CPU water-cooling head with brand-new architecture

Abstract

The utility model provides a CPU water cooling head with a brand new framework, which relates to the technical field of radiators and comprises a cavity, a radiating plate is arranged below the cavity, a water guide component is arranged between the cavity and the radiating plate, the cavity is provided with a water inlet hole and a water outlet hole, the water inlet hole is connected with a water inlet channel, and the water outlet hole is connected with a water outlet channel. The water inlet channel, the water guide assembly and the water outlet channel are in water communication; the water guiding assembly comprises a lower water guiding piece, an upper water guiding piece is arranged above the lower water guiding piece, a water guiding level is arranged in the middle of the upper water guiding piece, and a water guiding concave position is arranged on the side of the water guiding level. The heat dissipation device has the advantages that the CPU is placed on the heat dissipation plate, the heat dissipation plate is made of copper materials, so that the heat conduction performance of the heat dissipation plate is better, heat exchange operation is achieved through cooperation of the water inlet channel, the water guide assembly and the water outlet channel, the water flow circulation path is prolonged through the water guide assembly, the contact time of water and the heat dissipation plate is prolonged, and the heat dissipation efficiency is improved. Therefore, the water-cooling head achieves a good heat dissipation effect, and the heat dissipation efficiency of the water-cooling head is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a CPU water cooling head with a new architecture. Background Art

[0002] Computers are very popular nowadays, but there is a difficult problem that is difficult to overcome in computers, that is, CPU heat dissipation. As we all know, poor CPU heat dissipation will directly affect the work efficiency of the computer. The existing CPU water cooling technology uses a water cooling head to dissipate the CPU, which has a better heat dissipation effect.

[0003] In the prior art, the technical scheme of the Chinese patent document (Announcement No.: CN211529102U, Patent Name: Integrated Water-Cooled Radiator) discloses "including a water-cooled head, a cold water row and a connecting pipe, the cold water row is provided with a coolant circulation channel, the water-cooled head includes an upper cover assembly and a lower cover assembly arranged in sequence from top to bottom, the lower cover assembly includes a heat conducting plate, a pump body located on the heat conducting plate, and a lower cover located on the heat conducting plate and covering the pump body, the pump body is provided with a cold water inlet and a return water inlet, the connecting pipe connects the cold water inlet and the return water inlet with the coolant circulation channel, the pump body is provided with a water pump, the water pump is connected to a PCB board, the PCB board is provided with a light source, the upper cover assembly includes an outer ring, a first lens, a second lens and a light guide plate arranged in the outer ring, the first lens is located above the second lens, the light guide plate is located below the second lens, the outer surface of the second lens is sprayed with a coating layer, and the light guide plate is used to emit light from the light source through the second lens and the first lens in sequence."

[0004] Combined with the description and drawings of the patent document, the circulating liquid enters the water channel of the water cooling head through the water outlet nozzle of the water outlet chamber in turn. After the circulating liquid in the water channel flows through the heat transfer plate to take away the heat, it flows back to the cold water drain through the water inlet nozzle of the water inlet chamber. However, the water channel path is short, which makes it easy for the circulating liquid to have a short contact time with the heat transfer plate, making it impossible for the water cooling head to achieve a good heat dissipation effect, resulting in insufficient heat dissipation efficiency of the water cooling head. Utility Model Content

[0005] The utility model overcomes the shortcomings of the prior art, provides a CPU water cooling head with a new architecture, and can overcome the defects of the prior art mentioned in the background technology.

[0006] In order to solve the above technical problems, the utility model is achieved through the following technical solutions:

[0007] A CPU water cooling head with a new architecture includes a cavity, a heat sink is arranged below the cavity, a water guide component is arranged between the cavity and the heat sink, the cavity is provided with a water inlet hole and a water outlet hole, the water inlet hole is connected to a water inlet channel, the water outlet hole is connected to a water outlet channel, and the water inlet channel, the water guide component and the water outlet channel are connected by water.

[0008] Furthermore, the water guiding component includes a lower water guiding member, an upper water guiding member is arranged above the lower water guiding member, a water guiding level is arranged in the middle of the upper water guiding member, and a water guiding recess is arranged on the side of the water guiding level.

