to the transverse grooves 13, lifting rods 5 for moving the SMT patches upward from the positioning grooves 3 are arranged in the transverse grooves 13, convex portions 15 are protruded from the lifting rods 5 at the positions opposite to the grooves, the convex portions 15 are inserted into the grooves, shaft holes 16 are arranged on the convex portions 15, and positioning rods 6 are arranged in the shaft holes 16, and a heat dissipation mechanism is installed at one end of the cooling box 1.

[0022] In this embodiment, the heat dissipation mechanism includes a fixed plate 10 and a plurality of heat dissipation fans 11. A mounting port is provided at one end of the cooling box 1, and the fixed plate 10 is installed in the mounting port. A plurality of air inlet holes are provided on the fixed plate 10, and the heat dissipation fans 11 are all installed in the air inlet holes. A plurality of air outlet holes 12 are provided on the other end of the cooling box 1.

[0023] In this embodiment, one end of the positioning rod 6 is installed in the transverse groove 13 , and the other end protrudes out of the shaft hole 16 and extends into the positioning groove 3 .

[0024] In this embodiment, both ends of the box cover 2 are provided with side panels 8, both ends of the lifting rod 5 are installed on the inner side surfaces of the side panels 8, and handles 9 are installed on the outer side surfaces of the side panels 8.

[0025] In this embodiment, the top surface of the lifting rod 5 is flush with the bottom surface of the positioning groove 3, so that the SMT patch can be stably placed in the positioning groove.

[0026] In this embodiment, a plurality of guide plates 14 distributed in an inclined shape are installed on the bottom surface of the cooling box 1. The guide plates can guide the wind upward so that the wind can fully contact the bottom surface of the SMT patch.

[0027] In this embodiment, a plurality of limit plates 7 are installed on the top surface of the box cover 2, and the limit plates 7 are arranged on the left and the right. After the lifting rod moves upward, the lifting rod will eventually collide with the limit plates, preventing the lifting rod from directly moving out of the positioning groove, wherein the outer side surface of the lifting rod conflicts with the inner side surface of the positioning groove. Therefore, after the lifting rod moves upward, the lifting rod can be positioned by the friction between the lifting rod and the positioning groove.

[0028] When in use, the SMT patch can be placed in the positioning groove. During the placement process, the fixing hole on the SMT patch can be sleeved on the positioning rod, so that the SMT patch can be pressed above the cooling port. The SMT patch can be positioned through the positioning groove and the positioning rod, which increases the stability when heated in the curing oven;

[0029] After heating is completed, the curing oven can be opened, so that the cooling box can be directly taken out. The movement of the cooling box simultaneously brings out the SMT patches, so that the curing oven can directly heat another group of SMT patches, avoiding the intermediate stop.

[0030] After the cooling box is removed, the cooling fan can be started. The rotating cooling fan can generate wind, so that the wind can be directly blown into the cooling box and contact the guide plate. The upwardly tilted guide plate can guide the wind upward, so that the wind can pass through the cooling port and the bottom surface of the SMT patch, thereby quickly taking away the heat of the SMT patch until it is discharged from the air outlet, so as to complete the cooling operation of the SMT patch;

[0031] After cooling is completed, the handle can be held to pull the lifting rod upwards. The SMT patch can be taken out of the positioning groove by the lifting rod moving upwards, and also detached from the positioning rod, which facilitates the removal of the SMT patch.

[0032] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that are not conceived through creative work should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope defined in the claims.

Claims

1. A curing device for SMT patch processing, characterized in that: The invention comprises a cooling box (1) placed inside a curing oven, wherein a box cover (2) is installed on the open end surface of the cooling box (1), a plurality of positioning grooves (3) for placing SMT patches are transversely arranged on the box cover (2), a plurality of cooling ports (4) are arranged on the positioning grooves (3), transverse grooves (13) are arranged on both sides of the positioning grooves (3), grooves are arranged at the four corners of the cooling ports (4) opposite to the transverse grooves (13), lifting rods (5) for moving the SMT patches upward from the positioning grooves (3) are arranged in the transverse grooves (13), convex parts (15) are protruded from the lifting rods (5) at the positions opposite to the grooves, the convex parts (15) are inserted into the grooves, shaft holes (16) are arranged on the convex parts (15), and positioning rods (6) are arranged in the shaft holes (16), and a heat dissipation mechanism is installed at one end of the cooling box (1).

2. The curing device for SMT patch processing according to claim 1, characterized in that: The heat dissipation mechanism comprises a fixing plate (10) and a plurality of heat dissipation fans (11); a mounting opening is provided at one end of the cooling box (1); the fixing plate (10) is installed in the mounting opening; a plurality of air inlet holes are provided on the fixing plate (10); the heat dissipation fans (11) are all installed in the air inlet holes; and a plurality of air outlet holes (12) are provided at the other end of the cooling box (1).

3. The curing device for SMT patch processing according to claim 1, characterized in that: One end of the positioning rod (6) is installed in the transverse groove (13), and the other end protrudes out of the shaft hole (16) and extends into the positioning groove (3).

4. The curing device for SMT patch processing according to claim 1, characterized in that: Both ends of the box cover (2) are provided with side plates (8), both ends of the lifting rod (5) are installed on the inner side surfaces of the side plates (8), and handles (9) are installed on the outer side surfaces of the side plates (8).

5. The curing device for SMT patch processing according to claim 1, characterized in that: The top surface of the lifting rod (5) is arranged flush with the bottom surface of the positioning groove (3).

6. The curing device for SMT patch processing according to claim 1, characterized in that: A plurality of guide plates (14) distributed in an inclined shape are installed on the bottom surface inside the cooling box (1).

7. The curing device for SMT patch processing according to claim 1, characterized in that: A plurality of limit plates (7) are installed on the top surface of the box cover (2), and the limit plates (7) are arranged one on the left and one on the right.

Images