Sapphire grinding device and wandering star wheel thereof

Abstract

The utility model relates to a sapphire grinding device and a wandering star wheel thereof.The wandering star wheel comprises a wheel disc body and wheel teeth formed on the outer circumferential face of the wheel disc body, the wandering star wheel is used for being placed on a lower grinding disc of the sapphire grinding device, and the wheel teeth are used for being meshed with a sun gear of the sapphire grinding device and a gear ring located on the outer side of the sun gear; a plurality of through holes extending in the axial direction of the wheel disc body are formed in the wheel disc body, each through hole is used for allowing a sapphire wafer to be embedded so as to fix the sapphire wafer, the through holes comprise the first through holes and the second through holes, the first through holes are formed in the circumferential direction of the wheel disc body at intervals, and the second through holes are formed in the circumferential direction of the wheel disc body at intervals. The multiple second through holes are located in the inner sides of the multiple first through holes and arranged at intervals in the circumferential direction of the wheel disc body, and the minimum distance between the hole wall of each first through hole and the outer circumferential face of the wheel disc body is 9.30 mm to 9.34 mm. The wandering star wheel can fix more sapphire wafers, so that the grinding processing efficiency of the sapphire grinding device is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of sapphire grinding equipment, and in particular to a sapphire grinding device and a planetary wheel thereof. Background Art

[0002] Sapphire is a high-quality optical functional material with extremely high hardness, high temperature resistance, wear resistance, corrosion resistance, thermal conductivity, electrical insulation, good mechanical properties and a wide light transmission band. The ground sapphire wafers are widely used in high-brightness LED substrate materials, various optical components, and scanner window materials.

[0003] In the prior art, a sapphire grinding device is usually used to grind the sapphire on both sides, and the sapphire wafer is fixed on a planetary wheel (such as the Chinese utility model patent with the announcement number CN220145530U), and the upper grinding disc and the lower grinding disc rotate in opposite directions, and the planetary wheel is driven to rotate by the sun gear and the gear ring to achieve double-sided grinding of the sapphire wafer. However, the grinding efficiency of the existing sapphire grinding device is not ideal. The reason is that the design of the planetary wheel is unreasonable, and the number of sapphire wafers that can be accommodated by the planetary wheel is small. With the increasing market demand for sapphire wafers, improving the grinding efficiency of the sapphire grinding device has become an important research direction in this field. Utility Model Content

[0004] The purpose of the present disclosure is to provide a sapphire grinding device and a planetary wheel thereof. By using the planetary wheel, the number of sapphire wafers accommodated by the planetary wheel can be increased, thereby improving the grinding processing efficiency of the sapphire grinding device.

[0005] In order to achieve the above-mentioned object, according to a first aspect of the present disclosure, a planetary wheel of a sapphire grinding device is provided, the planetary wheel comprising a wheel disc body and gear teeth formed on the outer peripheral surface of the wheel disc body, the planetary wheel is used to be placed on the lower grinding disc of the sapphire grinding device, and the gear teeth are used to mesh with the sun gear of the sapphire grinding device and the gear ring located outside the sun gear;

[0006] The wheel disc body is formed with a plurality of through holes extending along the axial direction of the wheel disc body, each of the through holes being used for embedding a sapphire wafer to fix the sapphire wafer;

[0007] The plurality of through holes include a plurality of first through holes and a plurality of second through holes, the plurality of first through holes are arranged at intervals along the circumference of the wheel disc body, and the plurality of second through holes are located inside the plurality of first through holes and are arranged at intervals along the circumference of the wheel disc body;

[0008] The minimum distance between the hole wall of each of the first through holes and the outer peripheral surface of the wheel disc body is 9.30 mm to 9.34 mm.

[0009] Optionally, the minimum distance between the hole walls of every two adjacent first through holes is 11.12 mm to 11.16 mm.

[0010] Optionally, the minimum distance between the hole wall of each second through hole and the hole wall of the adjacent first through hole is 8.70 mm to 8.74 mm; and / or,

[0011] The minimum distance between the hole wall of each of the second through holes and the outer peripheral surface of the wheel disc body is 110.71 mm to 110.75 mm.

