Large-capacity uniform-flow silicon wafer cleaning tank

Abstract

The utility model belongs to the technical field of cleaning equipment, and relates to a large-capacity uniform-flow silicon wafer cleaning tank which comprises a cleaning tank body, a flower basket supporting mechanism, a uniform-flow mechanism and a bubbling mechanism, and the uniform-flow mechanism comprises two groups of uniform-flow pipelines of a structure shaped like a Chinese character'ri 'and two liquid inlet pipes of an L-shaped structure. The flow uniformizing pipeline is formed by connecting three transverse flow uniformizing pipes and two longitudinal flow uniformizing pipes, each flow uniformizing pipeline is located below three cleaning positions adjacent in the same direction, each transverse flow uniformizing pipe is located in the middle of one cleaning position, the liquid inlet pipe is located below the flow uniformizing pipeline and comprises a horizontal section and a turning section, the horizontal section extends in the transverse direction, and the turning section extends in the transverse direction. The transition section is communicated with the tail end of the horizontal section and the center of the middle transverse flow uniformizing pipe, and a plurality of flow uniformizing holes are formed in the transverse flow uniformizing pipe at equal intervals along the generatrix of the transverse flow uniformizing pipe. The equipment can ensure that the cleaning liquid uniformly passes through the gaps among the silicon wafers, so that the stability of the cleaning quality is kept under the condition of high productivity.

Description

Technical Field

[0001] The utility model relates to the technical field of cleaning equipment, in particular to a large-capacity uniform-flow silicon wafer cleaning tank. Background Art

[0002] In recent years, with the continuous development of the solar cell industry, the original 4-basket / batch tank cleaning equipment can no longer meet the production capacity requirements. The current mainstream method is to make the tank larger, and then how to make the solution in the tank more uniform becomes important.

[0003] Chinese patent CN110711742A discloses a cleaning tank structure that improves the uniformity of the solution. The cleaning tank here is a 4-basket / batch device. The bottom of this cleaning tank includes at least one flow-equalizing plate with multiple flow-equalizing holes, and the liquid inlet method is a multi-point feeding type. If it is to be made into a 6-basket / batch device, as the tank body becomes larger, the multi-point feeding liquid inlet method will not be able to replace the solution in the tank far away from the liquid inlet position in time when the circulation volume is relatively small, and the reaction in this area will be insufficient, thereby reducing the yield rate. If the circulation volume is simply increased, the solution replacement rate may meet the process requirements, but the silicon wafer will shake violently under the impact of the water flow, generating fragments to reduce the yield rate, and the energy consumption of the equipment will also become higher.

[0004] Therefore need to improve cleaning equipment to solve the above problems. Summary of the invention

[0005] The main purpose of the utility model is to provide a large-capacity uniform-flow silicon wafer cleaning tank, which can increase the processing capacity of the cleaning tank while ensuring the uniformity of the water flow and ensuring the stable cleaning quality of the silicon wafers in each flower basket.

[0006] The utility model achieves the above-mentioned purpose through the following technical solutions: a large-capacity uniform flow silicon wafer cleaning tank, comprising a cleaning tank body, a flower basket supporting mechanism, a uniform flow mechanism and a bubbling mechanism, wherein the cleaning tank body is provided with an overflow plate with a surrounding structure on four sides, the overflow plate divides the interior of the cleaning tank body into a cleaning area with a rectangular structure and a reflux area surrounding the cleaning area, the flower basket supporting mechanism is arranged at the lower part of the cleaning area, the uniform flow mechanism and the bubbling mechanism are both arranged in the cleaning area and located in the space below the flower basket supporting mechanism, and the bubbling mechanism comprises a plurality of bubbling holes distributed in an array;

[0007] A receiving plate is provided at the lower part of the flower basket supporting mechanism, and the receiving plate is located above the flow-uniform mechanism and the bubbling mechanism, and a plurality of mesh holes are evenly distributed on the receiving plate. The flower basket supporting mechanism includes two pairs of flower basket brackets parallel to the wide side direction of the cleaning area, and four limiting protrusions are evenly spaced on the flower basket brackets, thereby forming three horizontal and two vertical cleaning positions;

