Stacked packaging structure of semiconductor device

Abstract

The utility model discloses a semiconductor device stack packaging structure, which comprises a substrate, and further comprises a fixed frame plate mounted at the top end of the substrate; and the stacking and packaging mechanism is fixed in the fixed frame plate, the stacking and packaging mechanism comprises a plurality of partition plates, and the partition plates are fixed in the fixed frame plate. According to the invention, not only can a plurality of components be separated by using a plurality of partition plates, but also the spring is arranged in the first fixing cylinder, so that the second fixing cylinder and the pressing plate can be driven to move through the elasticity of the spring, the inserted components with different sizes can be directly limited, the installation by using a metal elastic sheet is omitted, and the installation efficiency is improved. And when the components are disassembled, the components can be directly taken out, so that the overall convenience of disassembling the components is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and specifically to a semiconductor device stacking packaging structure. Background Art

[0002] In the current semiconductor industry, electronic packaging has become an important aspect of industry development; decades of development of packaging technology have made high-density and small-size packaging requirements the mainstream direction of packaging; at present, the main development trend of semiconductor component packaging is multi-pin, narrow pitch, small, multi-function, etc., so the requirements for system integration are becoming more and more urgent. The use of single chip packaging technology has gradually failed to meet the needs of the industry. Through the technology of two-dimensional chip assembly to three-dimensional multi-chip assembly, the function of WSI is one of the main ways to achieve system integration technology. Another known three-chip three-dimensional packaging process is to stack three components or chips on a substrate in sequence or package them into one in other forms. Although this stacking technology can meet the packaging of multiple chips or components, it still has certain problems: the packaged semiconductor device needs to be tested before it can enter the market. Therefore, to test the performance of the final product, it is necessary to wait until the entire circuit is packaged. At this time, once the test finds that one or more of the three components have problems or are unqualified, the entire circuit will be scrapped, which will cause waste of components or chips without problems and other materials, thus causing huge losses to the production and manufacturing of the enterprise.

[0003] Patent No. 202120524189.X discloses a semiconductor device stacking packaging structure, including a substrate, a metal spring, a first component, a second component, a third component and a wire, the inner side of the third frame is elastically clamped with a third component through the metal spring, and the metal spring is electrically connected to the substrate through a wire; the utility model uses metal springs to install the first component, the second component and the third component on the inner sides of the first frame, the second frame and the third frame in sequence, and then electrically connects the first component, the second component and the third component to the substrate through wires, so that the first component, the second component and the third component can be tested separately before packaging, thereby ensuring the effectiveness of the product and avoiding the problem of yield loss and material waste that may result from the prior art that the three semiconductor devices must be completely packaged before testing.

[0004] However, in use, there are the following defects:

[0005] (1) Although the first component, the second component and the third component are sequentially installed on the inner sides of the first frame, the second frame and the third frame through metal springs, and then the first component, the second component and the third component are respectively electrically connected to the substrate through wires, so that multiple components can be tested individually, multiple metal springs need to be set up for installation to fix the multiple components, resulting in a great waste of time when disassembling and assembling the components. Moreover, in the process of testing multiple components individually, when a component catches fire or explodes, it will directly cause damage to other components. Therefore, we propose a semiconductor device stacking packaging structure. Utility Model Content

[0006] The purpose of the present application is to provide a semiconductor device stacking packaging structure to solve the problems raised in the background technology.

[0007] To achieve the above-mentioned purpose, the present application provides the following technical solution: a semiconductor device stacking packaging structure, including a substrate, and also including:

[0008] The fixed frame plate is installed on the top of the base plate;

[0009] The stacking packaging mechanism is fixed in the fixed frame plate, which can not only place multiple components at the same time, but also limit the placed components to avoid displacement and shaking of the components during the test. The stacking packaging mechanism includes multiple partitions, and the multiple partitions are respectively fixed inside the fixed frame plate;

[0010] A first fixed tube is installed at the top of the fixed frame plate and the bottom of the partition, a second fixed tube passes through the bottom of the first fixed tube, a spring is fixed at one end of the second fixed tube located inside the first fixed tube, and the first fixed tube is fixed on the top of the spring.

