Communication PCBA multi-channel reflow soldering device

Abstract

The utility model provides a communication PCBA (Printed Circuit Board Assembly) multichannel reflow soldering device which is characterized by comprising a base and a pressing needle cover plate, the base is used for installing a mother board attached with a daughter board, and electronic components are attached to the mother board and the daughter board; a plurality of elastic pressing structures are arranged in the pressing needle cover plate, the pressing needle cover plate covers the mother board and the daughter board and is fixedly connected with the base, and after the pressing needle cover plate and the base are fixed, the elastic pressing structures in the pressing needle cover plate press electronic elements on the daughter board, the mother board and the daughter board. The communication PCBA multi-channel reflow soldering device can solve the problems of insufficient soldering of a neutron plate and a power tube, large welding cavity and the like in multi-channel PCBA reflow soldering.

Description

Technical Field

[0001] The utility model relates to the field of reflow soldering, and is a communication PCBA multi-channel reflow soldering device. Background Art

[0002] In the newly designed RRU products, the daughterboard needs to be soldered to the motherboard to achieve the purpose of good soldering between the daughterboard and the motherboard and good soldering of the electronic components of the two boards. Traditional PCBA soldering adopts SMT process, and the electronic components are mounted on the PCB after printing solder paste on the PCB, and then the PCBA soldering is completed through reflow soldering. The traditional PCBA reflow soldering process is B-side tin printing-B-side patch-B-side reflow soldering-T-side tin printing-T-side patch-T-side reflow soldering. Multi-channel PCBA soldering requires the use of fixtures to solder the daughterboard PAM and the motherboard MOB and electronic components in the SMT process. The multi-channel PCBA reflow soldering process is B-side tin printing-B-side patch-B-side reflow soldering-T-side PAM tin printing T-side MOB tin printing-PAM patch to MOB and patch components + fixture-T-side reflow soldering + fixture. Therefore, in the multi-channel PCBA reflow soldering process, it is easy to have problems of poor soldering and large solder voids between the daughterboard and the power tube. Therefore, there is an urgent need for a soldering device that is applicable to multi-channel reflow soldering. Utility Model Content

[0003] In view of the problems existing in the prior art, a communication PCBA multi-channel reflow soldering device is provided, which realizes the soldering of the daughter board and the mother board of the multi-channel PCBA, and solves the problems of cold soldering and large soldering voids between the daughter board and the power tube.

[0004] The technical solution adopted by the utility model is as follows: a communication PCBA multi-channel reflow soldering device, including a base and a pressure pin cover plate; the base is used to install a motherboard with a daughter board attached, and the motherboard and the daughter board are both attached with electronic components; a plurality of elastic pressing structures are arranged in the pressure pin cover plate, the pressure pin cover plate covers the motherboard and the daughter board, and is connected and fixed with the base, and after being fixed, the elastic pressing structure in the pressure pin cover plate presses the daughter board, the motherboard and the electronic components on the daughter board.

[0005] As a preferred solution, it comprises a plurality of press pin cover plates, and the plurality of press pin cover plates are installed according to the position distribution of the electronic components and the sub-boards.

[0006] As a preferred solution, it also includes a heat-insulating cover plate, which covers the area on the motherboard where no welding is required and where the devices are present, and is fixed to the base after covering.

[0007] As a preferred solution, the elastic pressing structure in the pressure pin cover plate is a spring pressure pin or a spring pressure head, wherein a plurality of spring pressure pins cooperate to complete the sub-board pressing, and the spring pressure head is used for pressing different power tubes.

[0008] As a preferred solution, the pressure pin cover plate and the base are both provided with through holes that match the positions of the electronic components on the daughter board and the mother board to be welded.

[0009] As a preferred solution, positioning pins are provided at the four corners of the pressure needle cover plate, and corresponding positioning holes are provided on the base; the pressure needle cover plate is installed and positioned through the positioning pins and the positioning holes on the base.

[0010] As a preferred solution, the pressure needle cover is fixed to the base by a cover lock.

[0011] As a preferred solution, the cover lock includes a lock body, a first lock and a second lock, and fixed cylinders are respectively provided on both sides of the lock body; the first lock and the second lock have holes in the middle and are respectively embedded and installed with the fixed cylinders on both sides of the lock body; springs are respectively provided between the heads of the first lock and the second lock and the lock body, and the bottoms of the first lock and the second lock are respectively provided with hooks with openings facing the lock body, which are used to buckle with the base.

[0012] As a preferred solution, a locking platform is provided in the base at a position corresponding to the cover lock, for engaging with the hook of the cover lock.

