Carrying module for normal-high-low-temperature chips

Abstract

The utility model discloses a normal-high-low temperature chip carrying module, and relates to the technical field of chip testing. The normal high and low temperature chip carrying module comprises a first chip positioning structure and a driving mechanism, the first chip positioning structure is in driving connection with the output end of the driving mechanism to drive the first chip positioning structure to move, and the first chip positioning structure comprises a first chip positioning plate and a temperature control structure; the temperature control structure is attached to one side of the first chip positioning plate, a plurality of first chip positioning grooves are formed in the other side of the first chip positioning plate and used for storing chips, and the temperature control structure is used for adjusting the temperature of the first chip positioning plate to achieve normal high and low temperature. According to the utility model, the temperature control structure is arranged, so that the first chip positioning plate can preheat the chip when the chip is transported on the first chip positioning structure, the time for the chip to reach the temperature preset by the temperature area after the chip reaches the next temperature area is saved, and the chip testing efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a high and low temperature chip transport module. Background Art

[0002] With the rapid development of the integrated circuit industry, the demand for chip packaging and testing equipment is becoming increasingly strong. Electrical and electronic components need to pass adaptability testing after manufacturing. The purpose is to conduct environmental simulation tests on the physical and other related characteristics of the product under normal temperature, high temperature, and low temperature conditions. After the test, the performance of the product is judged by the test results to see if it still meets the predetermined requirements, so as to provide product design, improvement, identification, and factory inspection. The chip testing equipment is equipped with normal temperature test area, high temperature test area, and low temperature test area, but the chip handling module cannot preheat the chip. When the chip handling module transports the chip across regions, it may even lose the temperature of the chip, resulting in the chip being placed in the corresponding temperature area. It takes a long time to reach the preset temperature of the temperature area, resulting in low chip testing efficiency. Utility Model Content

[0003] The utility model aims to provide a normally high and low temperature chip handling module to solve the technical problem in the prior art that the chip handling module cannot preheat the chip, resulting in low chip testing efficiency.

[0004] The utility model provides a normally high and low temperature chip handling module, comprising a first chip positioning structure and a driving mechanism, wherein the first chip positioning structure is drivingly connected to the output end of the driving mechanism to drive the first chip positioning structure to move, the first chip positioning structure comprises a first chip positioning plate and a temperature control structure, the temperature control structure is attached to one side of the first chip positioning plate, and a plurality of first chip positioning grooves are provided on the other side of the first chip positioning plate for storing chips, and the temperature control structure is used to adjust the temperature of the first chip positioning plate to achieve normally high and low temperatures.

[0005] As described above, the normal high and low temperature chip handling module, the temperature control structure includes a first temperature control plate, a refrigerant tube and at least one first heating element, the first temperature control plate is attached to the bottom wall of the first chip positioning plate, the first heating element is arranged on the first temperature control plate, the refrigerant tube includes a first section and a second section, a flow channel is provided in the first temperature control plate, the inlet of the flow channel is connected to the output end of the first section, the outlet of the flow channel is connected to the input end of the second section, and the first temperature control plate is drivingly connected to the output end of the driving mechanism.

[0006] As described above, in the normal high and low temperature chip handling module, at least one mounting hole is opened on the front side wall of the first temperature control plate, the depth of the mounting hole is greater than half of the width of the first temperature control plate, and the first heating element is arranged in the mounting hole.

[0007] As described above, in the normal high and low temperature chip handling module, the number of the first heating element and the number of the mounting holes are both multiple, and the multiple mounting holes are evenly spaced and distributed on the first temperature control board, and a first heating element is placed in each mounting hole.

[0008] As described above for the normal high and low temperature chip handling module, the temperature control structure further comprises at least one temperature sensor, and the temperature sensor is arranged on the first temperature control board to detect the temperature value of the first temperature control board.

[0009] As described above for the normal high and low temperature chip handling module, the number of the temperature sensors is two, and the two temperature sensors are respectively arranged at the left and right ends of the first temperature control board.

[0010] As described above, the normally high and low temperature chip handling module, the first chip positioning structure also includes a fastener, the first chip positioning plate is provided with a first connecting hole, the first temperature control plate is provided with a second connecting hole, the fastener is sequentially inserted into the first connecting hole and the second connecting hole to fix the first chip positioning plate and the first temperature control plate in connection.

