Test socket

Abstract

The utility model relates to the technical field of semiconductor testing, in particular to a testing socket. The test socket comprises a mounting frame, a matching seat and a probe, the matching seat is fixed in the mounting frame, a stepped through hole is formed in the matching seat, the probe is accommodated in the stepped through hole, the stepped through hole comprises a limiting part and an adjusting part, the inner diameter of the limiting part is matched with the inner diameter of the probe, and the inner diameter of the adjusting part is larger than that of the limiting part. The gap between the adjusting part and the probe is configured to reduce the dielectric constant value of the test socket, the impedance of the semiconductor chip to be tested is in direct proportion to the axial length of the adjusting part and / or the inner diameter of the adjusting part, and the air in the gap between the adjusting part and the probe is utilized to reduce the overall dielectric constant value of the test socket. The axial length and / or the inner diameter of the adjusting part in the through hole of the connector can be adjusted according to actual requirements, the dielectric constant value of the test socket can be adjusted, and compared with the mode of arranging test sockets of various test specifications in the prior art, the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing, in particular to a testing socket. Background Art

[0002] With the rapid development of integrated circuits, there are more and more types of semiconductor chips. At the same time, there are many types of semiconductor chip packaging, which brings great challenges to the integrated circuit testing in semiconductor chips. In order to test semiconductor chips, test sockets are usually used for testing.

[0003] At present, the electrical signals of many semiconductor chips on the market are not designed with a single impedance. The impedance of semiconductor chips generally includes 40Ω, 42.5Ω, 45Ω, 50Ω, etc. When using a test socket to test semiconductor chips, because the test specification of the test socket is a single specification, a single test socket cannot guarantee that when testing semiconductor chips with different impedances, the test results obtained are all optimal test results. In order to obtain the best test results for semiconductor chips with different impedances, it is necessary to use a variety of test sockets with different test specifications to match the various impedances of semiconductor chips, but the price of the test socket is relatively high. If multiple test sockets are purchased and used, the production cost will rise sharply.

[0004] Therefore, it is urgent to invent a test socket to solve the above problems. Utility Model Content

[0005] The utility model aims to provide a test socket, which can adapt to the multi-impedance of a semiconductor chip by changing the dielectric constant value of the test socket, meet the test requirements and reduce the production cost.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] Test socket, including:

[0008] Mounting frame;

[0009] A matching seat and a probe, wherein the matching seat is fixed in the mounting frame, a stepped through hole is provided in the matching seat, and the probe is accommodated in the stepped through hole;

[0010] The stepped through hole includes a limiting portion and an adjusting portion, the inner diameter of the limiting portion is matched with the inner diameter of the probe, the inner diameter of the adjusting portion is larger than the inner diameter of the limiting portion, and the gap between the adjusting portion and the probe is configured to reduce the dielectric constant value of the test socket, and the impedance of the semiconductor chip to be tested is proportional to the axial length of the adjusting portion and / or the inner diameter of the adjusting portion.

[0011] As an optional solution, the probe is a double-action type, and the probe includes a first extension portion and second extension portions arranged at both ends of the first extension portion, and the second extension portion can move axially relative to the first extension portion;

[0012] The stepped through hole comprises a first limiting portion, a second limiting portion and a first adjusting portion, wherein the first adjusting portion is arranged corresponding to the first extending portion, both ends of the first adjusting portion are provided with the first limiting portion, and one end of each of the first limiting portions away from the first adjusting portion is provided with the second limiting portion;

[0013] The first limiting portion is configured to radially position the first extending portion, the second limiting portion is configured to radially position the second extending portion, and the first adjusting portion is configured to reduce the dielectric constant value at the first extending portion.

[0014] As an optional solution, the stepped through hole further includes:

[0015] A docking portion, wherein the docking portion is arranged at an end of the second limiting portion away from the first limiting portion, the docking portion is used to accommodate the second extending portion, and the inner diameter of the docking portion is greater than the inner diameter of the second limiting portion.

[0016] As an optional solution, the probe is a single-action type, and the probe includes a third extension portion, a fourth extension portion and a fifth extension portion, the third extension portion and the fifth extension portion are respectively arranged at two ends of the fourth extension portion, and the fourth extension portion can move axially relative to the fifth extension portion;

[0017] The stepped through hole comprises a third limiting portion, a fourth limiting portion, a second adjusting portion and a fifth limiting portion, the second adjusting portion is arranged corresponding to the fourth extending portion, both ends of the second adjusting portion are provided with the fourth limiting portions, and the ends of the two fourth limiting portions away from the second adjusting portion are respectively provided with the third limiting portion and the fifth limiting portion;

[0018] The third limiting portion is configured to radially position the third extension portion, the fourth limiting portion is configured to radially position the fourth extension portion, the fifth limiting portion is configured to radially position the fifth extension portion, and the second adjusting portion is configured to reduce the dielectric constant value at the fourth extension portion.

