Wafer testing device

Abstract

The utility model relates to a wafer testing device, which belongs to the field of wafer testing and comprises a workbench, a mounting frame fixedly mounted at the top of the workbench, a fixing assembly mounted on the mounting frame and a limiting assembly mounted on the workbench. The fixing assembly comprises an air cylinder fixedly installed at the top of the installation frame, an installation frame installed at the output end of the air cylinder, a probe movably installed at the bottom of the installation frame, an insertion column installed at the top of the probe in a threaded mode, a threaded block fixedly installed at the bottom of the insertion column and a moving assembly installed in the installation frame. According to the wafer testing device, by installing the fixing assembly, probes can be replaced conveniently when the probes are abraded, appropriate probes can be selected conveniently according to wafers of different models, the wafer detection efficiency and quality are improved, by installing the limiting assembly, the wafers of different models and sizes can be limited and clamped conveniently, and the wafer testing efficiency is improved. And the wafer detection quality is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer testing, in particular to a wafer testing device. Background Art

[0002] Wafers are the basic materials for manufacturing semiconductor devices. High-purity polysilicon is pulled into cylindrical single crystal silicon. Wafers undergo a series of manufacturing processes to form extremely small circuit structures, and then go through cutting, packaging, testing and other processes to become chips, which are widely used in various electronic devices. In the process of wafer processing, the processed wafers need to be tested. At present, there are certain problems in the wafer testing process.

[0003] Please refer to a wafer testing device with announcement number CN219039269U, including: a first mounting plate; a test board, mounted on the first mounting plate, on which a test component for testing the performance of the wafer and feeding back the test board is provided; the test board is also provided with at least two electrical connectors.....the test box is used to collect the test data of the test board and feed back the test data to the host computer; the wafer testing device of this application can complete the wafer test machine data collection through several test boxes, test boards and test components, without the need to use a large test machine to test the wafer, thereby reducing the wafer testing cost and the space required for wafer testing. In addition, the wafer testing device has a simple structure and is easy to maintain.

[0004] In the above patent, the probe is fixedly installed and connected to the device. It is not convenient to replace the probe when it is worn, and it is not convenient to match and detect wafers of different models and sizes, which reduces the use effect of wafer detection. It is also not convenient to limit and clamp the wafer, which makes the wafer easily displaced during detection, thereby reducing the quality of wafer detection. This application proposes a technical solution to solve this technical problem. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a wafer testing device having the advantages of XX, etc. It solves the problem that it is inconvenient to replace the probe when the probe is worn, it is inconvenient to perform matching detection for wafers of different models and sizes, thereby reducing the use effect of wafer detection, and it is also inconvenient to limit and clamp the wafer, which makes it easy for the wafer to move during detection, thereby reducing the quality of wafer detection.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer testing device, comprising a workbench, a mounting frame fixedly mounted on the top of the workbench, a fixing component mounted on the mounting frame, and a limiting component mounted on the workbench;

[0007] The fixed component includes a cylinder fixedly installed on the top of the mounting frame, a mounting frame installed on the output end of the cylinder, a probe movably installed on the bottom of the mounting frame, a plug-in column threadedly installed on the top of the probe, a threaded block fixedly installed on the bottom of the plug-in column, and a movable component installed inside the mounting frame.

[0008] By adopting the above technical solution, it is convenient to disassemble and replace the probe, so as to meet the needs of wafer detection.

[0009] Optionally, the movable component includes telescopic springs fixedly installed on both sides of the inner wall of the installation frame, an L-shaped slide fixedly installed on the opposite sides of the two telescopic springs, a clamping block fixedly installed on the opposite sides of the two L-shaped slides, and an L-shaped pull rod fixedly installed on the opposite sides of the two L-shaped slides.

[0010] By adopting the above technical solution, it is convenient to limit and fix the plug-in column, so that the installation of the probe is more stable.

[0011] Optionally, the limiting assembly includes a horizontal plate fixedly installed inside the workbench, an electric push rod fixedly installed on the top of the horizontal plate, a moving block fixedly installed on the output end of the electric push rod, a connecting column fixedly installed on the top of the moving block, and a clamp installed on the top of the connecting column.

[0012] By adopting the above technical solution, it is convenient to limit and clamp wafers of different models and sizes, thereby improving the quality of wafer inspection.

[0013] Optionally, the threaded block is threadedly connected to the probe, and a threaded hole for threaded connection is provided on the top of the probe.

[0014] By adopting the above technical solution, it is easy to replace the detection probe to match different types of wafers, thereby improving the efficiency of wafer detection.