[0012] Optionally, the minimum distance between the hole walls of every two adjacent second through holes is 13.65 mm to 13.69 mm.

[0013] Optionally, a first liquid leakage hole extending along the axial direction of the wheel disc body is formed on the wheel disc body;

[0014] The central axis of the first leakage hole coincides with the central axis of the wheel disc body, and the minimum distance between the hole wall of the first leakage hole and the hole wall of the second through hole is 28.85 mm to 28.89 mm.

[0015] Optionally, a plurality of second liquid leakage holes extending along the axial direction of the wheel disc body are formed on the wheel disc body, the plurality of second liquid leakage holes are located between the plurality of first through holes and the plurality of second through holes, and the plurality of second liquid leakage holes are arranged at intervals along the circumference of the wheel disc body;

[0016] The minimum distance between the hole wall of each second leakage hole and the hole wall of the adjacent first through hole is 7.3 mm to 7.7 mm;

[0017] The minimum distance between the hole wall of each second liquid leakage hole and the hole wall of the adjacent second through hole is 8.13 mm to 7.17 mm.

[0018] Optionally, a plurality of third liquid leakage holes extending along the axial direction of the wheel disc body are formed on the wheel disc body;

[0019] The plurality of third leakage holes are arranged at intervals along the circumference of the wheel disc body, and the distance between the center of each third leakage hole and the center of the wheel disc body is greater than the distance between the center of the first through hole and the center of the wheel disc body;

[0020] The minimum distance between the hole wall of each of the third leakage holes and the hole wall of the first through hole adjacent thereto is 8.26 mm to 8.30 mm;

[0021] The distance between the hole wall of each of the third leakage holes and the outer peripheral surface of the wheel disc body is 16.22 mm to 16.26 mm.

[0022] Optionally, the diameter of the first through hole and the diameter of the second through hole are both 100.35 mm to 100.45 mm.

[0023] Optionally, the thickness of the roulette body along its own axial direction is 0.62mm-0.73mm, and the outer diameter of the roulette body is 549.98mm-550.02mm.

[0024] According to a second aspect of the present disclosure, a sapphire grinding device is provided, comprising an upper grinding disc, a lower grinding disc, a sun gear, a gear ring and the above-mentioned planetary wheel, wherein the upper grinding disc and the lower grinding disc are arranged opposite to each other, the planetary wheel is placed on the lower grinding disc, and the teeth of the planetary wheel are meshed with the sun gear and the gear ring located outside the sun gear.

[0025] Compared with the planetary wheel of the sapphire grinding device in the prior art, the planetary wheel provided in the present application is provided with two circles of through holes (i.e., the first through holes located in the outer circle and the second through holes located in the inner circle) on the wheel disc body, so that more through holes can be provided on the wheel disc body, so that the planetary wheel can fix more sapphire wafers. In addition, by setting the minimum spacing a between the hole wall of each first through hole and the outer peripheral surface of the wheel disc body to 9.30mm-9.34mm, the first through holes can be close to the edge of the wheel disc body while ensuring that the wheel disc body has sufficient rigidity and strength, so that the inner side of the plurality of first through holes has a larger space, so that more second through holes can be provided on the wheel disc body, and more through holes can be provided on the wheel disc body, so that the planetary wheel can fix more sapphire wafers, so that the sapphire grinding device can grind and process more sapphire wafers at a time, thereby improving the grinding efficiency of the sapphire grinding device.

[0026] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0028] Figure 1 is a schematic diagram of the three-dimensional structure of a sapphire grinding device provided in one embodiment of the present disclosure;

[0029] Figure 2 1. A top view of a planetary wheel of a sapphire grinding device provided in one embodiment of the present disclosure.

