Integrated circuit board structure of COB packaging micro pixel multiplexing technology

Abstract

The utility model relates to the technical field of integrated circuit boards, in particular to an integrated circuit board structure of a COB packaging micro pixel multiplexing technology, which comprises a substrate, a packaging mechanism is arranged on the upper surface of the substrate, a heat dissipation mechanism is arranged in the substrate, connecting plates are fixed on the left side and the right side of the substrate, mounting holes are formed in the upper surfaces of the connecting plates, and the mounting holes are communicated with the packaging mechanism. A mounting sleeve is sleeved with the mounting hole, the packaging mechanism comprises a circuit assembly and a sealing assembly, and the circuit assembly comprises a mounting groove formed in the upper surface of the substrate. According to the integrated circuit board structure of the COB packaging micro pixel multiplexing technology, the circuit board body is matched with the micro pixels, the chip packaging size can be further reduced, the pixel density of a display device can be further improved, the integrated circuit board structure is applied to the display field, and a finer and high-definition display effect can be achieved; and the requirements of products with light and thin sizes and high integration level, such as mobile equipment such as smart phones and tablet personal computers, can also be met.

Description

Technical Field

[0001] The present application relates to the technical field of integrated circuit boards, and in particular to an integrated circuit board structure of a COB packaging micro-pixel multiplexing technology. Background Art

[0002] COB packaging technology is an integrated circuit packaging method that packages the chip directly onto the PCB instead of using the traditional chip packaging method. COB packaging technology has the advantages of small packaging size, simple structure, and good heat dissipation performance. Therefore, it is widely used in some occasions with high requirements on packaging size and heat dissipation.

[0003] For example, a Chinese patent (publication number: CN212062469U) discloses a COB packaging structure, including a substrate, a plurality of LED chips and a dam, wherein the dam forms a solid crystal area on the substrate, the LED chip is arranged in the solid crystal area, a lower circuit layer is arranged in the solid crystal area, an upper circuit layer is arranged on the top of the dam, a through hole penetrating the top and bottom of the dam is arranged in the dam, a metal conductive column is arranged in the through hole, and the upper circuit layer is electrically connected to the lower circuit layer through the metal conductive column. The principle of the utility model is as follows: an upper circuit layer is arranged on the dam, the upper circuit layer can replace the traditional jumper, making the overall circuit simpler, and the gold wire jumper is eliminated, and the circuit connection is more reliable; since the upper circuit layer is arranged on the dam, it does not affect the light output and appearance of the COB; by arranging the upper circuit layer on the dam, the distribution of the LED chips in the solid crystal area is freer.

[0004] The above-mentioned COB packaging structure still has certain shortcomings. An upper circuit layer is set on the dam, and the upper circuit layer can replace the traditional jumper to make the overall circuit simpler, and the gold wire jumper is eliminated, and the connection of the circuit is more reliable; since the upper circuit layer is set on the dam, it does not affect the light output and appearance of the COB; by setting the upper circuit layer on the dam, the distribution of the LED chip in the solid crystal area is freer, but due to the large chip package size, multiple tiny pixels cannot be packaged, resulting in a decrease in pixel density, so that the display field does not have a more refined and high-definition display effect, and at the same time it cannot meet the demand for lightweight and high-integration products. Therefore, an integrated circuit board structure of COB packaging tiny pixel multiplexing technology is proposed to solve the above problems. Utility Model Content

[0005] In view of the shortcomings of the prior art, the present application provides an integrated circuit board structure of a COB packaging micro-pixel multiplexing technology, which has the advantages of improving display effects, etc., and solves the problem of poor display effects of the existing COB packaging structure.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical solutions: an integrated circuit board structure of COB packaging micro-pixel multiplexing technology, comprising a substrate, a packaging mechanism is provided on the upper surface of the substrate, a heat dissipation mechanism is provided inside the substrate, connecting plates are fixed on both the left and right sides of the substrate, a mounting hole is opened on the upper surface of the connecting plate, and a mounting sleeve is sleeved inside the mounting hole;

[0007] The packaging mechanism includes a circuit component and a sealing component. The circuit component includes a mounting groove opened on the upper surface of a substrate, a circuit board body fixed inside the mounting groove, and a plurality of tiny pixel bodies fixed on the upper surface of the circuit board body.

