Material taking and placing device for silicon wafer testing equipment

Abstract

The utility model discloses a material taking and placing device for silicon wafer testing equipment, relates to the technical field of material taking and placing for silicon wafer testing, and solves the problems that the bottom position of the taking and placing device is fixed, the taking and placing device can only move around and limited positions, and a clamping jaw cannot perform same vertical clamping on silicon wafers with different parts and in the same direction; the silicon wafer clamping device comprises a base, a first linear motor and a second linear motor, a groove is formed in the base, the second linear motor is fixedly installed in the groove, a fixed seat is fixedly installed at the movable end of the second linear motor, and the movable end of the fixed seat is fixedly connected with the first linear motor. An installation frame is fixedly installed at the upper end of the fixing base, the electric clamping jaw can be conveniently moved to the positions above silicon wafers at different positions through cooperation between the first linear motor and the second linear motor, and through cooperation between the clamping pad and the clamping groove, the silicon wafers can be stably clamped and can be protected.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer testing material taking and placing, in particular to a material taking and placing device for silicon wafer testing equipment. Background Art

[0002] Before the silicon wafer is used, its electrical specificity needs to be tested. After searching, the patent with announcement number CN218114282U discloses a material picking and placing device for silicon wafer testing equipment, including an operating table, a lifting device is arranged inside the operating table, and the lifting device includes a cleaning tank, a motor, an electric push rod, a first connecting plate, a second placement plate and a fixed plate. The top of the operating table is provided with an adjustment device, and the adjustment device includes a fixed seat, a support column, a first connecting block, a rotating assembly and a second connecting block. The top of the second connecting block is provided with a picking and placing device, and the picking and placing device includes a first mechanical arm, a second connecting plate, a second mechanical arm, a third connecting block, a nozzle holder and an anti-wear pad. The top of the operating table is fixedly installed with a first placement plate, and a cleaning tank is provided on the top of the operating table. The cleaning tank is provided with a motor. The picking and placing device for silicon wafer testing equipment is no longer limited to horizontal angle picking and placing, so that the picking and placing angle is more multi-angle, which increases the space for picking and placing silicon wafers, and facilitates the next step of the cleaned silicon wafers. However, the bottom position of the pick-and-place device is fixed and can only move around a limited position, and the clamping claws cannot perform the same vertical clamping on silicon wafers in different positions and in the same direction, thereby making the position of the clamped silicon wafer unstable. Utility Model Content

[0003] In view of the deficiencies in the prior art, the utility model provides a picking and placing device for silicon wafer testing equipment, which solves the problem that the bottom position of the picking and placing device is fixed and can only move around a limited position, and the clamping claws cannot perform the same vertical clamping for silicon wafers in different positions and in the same direction, thereby making the position of the clamped silicon wafer unstable.

[0004] To achieve the above objectives, the utility model is implemented through the following technical solutions: a material taking and placing device for silicon wafer testing equipment includes a base, a first linear motor and a second linear motor, the base is provided with a groove inside, the second linear motor is fixedly installed in the groove, the moving end of the second linear motor is fixedly installed with a fixed seat, the upper end of the fixed seat is fixedly installed with a mounting frame, the mounting frame is in a "mouth" shape, the upper end of the first linear motor is fixedly installed on the upper end side wall in the mounting frame, the moving end of the first linear motor is fixedly installed with an adjustable electric telescopic rod, the output shaft of the adjustable electric telescopic rod is fixedly connected with an electric clamp, the upper end of the base is fixedly installed with a placement frame, the placement frame is U-shaped, a plurality of placement plates are fixedly installed at equal intervals inside the placement frame, the placement frames are all located below the first linear motor, and the distance between the clamping arms of the electric clamp is greater than the width of the placement frame, and the diameter of the silicon wafer is greater than the width of the placement frame.

[0005] Preferably, clamping pads are fixedly mounted on the side walls of the clamping side walls on both sides of the electric clamping jaws, and clamping grooves are provided inside the clamping pads, so as to facilitate clamping of the silicon wafer.

