Light source for silicon wafer detection
By using a combined structure of cylindrical lens and uniform light parts in the light source for silicon wafer detection, the problem of poor uniformity of traditional light sources is solved, and the detection accuracy and equipment life are improved by optimizing the heat dissipation design.
Patent Information
- Application Number
- CN202421004054.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-10
- Publication Date
- 2025-01-17
- Estimated Expiration
- 2034-05-10
AI Technical Summary
The uniformity of traditional bar light sources on silicon wafers is poor, affecting detection accuracy.
A structure including a shell, a lamp plate, a cylindrical lens and a uniform light element are adopted, wherein the cylindrical lens is located between the lamp plate and the uniform light element. The uniform light element focuses and diverges light, so that the light between adjacent lamp beads is stacked on each other. To improve the uniformity of the light source, and improve the heat dissipation performance through the bent parts and the heat dissipation plate.
It effectively improves the uniformity and heat dissipation performance of the bar light source, extends the life of the lamp board, and improves the accuracy of silicon wafer detection.
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Figure CN222363785U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of photovoltaic cell production, and specifically to a light source for silicon wafer detection. Background Art
[0002] During the production of silicon wafers, a strip light source is required to illuminate the silicon wafers to cooperate with the detection mechanism to carry out detection of the silicon wafers, such as hidden crack detection.
[0003] Strip light sources are mostly formed by a number of lamp beads arranged linearly. Since there are gaps between adjacent lamp beads and the light emission angle of the lamp beads is large, the light intensity at the emission center is higher than the light intensity on the surrounding side, resulting in poor uniformity of the strip light source formed on the silicon wafer by traditional strip light sources, which ultimately affects the detection accuracy of the detection mechanism. Utility Model Content
[0004] In order to solve the above technical problems, the present application provides a light source for silicon wafer detection, which adopts the following technical solutions:
[0005] A light source for silicon wafer detection, comprising a housing, a light board, a cylindrical lens and a light homogenizing member, wherein:
[0006] The light board, the cylindrical lens and the light homogenizer are all arranged in the housing, wherein the cylindrical lens is located between the light board and the light homogenizer;
[0007] A plurality of lamp beads are evenly spaced along a first direction on a surface of the lamp board facing the cylindrical lens. The cylindrical lens is extended along the first direction. The cylindrical lens is configured to receive light emitted by each lamp bead and converge the light toward the bottom of the central axis of the cylindrical lens.
[0008] The light homogenizer is configured to receive the light converged by the cylindrical lens and diverge the light along a first direction, so that the light in the area between two adjacent lamp beads overlaps with each other after passing through the light homogenizer.
[0009] A light homogenizer is used to focus and diverge the light converged by the cylindrical lens along the first direction, so that the light in the area between two adjacent lamp beads overlaps with each other after passing through the light homogenizer, which can effectively even out the light between the two adjacent lamp beads and improve the uniformity of the strip light source.
[0010] In some embodiments, the light homogenizer includes a plurality of semi-cylindrical lenses arranged in a linear array along a first direction, each semi-cylindrical lens is extended in a horizontal plane in a direction perpendicular to the first direction, and each semi-cylindrical lens is configured to receive a corresponding portion of the light converged by the cylindrical lens, and the corresponding portion of the light is focused by the semi-cylindrical lens and then diverged, so that the light in the area between two adjacent lamp beads overlaps with each other after passing through the light homogenizer.
[0011] A light homogenizing member with a simple structure is provided, which includes a plurality of semi-cylindrical lenses arranged in a linear array along a first direction. Each semi-cylindrical lens receives a corresponding portion of light converged by a cylindrical lens, and focuses and then diverges the corresponding portion of light. Under the combined action of each semi-cylindrical lens, the light in the area between two adjacent lamp beads overlaps with each other, thereby ultimately improving the uniformity of the strip light source.
[0012] In some embodiments, the light homogenizer further includes a light-transmitting substrate extending along a first direction, and a plurality of semi-cylindrical lenses are arranged in a linear array along the first direction on a surface of the light-transmitting substrate facing away from the cylindrical lenses.
[0013] A plurality of semi-cylindrical lenses are arranged in a linear array along the first direction on the light-transmitting substrate, which facilitates the installation and maintenance of the light homogenizer and facilitates the processing and molding of the light homogenizer.
[0014] In some embodiments, adjacent hemicylindrical lenses are tangent or intersect.
