Pulse type electroplating device for radio frequency inductor

Abstract

The utility model provides a pulse type electroplating device for a radio frequency inductor, which comprises an electroplating device main body, a top cover and a base, the side wall of the lower end of the electroplating device main body is provided with a waste liquid discharge port, the electroplating device main body is internally provided with a plurality of placing plates, and the placing plates are fixed on the inner wall of the electroplating device main body through placing blocks; the placing blocks are fixed on the inner wall of the electroplating device main body according to different heights, a plurality of through holes are formed in the placing plate, clamping blocks are arranged on the periphery of the placing plate, matched clamping grooves are formed in the placing blocks, when the placing plate is placed on the placing blocks, the clamping blocks are clamped into the clamping grooves, and the clamping blocks are clamped into the clamping grooves. According to the electroplating device disclosed by the invention, the plurality of placing plates are arranged in the electroplating device main body, the plurality of placing plates are fixed in the electroplating device main body through the placing blocks, and the interior of the electroplating device main body is divided into a plurality of spaces, so that multiple batches of electronic components with different specifications can be placed, electroplating operation can be carried out simultaneously, and the working efficiency is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, in particular to a pulse electroplating device for radio frequency inductors. Background Art

[0002] Electroplating technology is widely used in various applications and fields. Electroplating equipment usually includes components such as an electroplating tank, an electroplating solution, a cathode, an anode, an object to be plated, and an electroplated metal. The object to be plated is connected to the cathode, and the electroplated metal is connected to the anode. When an external voltage is applied between the cathode and the anode, the electroplated metal will precipitate positively charged electroplated metal ions, and negatively charged electrons will gather on the surface of the object to be plated. The electroplated metal ions are attracted by the electrons and flow to the surface of the object to be plated through the electroplating solution, so as to combine with the electrons on the surface of the object to be plated and deposit on the surface to be plated to form a coating film;

[0003] The existing Chinese patent document CN201520265652.8 relates to an electroplating device, which includes a tank body, a conductive frame and an anode basket. The tank body is provided with a receiving cavity for holding the electroplating solution; the conductive frame is mounted on the tank body, and the conductive frame includes a hanging rod portion, which is received in the receiving cavity and is lower than the liquid level of the electroplating solution; the anode basket is received in the receiving cavity, and the anode basket is mounted on the hanging rod portion and is electrically connected to the hanging rod portion, and the anode basket portion is lower than the liquid level of the electroplating solution. The above-mentioned electroplating device avoids the problems of surface oxidation of the hanging rod portion and surface precipitation of copper salt crystals during the electroplating process, so that the conductivity of the contact between the anode basket and the hanging rod portion can be ensured without cleaning the conductive frame during the electroplating process, making the electroplating process simpler and reducing energy consumption.

[0004] However, the above patent has certain defects when in use. Due to the large number of electronic components, the device cannot continuously perform electroplating operations on multiple electronic components. It is necessary to add a liquid storage device to continuously provide electrolyte. In addition, electronic components have high requirements for electroplating liquid. During the transportation of the electroplating liquid, the electroplating liquid is easily contaminated, resulting in poor electroplating effect of the finished product and affecting the production qualification rate.

[0005] To this end, a pulse electroplating device for radio frequency inductors is proposed to solve the above-mentioned problems. Utility Model Content

[0006] In order to overcome the deficiencies of the prior art, the utility model provides a pulse electroplating device for radio frequency inductors.

[0007] The utility model is implemented by the following technical solutions:

[0008] A pulse electroplating device for radio frequency inductance, comprising an electroplating device body, a top cover and a base, wherein the electroplating device body is fixed to the upper end of the base, the top cover is fixed to the top of the electroplating device body, a waste liquid discharge port is provided on the lower end side wall of the electroplating device body, a plurality of placement plates are provided inside the electroplating device body, and the placement plates are fixed to the inner wall of the electroplating device body through placement blocks;

[0009] There are multiple placement blocks, which are fixed on the inner wall of the electroplating device body at different heights. The placement plate is provided with multiple through holes. The placement plate is provided with clamping blocks around it. The placement block is provided with a matching clamping slot. When the placement plate is placed on the placement block, the clamping block is engaged in the clamping slot.