[0030] Description of Reference Numerals

[0031] 1-sapphire grinding device; 2-lower grinding disc; 3-upper grinding disc; 4-sun gear; 5-tooth ring; 10-planetary wheel; 11-wheel body; 12-tooth; 20-through hole; 21-first through hole; 22-second through hole; 30-first leakage hole; 40-second leakage hole; 50-third leakage hole; a-the minimum distance between the hole wall of the first through hole and the outer peripheral surface of the wheel body; b-the minimum distance between the hole walls of each adjacent two first through holes; c-the minimum distance between the hole wall of each second through hole and the hole wall of the adjacent first through hole; d-the minimum distance between the hole wall of each second through hole and the outer peripheral surface of the wheel body Small spacing; e-the minimum spacing between the hole walls of every two adjacent second through holes; f-the minimum spacing between the hole wall of the first leakage hole and the hole wall of the second through hole; g-the minimum spacing between the hole wall of each second leakage hole and the hole wall of the adjacent first through hole; h-the minimum spacing between the hole wall of each second leakage hole and the hole wall of the adjacent second through hole; i-the minimum spacing between the hole wall of each third leakage hole and the hole wall of the adjacent first through hole; j-the spacing between the hole wall of each third leakage hole and the outer peripheral surface of the wheel body; k1-the aperture of the first through hole; k2-the aperture of the second through hole; D-the outer diameter of the wheel body. DETAILED DESCRIPTION

[0032] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0033] In the present disclosure, unless otherwise stated, directional terms such as "upper, lower, top, bottom" are generally defined in terms of the drawing direction of the corresponding drawings (see Figure 1 The above descriptions are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, a specific orientation structure and operation, and therefore cannot be understood as limiting the present disclosure. "Inside and outside" refer to the inside and outside of the corresponding component outline. In addition, the terms "first", "second", etc. used are to distinguish one element from another, and do not have order and importance.

[0034] In the description of the present disclosure, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "connect", "connected", and "installed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0035] like Figure 1 and Figure 2 As shown, according to the first aspect of the present disclosure, a planetary wheel 10 of a sapphire grinding device is provided, the planetary wheel 10 includes a wheel disc body 11 and gear teeth 12 formed on the outer peripheral surface of the wheel disc body 11, the planetary wheel 10 is used to be placed on the lower grinding disc 2 of the sapphire grinding device 1, the gear teeth 12 are used to mesh with the sun gear 4 of the sapphire grinding device 1 and the gear ring 5 located outside the sun gear 4, a plurality of through holes 20 extending along the axial direction of the wheel disc body 11 are formed on the wheel disc body 11, each through hole 20 is used for embedding a sapphire wafer to fix the sapphire wafer, the plurality of through holes 20 include a plurality of first through holes 21 and a plurality of second through holes 22, the plurality of first through holes 21 are arranged at intervals along the circumference of the wheel disc body 11, the plurality of second through holes 22 are located on the inner side of the plurality of first through holes 21 and are arranged at intervals along the circumference of the wheel disc body 11, and the minimum spacing a between the hole wall of each first through hole 21 and the outer peripheral surface of the wheel disc body 11 can be 9.30 mm to 9.34 mm.

[0036] Through the above technical scheme, the use process of the sapphire grinding device 1 can be as follows: the planetary wheel 10 can be placed on the lower grinding disc 2 first, and the gear teeth 12 of the planetary wheel 10 are meshed with the sun gear 4 and the gear ring 5 located on the outside of the sun gear 4, and then the sapphire wafer is embedded in the through hole 20 of the wheel body 11 to fix the sapphire wafer on the planetary wheel 10, and then the upper grinding disc 3 of the sapphire grinding device 1 is lowered until the upper grinding disc 3 and the lower grinding disc 2 are in contact with the upper and lower ends of the sapphire wafer respectively, and finally the sapphire grinding device 1 is started to make the upper grinding disc 3 and the lower grinding disc 2 rotate in the opposite direction, and the sun gear 4 and the gear ring 5 rotate in the opposite direction to drive the planetary wheel 10 to rotate, thereby realizing double-sided grinding of the sapphire wafer.

