Drying mechanism for wet etching of semiconductor wafer

Abstract

The utility model relates to the technical field of wafer drying, in particular to a drying mechanism for wet etching of semiconductor wafers, which comprises a drying box, the left side surface and the right side surface of the drying box are fixedly connected with four fixing plates, the lower end surfaces of the fixing plates are fixedly connected with second supporting columns, and the lower end surfaces of the fixing plates are fixedly connected with the second supporting columns. Wherein the opposite sides of the two fixing plates are rotationally connected with conveying rods, the surfaces of the conveying rods are in transmission connection with a conveying belt, the number of the conveying rods is two, the back face of the drying box is fixedly connected with a steering engine, and the output end of the steering engine penetrates through the back face of the drying box and is fixedly connected with a rotating rod. According to the wafer drying device, the conveying belt is arranged to convey wafers, the wafers are dried through the fan and the heater, automatic drying of the wafers is achieved, and the wafers do not need to be taken and placed batch by batch to be dried, so that the drying efficiency of the wafers in the drying operation is improved, the time is short, and manpower is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer drying, in particular to a drying mechanism for wet etching of semiconductor wafers. Background Art

[0002] Patent No. CN216694239U discloses a wafer drying device. The utility model has a reasonable structural design. The drying device comprises a box body, a accommodating chamber is arranged in the box body, a drying component is arranged on the inner wall of the accommodating chamber, and a drying rack is arranged in the accommodating chamber. The drying rack is pushed out or pulled back into the box body by a pushing component arranged in the accommodating chamber. The pushing component comprises a slide rail which is arranged on the bottom surface of the accommodating chamber and extends from the inner side of the box body toward one side of the box body outlet. A pushing plate is slidably connected to the slide rail. A sliding bar is arranged at the bottom of the pushing plate. The sliding bar is slidably connected in the slide rail. The drying rack is fixed on the pushing plate. A driving member for driving the pushing plate to slide along the extension direction of the slide rail is also arranged on the bottom surface of the accommodating chamber. The utility model can push the drying rack out through the pushing component when the operator loads and removes the wafer, and realizes the loading and unloading operations of the wafer outside the box, so as to avoid the operator from being scalded by operating in a high temperature state, facilitate the loading and unloading operations, and improve the operating efficiency.

[0003] However, the above-mentioned existing wafer drying equipment needs to take out and place the wafers in batches for drying, which makes the drying efficiency of the wafers low.

[0004] In order to solve the above problems, the utility model provides a drying mechanism for wet etching of semiconductor wafers. Utility Model Content

[0005] In view of the deficiencies of the prior art, the utility model provides a drying mechanism for wet etching of semiconductor wafers to solve the technical problem in the prior art that "when drying, the wafers need to be taken and placed in batches for drying, resulting in low drying efficiency during the drying operation".

[0006] To achieve the above objectives, the utility model is implemented through the following technical solutions: a drying mechanism for wet etching of semiconductor wafers, comprising a drying box, the left side and the right side of the drying box are fixedly connected with fixed plates, the fixed plates are provided in four pieces, the lower end faces of the fixed plates are fixedly connected with second support columns, wherein the opposite sides of two of the fixed plates are rotatably connected with a conveying rod, the surface of the conveying rod is transmission-connected with a conveyor belt, the number of the conveying rods is provided in two, the back side of the drying box is fixedly connected with a servo, the output end of the servo passes through the back side of the drying box and is fixedly connected with a rotating rod, and the surface of the rotating rod is fixedly connected with a flip box.

[0007] As the preferred technical solution of the utility model, a servo motor is fixedly connected to the back of the fixed plate, and the output end of the servo motor passes through the back of the fixed plate and is installed at the center of one end of the transmission rod, and the other two ends of the transmission rod are respectively rotatably connected to the inner wall of the fixed plate.

[0008] As a preferred technical solution of the utility model, the other end of the rotating rod is rotatably connected to the inner wall of the drying box, the flip box is arranged on the upper surface of the conveyor belt, and the surface of the conveyor belt is provided with semiconductor wafers.