[0010] A liquid storage tank is provided on the side of the electroplating device body, a liquid filling port is provided on the top of the liquid storage tank, a liquid outlet is provided on the side of the liquid storage tank, a circulating pump is provided inside the liquid storage tank, and the output end of the circulating pump is connected to the liquid outlet;

[0011] A liquid inlet is arranged on the side of the electroplating device body, and a connecting pipe is arranged between the liquid inlet and the liquid outlet, and the connecting pipe connects the liquid inlet and the liquid outlet.

[0012] A filtering device is also provided in the liquid storage tank, and the filtering device comprises a coarse filter screen, activated carbon and a fine filter screen, and the coarse filter screen, activated carbon and fine filter screen are fixed on the inner side wall of the liquid storage tank in sequence from top to bottom.

[0013] A motor is provided on the top of the electroplating device body, and the motor is fixed on the top cover. A rotating shaft is provided at the output end of the motor, and the rotating shaft extends into the electroplating device body. A plurality of stirring rods are provided on the outer peripheral wall of the rotating shaft.

[0014] A controller is provided on the front of the electroplating device body, and the controller is fixed on the surface of the electroplating device body.

[0015] Compared with the prior art, the utility model has the following beneficial effects:

[0016] 1. By arranging multiple placement plates inside the main body of the electroplating device, and fixing the multiple placement plates inside the main body of the electroplating device through placement blocks, the inside of the main body of the electroplating device is divided into multiple spaces, so that multiple batches of electronic components of different specifications can be placed, and electroplating operations can be carried out at the same time, which greatly improves work efficiency;

[0017] 2. A liquid storage tank is provided with a filter device inside the liquid storage tank. The filter device ensures that the electrolyte entering the liquid storage tank is clean and pollution-free, and the circulating pump inside the liquid storage tank can continuously provide electrolyte to the main body of the electroplating device, effectively avoiding the situation of insufficient electrolyte. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall appearance structure of the utility model;

[0019] Figure 2 It is a schematic diagram of the internal structure of the main body of the electroplating device of the utility model;

[0020] Figure 3 This is a schematic diagram of the internal structure of the liquid storage tank of the utility model;

[0021] Figure 4 This is a schematic diagram of the structure of the placement plate of the utility model;

[0022] In the figure: 1. electroplating device body; 11. controller; 12. top cover; 13. waste liquid discharge port; 14. liquid inlet; 15. placement block; 2. motor; 21. rotating shaft; 22. stirring rod; 3. base; 4. connecting pipe; 5. liquid storage tank; 51. liquid filling port; 52. liquid outlet; 6. placement plate; 61. through hole; 62. block; 7. circulation pump; 8. coarse filter; 81. activated carbon; 82. fine filter. DETAILED DESCRIPTION

[0023] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0024] The utility model is further described below in conjunction with the accompanying drawings.

[0025] like Figures 1 to 4 As shown, a pulse electroplating device for radio frequency inductance includes an electroplating device body 1, a top cover 12 and a base 3, wherein the electroplating device body 1 is fixed to the upper end of the base 3, the top cover 12 is fixed to the top of the electroplating device body 1, a waste liquid discharge port 13 is provided on the lower side wall of the electroplating device body 1, and a plurality of placement plates 6 are provided inside the electroplating device body 1, and the placement plates 6 are fixed to the inner wall of the electroplating device body 1 through placement blocks 15;

[0026] There are multiple placement blocks 15, which are fixed on the inner wall of the electroplating device body 1 at different heights. The placement plate 6 is provided with multiple through holes 61. The placement plate 6 is provided with card blocks 62 around it. The placement block 15 is provided with a corresponding card slot. When the placement plate 6 is placed on the placement block 15, the card block 62 is snapped into the card slot. The multiple placement plates 6 divide the interior of the electroplating device body 1 into multiple spaces, so that multiple batches of electronic components of different specifications can be placed, and then electroplating operations can be carried out simultaneously, which greatly improves work efficiency.

[0027] A liquid storage tank 5 is provided on the side of the electroplating device body 1, a liquid filling port 51 is provided on the top of the liquid storage tank 5, a liquid outlet 52 is provided on the side of the liquid storage tank 5, a circulating pump 7 is provided inside the liquid storage tank 5, and the output end of the circulating pump 7 is connected to the liquid outlet 52;

[0028] A liquid inlet 14 is disposed on the side of the electroplating device body 1 , and a connecting pipe 4 is disposed between the liquid inlet 14 and the liquid outlet 52 , and the connecting pipe 4 connects the liquid inlet 14 and the liquid outlet 52 .