[0013] As a preferred solution, the base is provided with a mounting groove matching the motherboard, and buckles are arranged around the mounting groove. After the motherboard is installed in the mounting groove, the motherboard is fixed by the buckles.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: the communication PCBA multi-channel reflow soldering device proposed by the present invention can solve the problems of cold solder joints and large soldering voids of sub-boards and power tubes in multi-channel PCBA reflow soldering; the previous soldering scheme had a low yield and many reworks. Overall, after adopting the soldering device proposed by the present invention, the soldering yield is increased from 70% to more than 98%, and is very stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is an overall schematic diagram of the communication PCBA multi-channel reflow soldering device proposed by the utility model.

[0016] Figure 2 This is an exploded diagram of the communication PCBA multi-channel reflow soldering device proposed by the utility model.

[0017] Figure 3 This is a schematic diagram of the needle pressing cover plate proposed by the utility model.

[0018] Figure 4 This is a 3D schematic diagram of the cover lock proposed in the utility model.

[0019] Figure 5 This is a front view of the cover lock proposed by the utility model.

[0020] Figure markings: 1-base, 2-pressure needle cover, 3-insulation cover, 4-sub-board, 5-motherboard, 6-positioning pin, 7-positioning hole, 8-spring pressure needle, 9-spring pressure head, 10-cover lock, 11-lock platform, 101-lock body, 102-first lock, 103-second lock, 104-spring, 105-hook. DETAILED DESCRIPTION

[0021] Embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar modules or modules with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be construed as limitations on the present application. On the contrary, the embodiments of the present application include all changes, modifications and equivalents that fall within the spirit and connotation of the appended claims.

[0022] Please refer to Figures 1-2 The utility model proposes a communication PCBA multi-channel reflow soldering device, which can realize the soldering of the daughter board 4 and the mother board 5 of the multi-channel PCBA, and solve the problems of cold soldering and large soldering voids between the daughter board 4 and the power tube.

[0023] The welding device mainly includes a base 1 and a pressure needle cover plate 2. The base 1 is used to install the motherboard 5 and the daughterboard 4 to be welded. In the welding process, the motherboard 5 and the daughterboard 4 are also attached with electronic components to be welded. The pressure needle cover plate 2 is used to press the motherboard 5, the daughterboard 4 and the electronic components installed in the base 1 to ensure that there are no problems such as cold welding.

[0024] In one embodiment, there may be electronic components that do not need to be soldered on the motherboard 5 or the daughterboard 4. For the area where these electronic components are located, a heat insulation cover plate 3 is also provided. The heat insulation cover plate 3 covers the electronic components in this area and is fixed to the base 1 to provide heat insulation and thermal balance. If the board components in this area do not have the heat insulation cover plate 3 to block the heat in the reflow oven, the local temperature will be too high or cause damage. Correspondingly, a groove is opened in the base 1 to cooperate with the heat insulation cover plate 3 for positioning and fixing.

[0025] Please refer to Figure 3 In this embodiment, a plurality of elastic pressing structures are arranged in the press pin cover plate 2, and the press pin cover plate 2 covers the motherboard 5 and the daughterboard 4, and is connected and fixed with the base 1. After being fixed, the elastic pressing structure in the press pin cover plate 2 presses the daughterboard 4, the motherboard 5 and the electronic components on the daughterboard 4. In some embodiments, multiple press pin cover plates 2 can be used in combination to complete the pressing according to the number of daughterboards 4 or the distribution area of ​​the electronic components to be welded.

[0026] In order to ensure the welding quality, different elastic pressing structures are used for pressing. For example, for the power tube, a spring pressing head 9 is used for pressing. In one embodiment, the spring pressing head 9 can be made of Teflon material; for the sub-board 4, a spring pressing needle 8 is used for pressing. The reasonable distribution of the spring pressing needle 8 and the spring pressing head 9 meets the welding of the board components, the sub-board 4 PAM, the power tube, etc. In one embodiment, the stroke and pressure of the spring pressing needle 8 and the spring pressing head 9 can be adjusted according to the needs.

[0027] In one embodiment, in order to ensure the welding quality, the pressure pin cover plate 2 and the base 1 are both provided with through holes that match the positions of the electronic components on the daughter board 4 and the mother board 5 to be welded. In one embodiment, the base 1 is provided with a mounting groove that matches the mother board 5, and the mounting groove is surrounded by buckles. After the mother board 5 is installed in the mounting groove, the mother board 5 is fixed by the buckles.

[0028] In order to accurately install the press needle cover plate 2, in this embodiment, positioning pins 6 are provided at the four corners of the press needle cover plate 2, and corresponding positioning holes 7 are provided on the base 1. The press needle cover plate 2 is installed and positioned through the positioning pins 6 and the positioning holes 7 on the base 1.

[0029] In order to solve the problem of loosening or detaching of the screw buckle or buckle and difficult operation at high temperature in other previous projects, the present embodiment is provided with a cover plate lock buckle 10 on both sides of the needle pressing cover plate 2, which can ensure that there is no gap between the cover plate and the base 1 after the lock buckle is buckled, and meet the requirements of fast locking and opening operation.