[0009] As a preferred technical solution of the utility model, a power storage box is fixedly mounted on the upper end surface of the drying box, a heater is fixedly connected to the inner wall of the drying box, and the heater is electrically connected to the power storage box.

[0010] As a preferred technical solution of the utility model, a fan is fixedly connected in the drying box, and the fan is electrically connected to the power storage box.

[0011] As a preferred technical solution of the present utility model, a first support column is fixedly connected to the lower end surface of the drying box, and four first support columns are provided.

[0012] The utility model provides a drying mechanism for wet etching of semiconductor wafers, which has the following beneficial effects:

[0013] 1. The wafers are transported by setting a conveyor belt, and the wafers are dried by fans and heaters. This mechanism adopts a fast-drying method of conveying, so that the wafers can be dried automatically, and there is no need to take and place them in batches for drying, thereby improving the drying efficiency of the wafers in the drying operation, shortening the time, and saving manpower;

[0014] 2. By setting a servo, the flip box is driven to flip, so that the wafer is turned over, so that the wafer can be fully dried, which is practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a three-dimensional structural schematic diagram of a drying mechanism for wet etching of semiconductor wafers proposed by the utility model;

[0016] Figure 2 This is a schematic structural diagram of a drying mechanism for wet etching of semiconductor wafers proposed by the utility model;

[0017] Figure 3 This is a schematic structural diagram of a drying mechanism for wet etching of semiconductor wafers proposed by the utility model;

[0018] Figure 4 The utility model is a schematic diagram of the side cross-sectional structure of a drying mechanism for wet etching of a semiconductor wafer.

[0019] In the figure: 1 drying box, 2 first support column, 3 transmission rod, 4 second support column, 5 conveyor belt, 6 servo motor, 7 steering gear, 8 rotating rod, 9 turning box, 10 storage box, 11 heater, 12 fan. DETAILED DESCRIPTION

[0020] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0021] Thus, a feature indicated in this specification will be used to illustrate one of the features of an embodiment of the utility model, rather than implying that each embodiment of the utility model must have the described feature. In addition, it should be noted that this specification describes many features. Although some features can be combined together to illustrate possible system designs, these features can also be used in other combinations that are not explicitly described. Thus, unless otherwise stated, the described combinations are not intended to be limiting.

[0022] The principle and structure of the present invention are described in detail below with reference to the accompanying drawings and embodiments:

[0023] refer to Figure 1-4 A drying mechanism for wet etching of semiconductor wafers comprises a drying box 1, the left side and the right side of the drying box 1 are fixedly connected with fixed plates, four fixed plates are provided, the lower end faces of the fixed plates are fixedly connected with second support columns 4, wherein the opposite sides of the two fixed plates are rotatably connected with a transmission rod 3, the surface of the transmission rod 3 is transmission-connected with a conveyor belt 5, the number of the transmission rods 3 is set to two, the back side of the drying box 1 is fixedly connected with a steering gear 7, the output end of the steering gear 7 passes through the back side of the drying box 1 and is fixedly connected with a rotating rod 8, and the surface of the rotating rod 8 is fixedly connected with a flip box 9.

[0024] By setting the turning box 9, the wafer is turned over, so that the wafer can be fully dried;

[0025] Furthermore, a servo motor 6 is fixedly connected to the back of the fixed plate, and the output end of the servo motor 6 passes through the back of the fixed plate and is installed at the center of one end of the transmission rod 3. The two ends of the other transmission rod 3 are respectively rotatably connected to the inner wall of the fixed plate.

[0026] By setting a servo motor 6, the conveyor belt 5 can be driven to move;

[0027] Furthermore, the other end of the rotating rod 8 is rotatably connected to the inner wall of the drying box 1, and the turning box 9 is arranged on the upper surface of the conveyor belt 5, and the surface of the conveyor belt 5 is provided with semiconductor wafers.

[0028] By setting a conveyor belt 5, the wafer can be driven to move;

[0029] Furthermore, a power storage box 10 is fixedly mounted on the upper end surface of the drying box 1 , and a heater 11 is fixedly connected to the inner wall of the drying box 1 , and the heater 11 is electrically connected to the power storage box 10 .