[0037] Compared with the planetary wheel of the sapphire grinding device in the prior art, the planetary wheel 10 provided in the present application has two circles of through holes 20 arranged on the roulette body 11 (i.e., a first through hole 21 located in the outer circle and a second through hole 22 located in the inner circle), so that more through holes 20 can be arranged on the roulette body 11, thereby enabling the planetary wheel 10 to fix a larger number of sapphire wafers. Furthermore, by setting the minimum spacing a between the hole wall of each first through hole 21 and the outer peripheral surface of the roulette body 11 to 9.30 mm to 9.34 mm, the first through holes 21 can be placed close to the edge of the roulette body 11 while ensuring that the roulette body 11 has sufficient rigidity and strength, so that the inner sides of the multiple first through holes 21 have a larger space, so that more second through holes 22 can be provided on the roulette body 11, and more through holes 20 can be provided on the roulette body 11, so that the planetary wheel 10 can fix a larger number of sapphire wafers, and the sapphire grinding device 1 can grind and process more sapphire wafers at a time, thereby improving the grinding efficiency of the sapphire grinding device 1.

[0038] In order to provide more first through holes 21 on the roulette body 11, as an implementation method, Figure 2 As shown, the minimum spacing b between the hole walls of each two adjacent first through holes 21 can be 11.12 mm to 11.16 mm. While ensuring that the roulette body 11 has sufficient rigidity and strength, the multiple first through holes 21 can be arranged more compactly, so that more first through holes 21 can be provided on the roulette body 11, further increasing the number of sapphire wafers that can be fixed on the planetary wheel 10.

[0039] In order to provide more second through holes 22 on the roulette body 11, as an optional embodiment, Figure 2 As shown, the minimum spacing c between the hole wall of each second through hole 22 and the hole wall of the adjacent first through hole 21 can be 8.70 mm to 8.74 mm. While ensuring that the roulette body 11 has sufficient rigidity and strength, the second through holes 22 can be arranged along a circle with a larger diameter, so that more second through holes 22 can be provided on the roulette body 11.

[0040] Optionally, the minimum distance d between the hole wall of each second through hole 22 and the outer circumferential surface of the roulette body 11 can be 110.71 mm to 110.75 mm, or the second through holes 22 can be arranged along a circle with a larger diameter while ensuring that the roulette body 11 has sufficient rigidity and strength, so that more second through holes 22 can be provided on the roulette body 11.

[0041] In addition, in order to provide more second through holes 22 on the wheel body 11, as an optional embodiment, Figure 2 As shown, the minimum spacing e between the hole walls of each two adjacent second through holes 22 can be 13.65 mm to 13.69 mm, which can make the multiple second through holes 22 arranged more compactly while ensuring that the roulette body 11 has sufficient rigidity and strength, so that more second through holes 22 can be provided on the roulette body 11.

[0042] The sapphire grinding device 1 usually sprays grinding liquid above the planetary wheel 10 to improve the grinding effect of the upper grinding disc 3 and the lower grinding disc 2 on the sapphire wafer. In order to make the grinding liquid sprayed on the upper side of the planetary wheel 10 flow well to the lower side of the planetary wheel 10, as an embodiment, Figure 2 As shown, a first leakage hole 30 extending along the axial direction of the wheel body 11 is formed on the wheel body 11, the central axis of the first leakage hole 30 coincides with the central axis of the wheel body 11, and the minimum spacing f between the hole wall of the first leakage hole 30 and the hole wall of the second through hole 22 can be 28.85mm~28.89mm.

[0043] By setting the minimum spacing f between the hole wall of the first leakage hole 30 and the hole wall of the second through hole 22 to 28.85 mm to 28.89 mm, the first leakage hole 30 can have a larger aperture while ensuring that the wheel body 11 has sufficient rigidity and strength, so that the planetary wheel 10 has good leakage ability. In other words, the grinding liquid sprayed on the upper side of the planetary wheel 10 can flow well to the lower side of the planetary wheel 10 through the first leakage hole 30.