[0009] Furthermore, a flow hole is arranged in the middle of the lower water guide member, and a plurality of flow channels are arranged on the lower surface of the lower water guide member, one end of the flow channel is connected with the water in the water diversion recess, the other end of the flow channel is connected with the water in the flow hole, and the flow hole is connected with the water in the water diversion position.

[0010] Furthermore, the water outlet channel is arranged above the water guide level, and the water guide level, the water outlet channel and the water outlet hole are connected with each other by water.

[0011] Furthermore, the water inlet channel is arranged above the water diversion recess, and the water inlet hole, the water inlet channel and the water diversion recess are connected with each other by water.

[0012] Furthermore, the flow holes and the flow channels are arranged above the heat dissipation plate.

[0013] Furthermore, the heat sink is distributed with a plurality of first mounting holes, and the lower end surface of the cavity is distributed with a plurality of second mounting holes, and the first mounting holes correspond to the second mounting holes.

[0014] Furthermore, the water inlet and the water outlet are arranged on the upper end surface of the cavity.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] The CPU is placed on the heat sink, which is made of copper material to make the heat sink have better thermal conductivity. The heat exchange operation is achieved through the cooperation of the water inlet channel, the water guide component and the water outlet channel. The water guide component extends the water flow path and increases the contact time between the water and the heat sink, so that the water cooling head can achieve better heat dissipation effect, thereby improving the heat dissipation efficiency of the water cooling head. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide a further understanding of the present invention and are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation of the present invention. In the accompanying drawings:

[0018] Figure 1 This is the overall picture of the water cooling head;

[0019] Figure 2 This is the bottom view of the water cooling head;

[0020] Figure 3 It is a cutaway view of the water cooling head Figure 1 ;

[0021] Figure 4 It is a cutaway view of the water cooling head Figure 2 ;

[0022] Figure 5 It is a schematic diagram of the water guide assembly;

[0023] Figure 6 This is the view inside the cavity;

[0024] Figure 7 This is a diagram of the separation of the cavity and the heat sink.

[0025] In the figure: 1-cavity, 101-water inlet hole, 102-water outlet hole, 103-water inlet channel, 104-water outlet channel, 105-second mounting hole, 2-heat sink, 201-first mounting hole, 3-water guide assembly, 301-lower water guide member, 3011-circulation hole, 3012-circulation channel, 302-upper water guide member, 3021-water guide level, 3022-water guide recess. DETAILED DESCRIPTION

[0026] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0027] like Figures 1 to 4 As shown, a CPU water cooling head with a new architecture includes a cavity 1, a heat sink 2 is arranged below the cavity 1, a water guiding component 3 is arranged between the cavity 1 and the heat sink 2, the cavity 1 is provided with a water inlet hole 101 and a water outlet hole 102, the water inlet hole 101 is connected to a water inlet channel 103, the water outlet hole 102 is connected to a water outlet channel 104, the water inlet channel 103, the water guiding component 3 and the water outlet channel 104 are connected by water, the CPU is placed on the heat sink 2, the heat sink 2 is made of copper material, so that the heat sink 2 has better thermal conductivity, and then the heat exchange operation is realized by the cooperation of the water inlet channel 103, the water guiding component 3 and the water outlet channel 104, wherein the water guiding component 3 extends the water flow path, increases the contact time between the water and the heat sink 2, so that the water cooling head achieves a better heat dissipation effect, thereby improving the heat dissipation efficiency of the water cooling head.