[0015] Optionally, the L-shaped slide plate is slidably connected to the installation frame, and a slide groove for the L-shaped slide plate to slide is provided at the bottom of the inner wall of the installation frame.

[0016] By adopting the above technical solution, a guide is provided for the movement and storage of the clamping block, making the movement and storage of the clamping block more convenient.

[0017] Optionally, both sides of the plug-in column are provided with engaging grooves for engaging the engaging blocks, and the two L-shaped pull rods are fixedly mounted with handles on the opposite sides thereof.

[0018] By adopting the above technical solution, the plug-in column is limited and fixed by the clamping block, so that the installation of the probe is more stable.

[0019] Optionally, the bottom of the clamp is fixedly connected to the connecting column, and the top of the workbench is provided with a movable hole for extending the connecting column.

[0020] By adopting the above technical solution, the connecting column moves, thereby driving the clamp to move synchronously.

[0021] Furthermore, the number of the electric push rods is four, an operation panel is fixedly installed on the front of the workbench, and the cylinder and the electric push rod are both connected to the operation panel signal.

[0022] By adopting the above technical solution, it is convenient for users to operate and control the start time of the air cylinder and the electric push rod.

[0023] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0024] The wafer testing device is equipped with a fixing component, which makes it easy to replace the probe when the probe is worn, and is also convenient to select suitable probes according to different types of wafers, thereby improving the efficiency and quality of wafer inspection. By installing a limiting component, it is convenient to limit and clamp wafers of different types and sizes, thereby further improving the quality of wafer inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a cross-sectional view of the structure of the utility model;

[0026] Figure 2 For this utility model Figure 1 A magnified view of the structure in the middle;

[0027] Figure 3 This is a three-dimensional diagram of the installation frame structure of the utility model.

[0028] In the figure: 1. workbench; 2. mounting frame; 3. cylinder; 4. mounting frame; 5. probe; 6. plug-in column; 601. snap-in groove; 7. threaded block; 701. threaded hole; 8. telescopic spring; 9. L-shaped slide plate; 901. slide groove; 10. snap-in block; 11. L-shaped pull rod; 12. cross plate; 13. electric push rod; 14. moving block; 15. connecting column; 151. moving hole; 16. fixture. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] See also Figure 1-3 A wafer testing device in this embodiment includes a workbench 1, a mounting frame 2 fixedly installed on the top of the workbench 1, a fixing component installed on the mounting frame 2, and a limiting component installed on the workbench 1.

[0031] In this embodiment, the fixing assembly includes a cylinder 3 fixedly mounted on the top of the mounting frame 2, a mounting frame 4 mounted on the output end of the cylinder 3, a probe 5 movably mounted on the bottom of the mounting frame 4, and a plug-in column 6 threadedly mounted on the top of the probe 5.

[0032] A first extension hole is provided inside the mounting frame 2, and the cylinder 3 is fixedly connected to the mounting frame 4 through the first extension hole. When the cylinder 3 is started, the mounting frame 4 is driven to move up and down for adjustment.

[0033] The fixed component also includes a threaded block 7 fixedly installed at the bottom of the plug-in column 6 and a movable component installed inside the mounting frame 4. The threaded block 7 is threadedly connected to the probe 5. A threaded hole 701 for threaded connection is provided on the top of the probe 5 to facilitate replacement of the probe 5 so that the probe 5 can match wafers of different models and sizes.

[0034] It should be noted that the probe 5 is electrically connected to an external data terminal to facilitate the transmission of wafer detection information to the data terminal so that the user can record and observe the data.

[0035] The moving component includes telescopic springs 8 fixedly installed on both sides of the inner wall of the installation frame 4, and an L-shaped slide plate 9 fixedly installed on the opposite side of the two telescopic springs 8. The L-shaped slide plate 9 is slidably connected to the installation frame 4. A sliding groove 901 for the sliding of the L-shaped slide plate 9 is provided at the bottom of the inner wall of the installation frame 4, which provides a guide for the movement and storage of the card block 10, making the movement of the card block 10 more convenient.

[0036] The moving component also includes a clamping block 10 fixedly installed on the opposite side of the two L-shaped slides 9 and an L-shaped pull rod 11 fixedly installed on the opposite side of the two L-shaped slides 9. Clamping grooves 601 for clamping the clamping block 10 are provided on both sides of the plug-in column 6. Handles are fixedly installed on the opposite side of the two L-shaped pull rods 11, so that the user can pull the L-shaped pull rod 11 by the handle to move it.

[0037] Wherein, second extension holes are opened on both sides of the installation frame 4 , and the L-shaped pull rod 11 extends to the outside of the installation frame 4 through the second extension holes.

