High-frequency antenna laminated structure

Abstract

The utility model discloses a high-frequency antenna laminated structure, which comprises a first conducting layer, a first transparent medium layer, a transparent liquid medium layer, a second transparent medium layer and a second conducting layer, wherein the first transparent dielectric layer is a carrier of the first conductive layer, and the transparent liquid dielectric layer is used for increasing the thickness of the antenna; the second transparent dielectric layer is a carrier of the second conductive layer, and the two together form a grounding structure of the antenna. Through the stacked structure design, on the premise that the radiation performance of the antenna is not affected, the visible light permeability of the antenna is improved, the antenna can be better fused with the environment, the attractiveness is high, the installation flexibility is high, and the use requirements for the high-frequency antenna in multiple scenes can be well met.

Description

Technical Field

[0001] The utility model relates to the technical field of film antennas, and more specifically, to a high-frequency antenna stacking structure. Background Art

[0002] General high-frequency antennas (greater than 10GHz) usually use PCB microstrip printed antennas. The mature PCB processing technology can effectively control the production cost, but it cannot be transparent and cannot meet the application scenarios with high aesthetic requirements. Transparent film antennas have the advantages of high transparency and easy conformality without losing the antenna radiation performance, so they are widely used in such scenarios. For high-frequency microstrip antennas, the thickness of the intermediate dielectric layer directly affects the antenna working bandwidth, feed network design and antenna efficiency. The dielectric layer thickness is usually required to be above 0.25mm. However, the thickness of the dielectric used to make transparent film antennas is usually much less than 0.25mm. Direct application will cause problems such as small working bandwidth and low radiation efficiency of the antenna. Therefore, how to design and improve the structure of the film antenna to meet the use requirements of high-frequency transparent antennas is of great significance. Utility Model Content

[0003] The utility model provides a high-frequency antenna stacking structure to solve the problems raised in the above background technology. To achieve the above purpose, the utility model provides the following technical solutions: a high-frequency antenna stacking structure, including a first conductive layer, a first transparent medium layer, a transparent liquid medium layer, a second transparent medium layer and a second conductive layer;

[0004] An edge sealing layer is provided between the first transparent medium layer and the second transparent medium layer, and the edge sealing layer seals the peripheries of the first transparent medium layer and the second transparent medium layer, and an internal cavity is formed between the first transparent medium layer and the second transparent medium layer after the periphery is sealed; a liquid filling hole is provided on one side of the edge sealing layer, and the liquid filling hole is used to fill the transparent liquid medium layer into the internal cavity, and the internal cavity is used to contain the transparent liquid medium layer.

[0005] Preferably, the transparent liquid medium layer is a transparent liquid with low dielectric loss, and the dielectric loss tangent is less than or equal to 0.003; the dielectric loss of the transparent liquid medium layer is less than or equal to the dielectric loss of the first transparent medium layer, and less than or equal to the dielectric loss of the second transparent medium layer.

[0006] Preferably, the thickness of the transparent liquid medium layer includes but is not limited to 100 um and 200 um.

[0007] Preferably, the transparent liquid medium layer is ethyl acetate.

[0008] Preferably, the edge sealing layer can be any one of foam glue, liquid naturally air-drying glue, liquid UV glue or solid glue.

[0009] Preferably, the first conductive layer is formed on the first transparent medium layer by an additive method or an etching subtractive process; the material of the first transparent medium layer includes but is not limited to PET, COP, CPI, glass and a transparent substrate, and its thickness includes but is not limited to 50um, 100um and 125um.

[0010] Preferably, the first conductive layer is made of metal material or non-metallic conductive material.

[0011] Preferably, the second conductive layer forms a grid structure on the second transparent medium layer by a semi-additive method, an additive method or an etching subtractive process, and the material of the second transparent medium layer includes but is not limited to PET, COP, CPI, glass and a transparent substrate, and its thickness includes but is not limited to 50um, 100um and 125um.

[0012] Compared with the prior art, the utility model has the following beneficial effects: the utility model provides a high-frequency antenna stacking structure, including a first conductive layer, a first transparent medium layer, a transparent liquid medium layer, a second transparent medium layer and a second conductive layer, wherein the first transparent medium layer is a carrier of the first conductive layer, and the transparent liquid medium layer is used to increase the thickness of the antenna; the second transparent medium layer is a carrier of the second conductive layer, and the two together form the grounding structure of the antenna. Through the above-mentioned stacking structure design, the antenna can improve the transmittance of visible light without affecting the radiation performance, so that the antenna can be better integrated with the environment, with high aesthetics and strong installation flexibility, which can well meet the use requirements of high-frequency antennas in multiple scenarios.