[0019] As an optional solution, the probe is of a ring type, comprising a sixth extension portion, a seventh extension portion and a collar, the collar being fixed on the sixth extension portion, and the sixth extension portion being able to move axially relative to the seventh extension portion;

[0020] The stepped through hole comprises a sixth limiting portion, a seventh limiting portion, an eighth limiting portion and a third adjusting portion, the sixth limiting portion is disposed at both ends of the seventh limiting portion, and the eighth limiting portion and the third adjusting portion are disposed at one end of the two sixth limiting portions away from the seventh limiting portion respectively;

[0021] The ring is capable of moving within the seventh limiting portion, the seventh limiting portion is configured to radially position the ring, the sixth limiting portion is configured to radially position the sixth extension portion, the eighth limiting portion is configured to radially position the seventh extension portion, and the third adjustment portion is configured to reduce the dielectric constant value at the sixth extension portion.

[0022] As an optional solution, the mating seat includes:

[0023] The first matching plate and the second matching plate are arranged opposite to each other, the stepped through hole penetrates both the first matching plate and the second matching plate at the same time, and the probe is installed into the stepped through hole from the opposite end surfaces of the first matching plate and the second matching plate.

[0024] As an optional solution, the stepped through hole is chamfered on the end surface of the first mating plate close to the second mating plate; and / or

[0025] The stepped through hole is chamfered on the end surface of the second matching plate close to the first matching plate.

[0026] As an optional solution, the mating seat is made of plastic with insulating function.

[0027] As an optional solution, the mounting frame includes:

[0028] A frame structure, wherein a receiving cavity is provided in the frame structure, and the matching seat is fixed in the receiving cavity; and

[0029] A support column is disposed between the frame structure and a mounting base, and is configured to support the frame structure.

[0030] As an optional solution, a plurality of support columns are disposed in the mounting frame, and the plurality of support columns are arranged between the frame structure and the mounting base surface at intervals along the shape of the frame structure, and the plurality of support columns jointly support the frame structure.

[0031] Beneficial effects of the utility model:

[0032] The test socket provided by the utility model is provided with a stepped through hole in a matching seat for accommodating and fixing the probe, the stepped through hole is divided into a limiting part and an adjusting part, the inner diameter of the limiting part is matched with the diameter of the probe, and the inner diameter of the adjusting part is larger than the inner diameter of the limiting part, and the air existing in the gap between the adjusting part and the probe is used to reduce the dielectric constant value of the test socket as a whole, and the more air retained in the gap between the adjusting part and the probe, the smaller the dielectric constant value of the test socket as a whole, so that the test socket can be adapted to the semiconductor chip to be tested with a larger impedance. In the actual testing process, the axial length and / or inner diameter of the adjusting part in the stepped through hole can be adjusted according to actual needs, thereby realizing the adjustment of the dielectric constant value of the test socket. Compared with the method of providing a plurality of test sockets with different test specifications in the prior art, the production cost can be effectively reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a cross-sectional schematic diagram of a test socket in the prior art in the first embodiment of the utility model;

[0034] Figure 2 yes Figure 1 A local enlarged schematic diagram of the middle A;

[0035] Figure 3 It is a cross-sectional schematic diagram of the test socket provided in the first embodiment of the utility model;

[0036] Figure 4 yes Figure 3 A partial enlarged schematic diagram of point B in the middle;

[0037] Figure 5 It is a cross-sectional schematic diagram of a test socket in the prior art in the second embodiment of the utility model;

[0038] Figure 6 yes Figure 5 A partial enlarged schematic diagram of point C in the middle;

[0039] Figure 7 It is a cross-sectional schematic diagram of a test socket provided in the second embodiment of the utility model;

[0040] Figure 8 yes Figure 7 A partial enlarged schematic diagram of point D in the middle;

[0041] Fig. 9 It is a cross-sectional schematic diagram of a test socket in the prior art in the third embodiment of the utility model;

[0042] Fig.10 yes Fig. 9 A partial enlarged schematic diagram of point E in the middle;

[0043] Fig.11It is a cross-sectional schematic diagram of a test socket provided in Embodiment 3 of the present utility model;

[0044] Fig.12 yes Fig.11 A partial enlarged schematic diagram of point F in the middle.