[0015] Adjacent semi-cylindrical lenses are arranged tangently or intersectingly, so that the light propagating from the cylindrical lens to the semi-cylindrical lens can be focused and diverged by the semi-cylindrical lens as much as possible, so as to further improve the uniformity of the strip light source.
[0016] In some embodiments, the shell includes a first side panel and a second side panel, and the first end of the first side panel and the first end of the second side panel are both bent inward to form a bent portion; a heat sink is provided on the side of the light panel away from the cylindrical lens; the bent portion is pressed against the heat sink to conduct the heat on the heat sink to the first side panel and the second side panel.
[0017] By setting the housing to an assembled structure consisting of a first side panel and a second side panel, the disassembly, assembly and maintenance of the light source for silicon wafer detection of the present application are facilitated. By setting the bending portion, the heat sink is in direct contact with the first side panel and the second side panel, so that the heat generated by the light board can be quickly transferred to the first side panel and the second side panel through the heat sink, and dissipated through the first side panel and the second side panel, thereby improving the heat dissipation performance of the light source and extending the life of the light board.
[0018] In some embodiments, a plurality of inwardly recessed heat dissipation grooves are disposed on the outer surfaces of the first side plate and the second side plate.
[0019] By arranging heat dissipation grooves on the outer surfaces of the first side plate and the second side plate, the heat dissipation areas of the first side plate and the second side plate are increased, and the heat dissipation performance of the light source is further improved.
[0020] In some embodiments, the first side plate and the second side plate are integrally formed, and two mounting rods extending along the first direction are arranged in pairs on the outer surface of the first side plate and / or the second side plate, with a mounting groove formed between the two mounting rods.
[0021] The first side plate and the second side plate are integrally formed, which facilitates the production and assembly of the housing. By providing mounting grooves on the first side plate and the second side plate, the light source of the present application can be conveniently installed in a working position or removed from a working position.
[0022] In some embodiments, a light outlet extending along the first direction is formed between the second end of the first side panel and the second end of the second side panel; the inner walls of the first side panel and the second side panel are provided with a first card slot, an arc-shaped groove and a second card slot, the first card slot is used for clamping and installing the light board, the arc-shaped groove is used for clamping and installing the cylindrical lens, and the second card slot is used for clamping and installing the light homogenizing component; the light diverged by the light homogenizing component along the first direction is transmitted through the light outlet.
[0023] By arranging a light outlet extending in the first direction between the second end of the first side plate and the second end of the second side plate, the light emitted by the light homogenizer in the first direction is transmitted through the light outlet, further ensuring that the light source of the present application forms a strip-shaped light spot on the silicon wafer to be detected. By arranging the first card slot, the arc-shaped groove and the second card slot on the inner wall of the first side plate and the second side plate, the installation and maintenance of the light board, the cylindrical lens and the cylindrical lens are facilitated.
[0024] In some embodiments, the housing further includes two end plates, which are respectively disposed at two ends of the cylindrical lens and are respectively fixedly connected to two ends of the first side plate and the second side plate.
[0025] The two end plates and the first side plate and the second side plate together form a shell with closed sides, so that the light irradiated on the inner walls of the end plates, the first side plate and the second side plate is reflected and projected onto the cylindrical lens, and finally passes through the light outlet, thereby reducing light loss.
[0026] In some embodiments, the housing further includes an end cover connected to the first end of the first side plate and the first end of the second side plate, and a heat dissipation fan is disposed in the end cover.
[0027] The cooling fan draws air away from the light board, which can speed up the heat dissipation of the light board and improve the heat dissipation performance of the light source of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Figure 1 This is a schematic diagram of the external structure of a light source for silicon wafer detection in an embodiment of the present application;
[0029] Figure 2 This is a schematic diagram of the disassembled structure of the light source for silicon wafer detection in the embodiment of the present application;
[0030] Figure 3 It is a schematic diagram of the structure of the light source for silicon wafer detection in an embodiment of the present application at a viewing angle after the end plate is omitted;
[0031] Figure 4 It is a schematic diagram of the structure of the light source for silicon wafer detection in the embodiment of the present application at another viewing angle after the end plate is omitted;
[0032] Figure 5 A schematic diagram of light transmission of a light source for silicon wafer detection at a viewing angle in an embodiment of the present application;
[0033] Figure 6 It is a schematic diagram of light transmission of a light source for silicon wafer detection in an embodiment of the present application at another viewing angle;
[0034] Figure 7 This is a schematic diagram of a light source for silicon wafer detection in an embodiment of the present application installed in a working scenario.