[0008] The flow equalizing mechanism includes two sets of flow equalizing pipelines in a rectangular shape with a horizontal bar in the middle and two L-shaped liquid inlet pipes. Each flow equalizing pipeline is formed by connecting three horizontal flow equalizing pipes and two vertical flow equalizing pipes. The three horizontal flow equalizing pipes include a middle horizontal flow equalizing pipe and two side horizontal flow equalizing pipes. The diameter of the middle horizontal flow equalizing pipe is larger than that of the side horizontal flow equalizing pipes. The diameter in the middle of the vertical flow equalizing pipe is the same as that of the middle horizontal flow equalizing pipe, and the diameters on both sides are the same as those of the side horizontal flow equalizing pipes. Each set of flow equalizing pipelines is located below three adjacent cleaning positions in the same direction, and each horizontal flow equalizing pipe is respectively located in the middle of a cleaning position. The liquid inlet pipe is located below the flow equalizing pipeline and includes a horizontal section and a turning section. The horizontal section extends horizontally, and the turning section connects the end of the horizontal section to the central position of the middle horizontal flow equalizing pipe. A plurality of flow equalizing holes are arranged at equal distances along the generatrix of the horizontal flow equalizing pipe.

[0009] Specifically, two rows of flow equalizing holes are provided on each horizontal flow equalizing pipe. The water outlet directions of the flow equalizing holes are all obliquely downward. The two rows of flow equalizing holes are at the same height on the lower half arc surface of the horizontal flow equalizing pipe. The bottom of the cleaning area is a bottom plate with a folded surface structure. An empty cavity with an inverted isosceles trapezoid cross-section structure is formed between the bottom plate and the receiving plate. The flow equalizing mechanism and the bubbling mechanism are both located in the empty cavity.

[0010] Specifically, each set of flow equalizing pipelines encloses two rectangular areas. The bubbling mechanism includes eight groups of bubbling pipelines. All the bubbling pipelines and the flow equalizing pipelines are at the same height to form an interpenetrating structure. Among them, four groups are inner bubbling pipelines, and the inner bubbling pipelines are independently arranged in the four rectangular areas. The other four groups are outer bubbling pipelines, and the outer bubbling pipelines are respectively located on the longitudinal sides of the flow equalizing pipelines.

[0011] Furthermore, each bubbling pipeline includes three bubbling pipes with the same diameter. The bubbling holes are evenly distributed along the top generatrix of each bubbling pipe in the length direction. The three bubbling pipes are parallel to each other and are connected at both ends.

[0012] Furthermore, among the three bubbling pipes in the inner bubbling pipeline, from the symmetry plane of the cleaning tank body to both sides, they are the first bubbling pipe, the second bubbling pipe, and the third bubbling pipe in sequence. Among the three bubbling pipes in the outer bubbling pipeline, from the side close to the inner bubbling pipeline to the outside, they are the fourth bubbling pipe, the fifth bubbling pipe, and the sixth bubbling pipe in sequence. The two first bubbling pipes are located on both sides of the same middle horizontal flow equalizing pipe, and the distance between them is M. The distance between the first bubbling pipe and the second bubbling pipe is N. The third bubbling pipe and the fourth bubbling pipe are located on both sides of the same side horizontal flow equalizing pipe, and the distance between them is N. The distance between the fourth bubbling pipe and the fifth bubbling pipe is M. The distance between the fifth bubbling pipe and the sixth bubbling pipe is N, and M > N.

