Ultra-thin controller integrating direct current motor driving and three-phase motor driving

Abstract

The utility model provides an ultra-thin controller integrating direct current motor drive and three-phase motor drive, which is characterized in that the controller is composed of a heat dissipation bottom plate, a circuit board assembly and an upper cover, the circuit board assembly is tightly attached to the heat dissipation bottom plate for heat dissipation, an insulating film is arranged between the circuit board assembly and the heat dissipation bottom plate, a three-phase full bridge composed of an MOSFET and a half bridge composed of an MOSFET are arranged on the circuit board assembly, and the three-phase full bridge is connected with the upper cover. The three-phase full bridge is used for driving a three-phase motor, the half bridge is used for driving a direct-current motor, the MOSFET is packaged and welded on the circuit board by adopting a patch, not less than ten via holes are formed in the MOSFET heat dissipation bonding pad, heat is guided into the heat dissipation bottom plate through the circuit board and the via holes, a plurality of copper columns are welded on the circuit board in a patch manner and are used for external wiring, the copper columns are hollow and are internally provided with threads, and the copper columns are welded on the circuit board in a patch manner. And the screws can be screwed into the holes after penetrating through the heat dissipation bottom plate and the circuit board, so that the heat dissipation bottom plate, the circuit board and the copper columns are fastened into a whole, and an insulating spacer is arranged between the screws and the heat dissipation aluminum plate to separate the screws from the heat dissipation aluminum plate.

Description

Technical Field

[0001] The invention relates to a motor controller. Background Art

[0002] In recent years, electric pallet trucks and other electric logistics tools have developed rapidly. In the past, electric pallet trucks were controlled by a controller for travel, and the lifting pump motor was controlled by a contactor, which was costly and had a high failure rate. At the same time, power devices are developing rapidly, and new surface mount power devices have shown powerful performance, while old plug-in power devices have been greatly challenged. In view of these situations, the present invention proposes an ultra-thin controller that integrates DC motor drive and three-phase motor drive. Summary of the invention

[0003] 1) Technical problems solved

[0004] In the past, electric pallet trucks used a controller to control the travel, and a contactor to control the lifting pump motor. The contactor is not only expensive and large in size, but also has a high failure rate during use. As the requirements for cost and performance of electric pallet truck controllers become higher and higher, plug-in devices used in motor controllers are increasingly unable to meet performance requirements. When SMD devices are used in motor controllers, multiple circuit boards are often used. The power device is attached to one circuit board, and the control system is attached to another circuit board. The circuit boards are connected by connectors. Not only is the reliability poor, the cost is high, the vibration resistance is poor, and the structure is not compact enough, this solution proposes an ultra-thin controller that integrates DC motor drive and three-phase motor drive to address these problems.

[0005] 2) Technical solution

[0006] The present invention proposes an ultra-thin controller that integrates DC motor drive and three-phase motor drive, characterized in that the controller consists of a heat dissipation base plate, a circuit board assembly, and an upper cover. The circuit board assembly is close to the heat dissipation base plate for heat dissipation with an insulating film in between. The circuit board assembly has a three-phase full bridge composed of MOSFET and a half bridge composed of MOSFET. The three-phase full bridge is used to drive the three-phase motor, and the half bridge is used to drive the DC motor. The MOSFET is packaged in a surface mount package and welded on the circuit board. Each MOSFET heat dissipation pad is provided with no less than 10 vias, and heat is introduced into the heat dissipation base plate through the circuit board and the vias. A number of copper columns are also surface mounted and welded on the circuit board for external wiring. The copper columns are hollow and have threads inside. The screws can be screwed into the holes after passing through the heat dissipation base plate and the circuit board, thereby fastening the heat dissipation base plate, the circuit board and the copper columns together. An insulating gasket is provided between the screws and the heat dissipation aluminum plate to separate the screws from the heat dissipation aluminum plate.

[0007] The upper cover is made of plastic and has several pillars inside. When the upper cover is closed, these pillars press the circuit board tightly against the heat dissipation base.

[0008] The pads for welding power devices are connected to the surrounding copper foil, the area of ​​which is not less than 25 square millimeters, and there are at least 10 vias on the copper foil connecting the top and bottom copper foils.

[0009] There are at least 6 vias on the pad where the copper pillar is soldered to connect the top and bottom copper layers of the circuit board.

[0010] There are at least 3 slots on the circuit board for welding the negative copper busbar.

[0011] A sampling resistor is welded on the circuit board for current sampling.

[0012] A control chip is soldered on the circuit board.

[0013] Several connectors are soldered on the circuit board for connecting external wiring harnesses.