[0011] As described above, the normally high and low temperature chip handling module further includes a second chip positioning structure and a fixing member, the second chip positioning structure and the first chip positioning structure are both arranged on the fixing member, and the driving mechanism is drivingly connected to the fixing member.

[0012] As described above, the normally high and low temperature chip handling module, the second chip positioning structure includes a second chip positioning plate, a second temperature control plate and a second heating element, the second temperature control plate is attached to the bottom wall of the second chip positioning plate, and the second heating element is arranged on the second temperature control plate to heat the second temperature control plate.

[0013] As described above, the normal high and low temperature chip handling module, the driving mechanism includes a driving motor and a synchronous belt, the output end of the driving motor is connected to the synchronous belt to drive the synchronous belt to rotate, and the fixing member is connected to the synchronous belt.

[0014] Implementing the embodiments of the present utility model will have the following beneficial effects:

[0015] In the utility model, the normally high and low temperature chip handling module includes a first chip positioning structure and a driving mechanism. The first chip positioning structure is connected to the output end of the driving mechanism to drive the first chip positioning structure to move. The first chip positioning structure includes a first chip positioning plate and a temperature control structure. The temperature control structure is attached to one side of the first chip positioning plate. A plurality of first chip positioning grooves are provided on the other side of the first chip positioning plate for storing chips. The temperature control structure is used to adjust the temperature of the first chip positioning plate to achieve normally high and low temperatures. By setting the temperature control structure, the first chip positioning plate can preheat the chip during the transportation of the chip on the first chip positioning structure, saving the time for the chip to reach the preset temperature of the temperature zone after arriving at the next temperature zone, thereby improving the chip testing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 is a structural schematic diagram of a normal high and low temperature chip handling module according to an exemplary embodiment;

[0018] Figure 2 is a structural schematic diagram of a first chip positioning structure according to an exemplary embodiment;

[0019] Figure 3 FIG. 4 is a structural exploded view of a first chip positioning structure according to an exemplary embodiment.

[0020] Among them: 1. first chip positioning structure; 11. first chip positioning plate; 111. first chip positioning groove; 112. first connecting hole; 12. first temperature control plate; 121. mounting hole; 122. second connecting hole; 13. refrigerant pipe; 14. first heating element; 15. temperature sensor; 2. driving mechanism; 21. driving motor; 22. synchronous belt; 3. second chip positioning structure; 31. second chip positioning plate; 32. second temperature control plate; 4. fixing part. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0023] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0024] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0026] See also Figure 1-Figure 3The utility model provides a normal high and low temperature chip transport module, including a first chip positioning structure 1 and a driving mechanism 2. The first chip positioning structure 1 is connected to the output end of the driving mechanism 2 to drive the first chip positioning structure 1 to move. The first chip positioning structure 1 includes a first chip positioning plate 11 and a temperature control structure. The temperature control structure is attached to one side of the first chip positioning plate 11. A plurality of first chip positioning grooves 111 are provided on the other side of the first chip positioning plate 11 for storing chips. The temperature control structure is used to adjust the temperature of the first chip positioning plate 11 to achieve normal high and low temperatures. By setting the temperature control structure, the first chip positioning plate 11 can preheat the chip during the transportation of the chip on the first chip positioning structure 1, saving the time for the chip to reach the preset temperature of the temperature zone after arriving at the next temperature zone, thereby improving the chip testing efficiency.

[0027] In an optional embodiment, there are thirty-two first chip positioning grooves 111 , which are distributed in four rows and eight columns on the first chip positioning plate 11 , so as to transport thirty-two chips at the same time, thereby improving chip testing efficiency.

[0028] Further, the temperature control structure includes a first temperature control plate 12, a refrigerant pipe 13 and at least one first heating element 14. The first temperature control plate 12 is attached to the bottom wall of the first chip positioning plate 11. The first heating element 14 is arranged on the first temperature control plate 12. The refrigerant pipe 13 includes a first section and a second section. A flow channel is arranged in the first temperature control plate 12. The inlet of the flow channel is connected to the output end of the first section, and the outlet of the flow channel is connected to the input end of the second section. The first temperature control plate 12 is drivingly connected to the output end of the driving mechanism 2. The first heating element 14 can heat the first temperature control plate 12, so that the first temperature control plate 12 is heated to reach a high temperature state, so that the first chip positioning plate 11 and the chip placed on the first chip positioning plate 11 are also heated, so that the chip reaches a high temperature state in advance; the refrigerant pipe 13 can transport refrigerant to the first temperature control plate 12, so that the first temperature control plate 12 is cooled to reach a low temperature state, so that the first chip positioning plate 11 and the chip placed on the first chip positioning plate 11 are also cooled, so that the chip reaches a low temperature state in advance.