[0013] The beneficial effects of the technical solution of the present utility model are:

[0014] This equipment arranges the transverse flow-distributing pipes according to the actual number and structure of cleaning positions, so that each cleaning position is located above a transverse flow-distributing pipe. The structure of the flow-distributing pipe is also more conducive to the water flowing out evenly from each flow-distributing hole. After passing through the mesh holes on the receiving plate, it can ensure that the cleaning liquid evenly passes through the gaps between the silicon wafers, thereby maintaining the stability of the cleaning quality under high production capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A three-dimensional diagram of a silicon wafer cleaning tank in an open state in an embodiment;

[0016] Figure 2 is a cross-sectional view of the silicon wafer cleaning tank in operation;

[0017] Figure 3 A three-dimensional diagram of a silicon wafer cleaning tank in an embodiment with some parts removed;

[0018] Figure 4 for Figure 3 A partial enlarged view of position A in the middle;

[0019] Figure 5 It is a three-dimensional diagram of the flow-uniform mechanism (the lower part faces upward);

[0020] Figure 6 This is a bottom view of the uniform flow pipeline.

[0021] The numbers in the figure represent:

[0022] 1- Silicon wafer cleaning tank,

[0023] 11-cleaning tank, 11a-cleaning area, 11b-reflow area, 111-overflow plate, 112-bottom plate;

[0024] 12-flower basket supporting mechanism, 121-receiving plate, 1211-mesh, 122-flower basket support, 1221-limiting protrusion,

[0025] 13-flow equalizing mechanism, 131-flow equalizing pipeline, 1311a-central transverse flow equalizing pipe, 1311b-side transverse flow equalizing pipe, 13111-flow equalizing hole, 1312-longitudinal flow equalizing pipe, 132-liquid inlet pipe, 1321-horizontal section, 1322-turning section,

[0026] 14-bubble mechanism, 14a-inner bubbling pipeline, 14b-outer bubbling pipeline, 141-bubble tube, 141a-first bubbling tube, 141b-second bubbling tube, 141c-third bubbling tube, 141d-fourth bubbling tube, 141e-fifth bubbling tube, 141f-sixth bubbling tube, 1411-bubble hole;

[0027] 2- Flower basket,

[0028] 3-Silicon wafer. DETAILED DESCRIPTION

[0029] The utility model is further described in detail below in conjunction with specific embodiments.

[0030] Example:

[0031] like Figure 1 and Figure 2 As shown, a high-capacity uniform-flow silicon wafer cleaning tank 1 of the utility model comprises a cleaning tank body 11 , a basket supporting mechanism 12 , a uniform-flow mechanism 13 and a bubbling mechanism 14 .

[0032] like Figures 1 to 6 As shown, an overflow plate 111 with a surrounding structure on four sides is provided in the cleaning tank body 11, and the overflow plate 111 divides the interior of the cleaning tank body 11 into a cleaning area 11a with a rectangular structure and a reflux area 11b surrounding the cleaning area 11a. The flower basket supporting mechanism 12 is arranged at the lower part of the cleaning area 11a, and the uniform flow mechanism 13 and the bubbling mechanism 14 are both arranged in the cleaning area 11a and located in the space below the flower basket supporting mechanism 12. The bubbling mechanism 14 includes a plurality of bubbling holes 1411 distributed in an array.

[0033] like Figure 2 and Figure 4 As shown, a receiving plate 121 is provided at the lower part of the flower basket supporting mechanism 12, and the receiving plate 121 is located above the flow uniforming mechanism 13 and the bubbling mechanism 14. A plurality of mesh holes 1211 are evenly distributed on the receiving plate 121. The flower basket supporting mechanism 12 includes two pairs of flower basket brackets 122 parallel to the wide side direction of the cleaning area 11a, and four limiting protrusions 122 are equidistantly arranged on the flower basket brackets 122, thereby forming three horizontal and two vertical cleaning positions.

[0034] The flower basket supporting mechanism 12 supports and limits the flower basket 2. The four limiting protrusions 122 divide the cleaning area 11a into three interval areas in the longitudinal direction, and each pair of flower basket brackets 121 divides the cleaning area 11a into two interval areas in the transverse direction, so a total of 3×2 cleaning positions are obtained. Each cleaning position corresponds to a flower basket 2, and each flower basket 2 can be inserted with 100 silicon wafers in the longitudinal direction, so the processing capacity of the silicon wafer cleaning tank 1 is 600 wafers each time.