[0013] The design is reasonable and the structure is simple. It is connected to the vertical packaging machine through a mounting plate, and the adjusting mechanism is connected to the mounting plate. The adjusting mechanism realizes the advance and retreat adjustment of the film-drawing mechanism. The entire film-drawing device is small in size and convenient to install and maintain. While ensuring the stability of the packaging machine during the film-drawing process, it improves its work efficiency, reduces production costs, and is easy to promote and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of a high-frequency antenna stacking structure according to an embodiment of the utility model;

[0015] exist Figure 1 In the figure, the corresponding relationship between the names of the components and the numbers of the drawings is as follows:

[0016] 1--first conductive layer, 2--first transparent medium layer, 3--transparent liquid medium layer, 4--second transparent medium layer, 5--second conductive layer. DETAILED DESCRIPTION

[0017] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0018] In the description of the present invention, unless otherwise specified, "multiple" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third" and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0019] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0020] Please refer to Figure 1 The utility model provides a high-frequency antenna stacking structure, including a first conductive layer 1, a first transparent medium layer 2, a transparent liquid medium layer 3, a second transparent medium layer 4 and a second conductive layer 5;

[0021] An edge sealing layer is provided between the first transparent medium layer 2 and the second transparent medium layer 4, and the edge sealing layer seals the periphery of the first transparent medium layer 2 and the second transparent medium layer 4. An internal cavity is formed between the first transparent medium layer 2 and the second transparent medium layer 4 after the periphery is sealed; a liquid filling hole is provided on one side of the edge sealing layer, and the liquid filling hole is used to fill the transparent liquid medium layer 3 into the internal cavity, and the internal cavity is used to contain the transparent liquid medium layer 3.

[0022] In the embodiment of the utility model, the first conductive layer 1 is used as an antenna amplifier, and an electrode sheet is provided at its end point, and the electrode sheet is connected to the antenna signal transmission device. The entire first conductive layer 1 can be designed with a specific line pattern to reduce optical interference phenomena such as rainbow patterns and moiré patterns. The second conductive layer 5 located at the bottom layer is used as the ground terminal of the antenna by forming a grid shape. The first transparent medium layer 2 and the second transparent medium layer 4 are respectively used as carriers of the two conductive layers, and the transparent liquid medium layer 3 is between the two carriers.

[0023] Compared with common transparent media, this embodiment uses a transparent liquid medium to increase the thickness of the antenna. During processing, the edge sealing layer can be used to bond the sides of the first transparent medium layer 2 and the second transparent medium layer 4 and seal the periphery, so that a sealed state is formed between the first transparent medium layer 2 and the second transparent medium layer 4, and the internal cavity is retained between the two. Then, only one or more filling holes are left in the edge sealing layer to facilitate the filling of the transparent liquid medium, and a transparent liquid medium layer 3 is formed after the filling. The thickness of the transparent liquid medium layer 3 can be designed based on the simulation and actual test results of the antenna.

[0024] This embodiment uses liquid as the intermediate layer between the first transparent medium layer 2 and the second transparent medium layer 4, and its thickness can be easily controlled to meet the design requirements of different antennas, which has high flexibility.

[0025] Preferably, the transparent liquid medium layer 3 is a transparent liquid with low dielectric loss, and the dielectric loss tangent is less than or equal to 0.003; the dielectric loss of the transparent liquid medium layer 3 is less than or equal to the dielectric loss of the first transparent medium layer 2, and less than or equal to the dielectric loss of the second transparent medium layer 4. In this embodiment, the transparent liquid medium layer 3 uses a transparent liquid with low dielectric loss, the dielectric loss is less than or equal to the first transparent medium layer 2 and the second transparent medium layer 4, and its dielectric loss tangent, i.e., tanδ≤0.003.

[0026] Preferably, the thickness of the transparent liquid medium layer 3 includes but is not limited to 100um and 200um. In this embodiment, the thickness of the transparent liquid medium layer 3 can be designed according to the simulation and actual test results of the antenna, and can be 100um, 200um or other thicknesses.

[0027] Preferably, the transparent liquid medium layer 3 is ethyl acetate. In this embodiment, the liquid medium of the transparent liquid medium layer 3 can be a low dielectric loss liquid material such as ethyl acetate.