[0011] In this technical solution, not only can multiple partitions be used to separate multiple components, but also, since a spring is arranged inside the first fixed cylinder, the elasticity of the spring can drive the second fixed cylinder and the pressure plate to move, so that components of different sizes can be directly limited, eliminating the need to use metal springs for installation. When disassembling components, the components can be directly taken out, which increases the overall convenience of component disassembly and assembly.

[0012] As an optional solution of the technical solution of the present application, a cavity is opened inside the partition, flame retardant panels are fixed at both upper and lower ends of the cavity, and a vacuum insulation panel is fixed between the two flame retardant panels.

[0013] In this technical solution, the flame retardant plate can be used to increase the flame retardant properties of the partition. When one of the components catches fire or explodes, the flame can be blocked by the partition and the flame retardant plate. In addition, a vacuum insulation panel is also provided to block the heat caused by the fire or explosion, thereby preventing the heat from affecting other components.

[0014] As an optional solution of the technical solution of the present application, a pressing plate is fixed to the bottom of the second fixing tube, and the component body is attached to the bottom of the pressing plate.

[0015] As an optional solution of the technical solution of the present application, a plastic package is installed on the top of the substrate, and one end of multiple circuits passes through both sides of the plastic package.

[0016] As an optional solution of the technical solution of the present application, the other end of the circuit is connected to the component body through the fixed frame plate.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. The present application combines a fixed frame plate, a partition and a fixed cylinder, which can not only utilize multiple partitions to separate and arrange multiple components, but also, since a spring is arranged inside the first fixed cylinder, the elasticity of the spring can drive the second fixed cylinder and the pressure plate to move, and components of different sizes can be directly limited, eliminating the need to use metal springs for installation. When disassembling components, the components can be directly taken out, thereby increasing the overall convenience of component disassembly and assembly.

[0019] 2. The present application combines partitions, cavities and flame-retardant panels, and the flame-retardant panels can be used to increase the flame-retardant properties of the partitions. When one of the components catches fire or explodes, the flame can be blocked by the partitions and the flame-retardant panels. In addition, a vacuum insulation panel is provided to block the heat during a fire or explosion, thereby preventing the heat from affecting other components. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0021] Figure 1 This is an overall view of a semiconductor device stacking package structure of the present application;

[0022] Figure 2 This is a view inside the cavity of a semiconductor device stacking package structure of the present application;

[0023] Figure 3 This is an internal view of a first fixed tube of a semiconductor device stacking package structure of the present application.

[0024] In the figure: 1. substrate; 101. plastic package; 2. fixed frame plate; 201. partition; 202. first fixed cylinder; 203. second fixed cylinder; 204. pressure plate; 205. component body; 206. circuit; 207. spring; 3. cavity; 301. vacuum insulation board; 302. flame retardant board. DETAILED DESCRIPTION

[0025] See also Figure 1-3 The present application provides a technical solution: a semiconductor device stacking packaging structure, including a substrate 1, and also including: a fixed frame plate 2, installed on the top of the substrate 1; a stacking packaging mechanism, fixed in the fixed frame plate 2, which can not only place multiple components at the same time, but also limit the placed components to avoid displacement and shaking of the components during the test. The stacking packaging mechanism includes multiple partitions 201, and the multiple partitions 201 are respectively fixed inside the fixed frame plate 2; a first fixed cylinder 202 is installed at the top of the fixed frame plate 2 and the bottom of the partition 201, and a second fixed cylinder 203 penetrates the bottom of the first fixed cylinder 202. A spring 207 is fixed to one end of the second fixed cylinder 203 located in the first fixed cylinder 202, and the first fixed cylinder 202 is fixed to the top of the spring 207. First, multiple components are inserted into the three spaces separated by the two partitions 201 respectively. After the components are placed in, since the spring 207 is arranged in the first fixed cylinder 202, the elasticity of the spring 207 can drive the second fixed cylinder 203 and the pressure plate 204 to move, and components of different sizes can be directly limited. The use of metal spring sheets for installation is eliminated. When disassembling components, the components can be taken out directly, which increases the overall convenience of component disassembly and assembly.