[0014] 3) Beneficial effects

[0015] The present invention provides an ultra-thin controller integrating direct current motor drive and three-phase motor drive, which has a simple and compact structure, low cost and high reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is the overall picture of the product. Figure 2 This is a product breakdown diagram. Figure 3 For the circuit board assembly diagram, Figure 4 For the cover image, Figure 5 This is a diagram of the heat dissipation base. In the figure: 1- heat dissipation base, 2- circuit board assembly, 3- top cover, 4- MOSFET, 5- copper column, 6- negative copper bus, 7- sampling resistor, 8- control chip, 9- connector DETAILED DESCRIPTION

[0017] The present invention proposes an ultra-thin controller integrating DC motor drive and three-phase motor drive, characterized in that the controller is composed of a heat dissipation base plate 1, a circuit board assembly 2, and an upper cover 3. The circuit board assembly 2 is close to the heat dissipation base plate 1 for heat dissipation, with an insulating film therebetween. The circuit board assembly 2 is provided with a three-phase full bridge composed of MOSFET and a half bridge composed of MOSFET. The three-phase full bridge is used to drive the three-phase motor, and the half bridge is used to drive the DC motor. The MOSFET is packaged by SMD and welded on the circuit board. Each MOSFET heat dissipation pad is provided with no less than 10 vias, and heat is introduced into the heat dissipation base plate 1 through the circuit board and the vias. A plurality of copper pillars 5 are also SMD-welded on the circuit board for external wiring. The copper pillars 5 are hollow and have threads therein. The screws can be screwed into the holes after passing through the heat dissipation base plate 1 and the circuit board, thereby fastening the heat dissipation base plate 1 to the circuit board 2 and the copper pillars 5 as a whole. An insulating gasket is provided between the screw and the heat dissipation base plate 1 to separate the screw from the heat dissipation base plate 1.

[0018] The upper cover 3 is made of plastic, and a plurality of pillars 10 are arranged inside the cover. When the upper cover is closed, the pillars 10 press the circuit board assembly 2 tightly against the heat dissipation base plate.

[0019] The pads for welding power devices are connected to the surrounding copper foil, the area of ​​which is not less than 25 square millimeters, and there are at least 10 vias on the copper foil connecting the top and bottom copper foils.

[0020] There are at least 6 vias on the pad where the copper pillar is soldered to connect the top and bottom copper layers of the circuit board.

[0021] There are at least three slots on the circuit board for welding the negative electrode copper bus 6.

[0022] A sampling resistor 7 is welded on the circuit board for current sampling.

[0023] A control chip 8 is welded on the circuit board.

[0024] A number of connectors 9 are welded on the circuit board for connecting to external wiring harnesses.

Claims

1. An ultra-thin controller integrating DC motor drive and three-phase motor drive, characterized in that: The controller consists of a heat sink, a circuit board assembly, and an upper cover. The circuit board assembly is close to the heat sink for heat dissipation, with an insulating film in between. The circuit board assembly has a three-phase full bridge composed of MOSFET and a half bridge composed of MOSFET. The three-phase full bridge is used to drive a three-phase motor, and the half bridge is used to drive a DC motor. The MOSFET is packaged in a surface mount package and welded on the circuit board. Each MOSFET heat dissipation pad is provided with no less than 10 vias. The heat is introduced into the heat sink through the circuit board and the vias. A number of copper columns are also surface mounted and welded on the circuit board for external wiring. The copper columns are hollow and have threads inside. The screws can be screwed into the holes after passing through the heat sink and the circuit board, thereby fastening the heat sink to the circuit board and the copper columns as a whole. There is an insulating gasket between the screws and the heat sink aluminum plate to separate the screws from the heat sink aluminum plate.

2. The ultra-thin controller integrating DC motor drive and three-phase motor drive as claimed in claim 1, characterized in that: The upper cover is made of plastic and has several pillars inside. When the upper cover is closed, these pillars press the circuit board tightly against the heat dissipation base.

3. The ultra-thin controller integrating DC motor drive and three-phase motor drive as claimed in claim 1, characterized in that: The pads for welding power devices are connected to the surrounding copper foil, the area of ​​which is not less than 25 square millimeters, and there are at least 10 vias on the copper foil connecting the top and bottom copper foils.

4. The ultra-thin controller integrating DC motor drive and three-phase motor drive as claimed in claim 1, characterized in that: There are at least 6 vias on the pad where the copper pillar is soldered to connect the top and bottom copper layers of the circuit board.

5. The ultra-thin controller integrating DC motor drive and three-phase motor drive as claimed in claim 1, characterized in that: There are at least 3 slots on the circuit board for welding the negative copper busbar.

6. The ultra-thin controller integrating DC motor drive and three-phase motor drive as claimed in claim 1, characterized in that: A sampling resistor is welded on the circuit board for current sampling.

7. The ultra-thin controller integrating DC motor drive and three-phase motor drive as claimed in claim 1, characterized in that: A control chip is soldered on the circuit board.

8. The ultra-thin controller integrating DC motor drive and three-phase motor drive as claimed in claim 1, characterized in that: Several connectors are soldered on the circuit board for connecting external wiring harnesses.

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