[0030] Please refer to Figure 4 , Figure 5 The cover plate lock 10 comprises a lock body 101, a first lock 102 and a second lock 103, and a fixed cylinder is provided on both sides of the lock body 101. The first lock 102 and the second lock 103 have holes in the middle, and are respectively embedded and installed with the fixed cylinders on both sides of the lock body 101, and can move around the fixed cylinders after installation. At the same time, springs 104 are respectively provided between the heads of the first lock 102 and the second lock 103 and the lock body 101. In the absence of external force, the heads of the first lock 102 and the second lock 103 are separated from the lock body 101 by the springs 104. The bottoms of the first lock 102 and the second lock 103 are respectively provided with hooks 105 with openings facing the lock body 101, which are used to buckle with the base 1 to complete the fixation. Corresponding to the cover plate lock 10, a lock platform 11 is provided at the corresponding position of the base 1 with the cover plate lock 10, which is used to buckle with the hook of the cover plate lock 10.

[0031] The use process of the cover lock 10 in this embodiment is as follows: by pressing the head of the left second lock 103, the bottom of the lock opens, and after closing the cover and releasing your hand, the bottom hook 105 of the lock automatically locks with the platform on the base 1.

[0032] The welding device proposed by the utility model has a PCBA warpage within 0.2% (generally required to be no more than 0.5%) during welding; the welding void rate of the key component PA is less than 25%, meeting the performance indicators.

[0033] It should be noted that in the description of the embodiments of the present utility model, unless otherwise clearly specified and limited, the terms "setting" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances; the drawings in the embodiments are used to clearly and completely describe the technical solutions in the embodiments of the present utility model. Obviously, the described embodiments are part of the embodiments of the present utility model, not all of the embodiments. The components of the embodiments of the present utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0034] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A communication PCBA multi-channel reflow soldering device, characterized in that: It includes a base and a press needle cover plate; the base is used to install a motherboard with a daughterboard attached, and the motherboard and the daughterboard are both attached with electronic components; a plurality of elastic pressing structures are arranged in the press needle cover plate, the press needle cover plate covers the motherboard and the daughterboard, and is connected and fixed with the base, and after being fixed, the elastic pressing structures in the press needle cover plate press the daughterboard, the motherboard and the electronic components on the daughterboard.

2. The communication PCBA multi-channel reflow soldering device according to claim 1, characterized in that: It comprises a plurality of pressure pin cover plates, and the plurality of pressure pin cover plates are installed according to the position distribution of the electronic components and the sub-boards.

3. The communication PCBA multi-channel reflow soldering device according to claim 1, characterized in that: It also includes a heat-insulating cover plate, which covers an area on the motherboard where no welding is required and where components are present, and is fixed to the base after covering.

4. The communication PCBA multi-channel reflow soldering device according to claim 1, characterized in that: The elastic pressing structure in the pressure pin cover plate is a spring pressure pin or a spring pressure head, wherein a plurality of spring pressure pins cooperate to complete the sub-board pressing, and the spring pressure head is used for pressing different power tubes.

5. The communication PCBA multi-channel reflow soldering device according to claim 1, characterized in that: The pressure needle cover plate and the base are both provided with through holes matching the positions of the electronic components on the daughter board and the mother board to be welded.

6. The communication PCBA multi-channel reflow soldering device according to claim 1, characterized in that: The four corners of the pressure needle cover plate are all provided with positioning pins, and the base is provided with corresponding positioning holes; the pressure needle cover plate is installed and positioned through the positioning pins and the positioning holes on the base.

7. The communication PCBA multi-channel reflow soldering device according to claim 1, characterized in that: The pressure needle cover plate is fixed to the base through a cover plate lock.

8. The communication PCBA multi-channel reflow soldering device according to claim 7, characterized in that: The cover lock includes a lock body, a first lock and a second lock, and fixed cylinders are respectively provided on both sides of the lock body; the first lock and the second lock have holes in the middle and are respectively embedded and installed with the fixed cylinders on both sides of the lock body; springs are respectively provided between the heads of the first lock and the second lock and the lock body, and the bottoms of the first lock and the second lock are respectively provided with hooks with openings facing the lock body for buckling with the base.

9. The communication PCBA multi-channel reflow soldering device according to claim 7, characterized in that: A locking platform is provided at a position in the base corresponding to the cover locking buckle, which is used to be engaged with the hook buckle of the cover locking buckle.

10. The communication PCBA multi-channel reflow soldering device according to claim 1, characterized in that: The base is provided with a mounting groove matching the motherboard, and buckles are arranged around the mounting groove. After the motherboard is mounted in the mounting groove, the motherboard is fixed by the buckles.

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