[0026] See also Figure 2 A cavity 3 is opened inside the partition 201, and flame retardant panels 302 are fixed at the upper and lower ends of the cavity 3, and a vacuum insulation panel 301 is fixed between the two flame retardant panels 302. The flame retardant panels 302 increase the flame retardant performance of the partition 201. When one of the components catches fire or explodes, the flame can be blocked by the partition 201 and the flame retardant panels 302. In addition, a vacuum insulation panel 301 is also provided to block the heat during fire or explosion, thereby preventing the heat from affecting other components.

[0027] See also Figure 2 A pressing plate 204 is fixed to the bottom of the second fixing tube 203 , and a component body 205 is attached to the bottom of the pressing plate 204 .

[0028] See also Figure 1 A plastic package 101 is installed on the top of the substrate 1 , and one end of a plurality of circuits 206 penetrates through both sides of the plastic package 101 .

[0029] See also Figure 1The other end of the line 206 passes through the fixed frame plate 2 and is connected to the component body 205.

[0030] When using a semiconductor device stacking packaging structure, multiple components are first inserted into the three spaces separated by two partitions 201. After the components are placed in, since a spring 207 is provided in the first fixed cylinder 202, the elasticity of the spring 207 can drive the second fixed cylinder 203 and the pressure plate 204 to move, so that components of different sizes can be directly limited, eliminating the need for metal spring clips for installation. When disassembling components, the components can be directly taken out, which increases the overall convenience of component disassembly and assembly. The flame retardant performance of the partition 201 is increased by the flame retardant plate 302. When one of the components catches fire or explodes, the flame can be blocked by the partition 201 and the flame retardant plate 302. In addition, a vacuum insulation board 301 is provided to block the heat during fire or explosion to prevent the heat from affecting other components.

Claims

1. A semiconductor device stacking package structure, comprising a substrate (1), characterized in that: Also includes: A fixed frame plate (2) is mounted on the top of the base plate (1); The stacking packaging mechanism is fixed in the fixed frame plate (2), and can not only place a plurality of components at the same time, but also limit the position of the placed components, thereby preventing the components from shifting and shaking during the test process. The stacking packaging mechanism comprises a plurality of partitions (201), and the plurality of partitions (201) are respectively fixed in the fixed frame plate (2); A first fixed tube (202) is installed at the top of the fixed frame plate (2) and the bottom of the partition plate (201); a second fixed tube (203) passes through the bottom of the first fixed tube (202); a spring (207) is fixed at one end of the second fixed tube (203) located inside the first fixed tube (202); and the first fixed tube (202) is fixed to the top of the spring (207).

2. The semiconductor device stacking package structure according to claim 1, characterized in that: A cavity (3) is provided inside the partition (201), and flame retardant panels (302) are fixed at both upper and lower ends of the cavity (3), and a vacuum insulation panel (301) is fixed between the two flame retardant panels (302).

3. The semiconductor device stacking package structure according to claim 1, characterized in that: A pressing plate (204) is fixed to the bottom of the second fixing cylinder (203), and a component body (205) is attached to the bottom of the pressing plate (204).

4. The semiconductor device stacking package structure according to claim 1, characterized in that: A plastic package (101) is installed on the top of the substrate (1), and one end of a plurality of circuits (206) passes through both sides of the plastic package (101).

5. The semiconductor device stacking package structure according to claim 4, characterized in that: The other end of the circuit (206) passes through the fixed frame plate (2) and is connected to the component body (205).

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