[0035] Figures 1 to 7 Included:
[0036] Housing 1: first side plate 11, second side plate 12, bending portion 13, heat dissipation plate 14, heat dissipation groove 15, mounting rod 16, mounting groove 17, light outlet 18, first card slot 19, arc groove 110, second card slot 120, end plate 130, end cover 140, heat dissipation fan 150;
[0037] Light board 2: lamp beads 21;
[0038] Cylindrical lens 3;
[0039] Light homogenizer 4: semi-cylindrical lens 41, light-transmitting substrate 42;
[0040] Light 100;
[0041] Adjusting rod 5 , mounting hole 51 , first conveying unit 6 , second conveying unit 7 , column 8 . DETAILED DESCRIPTION
[0042] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0043] like Figures 1 to 6 As shown, the light source for silicon wafer detection in the embodiment of the present application includes a housing 1, a light board 2, a cylindrical lens 3 and a light homogenizer 4, wherein:
[0044] The light board 2 , the cylindrical lens 3 and the light homogenizer 4 are all arranged in the housing 1 , wherein the cylindrical lens 3 is located between the light board 2 and the light homogenizer 4 .
[0045] A plurality of lamp beads 21 are evenly spaced along a first direction (the X-axis direction in the figure) on a side surface (eg, the lower surface) of the lamp board 2 facing the cylindrical lens 3. For example, Figures 5 and 6 The four lamp beads 21.
[0046] The cylindrical lens 3 is extended along the first direction, and is configured to receive the light 100 emitted by each lamp bead 21 and converge the light 100 toward directly below the central axis of the cylindrical lens 3 .
[0047] The light homogenizer 4 is configured to receive the light converged by the cylindrical lens 3 and diverge the light along a first direction, so that the light in the area between two adjacent lamp beads 21 overlaps each other after passing through the light homogenizer 4 .
[0048] It can be seen that by setting the cylindrical lens 3, the light emitted by the multiple lamp beads 21 evenly spaced along the first direction is converged toward the center axis of the cylindrical lens directly below the light homogenizer 4. The light homogenizer 4 focuses and diverges the light along the first direction, so that the light in the area between two adjacent lamp beads 21 overlaps with each other, thereby effectively homogenizing the light between the two adjacent lamp beads 21 and improving the uniformity of the strip light source.
[0049] like Figures 5 and 6 As shown, optionally, the light homogenizer 4 includes a plurality of semi-cylindrical lenses 41 arranged in a linear array along a first direction, each semi-cylindrical lens 41 is extended in a horizontal plane along a direction perpendicular to the first direction (such as the Y-axis direction in the figure), and each semi-cylindrical lens 41 is configured to receive a corresponding portion of the light converged by the cylindrical lens 3, and the corresponding portion of the light is focused by the semi-cylindrical lens 3 and then diverged (such as Figure 6 ), under the combined effect of each semi-cylindrical lens, the light in the area between two adjacent lamp beads 21 passes through the light homogenizing member 4 and then overlaps with each other (after overlapping with each other, as shown in FIG. Figure 6 In order to fully even out the light between two adjacent lamp beads 21, optionally, the number of the semi-cylindrical lenses 41 is greater than the number of the lamp beads 21.
[0050] In order to facilitate the disassembly, assembly and maintenance of the light homogenizer 4, and to facilitate the processing and forming of the light homogenizer 4, optionally, the light homogenizer 4 also includes a light-transmitting substrate 42 extending along the first direction, and a plurality of semi-cylindrical lenses 41 are arranged in a linear array along the first direction on a side surface of the light-transmitting substrate 42 away from the cylindrical lens 3.
[0051] In order to allow the light propagating from the cylindrical lens 3 to the semi-cylindrical lens 41 to be focused and diverged by the semi-cylindrical lens 41 as much as possible, and to further improve the uniformity of the strip light source, optionally, adjacent semi-cylindrical lenses 41 are tangent or intersecting.
[0052] Whether adjacent semi-cylindrical lenses 41 are tangent or intersecting can be reasonably selected in combination with the working distance of the light homogenizer 4 (i.e., the focal length of the semi-cylindrical lens). Generally, as the working distance increases, the degree of intersection of adjacent semi-cylindrical lenses 41 is reduced, and the minimum degree of intersection is when adjacent semi-cylindrical lenses 41 are tangent (i.e., adjacent semi-cylindrical lenses 41 cannot be separated).