[0030] By setting the heater 11, the wafer can be heated and dried;

[0031] Furthermore, a fan 12 is fixedly connected in the drying box 1 , and the fan 12 is electrically connected to the power storage box 10 .

[0032] By providing the power storage box 10, power can be supplied to the fan 12 and the heater 11;

[0033] Furthermore, the lower end surface of the drying box 1 is fixedly connected with a first support column 2, and four first support columns 2 are provided.

[0034] By providing the drying box 1, it is possible to prevent the heat in the drying box 1 from being lost in large quantities, thus saving energy.

[0035] Furthermore, the model of the servo 7 is set to S30A-180°, and the brand is WHEELTEC.

[0036] The working principle of the utility model is as follows: first, the heater 11 and the fan 12 are started. When the temperature in the drying box 1 rises, the servo motor 6 is started, the conveying rod 3 is driven by the servo motor 6, the conveying rod 3 rotates to drive the conveyor belt 5 to move, the conveyor belt 5 spreads the wafers to be dried on the feeding side of the conveyor belt 5, the conveyor belt 5 drives the wafers into the drying box 1, and the hot air generated by the drying box 1 can make the wafers dry quickly through the fan 12. By setting the conveyor belt 5, the work efficiency can be improved, and the quick freezing of large quantities of products can be achieved. At the same time, during the conveying process, the steering gear 7 is started, the conveyor belt 5 drives the wafers into the flip box 9, the flip box 9 is turned by the steering gear 7, and then the wafers are driven to leave the flip box 9 by the conveyor belt 5, thereby completing the flipping of the wafers and completing the comprehensive drying of the wafers;

[0037] Compared with the prior art, the method of fast drying by transmission is adopted, so that the wafers can be dried automatically, and there is no need to take and place them for drying in batches, thereby improving the drying efficiency of the wafers in the drying operation, shortening the time and saving manpower.

[0038] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the utility model, and these modifications or replacements should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A drying mechanism for wet etching of semiconductor wafers, comprising a drying box (1), characterized in that: The left side and right side of the drying box (1) are fixedly connected to fixed plates, the fixed plates are arranged in four pieces, the lower end surfaces of the fixed plates are fixedly connected to second support columns (4), wherein two of the fixed plates are rotatably connected to transmission rods (3) on opposite sides, the surfaces of the transmission rods (3) are transmission-connected to a conveyor belt (5), the number of the transmission rods (3) is arranged in two, the back side of the drying box (1) is fixedly connected to a steering gear (7), the output end of the steering gear (7) passes through the back side of the drying box (1) and is fixedly connected to a rotating rod (8), the surface of the rotating rod (8) is fixedly connected to a flip box (9).

2. A drying mechanism for semiconductor wafer wet etching according to claim 1, characterized in that: A servo motor (6) is fixedly connected to the back of the fixed plate, and the output end of the servo motor (6) passes through the back of the fixed plate and is installed at the center of one end of the transmission rod (3), and the other two ends of the transmission rod (3) are respectively rotatably connected to the inner wall of the fixed plate.

3. A drying mechanism for semiconductor wafer wet etching according to claim 1, characterized in that: The other end of the rotating rod (8) is rotatably connected to the inner wall of the drying box (1), and the turning box (9) is arranged on the upper surface of the conveyor belt (5), and the surface of the conveyor belt (5) is provided with semiconductor wafers.

4. A drying mechanism for semiconductor wafer wet etching according to claim 1, characterized in that: An electricity storage box (10) is fixedly mounted on the upper end surface of the drying box (1), a heater (11) is fixedly connected to the inner wall of the drying box (1), and the heater (11) is electrically connected to the electricity storage box (10).

5. A drying mechanism for semiconductor wafer wet etching according to claim 4, characterized in that: A fan (12) is fixedly connected inside the drying box (1), and the fan (12) is electrically connected to the power storage box (10).

6. A drying mechanism for semiconductor wafer wet etching according to claim 1, characterized in that: The lower end surface of the drying box (1) is fixedly connected to a first support column (2), and the number of the first support columns (2) is four.

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