[0035] like Figures 2 to 6As shown, the flow equalizing mechanism 13 includes two groups of flow equalizing pipes 131 of a Japanese-shaped structure and two liquid inlet pipes 132 of an L-shaped structure. The flow equalizing pipe 131 is formed by connecting three transverse flow equalizing pipes and two longitudinal flow equalizing pipes 1312. The three transverse flow equalizing pipes include a central transverse flow equalizing pipe 1311a and two side transverse flow equalizing pipes 1311b. The diameter of the central transverse flow equalizing pipe 1311a is larger than that of the side transverse flow equalizing pipe 1311b. The diameter of the middle part of the longitudinal flow equalizing pipe 1312 is the same as that of the central transverse flow equalizing pipe 1311a. The diameter is the same as the diameter of the side horizontal flow-uniform pipe 1311b, each group of flow-uniform pipes 131 is located below three adjacent cleaning positions in the same direction and each horizontal flow-uniform pipe is located in the middle of a cleaning position, the liquid inlet pipe 132 is located below the flow-uniform pipe 131 and includes a horizontal section 1321 and a turning section 1322, the horizontal section 1321 extends laterally, the turning section 1322 connects the end of the horizontal section 1321 with the center position of the central horizontal flow-uniform pipe 1311a, and a plurality of flow-uniform holes 13111 are equidistantly arranged along the busbar on the horizontal flow-uniform pipe.

[0036] The structure of the flow-equalizing pipeline 131 is mirror-symmetrical along the front-back and left-right directions, and the inlet is set at the center of the structure. Considering that the central transverse flow-equalizing pipe 1311a is the only one that inlets liquid, 1 / 3 of the cleaning liquid is to be sprayed out from the flow-equalizing hole 13111 on the central transverse flow-equalizing pipe 1311a, and the other 2 / 3 of the cleaning liquid is divided into the flow-equalizing holes 13111 on the two side transverse flow-equalizing pipes 1311b for spraying, so the theoretical flow rate on each transverse flow-equalizing pipe is the same. However, the flow rate in the central transverse flow-equalizing pipe 1311a is larger than the flow rate in the side transverse flow-equalizing pipe 1311b, so the caliber of the former is larger than the latter. The equipment arranges the transverse flow-distributing pipes according to the actual number and structure of the cleaning positions, so that each cleaning position is located above a transverse flow-distributing pipe. The structure of the flow-distributing pipe 131 is also more conducive to the water flowing out evenly from each flow-distributing hole 13111. After passing through the mesh 1211 on the receiving plate 121, it can ensure that the cleaning liquid evenly passes over the gaps between the silicon wafers 3, thereby maintaining the stability of the cleaning quality under the condition of large production capacity.

[0037] like Figure 2 , Figure 5 and Figure 6 As shown, each transverse flow-uniform tube is provided with two rows of flow-uniform holes 13111, and the water outlet direction of the flow-uniform holes 13111 is obliquely downward. The two rows of flow-uniform holes 13111 are located at the same height on the lower semi-arc surface of the transverse flow-uniform tube. The bottom of the cleaning area is a bottom plate 112 with a folded surface structure. A cavity with an inverted isosceles trapezoidal cross-section structure is formed between the bottom plate 112 and the receiving plate 121, and the flow-uniform mechanism 13 and the bubbling mechanism 14 are both located in the cavity.

[0038] When the cleaning liquid enters the cleaning area 11a, it will flow out obliquely downward with the horizontal flow-distributing pipe as the center, and then fill the space of the cleaning area 11a from bottom to top. Because the horizontal flow-distributing pipe corresponds to the cleaning position one by one, each spray of cleaning liquid will generally spread in the respective cleaning position and flow upward. The structure of the bottom plate 112 can also help the cleaning liquid to be better distributed and avoid the formation of flow dead zones in the space.