[0053] In order to facilitate the disassembly and maintenance of the light source for silicon wafer detection, optional Figures 1 to 4 As shown, the housing 1 is composed of a first side plate 11 and a second side plate 12 assembled together.
[0054] In addition, the first end of the first side plate 11 and the first end of the second side plate 12 (for example, the upper end) are bent inward to form a bent portion 13. A heat sink 14 is provided on the side of the lamp board 2 that is away from the cylindrical lens 3 (for example, the upper side), and the bent portion 13 is pressed against the heat sink 14. Since the heat sink 14 is in direct contact with the bent portions 13 of the first side plate 11 and the second side plate 12, the heat generated by the lamp board 2 can be quickly conducted to the first side plate 11 and the second side plate 12 through the heat sink 14, and dissipated through the first side plate 11 and the second side plate 12, thereby improving the heat dissipation performance of the light source for silicon wafer detection in the embodiment of the present application and extending the service life of the light source, especially the lamp board 2.
[0055] In order to further improve the heat dissipation performance of the light source for silicon wafer detection, optionally, a plurality of inwardly recessed heat dissipation grooves are provided on the outer surfaces of the first side plate 11 and the second side plate 12 .
[0056] Optionally, the first side plate 11 and the second side plate 12 are integrally formed structures, and two mounting rods 16 extending along the first direction are arranged in pairs on the outer surface of at least one of the first side plate 11 and the second side plate 12 , and a mounting groove 17 is formed between the two mounting rods 16 .
[0057] Specifically, when the silicon wafer inspection light source of the present application is used in a silicon wafer inspection scene, the silicon wafer inspection light source can be installed above two conveying units that are disconnected from each other (for example, above the first conveying unit 6 and the second conveying unit 7). In some inspection scenes, it is often necessary to adjust the light output angle of the light source, and the installation of the light source is not limited to a simple fixed installation. Figure 7 As shown, the adjusting rod 5 is rotatably mounted on the columns 8 located on both sides of the conveying unit. The adjusting rod 5 is provided with a plurality of mounting holes 51 for fasteners such as screws, bolts or expansion screws to pass through.
[0058] In order to install the silicon wafer detection light source of the present application on the adjusting rod 5, a number of nuts can be clamped in the mounting groove 17, and bolts or screws can be passed through the mounting holes 51 to connect with the nuts, thereby realizing the fixed connection between the adjusting rod 5 and the silicon wafer detection light source; expansion screws can also be directly used to pass through the mounting holes 51 and expand in the mounting groove 17 to realize the fixed connection between the adjusting rod 5 and the silicon wafer detection light source; fasteners with a certain clamping shape can also be used, and a clamping shape compatible with the fastener can be set in the mounting groove 17 to realize the fixed connection between the adjusting rod 5 and the silicon wafer detection light source.
[0059] The first side plate 11 and the second side plate 12 are integrally formed, which facilitates the production and preparation of the housing 1 and facilitates the assembly of the housing 1. By providing a mounting groove 17 on the outer surface of at least one of the first side plate 11 and the second side plate 12, the light source of the embodiment of the present application can be conveniently installed in the working position or removed from the working position.
[0060] Optional, such as Figure 3 As shown, a light outlet 18 extending along the first direction is formed between the second end (eg, the lower end) of the first side plate 11 and the second side plate 12. Figure 4 As shown, the inner walls of the first side plate 11 and the second side plate 12 are both provided with a first slot 19, an arc groove 110 and a second slot 120, the first slot 19 is used for clamping and installing the light board 2, the arc groove 110 is used for clamping and installing the cylindrical lens 3, and the second slot 120 is used for clamping and installing the light homogenizer 4. The light diverged by the light homogenizer 4 along the first direction finally passes through the light outlet 18.
[0061] By setting a light outlet extending along the first direction between the second end of the first side plate 11 and the second end of the second side plate 12, the light diverged along the first direction by the light homogenizer 4 is transmitted through the light outlet 18, further ensuring that the light source for silicon wafer detection of the present application forms a strip-shaped light spot on the silicon wafer to be detected.
[0062] Optionally, the housing 1 further includes two end plates 130, which are respectively disposed at the two ends of the cylindrical lens 2 and are respectively fixedly connected to the two ends of the first side plate 11 and the second side plate 12. The two end plates 130, the first side plate 11 and the second side plate 12 together form a housing 1 with a closed periphery, so that the light irradiated onto the inner walls of the end plates 130, the first side plate 11 and the second side plate 12 is reflected and projected onto the cylindrical lens 3, and finally passes through the light outlet 18, thereby reducing light loss.