[0029] It should be noted that the first heating element 14 and the refrigerant pipe 13 are both electrically connected to the central control system of the test equipment. The central control system of the test equipment can open and close the first heating element 14 and the refrigerant pipe 13 respectively. When the chip needs to be transported to the normal temperature test area, the first heating element 14 and the refrigerant pipe 13 are closed, so that the first temperature control plate 12 is at normal temperature, thereby making the chip also at normal temperature; when the chip needs to be transported to the high temperature test area, the refrigerant pipe 13 is closed, and the first heating element 14 is opened. The first temperature control plate 12 is heated by the first heating element 14, so that the first temperature control plate 12 is heated to reach a high temperature state, thereby preheating the chip on the first chip positioning plate 11 in advance; when the chip needs to be transported to the low temperature test area, the first heating element 14 is closed, and the refrigerant pipe 13 is opened. The refrigerant is transported to the first temperature control plate 12 through the refrigerant pipe 13, so that the first temperature control plate 12 is cooled to reach a low temperature state, thereby precooling the chip on the first chip positioning plate 11 in advance.

[0030] Furthermore, at least one mounting hole 121 is provided on the front side wall of the first temperature control plate 12, the depth of the mounting hole 121 is greater than half the width of the first temperature control plate 12, and the first heating element 14 is disposed in the mounting hole 121. In a specific embodiment, the first heating element 14 is a long strip heating rod, which is distributed front and back on the first temperature control plate 12, which is conducive to a more uniform temperature on the first temperature control plate 12.

[0031] Furthermore, the number of the first heating element 14 and the number of the mounting holes 121 are both multiple, and the multiple mounting holes 121 are evenly spaced and distributed on the first temperature control board 12, and a first heating element 14 is placed in each mounting hole 121. The multiple first heating elements 14 are evenly distributed on the first temperature control board 12 to heat the first temperature control board 12 together, so that the first temperature control board 12 can be quickly heated and heat is transferred to the first chip positioning board 11 to heat the chip. This structural design can make the first temperature control board 12 evenly heated and maintain the thermal balance of the first temperature control board 12.

[0032] Furthermore, the temperature control structure further includes at least one temperature sensor 15, which is disposed on the first temperature control board 12 to detect the temperature value of the first temperature control board 12. The temperature sensor 15 is electrically connected to the central control system of the test equipment, and the temperature sensor 15 can detect the temperature value of the first temperature control board 12 and transmit the data to the test equipment, so that the user can adjust the temperature of the first temperature control board 12 conveniently.

[0033] Furthermore, there are two temperature sensors 15, which are respectively arranged at the left and right ends of the first temperature control board 12. The temperature of the first temperature control board 12 is detected by the two temperature sensors 15, which is conducive to improving the accuracy of temperature detection.

[0034] Furthermore, the first chip positioning structure 1 further includes a fastener, a first connection hole 112 is provided on the first chip positioning plate 11, a second connection hole 122 is provided on the first temperature control plate 12, and the fastener is sequentially inserted into the first connection hole 112 and the second connection hole 122 to fix the first chip positioning plate 11 and the first temperature control plate 12. In an optional embodiment, the fastener may be a screw or a bolt, and the first chip positioning plate 11 and the first temperature control plate 12 are fixedly connected by the fastener.

[0035] Furthermore, the normal high and low temperature chip handling module further includes a second chip positioning structure 3 and a fixing member 4. The second chip positioning structure 3 and the first chip positioning structure 1 are both arranged on the fixing member 4, and the driving mechanism 2 is drivingly connected to the fixing member 4. The second chip positioning structure 3 is used to transport the chips after the test.

[0036] Further, the second chip positioning structure 3 includes a second chip positioning plate 31, a second temperature control plate 32 and a second heating element, the second temperature control plate 32 is attached to the bottom wall of the second chip positioning plate 31, and the second heating element is arranged on the second temperature control plate 32 to heat the second temperature control plate 32. The second heating element is arranged on the second temperature control plate 32, which can heat the chip after being tested in the low-temperature test area to avoid frosting of the chip after coming out of the low-temperature test area.

