Pressure sensor assembly

Abstract

The utility model provides a pressure sensor assembly, which comprises a pressure sensor, and the pressure sensor comprises a main body part, a connecting plug connected with the main body part, and a connecting part connected with the main body part. The main body part is provided with an accommodating cavity, and the pressure sensor assembly further comprises a pressure chip arranged in the accommodating cavity. And the connecting part is provided with a channel connected with the accommodating cavity. Wherein the pressure sensing module comprises a pressure sensing component and a contact pin, and is used for replacing the pressure sensing component installed through a wire binding process, so that the effects that the process is relatively simple and the production cost is reduced are achieved.

Description

Technical Field

[0001] The utility model relates to a pressure sensor component, in particular to a pressure sensor component used in the field of automobile brake auxiliary systems. Background Art

[0002] Pressure sensors are used in many systems of vehicles. During the operation of the pressure sensor, the pressure gas to be measured will contact the pressure chip through the sensor air inlet, and the sensor will sense the gas pressure and transmit the signal.

[0003] Traditional pressure sensing chips need to use a wire binding process to output pressure signals. However, this wire binding method is not only difficult in terms of technology, but also has many limitations on the structural design of the product, and the frequency of failure is relatively high. Utility Model Content

[0004] The utility model aims to provide a pressure sensor component with low process difficulty and reduced production cost.

[0005] According to one aspect of the utility model, a pressure sensor assembly is provided, which includes a main body, a plug connector connected to the main body, and a cover body connected to the main body, the main body is provided with a receiving cavity, the pressure sensor assembly also includes a pressure sensing module arranged in the receiving cavity, the cover body is provided with a channel connected to the receiving cavity, and the pressure sensing module includes a pressure sensing component and a pin.

[0006] Preferably, the pressure sensing component and the pin are connected together by welding, and the welded pressure sensing module is directly installed in the receiving cavity of the main body, replacing the cumbersome wire binding process.

[0007] Preferably, the pressure sensing component comprises a pressure sensing element.

[0008] Preferably, the pressure sensing component is formed by integrally packaging a MEMS chip and an ASIC chip.

[0009] Preferably, the pressure sensing component is formed by installing a pressure sensing element on a PCB circuit board.

[0010] Preferably, the number of the pins is three.

[0011] The pressure sensor assembly provided by the utility model replaces the difficult wire binding process implemented after the chip is installed in the sensor by installing a packaged pressure sensing component with a pin into the pressure sensor, thereby reducing process requirements and production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1It is a three-dimensional exploded view of the pressure sensor assembly of the utility model.

[0013] Figure 2 It is a top view of the column part of the pressure sensor assembly of the utility model.

[0014] Figure 3 It is a three-dimensional diagram of the pressure sensor assembly of the present utility model.

[0015] in,

[0016] 100. Pressure sensor assembly; 1. Plug connector; 2. Main body; 21. Accommodating cavity; 3. Colloid; 4. Cover body; 5. Pressure sensing module; 51. Pressure sensing component; 52. Pin. DETAILED DESCRIPTION

[0017] See also Figures 1 to 3 As shown, the utility model provides a pressure sensor assembly 100, the pressure sensor 100 comprises a main body 2, a plug connector 1 connected to the main body 2 and a cover body 4 connected to the main body 2, the main body 2 is provided with a receiving cavity 21, the pressure sensor assembly 100 further comprises a pressure sensing module 5 arranged in the receiving cavity 21, and the cover body 4 is provided with a channel communicating with the receiving cavity 21. The pressure sensing module 5 comprises a pressure sensing component 51 and a plug pin 52.

[0018] In order to connect the pressure sensing component 51 and the pin 52, welding method can be used, especially resistance welding method.

[0019] The pressure sensing module 5 formed by welding the pressure sensing component 51 and the pin 52 into the accommodating cavity 21 can reduce the relatively complicated wire binding process. In traditional pressure sensors, generally, a circuit board with a pressure sensing chip installed is first installed into the pressure sensor, and then the chip and the connector are connected using a wire binding process. Therefore, a relatively complicated wire binding process needs to be implemented during the production process, and there are many restrictions in the design. According to the pressure sensor assembly 100 of the utility model, the packaged pressure sensing module 5 with the pin 52 is directly installed in the pressure sensor, and then the pin 52 is connected to the terminal of the plug connector 1. In this way, the wire binding process is no longer required, which makes the installation process much simpler, reduces the requirements for the production process, and reduces the production cost.

[0020] The pressure sensing component 51 includes a pressure sensing element, which is a MEMS chip or other pressure sensitive chips.

[0021] Specifically, the pressure sensing component 51 is formed by integrally packaging a MEMS chip and an ASIC chip. The pressure sensing element is mounted on a PCB circuit board, connected to the pin 52 by welding, and then placed in the receiving cavity 21 of the main body (2). When the cover 4 covers the main body 2, the cover 4 is provided with a through hole connected to the main body 2, so that the pressure sensing component 51 installed on the main body 2 can sense the pressure of the gas. The pin 52 is connected to the terminal of the plug connector 1 to transmit the sensed pressure signal to the outside. At this time, there can be three pins 52.

[0022] In order to fix the cover part 4 and the main body 2 , glue is injected into the periphery of the receiving cavity 21 of the main body 2 . The glue forms a colloid 3 after solidification, and fixes the main body 2 and the cover part 4 together.

[0023] It will be apparent to those skilled in the art that various modifications and variations can be made to the above exemplary embodiments of the present invention without departing from the spirit and scope of the present invention. Therefore, it is intended that the present invention covers modifications and variations of the present invention that fall within the scope of the appended claims and their equivalent technical solutions.

Claims

1. A pressure sensor assembly, comprising a main body (2), a plug connector (1) connected to the main body (2), and a cover body (4) connected to the main body (2), wherein the main body (2) is provided with a receiving cavity (21), the pressure sensor assembly (100) further comprises a pressure sensing module (5) arranged in the receiving cavity (21), and the cover body (4) is provided with a channel connected to the receiving cavity (21), characterized in that: The pressure sensing module (5) comprises a pressure sensing component (51) and a pin (52).

2. The pressure sensor assembly according to claim 1, wherein: The pressure sensing component (51) and the plug pin (52) are connected together by welding.

3. The pressure sensor assembly according to claim 2, characterized in that The pressure sensing component (51) comprises a pressure sensing element.

4. The pressure sensor assembly according to claim 3, characterized in that The pressure sensing component (51) is formed by integrally packaging a MEMS chip and an ASIC chip.

5. The pressure sensor assembly according to claim 3, characterized in that: The pressure sensing component (51) is formed by installing a pressure sensing element on a PCB circuit board.

6. The pressure sensor assembly according to claim 1, wherein: The number of the pins (52) is three.

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