[0063] Optionally, the housing 1 further includes an end cover 140, which is connected to the first end of the first side plate 11 and the first end of the second side plate 12, and a cooling fan 150 is disposed in the end cover 140. The cooling fan 150 draws air away from the lamp board 2, thereby accelerating the heat dissipation speed of the lamp board 2 and further improving the heat dissipation performance of the light source.
[0064] The above description of the present application is sufficiently detailed and has certain particularities. Those skilled in the art should understand that the description in the embodiments is merely exemplary, and all changes made without departing from the true spirit and scope of the present application should fall within the scope of protection of the present application. The scope of protection claimed in the present application is defined by the claims, not by the above description in the embodiments. Moreover, the embodiments mentioned in the present application are not limited to being implemented individually, and some embodiments can also be implemented in combination.
Claims
1. A light source for silicon wafer inspection, characterized in that: The light source for silicon wafer detection includes a housing, a light board, a cylindrical lens and a light homogenizer, wherein: The light board, the cylindrical lens and the light homogenizer are all arranged in the housing, wherein the cylindrical lens is located between the light board and the light homogenizer; A plurality of lamp beads are evenly spaced along a first direction on a surface of the lamp board facing the cylindrical lens, the cylindrical lens is extended along the first direction, and the cylindrical lens is configured to receive light emitted by each of the lamp beads and converge the light toward directly below the central axis of the cylindrical lens; The light homogenizer is configured to receive the light converged by the cylindrical lens and diverge the light along the first direction, so that the light in the area between two adjacent lamp beads overlaps with each other after passing through the light homogenizer.
2. The light source for silicon wafer inspection according to claim 1, characterized in that: The light homogenizer includes a plurality of semi-cylindrical lenses arranged in a linear array along the first direction, each of the semi-cylindrical lenses is extended in a horizontal plane in a direction perpendicular to the first direction, and each of the semi-cylindrical lenses is configured to receive a corresponding portion of the light converged by the cylindrical lens, and the corresponding portion of the light is focused by the semi-cylindrical lens and then diverged, so that the light in the area between two adjacent lamp beads overlaps with each other after passing through the light homogenizer.
3. The light source for silicon wafer inspection according to claim 2, characterized in that: The light homogenizer further includes a light-transmitting substrate extending along the first direction, and a plurality of semi-cylindrical lenses are arranged in a linear array along the first direction on a surface of the light-transmitting substrate facing away from the cylindrical lenses.
4. The light source for silicon wafer inspection according to claim 2 or 3, characterized in that: Adjacent semi-cylindrical lenses are tangent to or intersect with each other.
5. The light source for silicon wafer inspection according to claim 1, characterized in that: The housing comprises a first side plate and a second side plate, wherein the first end of the first side plate and the first end of the second side plate are both bent inward to form a bent portion; A heat sink is disposed on one side of the lamp board away from the cylindrical lens; the bent portion is pressed against the heat sink to conduct the heat on the heat sink to the first side plate and the second side plate.
6. The light source for silicon wafer inspection according to claim 5, characterized in that: A plurality of inwardly recessed heat dissipation grooves are arranged on the outer side surfaces of the first side plate and the second side plate.
7. The light source for silicon wafer inspection according to claim 5, characterized in that: The first side plate and the second side plate are integrally formed structures. Two mounting rods extending along the first direction are arranged in pairs on the outer surface of the first side plate and / or the second side plate, and a mounting groove is formed between the two mounting rods.
8. The light source for silicon wafer inspection according to claim 5, characterized in that: A light outlet extending along the first direction is formed between the second end of the first side plate and the second end of the second side plate; The inner walls of the first side plate and the second side plate are both provided with a first card slot, an arc-shaped groove and a second card slot, the first card slot is used for clamping and installing the light board, the arc-shaped groove is used for clamping and installing the cylindrical lens, and the second card slot is used for clamping and installing the light homogenizer; The light diverged by the light homogenizer along the first direction is transmitted through the light outlet.
9. The light source for silicon wafer inspection according to claim 5, characterized in that: The housing further comprises two end plates, which are respectively arranged at two ends of the cylindrical lens and are respectively fixedly connected to two ends of the first side plate and the second side plate.
10. The light source for silicon wafer inspection according to claim 5, characterized in that: The housing further comprises an end cover, wherein the end cover is connected to the first end of the first side plate and the first end of the second side plate, and a heat dissipation fan is arranged in the end cover.