[0028] Preferably, the edge sealing layer can be any one of foam glue, liquid natural air-drying glue, liquid UV glue or solid glue. In this embodiment, the edge sealing layer can be any edge sealing glue with edge sealing effect, such as foam glue, liquid natural air-drying glue, liquid UV glue or solid glue.

[0029] Preferably, the first conductive layer 1 is formed on the first transparent medium layer 2 by an additive method or an etching subtractive process; the material of the first transparent medium layer 2 includes but is not limited to PET, COP, CPI, glass and a transparent substrate, and its thickness includes but is not limited to 50um, 100um and 125um. In this embodiment, the first transparent medium layer 2 is a carrier of the first conductive layer 1, and a transparent substrate such as PET, COP, CPI, glass, etc. can be selected, and the thickness includes but is not limited to conventional sizes such as 50um, 100um, 125um, etc.

[0030] Preferably, the first conductive layer 1 is made of metal material or non-metallic conductive material.

[0031] Preferably, the second conductive layer 5 forms a grid structure on the second transparent medium layer by a semi-additive method, an additive method or an etching subtractive process, and the material of the second transparent medium layer 4 includes but is not limited to PET, COP, CPI, glass and a transparent substrate, and its thickness includes but is not limited to 50um, 100um and 125um. In this embodiment, the second transparent medium layer 4 is a carrier of the second conductive layer 5, and the material includes but is not limited to PET, COP, CPI, glass and other transparent substrates, and the thickness includes but is not limited to conventional sizes such as 50um, 100um, 125um, etc.

[0032] Compared with the prior art, the utility model has the following beneficial effects: the utility model provides a high-frequency antenna stacking structure, including a first conductive layer, a first transparent medium layer, a transparent liquid medium layer, a second transparent medium layer and a second conductive layer, wherein the first transparent medium layer is a carrier of the first conductive layer, and the transparent liquid medium layer is used to increase the thickness of the antenna; the second transparent medium layer is a carrier of the second conductive layer, and the two together form the grounding structure of the antenna. Through the above-mentioned stacking structure design, the antenna can improve the transmittance of visible light without affecting the radiation performance, so that the antenna can be better integrated with the environment, with high aesthetics and strong installation flexibility, which can well meet the use requirements of high-frequency antennas in multiple scenarios.

[0033] The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A high-frequency antenna stacking structure, characterized in that: It comprises a first conductive layer (1), a first transparent medium layer (2), a transparent liquid medium layer (3), a second transparent medium layer (4) and a second conductive layer (5); An edge sealing layer is provided between the first transparent medium layer and the second transparent medium layer, and the edge sealing layer seals the peripheries of the first transparent medium layer and the second transparent medium layer, and an internal cavity is formed between the first transparent medium layer and the second transparent medium layer after the periphery is sealed; a liquid filling hole is provided on one side of the edge sealing layer, and the liquid filling hole is used to fill the transparent liquid medium layer into the internal cavity, and the internal cavity is used to contain the transparent liquid medium layer.

2. The high-frequency antenna stacking structure according to claim 1, characterized in that: The transparent liquid medium layer is a transparent liquid with low dielectric loss, and the dielectric loss tangent is less than or equal to 0.003; the dielectric loss of the transparent liquid medium layer is less than or equal to the dielectric loss of the first transparent medium layer, and less than or equal to the dielectric loss of the second transparent medium layer.

3. The high-frequency antenna stacking structure according to claim 2, characterized in that: The thickness of the transparent liquid medium layer includes but is not limited to 100 um and 200 um.

4. The high-frequency antenna stacking structure according to claim 3, characterized in that: The transparent liquid medium layer is ethyl acetate.

5. The high-frequency antenna stacked structure according to claim 2, characterized in that: The edge sealing layer can be any one of foam glue, liquid naturally air-drying glue, liquid UV glue or solid glue.

6. The high-frequency antenna stacked structure according to claim 1, characterized in that: The first conductive layer is formed on the first transparent medium layer by an additive method or an etching subtractive process; the material of the first transparent medium layer includes but is not limited to PET, COP, CPI, glass and a transparent substrate, and its thickness includes but is not limited to 50um, 100um and 125um.

7. The high-frequency antenna stacked structure according to claim 6, characterized in that: The first conductive layer is made of metal material or non-metallic conductive material.

8. The high-frequency antenna stacked structure according to claim 1, characterized in that: The second conductive layer forms a grid structure on the second transparent medium layer by a semi-additive method, an additive method or an etching subtractive process. The material of the second transparent medium layer includes but is not limited to PET, COP, CPI, glass and a transparent substrate, and its thickness includes but is not limited to 50um, 100um and 125um.

Images