[0039] like Figures 4 to 6 As shown, each group of uniform flow pipelines 13 encloses two rectangular areas, and the bubbling mechanism 14 includes eight groups of bubbling pipelines. All the bubbling pipelines are located at the same height as the uniform flow pipeline 131 to form an interlaced structure, of which four groups are inner bubbling pipelines 14a, and the inner bubbling pipelines 14a are independently arranged in four rectangular areas, and the other four groups are outer bubbling pipelines 14b, and the outer bubbling pipelines 14b are respectively located on both sides of the longitudinal direction of the uniform flow pipeline 13; each bubbling pipeline includes three bubbling tubes with the same caliber, and the bubbling holes are evenly distributed on the top busbar of each bubbling tube along the length direction, and the three bubbling tubes are parallel to each other and connected at both ends.

[0040] This arrangement can reduce the height of the space below the flower basket supporting mechanism 12, making the structure more compact.

[0041] like Figure 2 and Figure 4 As shown, the three bubbling tubes in the inner bubbling pipeline 14a are the first bubbling tube 141a, the second bubbling tube 141b and the third bubbling tube 141c from the symmetric plane of the cleaning tank 11 to both sides, and the three bubbling tubes in the outer bubbling pipeline 14b are the fourth bubbling tube 14d, the fifth bubbling tube 14e and the sixth bubbling tube 14f from the inner bubbling pipeline 14a to the outside, and the two first bubbling tubes 141a are located in the same central horizontal flow-uniforming tube 1311a are located on both sides of the same side transverse flow-uniformizing tube 1311b and are spaced apart by a distance of M. The first bubble tube 141a and the second bubble tube 141b are spaced apart by a distance of N. The third bubble tube 141c and the fourth bubble tube 141d are located on both sides of the same side transverse flow-uniformizing tube 1311b and are spaced apart by a distance of N. The fourth bubble tube 141d and the fifth bubble tube 141e are spaced apart by a distance of M. The fifth bubble tube 141e and the sixth bubble tube 141f are spaced apart by a distance of N, and M>N.

[0042] Affected by the zigzag structure of the uniform flow pipeline 131, for every three cleaning positions, there will be a total of four bubbling pipelines in the lower part, each of which includes three bubbling tubes, and there will be a total of 12 bubbling tubes in the four bubbling pipelines. According to the demand for uniform gas supply, the bubbling tubes are grouped in groups of four, so the third bubbling tube 141c in the inner bubbling pipeline 14a and the fourth bubbling tube 14d, the fifth bubbling tube 14e and the sixth bubbling tube 14f on the same side constitute a bubbling area, and the two first bubbling tubes 141a and the two second bubbling tubes 141b constitute another bubbling area, so that they correspond to the position of the cleaning area, and the spacing between the bubbling tubes in the three bubbling areas is also completely corresponding. In this way, the ejection of bubbles will be more uniform.