[0006] Preferably, a plurality of placement seats are fixedly mounted on the upper end of the base and are arranged at the rear end of the groove, so as to facilitate clamping the silicon wafer and placing the silicon wafer on the placement seats.

[0007] Preferably, the distance between the top surface of the first linear motor and the bottom of the electric clamp in the initial position is smaller than the height inside the mounting frame, so that the first linear motor can drive the electric clamp to move back and forth.

[0008] Preferably, the length of the first linear motor is greater than the length of the base, so that silicon wafers at different positions can be taken and placed.

[0009] The utility model provides a material taking and placing device for silicon wafer testing equipment. It has the following beneficial effects:

[0010] 1. The pick-up and unplacing device for silicon wafer testing equipment, when using the pick-up and unplacing device for silicon wafer testing equipment, can conveniently move the electric clamp to the top of the silicon wafer at different positions through the cooperation between the first linear electric motor and the second linear motor, and can not only stably clamp the silicon wafer but also protect it by the cooperation between the clamping pad and the clamping groove;

[0011] 2. The pick-up and unloading device for silicon wafer testing equipment, when in use, cooperates between the mounting frame and the placement plate, so that the silicon wafers can be placed in layers. When clamping, the clamping arms on both sides of the electric clamp are located on both sides of the mounting frame, so that the silicon wafers can be clamped vertically, thereby increasing the stability of the clamping of the silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0013] Figure 2 It is a side view of the utility model;

[0014] Figure 3 It is a schematic diagram of the placement structure of the utility model;

[0015] Figure 4 For this utility model Figure 2 Schematic diagram of the structure of part A.

[0016] In the figure, 1-base, 2-mounting frame, 3-electric clamp, 4-adjustable telescopic rod, 5-clamping slot, 6-first linear motor, 7-fixed seat, 8-mounting slot, 9-second linear motor, 10-placing frame, 11-placing seat, 12-placing plate, 13-clamping pad. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] Example 1

[0019] See also Figure 1-4The embodiment of the utility model provides a material taking and unloading device for silicon wafer testing equipment, including a base 1, a first linear motor 6 and a second linear motor 9. A groove 8 is arranged inside the base 1, and the second linear motor 9 is fixedly installed inside the groove 8. A fixed seat 7 is fixedly installed on the movable end of the second linear motor 9, and a mounting frame 2 is fixedly installed on the upper end of the fixed seat 7. The mounting frame 2 is in a "mouth" shape. The upper end of the first linear motor 6 is fixedly installed on the upper end side wall of the mounting frame 2. An adjustable electric telescopic rod 4 is fixedly installed on the movable end of the first linear motor 6, and an output shaft of the adjustable electric telescopic rod 4 is fixedly connected to an electric clamp 3. A placement frame 10 is fixedly installed on the upper end of the base 1, and the placement frame 10 is U-shaped. A plurality of placement plates 12 are fixedly installed at equal intervals inside the placement frame 10, and the placement frames 10 are all in the first linear motor 6, and the distance between the clamping arms of the electric clamp 3 is greater than the width of the placement rack 10, the diameter of the silicon wafer is greater than the width of the placement rack 10, the length of the first linear motor 6 is greater than the length of the base 1, and the silicon wafers are placed separately on adjacent placement plates 12. When clamping, the second linear motor 9 drives the fixed seat 7 to move its position, so that the position of the mounting frame 2 can be moved, and the position of the electric clamp 3 is moved to the placement rack 10, and the placement rack 10 is between the clamping arms on both sides of the electric clamp 3, and then the first linear motor 6 is used to move the electric clamp 3 to the top of the placement rack 10, and the electric telescopic rod 4 is opened and adjusted to enable the electric clamp 3 to clamp the placed silicon wafer. After clamping, the first linear motor 6 is used to move the electric clamp 3 horizontally out of the interior of the placement rack 10.