[0008] By adopting the above technical solution, the heat dissipation mechanism is used to dissipate the heat of the packaging mechanism, and the circuit board body is COB packaged by the packaging mechanism.

[0009] Furthermore, the sealing assembly includes a cofferdam fixed to the upper surface of the substrate and a filling layer fixed inside the cofferdam.

[0010] By adopting the above technical solution, the circuit board body is COB packaged through the filling layer.

[0011] Furthermore, the cofferdam is in a U-shape, and the filling layer is fluorescent glue.

[0012] Using the above technical solution, the circuit board body is COB packaged through fluorescent glue

[0013] Furthermore, the filling layer is fixed to the upper surface of the circuit board body, and the filling layer is fixed to the outer surface of the tiny pixel body.

[0014] The above technical solution is used to package the circuit board body and the tiny pixel body.

[0015] Furthermore, the installation sleeve is in an I-shape, and the circuit board body is attached to the inner cavity wall of the cofferdam.

[0016] By adopting the above technical solution, the circuit board body is protected by the cofferdam.

[0017] Furthermore, the heat dissipation mechanism includes a fixing groove opened on the back side of the substrate, sliding grooves opened on the left and right sides of the inner cavity of the fixing groove, a radiator slidably connected to the inside of the fixing groove, a heat sink fixed on the upper surface of the radiator, and sliders fixed on the left and right sides of the radiator.

[0018] By adopting the above technical solution, the heat dissipation mechanism is used to dissipate heat from the circuit board body.

[0019] Furthermore, the fixing groove is T-shaped, and the upper surface of the heat sink is attached to the lower surface of the circuit board body.

[0020] By adopting the above technical solution, the heat dissipation of the circuit board body is carried out through the heat sink and the heat sink, so as to prevent the circuit board body from being damaged due to excessive temperature.

[0021] Furthermore, the slider and the slide groove are both T-shaped, and the slider is slidably connected to the inside of the slide groove.

[0022] The above technical solution is adopted to increase the stability of the heat sink when it moves, making it easier for the heat sink to dissipate heat from the circuit board body.

[0023] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0024] 1. The integrated circuit board structure and packaging mechanism of the COB packaging micro-pixel multiplexing technology, after welding multiple micro-pixel bodies to the upper surface of the circuit board body, the circuit board body is placed into the inside of the installation groove through the cofferdam, and after the circuit board body is fixed by glue, a filling layer is applied on the upper surface of the circuit board body, and the circuit board body and the micro-pixel body are packaged by the filling layer. Through the cooperation of the circuit board body and the micro-pixel, the chip packaging size can be further reduced and the pixel density of the display device can be further improved. This technology can be applied in the display field to bring more sophisticated and high-definition display effects, and can also meet the demand for lightweight and highly integrated products, such as smart phones, tablets and other mobile devices.

[0025] 2. The integrated circuit board structure of the COB packaging micro-pixel multiplexing technology pushes the heat sink to move through the heat dissipation mechanism. The heat sink will drive the slider to slide inside the slide slot, and the heat sink will move together through the heat sink, so that the heat sink and the circuit board body are fitted together, which is convenient for heat dissipation of the circuit board body through the heat sink and the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the structure of this application;

[0027] Figure 2 A schematic diagram of the three-dimensional structure of this application;

[0028] Figure 3 This is a schematic diagram of the structure of the packaging mechanism of this application;

[0029] Figure 4 This is a schematic diagram of the structure of the heat dissipation mechanism of this application.