[0037] In an optional embodiment, the second chip positioning plate 31 is provided with second chip positioning grooves, and there are thirty-two second chip positioning grooves, which are distributed in four rows and eight columns on the second chip positioning plate 31 to transport thirty-two chips at the same time, thereby improving chip testing efficiency.

[0038] Furthermore, the driving mechanism 2 includes a driving motor 21 and a synchronous belt 22, the output end of the driving motor 21 is connected to the synchronous belt 22 to drive the synchronous belt 22 to rotate, and the fixing member 4 is connected to the synchronous belt 22. The driving motor 21 and the synchronous belt 22 cooperate to drive the fixing member 4 to move in the horizontal direction, thereby realizing the transportation and movement of the chip.

[0039] The above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit the protection scope of the utility model.

Claims

1. A high and low temperature chip handling module, characterized in that: The invention comprises a first chip positioning structure (1) and a driving mechanism (2), wherein the first chip positioning structure (1) is drivingly connected to an output end of the driving mechanism (2) so as to drive the first chip positioning structure (1) to move, wherein the first chip positioning structure (1) comprises a first chip positioning plate (11) and a temperature control structure, wherein the temperature control structure is attached to one side of the first chip positioning plate (11), and a plurality of first chip positioning grooves (111) are provided on the other side of the first chip positioning plate (11) for storing chips, and the temperature control structure is used to adjust the temperature of the first chip positioning plate (11) to achieve a constant high or low temperature.

2. The high and low temperature chip handling module according to claim 1, characterized in that: The temperature control structure comprises a first temperature control plate (12), a refrigerant tube (13) and at least one first heating element (14); the first temperature control plate (12) is attached to the bottom wall of the first chip positioning plate (11); the first heating element (14) is arranged on the first temperature control plate (12); the refrigerant tube (13) comprises a first section and a second section; a flow channel is provided in the first temperature control plate (12); the inlet of the flow channel is connected to the output end of the first section; the outlet of the flow channel is connected to the input end of the second section; the first temperature control plate (12) is drivingly connected to the output end of the driving mechanism (2).

3. The high and low temperature chip handling module according to claim 2, characterized in that: At least one mounting hole (121) is provided on the front side wall of the first temperature control plate (12), the depth of the mounting hole (121) is greater than half the width of the first temperature control plate (12), and the first heating element (14) is arranged in the mounting hole (121).

4. The normal high and low temperature chip handling module according to claim 3, characterized in that: The first heating element (14) and the mounting holes (121) are both multiple in number, the multiple mounting holes (121) are distributed on the first temperature control plate (12) at equal intervals, and one of the first heating elements (14) is placed in each mounting hole (121).

5. The normal high and low temperature chip handling module according to claim 2, characterized in that: The temperature control structure further comprises at least one temperature sensor (15), wherein the temperature sensor (15) is arranged on the first temperature control plate (12) to detect the temperature value of the first temperature control plate (12).

6. The normal high and low temperature chip handling module according to claim 5, characterized in that: The number of the temperature sensors (15) is two, and the two temperature sensors (15) are respectively arranged at the left and right ends of the first temperature control plate (12).

7. The normal high and low temperature chip handling module according to claim 2, characterized in that: The first chip positioning structure (1) further comprises a fastener, the first chip positioning plate (11) is provided with a first connection hole (112), the first temperature control plate (12) is provided with a second connection hole (122), and the fastener is inserted into the first connection hole (112) and the second connection hole (122) in sequence to fix the first chip positioning plate (11) and the first temperature control plate (12) in connection.

8. The normal high and low temperature chip handling module according to claim 1, characterized in that: The normally high and low temperature chip handling module further comprises a second chip positioning structure (3) and a fixing member (4); the second chip positioning structure (3) and the first chip positioning structure (1) are both arranged on the fixing member (4); and the driving mechanism (2) is drivingly connected to the fixing member (4).

9. The normal high and low temperature chip handling module according to claim 8, characterized in that: The second chip positioning structure (3) comprises a second chip positioning plate (31), a second temperature control plate (32) and a second heating element, wherein the second temperature control plate (32) is attached to the bottom wall of the second chip positioning plate (31), and the second heating element is arranged on the second temperature control plate (32) to heat the second temperature control plate (32).

10. The normal high and low temperature chip handling module according to claim 8, characterized in that: The driving mechanism (2) comprises a driving motor (21) and a synchronous belt (22); an output end of the driving motor (21) is connected to the synchronous belt (22) to drive the synchronous belt (22) to rotate; and the fixing member (4) is connected to the synchronous belt (22).

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