[0043] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A high-capacity uniform-flow silicon wafer cleaning tank, characterized in that: It includes a cleaning tank body, a flower basket supporting mechanism, a flow equalizing mechanism and a bubbling mechanism. An overflow plate with a four-sided surrounding structure is arranged in the cleaning tank body. The overflow plate divides the interior of the cleaning tank body into a rectangular cleaning area and a return area surrounding the cleaning area. The flower basket supporting mechanism is arranged at the lower part of the cleaning area. Both the flow equalizing mechanism and the bubbling mechanism are arranged in the cleaning area and in the space below the flower basket supporting mechanism. The bubbling mechanism includes a number of bubbling holes distributed in an array. A receiving plate is arranged at the lower part of the flower basket supporting mechanism. The receiving plate is located above the flow equalizing mechanism and the bubbling mechanism. A plurality of mesh holes are evenly distributed on the receiving plate. The flower basket supporting mechanism includes two pairs of flower basket supports parallel to the wide side direction of the cleaning area. Four limiting convex parts are equidistantly arranged at equal intervals on the flower basket supports, thus forming three horizontal and two vertical cleaning positions. The flow equalizing mechanism includes two sets of flow equalizing pipelines in a "day" shape structure and two L-shaped liquid inlet pipes. The flow equalizing pipeline is formed by connecting three horizontal flow equalizing pipes and two vertical flow equalizing pipes. The three horizontal flow equalizing pipes include a middle horizontal flow equalizing pipe and two side horizontal flow equalizing pipes. The caliber of the middle horizontal flow equalizing pipe is larger than that of the side horizontal flow equalizing pipes. The caliber in the middle of the vertical flow equalizing pipe is the same as that of the middle horizontal flow equalizing pipe, and the calibers on both sides are the same as that of the side horizontal flow equalizing pipes. Each set of flow equalizing pipelines is located below three adjacent cleaning positions in the same direction, and each horizontal flow equalizing pipe is respectively located in the middle of a cleaning position. The liquid inlet pipe is located below the flow equalizing pipeline and includes a horizontal section and a turning section. The horizontal section extends horizontally, and the turning section connects the end of the horizontal section with the central position of the middle horizontal flow equalizing pipe. A number of flow equalizing holes are equidistantly arranged along the generatrix of the horizontal flow equalizing pipe.

2. The high-capacity uniform-flow silicon wafer cleaning tank according to claim 1, characterized in that: Two rows of flow equalizing holes are arranged on each horizontal flow equalizing pipe. The water outlet directions of the flow equalizing holes are all obliquely downward. The two rows of flow equalizing holes are at the same height on the lower half arc surface of the horizontal flow equalizing pipe. The bottom of the cleaning area is a bottom plate with a folded surface structure. A cavity with an inverted isosceles trapezoid cross-section structure is formed between the bottom plate and the receiving plate. Both the flow equalizing mechanism and the bubbling mechanism are located in the cavity.

3. The high-capacity uniform-flow silicon wafer cleaning tank according to claim 1, characterized in that: Each set of flow equalizing pipelines encloses two rectangular areas. The bubbling mechanism includes eight groups of bubbling pipelines. All the bubbling pipelines and the flow equalizing pipelines are at the same height to form an interpenetrating structure. Among them, four groups are inner bubbling pipelines, and the inner bubbling pipelines are independently arranged in four rectangular areas. The other four groups are outer bubbling pipelines, and the outer bubbling pipelines are respectively located on the longitudinal sides of the flow equalizing pipelines.

4. The high-capacity uniform-flow silicon wafer cleaning tank according to claim 3, characterized in that: Each bubbling pipeline includes three bubbling pipes with the same caliber. The bubbling holes are evenly distributed along the length direction on the top generatrix of each bubbling pipe. The three bubbling pipes are parallel to each other and are connected at both ends.

5. The high-capacity uniform-flow silicon wafer cleaning tank according to claim 4, characterized in that: The three bubbling tubes in the inner bubbling pipeline are the first bubbling tube, the second bubbling tube and the third bubbling tube in sequence from the symmetry plane of the cleaning tank body to both sides, and the three bubbling tubes in the outer bubbling pipeline are the fourth bubbling tube, the fifth bubbling tube and the sixth bubbling tube in sequence from close to the inner bubbling pipeline to the outside, the two first bubbling tubes are located on both sides of the same central horizontal flow-uniforming tube and are spaced apart by a distance of M, the first bubbling tube and the second bubbling tube are spaced apart by a distance of N, the third bubbling tube and the fourth bubbling tube are located on both sides of the same side horizontal flow-uniforming tube and are spaced apart by a distance of N, the fourth bubbling tube and the fifth bubbling tube are spaced apart by a distance of M, the fifth bubbling tube and the sixth bubbling tube are spaced apart by N, and M>N.

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