[0020] Example 2

[0021] In this embodiment, Figure 1-4 As shown, the side walls of the clamping side walls on both sides of the electric clamp 3 are fixedly installed with clamping pads 13, and the interior of the clamping pads 13 is provided with clamping grooves 5. When clamping the silicon wafer, the two sides of the silicon wafer are allowed to enter the interior of the clamping groove 5, which is convenient for clamping the silicon wafer. A plurality of placement seats 11 are fixedly installed on the upper end of the base 1 and are arranged at the rear end of the groove 8. After the silicon wafer is clamped, the clamped silicon wafer is placed on the corresponding placement seat 8 according to the position of the placement seat 11 by utilizing the cooperation between the first linear motor 6 and the second linear motor 9. The distance from the top surface of the first linear motor 6 to the bottom of the electric clamp 3 in the initial position is less than the height inside the mounting frame 2.

[0022] It should be noted that in this embodiment, when using the silicon wafer testing equipment to take and place the material, Figure 1-4As shown, the silicon wafers are placed separately on adjacent placement plates 12. When clamping, the second linear motor 9 drives the fixed seat 7 to move, so that the position of the mounting frame 2 can be moved, and the position of the electric clamp 3 is moved to the placement frame 10, and the placement frame 10 is between the clamping arms on both sides of the electric clamp 3. Then, the first linear motor 6 is used to move the electric clamp 3 to the top of the placement frame 10, and the electric telescopic rod 4 is opened and adjusted to enable the electric clamp 3 to clamp the placed silicon wafer, so that the two sides of the silicon wafer enter the inside of the clamping groove 5, which is convenient for clamping the silicon wafer. After clamping, the first linear motor 6 is used to move the electric clamp 3 horizontally out of the placement frame 10, and then the first linear motor 6 and the second linear motor 9 are used to cooperate according to the position of the placement seat 11 to place the clamped silicon wafer on the corresponding placement seat 8.

[0023] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0024] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A material handling device for silicon wafer testing equipment, characterized in that: The invention comprises a base (1), a first linear motor (6) and a second linear motor (9), wherein a groove (8) is arranged inside the base (1), the second linear motor (9) is fixedly mounted inside the groove (8), a fixed seat (7) is fixedly mounted on the movable end of the second linear motor (9), a mounting frame (2) is fixedly mounted on the upper end of the fixed seat (7), the mounting frame (2) is in the shape of a "mouth", the upper end of the first linear motor (6) is fixedly mounted on the upper end side wall of the mounting frame (2), the movable ... An adjustable electric telescopic rod (4) is fixedly installed, and the output shaft of the adjustable electric telescopic rod (4) is fixedly connected to an electric clamp (3). A placement frame (10) is fixedly installed on the upper end of the base (1). The placement frame (10) is U-shaped, and a plurality of placement plates (12) are fixedly installed at equal intervals inside the placement frame (10). The placement frames (10) are all located below the first linear motor (6), and the distance between the clamping arms of the electric clamp (3) is greater than the width of the placement frame (10), and the diameter of the silicon wafer is greater than the width of the placement frame (10).

2. The material handling device for silicon wafer testing equipment according to claim 1, characterized in that: Clamping pads (13) are fixedly mounted on the side walls of the clamping side walls on both sides of the electric clamping jaw (3), and clamping grooves (5) are arranged inside the clamping pads (13).

3. The material handling device for silicon wafer testing equipment according to claim 1, characterized in that: A plurality of placement seats (11) are fixedly mounted on the upper end of the base (1) and are arranged at the rear end of the groove (8).

4. The material loading and unloading device for silicon wafer testing equipment according to claim 1, characterized in that: The distance between the top surface of the first linear motor (6) and the bottom of the electric clamp (3) in the initial position is smaller than the height inside the mounting frame (2).

5. The material loading and unloading device for silicon wafer testing equipment according to claim 1, characterized in that: The length of the first linear motor (6) is greater than the length of the base (1).

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