[0038] In this embodiment, the limit assembly includes a horizontal plate 12 fixedly installed inside the workbench 1, an electric push rod 13 fixedly installed on the top of the horizontal plate 12, and a moving block 14 fixedly installed on the output end of the electric push rod 13. An operation panel is fixedly installed on the front of the workbench 1, and the cylinder 3 and the electric push rod 13 are both connected to the operation panel signal, which is convenient for the user to control the starting time of the cylinder 3 and the electric push rod 13.

[0039] The limiting assembly also includes a connecting column 15 fixedly installed on the top of the moving block 14 and a clamp 16 installed on the top of the connecting column 15. There are four electric push rods 13. The bottom of the clamp 16 is fixedly connected to the connecting column 15. A moving hole 151 for extending the connecting column 15 is provided on the top of the workbench 1. When the electric push rod 13 is started, the connecting column 15 is driven to move, thereby achieving the purpose of adjusting the distance between the two clamps 16.

[0040] The working principle of the above embodiment is as follows: when in use, the probe 5 is disassembled and replaced according to the size of the wafer to be detected. The user pulls the two L-shaped pull rods 11 by the handle, so that the two L-shaped slide plates 9 move in opposite directions, the telescopic spring 8 is compressed, and the two clamping blocks 10 are driven to move, and finally the plug-in column 6 is moved out of the installation frame 4, and the threaded block 7 is driven to rotate synchronously by rotating the plug-in column 6, so that the probe 5 and the plug-in column 6 are disassembled, so as to facilitate the replacement of the probe 5 according to the use requirements;

[0041] Then, the wafer to be inspected is placed on the workbench 1, and then the two groups of electric push rods 13 are started, driving the two groups of moving blocks 14 to move in opposite directions, and the clamps 16 are driven to move synchronously through the connecting columns 15, so as to limit and clamp the wafers of different types, and then the cylinder 3 is started to move the probe 5 downward to contact the wafer, and then the wafer is inspected.

Claims

1. A wafer testing device, characterized in that: The invention comprises a workbench (1), a mounting frame (2) fixedly mounted on the top of the workbench (1), a fixing component mounted on the mounting frame (2), and a limiting component mounted on the workbench (1); the fixing component comprises a cylinder (3) fixedly mounted on the top of the mounting frame (2), a mounting frame (4) mounted on the output end of the cylinder (3), a probe (5) movably mounted on the bottom of the mounting frame (4), a plug-in column (6) threadedly mounted on the top of the probe (5), a threaded block (7) fixedly mounted on the bottom of the plug-in column (6), and a moving component mounted inside the mounting frame (4).

2. A wafer testing device according to claim 1, characterized in that: The moving assembly comprises telescopic springs (8) fixedly mounted on both sides of the inner wall of the mounting frame (4), an L-shaped slide plate (9) fixedly mounted on the opposite side of the two telescopic springs (8), a clamping block (10) fixedly mounted on the opposite side of the two L-shaped slide plates (9), and an L-shaped pull rod (11) fixedly mounted on the opposite side of the two L-shaped slide plates (9).

3. The wafer testing device according to claim 1, characterized in that: The limiting assembly comprises a horizontal plate (12) fixedly mounted inside the workbench (1), an electric push rod (13) fixedly mounted on the top of the horizontal plate (12), a moving block (14) fixedly mounted on the output end of the electric push rod (13), a connecting column (15) fixedly mounted on the top of the moving block (14), and a clamp (16) mounted on the top of the connecting column (15).

4. The wafer testing device according to claim 1, characterized in that: The threaded block (7) is threadedly connected to the probe (5), and a threaded hole (701) for threaded connection is provided on the top of the probe (5).

5. The wafer testing device according to claim 2, characterized in that: The L-shaped slide plate (9) is slidably connected to the installation frame (4), and a slide groove (901) for the L-shaped slide plate (9) to slide is provided at the bottom of the inner wall of the installation frame (4).

6. The wafer testing device according to claim 2, characterized in that: Both sides of the plug-in column (6) are provided with engaging grooves (601) for engaging the engaging block (10), and the two L-shaped pull rods (11) are fixedly mounted with handles on the opposite sides.

7. The wafer testing device according to claim 3, characterized in that: The bottom of the clamp (16) is fixedly connected to the connecting column (15), and the top of the workbench (1) is provided with a movable hole (151) for extending the connecting column (15).

8. The wafer testing device according to claim 3, characterized in that: The number of the electric push rods (13) is four, an operation panel is fixedly installed on the front of the workbench (1), and the cylinder (3) and the electric push rods (13) are both connected to the operation panel signal.

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