[0044] In order to make the planetary wheel 10 have good leakage capacity, as an implementation method, Figure 2 As shown, a plurality of second leakage holes 40 extending along the axial direction of the wheel body 11 are formed on the wheel body 11, and the plurality of second leakage holes 40 are located between the plurality of first through holes 21 and the plurality of second through holes 22, and the plurality of second leakage holes 40 are arranged at intervals along the circumference of the wheel body 11, and the minimum spacing g between the hole wall of each second leakage hole 40 and the hole wall of the adjacent first through hole 21 can be 7.3mm~7.7mm, and the minimum spacing h between the hole wall of each second leakage hole 40 and the hole wall of the adjacent second through hole 22 can be 8.13mm~7.17mm.

[0045] By setting the minimum spacing g between the hole wall of each second leakage hole 40 and the hole wall of the adjacent first through hole 21 to 7.3mm~7.7mm, and setting the minimum spacing h between the hole wall of each second leakage hole 40 and the hole wall of the adjacent second through hole 22 to 8.13mm~7.17mm, the second leakage hole 40 can have a larger aperture while ensuring that the wheel body 11 has sufficient rigidity and strength, so that the planetary wheel 10 has good leakage ability. In other words, the grinding liquid sprayed on the upper side of the planetary wheel 10 can better flow to the lower side of the planetary wheel 10 through the second leakage hole 40.

[0046] In order to make the planetary wheel 10 have good leakage capacity, as an implementation method, Figure 2 As shown, a plurality of third leakage holes 50 extending along the axial direction of the wheel body 11 are formed on the wheel body 11, and the plurality of third leakage holes 50 are arranged at intervals along the circumference of the wheel body 11. The distance between the center of each third leakage hole 50 and the center of the wheel body 11 is greater than the distance between the center of the first through hole 21 and the center of the wheel body 11. The minimum distance i between the hole wall of each third leakage hole 50 and the hole wall of the adjacent first through hole 21 is 8.26mm~8.30mm, and the distance j between the hole wall of each third leakage hole 50 and the outer peripheral surface of the wheel body 11 is 16.22mm~16.26mm.

[0047] By setting the minimum spacing i between the hole wall of each third leakage hole 50 and the hole wall of the adjacent first through hole 21 to 8.26mm~8.30mm, and setting the spacing j between the hole wall of each third leakage hole 50 and the outer peripheral surface of the wheel body 11 to 16.22mm~16.26mm, the third leakage hole 50 can have a larger aperture while ensuring that the wheel body 11 has sufficient rigidity and strength, so that the planetary wheel 10 has good leakage ability. In other words, the grinding liquid sprayed on the upper side of the planetary wheel 10 can flow better to the lower side of the planetary wheel 10 through the third leakage hole 50.

[0048] In the present disclosure, the first through hole 21 and the second through hole 22 can be set to any suitable aperture according to actual needs, and the present disclosure does not limit this. As an implementation mode, Figure 2 As shown, the aperture k1 of the first through hole 21 and the aperture k2 of the second through hole 22 may both be 100.35 mm to 100.45 mm, so that the first through hole 21 and the second through hole 22 can be used to embed a sapphire wafer of a regular size.

[0049] In the present disclosure, the outer diameter and the thickness along the axial direction of the wheel body 11 can be set to any suitable size according to actual needs, and the present disclosure does not limit this. As an implementation method, Figure 2 As shown, the thickness of the roulette body 11 along its own axis can be 0.62mm~0.73mm, and the outer diameter D of the roulette body 11 can be 549.98mm~550.02mm, so that the roulette body 11 not only has sufficient rigidity and strength, but also has a light weight, which is convenient for staff to operate it.

[0050] like Figure 1 As shown, according to the second aspect of the present disclosure, a sapphire grinding device 1 is provided, comprising an upper grinding disc 3, a lower grinding disc 2, a sun gear 4, a gear ring 5 and the above-mentioned planetary wheel 10, the upper grinding disc 3 and the lower grinding disc 2 are arranged opposite to each other, the planetary wheel 10 is placed on the lower grinding disc 2, and the teeth 12 of the planetary wheel 10 are meshed with the sun gear 4 and the gear ring 5 located outside the sun gear 4.