[0030] In the figure: 1. substrate; 2. connecting plate; 3. packaging mechanism; 301. mounting groove; 302. cofferdam; 303. circuit board body; 304. micro pixel body; 305. filling layer; 4. mounting sleeve; 5. heat dissipation mechanism; 501. fixing groove; 502. radiator; 503. heat sink; 504. slider; 505. slide groove; 6. mounting hole. Detailed implementation manners

[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0032] Please refer to Figure 1 , an integrated circuit board structure of a COB packaging micro-pixel multiplexing technology in this embodiment includes a substrate 1. A packaging mechanism 3 is provided on the upper surface of the substrate 1, and a heat dissipation mechanism 5 is provided inside the substrate 1. The packaging mechanism 3 is dissipated by the heat dissipation mechanism 5. Connecting plates 2 are fixed on both the left and right sides of the substrate 1. Mounting holes 6 are opened on the upper surface of the connecting plates 2, and mounting sleeves 4 are sleeved inside the mounting holes 6. The mounting sleeves 4 are in an I shape, and the substrate 1 is conveniently mounted through the mounting sleeves 4.

[0033] Please refer to Figure 2 , for packaging, the packaging mechanism 3 in this embodiment includes a circuit component and a sealing component. The circuit component includes a mounting groove 301 opened on the upper surface of the substrate 1, a circuit board body 303 fixed inside the mounting groove 301, and a plurality of micro-pixel bodies 304 fixed on the upper surface of the circuit board body 303. By mounting a plurality of micro-pixel bodies 304 on the circuit board body 303 and sharing a plurality of micro-pixel bodies 304 with one circuit board body 303, the size of the display device can be reduced and the pixel density can be increased, so that the display screen can have a higher resolution under the same size, and the cost and power consumption can be reduced.

[0034] The sealing component includes a cofferdam 302 fixed on the upper surface of the substrate 1 and a filling layer 305 fixed inside the cofferdam 302.

[0035] Among them, the cofferdam 302 is in a zigzag shape, and the filling layer 305 is a fluorescent glue. The phosphor glue is a two-component, heat-curable silicone, which is used for LED packaging. After curing, it has the characteristics of high light transmittance, high refractive index, good thermal stability, small stress, and low hygroscopicity, and does not affect the light output and appearance of the COB.

[0036] In addition, the filling layer 305 is fixed on the upper surface of the circuit board body 303 and on the outer surface of the micro-pixel body 304, and is used for packaging the circuit board body 303 and the micro-pixel body 304. The circuit board body 303 is attached to the inner cavity wall of the cofferdam 302, and the circuit board body 303 is protected by the cofferdam 302.

[0037] The packaging mechanism 3 in this embodiment, after welding a plurality of tiny pixel bodies 304 to the upper surface of the circuit board body 303, places the circuit board body 303 into the interior of the mounting groove 301 through the cofferdam 302, fixes the circuit board body 303 with glue, and then applies a filling layer 305 on the upper surface of the circuit board body 303, and packages the circuit board body 303 and the tiny pixel body 304 with the filling layer 305.

[0038] See also Figure 3 and Figure 4 In order to dissipate the heat of the circuit board body 303, the heat dissipation mechanism 5 in this embodiment includes a fixing groove 501 opened on the back of the substrate 1, sliding grooves 505 opened on the left and right sides of the inner cavity of the fixing groove 501, a heat sink 502 slidably connected to the inside of the fixing groove 501, a heat sink 503 fixed on the upper surface of the heat sink 502, and sliders 504 fixed on the left and right sides of the heat sink 502. The heat of the circuit board body 303 is dissipated through the heat sink 502 and the heat sink 503.

[0039] The fixing groove 501 is T-shaped, the upper surface of the heat sink 503 is attached to the lower surface of the circuit board body 303, and the heat sink 502 and the heat sink 503 are used to dissipate heat from the circuit board body 303 to prevent the circuit board body 303 from being damaged due to excessive temperature.

[0040] In addition, the slider 504 and the slide groove 505 are both T-shaped, and the slider 504 is slidably connected to the inside of the slide groove 505, which increases the stability of the heat sink 502 when moving and facilitates the heat sink 502 to dissipate heat from the circuit board body 303.

[0041] The heat dissipation mechanism 5 in this embodiment pushes the radiator 502 to move, and the radiator 502 drives the slider 504 to slide inside the slide groove 505, and drives the heat sink 503 to move together through the radiator 502, so that the heat sink 503 fits with the circuit board body 303, which facilitates the heat dissipation of the circuit board body 303 through the radiator 502 and the heat sink 503.