[0028] Specifically, Figures 5 and 6As shown, the water guide component 3 includes a lower water guide member 301, an upper water guide member 302 is arranged above the lower water guide member 301, a water guide level 3021 is arranged in the middle of the upper water guide member 302, a water guide recess 3022 is arranged on the side of the water guide level 3021, a flow hole 3011 is arranged in the middle of the lower water guide member 301, and a plurality of flow channels 3012 are arranged on the lower surface of the lower water guide member 301, one end of the flow channel 3012 is in water communication with the water guide recess 3022, the other end of the flow channel 3012 is in water communication with the flow hole 3011, the flow hole 3011 is in water communication with the water guide level 3021, and the water outlet channel 104 is arranged above the water guide level 3021 The water guide level 3021, the water outlet channel 104 and the water outlet hole 102 are connected with each other by water. The water inlet channel 103 is arranged above the water guide recess 3022. The water inlet hole 101, the water inlet channel 103 and the water guide recess 3022 are connected with each other by water. After water enters the water inlet channel 103 from the water inlet hole 101, it flows downward from the water inlet channel 103 through the water guide recess 3022 to the lower end of the lower water guide member 301. In the process of entering the circulation channel 3012 and flowing to the circulation hole 3011, it will take away the heat generated by the CPU, and then enter the water outlet channel 104 from the circulation hole 3011 through the water guide level 3021, and finally flow out from the water outlet hole 102.

[0029] The flow hole 3011 and the flow channel 3012 are arranged above the heat sink 2. Figure 3 As shown, the lower end surface of the lower water guide 301 is in contact with the upper end surface of the heat sink 2, so that the heat dissipating water flow is in full contact with the heat sink 2, thereby improving the heat dissipation efficiency of the heat sink 2 to the CPU.

[0030] like Figure 7 As shown, the heat sink 2 is provided with a plurality of first mounting holes 201, and the lower end surface of the cavity 1 is provided with a plurality of second mounting holes 105, the first mounting holes 201 correspond to the second mounting holes 105, and screws are used to pass through the first mounting holes 201 and the second mounting holes 105 to fix the cavity 1 and the heat sink 2 in connection.

[0031] The water inlet hole 101 and the water outlet hole 102 are arranged on the upper end surface of the cavity 1 to facilitate the installation of the water inlet pipe and the water outlet pipe.

[0032] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. However, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A new CPU water cooling head, characterized by: The invention comprises a cavity (1), a heat sink (2) is arranged below the cavity (1), a water guide assembly (3) is arranged between the cavity (1) and the heat sink (2), the cavity (1) is provided with a water inlet hole (101) and a water outlet hole (102), the water inlet hole (101) is connected to a water inlet channel (103), the water outlet hole (102) is connected to a water outlet channel (104), and the water inlet channel (103), the water guide assembly (3) and the water outlet channel (104) are in water communication.

2. The new CPU water cooling head according to claim 1, characterized in that: The water guide assembly (3) comprises a lower water guide member (301), an upper water guide member (302) is arranged above the lower water guide member (301), a water guide level (3021) is arranged in the middle of the upper water guide member (302), and a water guide recess (3022) is arranged on the side of the water guide level (3021).

3. The new CPU water cooling head according to claim 2 is characterized in that: A circulation hole (3011) is arranged in the middle of the lower water guiding member (301), and a plurality of circulation channels (3012) are arranged on the lower surface of the lower water guiding member (301), one end of the circulation channel (3012) is in water communication with the water diversion recess (3022), the other end of the circulation channel (3012) is in water communication with the circulation hole (3011), and the circulation hole (3011) is in water communication with the water diversion position (3021).

4. The new CPU water cooling head according to claim 3 is characterized in that: The water outlet channel (104) is arranged above the water guide level (3021), and the water guide level (3021), the water outlet channel (104) and the water outlet hole (102) are in water communication.

5. The new CPU water cooling head according to claim 3 is characterized in that: The water inlet channel (103) is arranged above the water diversion recess (3022), and the water inlet hole (101), the water inlet channel (103) and the water diversion recess (3022) are in water communication.

6. The new CPU water cooling head according to claim 3 is characterized in that: The circulation holes (3011) and the circulation channels (3012) are arranged above the heat dissipation plate (2).

7. The new CPU water cooling head according to claim 6, characterized in that: The heat dissipation plate (2) is provided with a plurality of first mounting holes (201) distributed thereon, and the lower end surface of the cavity (1) is provided with a plurality of second mounting holes (105) distributed thereon, and the first mounting holes (201) correspond to the second mounting holes (105).

8. The new CPU water cooling head according to claim 1, characterized in that: The water inlet (101) and the water outlet (102) are arranged on the upper end surface of the cavity (1).

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