[0029] The liquid storage tank 5 is also provided with a filtering device, which includes a coarse filter 8, activated carbon 81 and a fine filter 82. The coarse filter 8, activated carbon 81 and fine filter 82 are fixed on the inner wall of the liquid storage tank 5 from top to bottom in sequence. The electrolyte is added from the liquid filling port 51, and the coarse filter 8 filters large particles of solid impurities, and the activated carbon 81 further adsorbs them. Finally, the fine filter 82 filters small particles of impurities to ensure that the electrolyte entering the liquid storage tank 5 is clean and pollution-free.

[0030] A motor 2 is provided on the top of the electroplating device body 1, and the motor 2 is fixed on the top cover 12. A rotating shaft 21 is provided at the output end of the motor 2, and the rotating shaft 21 extends into the electroplating device body. A plurality of stirring rods 22 are provided on the outer peripheral wall of the rotating shaft 21. When the motor 2 is started, the stirring rods 22 are driven to rotate, thereby driving the stirring of the internal electrolyte, accelerating the electroplating reaction, improving efficiency, and making the electroplating more complete.

[0031] A controller 11 is provided on the front of the electroplating device body 1 , and the controller 11 is fixed on the surface of the electroplating device body 1 .

[0032] The use principle of the utility model is: when in use, open the top cover 12, take out the placement plate 6 in sequence, and then put the electronic components to be electroplated in sequence, each layer of electronic components is placed on the placement plate 6, and after placement, start the electroplating device body 1 to electroplate them;

[0033] Due to the large number, the circulation pump 7 is started during the electroplating process, and the circulation pump 7 draws the electrolyte in the liquid storage tank 5, and injects it into the interior of the electroplating device body from the liquid inlet 14 through the connecting pipe 4, so as to replenish the electrolyte, effectively avoid the occurrence of insufficient electrolyte, ensure that the device can perform electroplating operations on electronic components in batches, and greatly improve work efficiency.

[0034] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A pulse electroplating device for radio frequency inductors, comprising an electroplating device body (1), a top cover (12) and a base (3), wherein the electroplating device body (1) is fixed to the upper end of the base (3), and the top cover (12) is fixed to the top of the electroplating device body (1), characterized in that: A waste liquid discharge port (13) is provided on the lower side wall of the electroplating device body (1), and a plurality of placement plates (6) are provided inside the electroplating device body (1), wherein the placement plates (6) are fixed to the inner wall of the electroplating device body (1) via placement blocks (15); The placement blocks (15) are provided in plurality and fixed on the inner wall of the electroplating device body (1) at different heights. The placement plate (6) is provided with a plurality of through holes (61). The placement plate (6) is provided with clamping blocks (62) around the periphery. The placement block (15) is provided with a matching clamping groove. When the placement plate (6) is placed on the placement block (15), the clamping block (62) is clamped into the clamping groove.

2. The pulse electroplating device for radio frequency inductors according to claim 1, characterized in that: A liquid storage tank (5) is provided on the side of the electroplating device body (1), a liquid filling port (51) is provided on the top of the liquid storage tank (5), a liquid outlet (52) is provided on the side of the liquid storage tank (5), a circulating pump (7) is provided inside the liquid storage tank (5), and the output end of the circulating pump (7) is connected to the liquid outlet (52); A liquid inlet (14) is provided on the side of the electroplating device body (1), and a connecting pipe (4) is provided between the liquid inlet (14) and the liquid outlet (52), wherein the connecting pipe (4) connects the liquid inlet (14) and the liquid outlet (52).

3. The pulse electroplating device for radio frequency inductors according to claim 2, characterized in that: A filtering device is also provided in the liquid storage tank (5), the filtering device comprising a coarse filter (8), activated carbon (81) and a fine filter (82), the coarse filter (8), activated carbon (81) and fine filter (82) being fixed on the inner wall of the liquid storage tank (5) in sequence from top to bottom.

4. The pulse electroplating device for radio frequency inductors according to claim 3, characterized in that: A motor (2) is provided on the top of the electroplating device body (1), and the motor (2) is fixed on the top cover (12). A rotating shaft (21) is provided at the output end of the motor (2), and the rotating shaft (21) extends into the electroplating device body. A plurality of stirring rods (22) are provided on the outer peripheral wall of the rotating shaft (21).

5. The pulse electroplating device for radio frequency inductors according to claim 4, characterized in that: A controller (11) is provided on the front of the electroplating device body (1), and the controller (11) is fixed on the surface of the electroplating device body (1).

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