[0042] It should be noted that combining COB packaging technology with micro-pixel multiplexing technology can further reduce the chip packaging size and further improve the pixel density of display devices. The application of this technology in the display field can bring more refined and high-definition display effects, while also meeting the demand for lightweight and highly integrated products, such as smart phones, tablets and other mobile devices.

[0043] The working principle of the above embodiment is:

[0044] (1) After welding a plurality of tiny pixel bodies 304 to the upper surface of the circuit board body 303, glue is applied to the bottom of the circuit board body 303, and the circuit board body 303 is placed into the interior of the mounting groove 301 through the cofferdam 302. After the circuit board body 303 is fixed by glue, a filling layer 305 is applied to the upper surface of the circuit board body 303 so that the filling layer 305 is flush with the cofferdam 302, and the circuit board body 303 and the tiny pixel bodies 304 are encapsulated by the filling layer 305.

[0045] (2) After aligning the slider 504 with the slide groove 505, push the heat sink 502 to move. The heat sink 502 will drive the slider 504 to slide inside the slide groove 505, and the heat sink 502 will slide inside the fixed groove 501. The movement of the heat sink 502 will drive the heat sink 503 to move together, so that the heat sink 503 fits with the circuit board body 303, which facilitates the heat dissipation of the circuit board body 303 through the heat sink 502 and the heat sink 503.

Claims

1. An integrated circuit board structure of COB packaging micro-pixel multiplexing technology, comprising a substrate (1), characterized in that: The upper surface of the substrate (1) is provided with a packaging mechanism (3), the inside of the substrate (1) is provided with a heat dissipation mechanism (5), both left and right sides of the substrate (1) are fixed with connecting plates (2), the upper surface of the connecting plate (2) is provided with mounting holes (6), and a mounting sleeve (4) is sleeved inside the mounting hole (6); The packaging mechanism (3) includes a circuit component and a sealing component. The circuit component includes a mounting groove (301) formed on the upper surface of the substrate (1), a circuit board body (303) fixed inside the mounting groove (301), and a plurality of micro pixel bodies (304) fixed on the upper surface of the circuit board body (303).

2. The integrated circuit board structure of the COB packaging micro-pixel multiplexing technology according to claim 1 is characterized in that: The sealing component includes a cofferdam (302) fixed on the upper surface of the substrate (1) and a filling layer (305) fixed inside the cofferdam (302).

3. The integrated circuit board structure of the COB packaging micro-pixel multiplexing technology according to claim 2 is characterized in that: The cofferdam (302) is in a zigzag shape, and the filling layer (305) is a fluorescent glue.

4. The integrated circuit board structure of the COB packaging micro-pixel multiplexing technology according to claim 2, characterized in that: The filling layer (305) is fixed on the upper surface of the circuit board body (303), and the filling layer (305) is fixed on the outer surface of the micro pixel body (304).

5. The integrated circuit board structure of the COB packaging micro-pixel multiplexing technology according to claim 2, characterized in that: The mounting sleeve (4) is in an I shape, and the circuit board body (303) is attached to the inner cavity wall of the cofferdam (302).

6. The integrated circuit board structure of the COB packaging micro-pixel multiplexing technology according to claim 1, characterized in that: The heat dissipation mechanism (5) includes a fixing groove (501) formed on the back surface of the substrate (1), sliding grooves (505) formed on the left and right sides inside the inner cavity of the fixing groove (501), a radiator (502) slidably connected inside the fixing groove (501), heat dissipation fins (503) fixed on the upper surface of the radiator (502), and sliders (504) fixed on the left and right sides of the radiator (502).

7. The integrated circuit board structure of the COB packaging micro-pixel multiplexing technology according to claim 6, characterized in that: The fixing groove (501) is in a T shape, and the upper surface of the heat dissipation fin (503) is attached to the lower surface of the circuit board body (303).

8. The integrated circuit board structure of the COB packaging micro-pixel multiplexing technology according to claim 6, characterized in that: Both the slider (504) and the sliding groove (505) are in a T shape, and the slider (504) is slidably connected inside the sliding groove (505).

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