SMBF diode packaging structure

Abstract

The utility model relates to the technical field of SMBF diodes, in particular to an SMBF diode packaging structure, which comprises a first pin and a second pin, one end of the first pin is provided with a first lead, one end of the second pin is provided with a second lead, and the first lead and the second lead are in a two-piece overlapping and buckling design. A core particle is arranged between the first lead and the second lead, the core particle is electrically connected with the first lead and the second lead through solder paste, and the first lead, the second lead and the periphery of the core particle are plastically packaged through black glue to form a packaging body; the outer end of the first pin and the outer end of the second pin are each provided with a plurality of bent parts. According to the SMBF diode, the first pin and the second pin are provided with the multiple sections of bending parts, the contact area between the first pin and the air and the contact area between the second pin and the air are increased, the heat dissipation effect of the SMBF diode in operation can be further improved, meanwhile, the strength of the first pin and the strength of the second pin can be improved, and the service life of the SMBF diode is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of SMBF diodes, in particular to a SMBF diode packaging structure. Background Art

[0002] SMBF is the abbreviation of Super Miniature Flat Lead diode. It is a surface mount diode with very small size and flat lead design. SMBF diodes are often used in applications such as current rectification, signal conditioning, protection or switching in electronic devices. They provide efficient electrical performance and reliability in relatively small sizes.

[0003] The SMBF diode has limited heat dissipation capacity due to its small size and flat lead design, which can easily affect its service life when used in high-power applications or working at high loads for a long time. Therefore, we propose an SMBF diode packaging structure to solve the above problems. Utility Model Content

[0004] The utility model aims to solve the disadvantage of poor heat dissipation performance of the SMBF diode in the prior art and proposes a SMBF diode packaging structure.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A SMBF diode packaging structure includes a first pin and a second pin, wherein a first lead is disposed at one end of the first pin, a second lead is disposed at one end of the second pin, a two-piece overlapping design is adopted between the first lead and the second lead, a core particle is disposed between the first lead and the second lead, the core particle is electrically connected to the first lead and the second lead through solder paste, and the first lead, the second lead and the core particle are plastic-sealed with black glue to form a packaging body;

[0007] The outer ends of the first pin and the second pin are both provided with a plurality of bending portions.

[0008] As a preferred technical solution of the present invention, the first lead, the second lead and the core particle are assembled and welded by die bonding.

[0009] As a preferred technical solution of the utility model, the first pin and the second pin are both provided with a through hole, and the through hole is located inside the black glue. The through hole can improve the firmness of the black glue and the first pin and the second pin after plastic sealing.

[0010] As a preferred technical solution of the utility model, the first pin and the first lead, the second pin and the second lead are all integrally formed, and the vertical sections of the first pin, the first lead and the second pin, and the second lead are all arranged in a "Z" shape.

[0011] As a preferred technical solution of the utility model, the bottom surface of the first pin, the bottom surface of the second pin and the bottom surface of the black plastic are on the same horizontal plane, and the three are on the same horizontal plane to facilitate stable installation of the device.

[0012] The beneficial effects of the utility model are:

[0013] By providing multiple bending portions on the first pin and the second pin, the contact area between the first pin, the second pin and the air is increased, thereby further improving the heat dissipation effect of the SMBF diode during operation, and at the same time increasing the strength of the first pin and the second pin, thereby increasing the service life of the SMBF diode. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the internal top view of an SMBF diode packaging structure proposed by the utility model;

[0015] Figure 2 This is a schematic diagram of the internal main view of an SMBF diode packaging structure proposed by the utility model.

[0016] In the figure: 1. first pin; 2. first lead; 3. second pin; 4. second lead; 5. bending part; 6. core particle; 7. black glue; 8. solder paste; 9. through hole. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0018] Reference Figure 1-2 , an SMBF diode packaging structure, comprising a first pin 1 and a second pin 3, a first lead 2 is disposed at one end of the first pin 1, a second lead 4 is disposed at one end of the second pin 3, the first pin 1 and the first lead 2, the second pin 3 and the second lead 4 are all integrally formed, and the vertical sections of the first pin 1, the first lead 2, the second pin 3, and the second lead 4 are all arranged in a "Z" shape;

[0019] Among them, a two-piece overlapping design is adopted between the first lead 2 and the second lead 4, and a core particle 6 is arranged between the first lead 2 and the second lead 4, and the core particle 6 is electrically connected to the first lead 2 and the second lead 4 through a solder paste 8. The first lead 2, the second lead 4 and the core particle 6 are assembled and welded by a solid crystal bonding sheet, and the first lead 2, the second lead 4 and the core particle 6 are plastic-sealed with a black glue 7 to form a package body. A through hole 9 is opened on the first pin 1 and the second pin 3, and the through hole 9 is located inside the black glue 7. The through hole 9 can improve the firmness of the black glue 7 and the first pin 1 and the second pin 3 after plastic sealing;

[0020] Secondly, the outer ends of the first pin 1 and the second pin 3 are provided with multiple bending portions 5. The setting of the bending portions 5 increases the contact area between the first pin 1 and the second pin 3 and the air, thereby further improving the heat dissipation effect during the operation of the SMBF diode, and at the same time, increasing the strength of the first pin 1 and the second pin 3.

[0021] Furthermore, the bottom surface of the first pin 1 , the bottom surface of the second pin 3 and the bottom surface of the black glue 7 are on the same horizontal plane, and the three are on the same horizontal plane, which facilitates the stable installation of the device.

[0022] In this embodiment, the contact area between the first pin 1 and the second pin 3 and the air is increased by disposing the bending portion 5 , and the bending portion 5 improves the heat dissipation effect of the SMBF diode during operation.

[0023] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A SMBF diode packaging structure, comprising a first pin (1) and a second pin (3), characterized in that: A first lead (2) is arranged at one end of the first pin (1), a second lead (4) is arranged at one end of the second pin (3), a two-piece overlapping design is adopted between the first lead (2) and the second lead (4), a core particle (6) is arranged between the first lead (2) and the second lead (4), the core particle (6) is electrically connected to the first lead (2) and the second lead (4) through solder paste (8), and the first lead (2), the second lead (4) and the core particle (6) are plastic-sealed with black glue (7) to form a package; The outer ends of the first pin (1) and the second pin (3) are both provided with a plurality of bent portions (5).

2. The SMBF diode packaging structure according to claim 1, characterized in that: The first lead (2), the second lead (4) and the core particle (6) are assembled and welded by die bonding.

3. The SMBF diode packaging structure according to claim 1, characterized in that: The first pin (1) and the second pin (3) are both provided with a through hole (9), and the through hole (9) is located inside the black glue (7).

4. The SMBF diode packaging structure according to claim 1, characterized in that: The first pin (1) and the first lead (2), the second pin (3) and the second lead (4) are all integrally formed, and the vertical cross-sections of the first pin (1), the first lead (2), the second pin (3), and the second lead (4) are all arranged in a "Z" shape.

5. The SMBF diode packaging structure according to claim 4, characterized in that: The bottom surface of the first pin (1), the bottom surface of the second pin (3) and the bottom surface of the black plastic (7) are on the same horizontal plane.

Images