[0051] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0052] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0053] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A planetary wheel of a sapphire grinding device, characterized in that: The planetary wheel comprises a wheel disc body and gear teeth formed on the outer peripheral surface of the wheel disc body, the planetary wheel is used to be placed on the lower grinding disc of the sapphire grinding device, and the gear teeth are used to mesh with the sun gear of the sapphire grinding device and the gear ring located outside the sun gear; The wheel disc body is formed with a plurality of through holes extending along the axial direction of the wheel disc body, each of the through holes being used for embedding a sapphire wafer to fix the sapphire wafer; The plurality of through holes include a plurality of first through holes and a plurality of second through holes, the plurality of first through holes are arranged at intervals along the circumference of the wheel disc body, and the plurality of second through holes are located inside the plurality of first through holes and are arranged at intervals along the circumference of the wheel disc body; The minimum distance between the hole wall of each of the first through holes and the outer peripheral surface of the wheel disc body is 9.30 mm to 9.34 mm.

2. The planetary wheel according to claim 1, characterized in that: The minimum distance between the hole walls of each two adjacent first through holes is 11.12 mm to 11.16 mm.

3. The planetary wheel according to claim 1, characterized in that: The minimum distance between the hole wall of each second through hole and the hole wall of the adjacent first through hole is 8.70 mm to 8.74 mm; and / or, The minimum distance between the hole wall of each of the second through holes and the outer peripheral surface of the wheel disc body is 110.71 mm to 110.75 mm.

4. The planetary wheel according to claim 1, characterized in that: The minimum distance between the hole walls of each two adjacent second through holes is 13.65 mm to 13.69 mm.

5. The planetary wheel according to any one of claims 1 to 4, characterized in that: The wheel disc body is formed with a first liquid leakage hole extending along the axial direction of the wheel disc body; The central axis of the first leakage hole coincides with the central axis of the wheel disc body, and the minimum distance between the hole wall of the first leakage hole and the hole wall of the second through hole is 28.85 mm to 28.89 mm.

6. The planetary wheel according to any one of claims 1 to 4, characterized in that: The roulette body is formed with a plurality of second leakage holes extending along the axial direction of the roulette body, the plurality of second leakage holes are located between the plurality of first through holes and the plurality of second through holes, and the plurality of second leakage holes are arranged at intervals along the circumference of the roulette body; The minimum distance between the hole wall of each second leakage hole and the hole wall of the adjacent first through hole is 7.3 mm to 7.7 mm; The minimum distance between the hole wall of each second liquid leakage hole and the hole wall of the adjacent second through hole is 8.13 mm to 7.17 mm.

7. The planetary wheel according to any one of claims 1 to 4, characterized in that: The wheel disc body is formed with a plurality of third liquid leakage holes extending along the axial direction of the wheel disc body; The plurality of third leakage holes are arranged at intervals along the circumference of the wheel disc body, and the distance between the center of each third leakage hole and the center of the wheel disc body is greater than the distance between the center of the first through hole and the center of the wheel disc body; The minimum distance between the hole wall of each of the third leakage holes and the hole wall of the first through hole adjacent thereto is 8.26 mm to 8.30 mm; The distance between the hole wall of each of the third leakage holes and the outer peripheral surface of the wheel disc body is 16.22 mm to 16.26 mm.

8. The planetary wheel according to any one of claims 1 to 4, characterized in that: The diameter of the first through hole and the diameter of the second through hole are both 100.35 mm to 100.45 mm.

9. The planetary wheel according to any one of claims 1 to 4, characterized in that: The thickness of the roulette body along its own axial direction is 0.62mm-0.73mm, and the outer diameter of the roulette body is 549.98mm-550.02mm.

10. A sapphire grinding device, characterized in that: It comprises an upper grinding disc, a lower grinding disc, a sun gear, a gear ring and a planetary wheel as described in any one of claims 1 to 9, wherein the upper grinding disc and the lower grinding disc are arranged opposite to each other, the planetary wheel is placed on the lower grinding disc, and the teeth of the planetary wheel are meshed with the sun gear and the gear ring located outside the sun gear.

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