[0045] In the figure:

[0046] 1. Existing frame; 2. Existing connecting seat; 3. Placement through hole; 31. First placement section; 32. Second placement section; 33. Third placement section; 34. Fourth placement section; 35. Fifth placement section; 36. Sixth placement section; 37. Seventh placement section; 38. Eighth placement section; 39. Ninth placement section;

[0047] 1000, test socket;

[0048] 100, mounting frame; 110, frame structure; 120, supporting column;

[0049] 200, matching seat; 210, first matching plate; 220, second matching plate; 230, stepped through hole; 231, first limiting portion; 232, second limiting portion; 233, first adjusting portion; 234, docking portion; 235, third limiting portion; 236, fourth limiting portion; 237, second adjusting portion; 238, fifth limiting portion; 239, sixth limiting portion; 2310, seventh limiting portion; 2311, eighth limiting portion; 2312, third adjusting portion;

[0050] 300, probe; 310, first extension; 320, second extension; 330, third extension; 340, fourth extension; 350, fifth extension; 360, sixth extension; 370, seventh extension; 380, collar;

[0051] 2000. Semiconductor chip under test. DETAILED DESCRIPTION

[0052] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved more clearly, the technical solutions of the present invention are further explained below with reference to the accompanying drawings and through specific implementation methods.

[0053] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0054] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0055] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0056] Embodiment 1

[0057] like Figure 1 and Figure 2 As shown, the existing test socket includes an existing frame 1 and an existing connection seat 2. The existing connection seat 2 is arranged in the existing frame 1. A placement through hole 3 that matches the shape of the probe 300 is opened in the existing connection seat 2 to accommodate and fix the probe 3000.

[0058] At present, the electrical signals of many semiconductor chips on the market are not designed with a single impedance. The impedance of the semiconductor chip 2000 generally includes 40Ω, 42.5Ω, 45Ω, 50Ω, etc. When using the existing test socket to test the semiconductor chip 2000, because the test specification of the existing test socket is a single specification, the existing test socket cannot guarantee that when testing the semiconductor chip 2000 with different impedances, the test results obtained are all the optimal test results. In order to obtain the optimal test results for semiconductor chips with different impedances, it is necessary to use a variety of test sockets with different test specifications to match the multiple impedances of the semiconductor chip, but the price of the test socket is relatively high. If multiple test sockets are purchased and used, the production cost will rise sharply.

[0059] In order to solve the above problems, Figure 3 and Figure 4As shown, this embodiment provides a test socket 1000. The test socket 1000 includes a mounting frame 100, a mating seat 200 and a probe 300, wherein the mating seat 200 is fixed in the mounting frame 100, a stepped through hole 230 is provided in the mating seat 200, and the probe 300 is accommodated in the stepped through hole 230, and the stepped through hole 230 includes a limiting part and an adjusting part, the inner diameter of the limiting part is matched with the inner diameter of the probe 300, the inner diameter of the adjusting part is larger than the inner diameter of the limiting part, and the gap between the adjusting part and the probe 300 is configured to reduce the dielectric constant value of the test socket 1000, and the impedance of the semiconductor chip 2000 to be tested is proportional to the axial length of the adjusting part and / or the inner diameter of the adjusting part.

[0060] The test socket 1000 is provided with a stepped through hole 230 in a matching seat 200 for accommodating and fixing the probe 300, and the stepped through hole 230 is divided into a limiting part and an adjusting part. The inner diameter of the limiting part is matched with the diameter of the probe 300, and the inner diameter of the adjusting part is larger than the inner diameter of the limiting part. The air existing in the gap between the adjusting part and the probe 300 is used to reduce the dielectric constant value of the test socket 1000 as a whole. Moreover, the more air is retained in the gap between the adjusting part and the probe, the smaller the dielectric constant value of the test socket 1000 as a whole is, so that the test socket 1000 can be adapted to the semiconductor chip 2000 to be tested with a larger impedance. In the actual testing process, the axial length and / or inner diameter of the adjusting part in the stepped through hole 230 can be adjusted according to actual needs, thereby realizing the adjustment of the dielectric constant value of the test socket 1000. Compared with the method of providing a plurality of existing test sockets with different test specifications in the prior art, the production cost can be effectively reduced.

[0061] The probe 300 in this embodiment is a double-action type, and includes a first extension portion 310 and second extension portions 320 disposed at both ends of the first extension portion 310 , and the second extension portion 320 can move axially relative to the first extension portion 310 . The diameter of the second extension portion 320 is smaller than that of the first extension portion 310 .

[0062] In order to effectively fix the probe 300, the mating seat 200 includes a first mating plate 210 and a second mating plate 220 that are arranged opposite to each other, wherein the stepped through hole 230 penetrates both the first mating plate 210 and the second mating plate 220, and the probe 300 is installed into the stepped through hole 230 from the opposite end faces of the first mating plate 210 and the second mating plate 220. By setting the mating seat 200 to the first mating plate 210 and the second mating plate 220 that are arranged opposite to each other, the stepped through hole 230 penetrates both the first mating plate 210 and the second mating plate 220, and the probe 300 is installed into the stepped through hole 230 from the opposite end faces of the first mating plate 210 and the second mating plate 220, it is possible to ensure that the first mating plate 210 and the second mating plate 220 effectively limit and fix the probe 300.

[0063] When the probe 300 needs to be installed into the stepped through hole 230, first separate the first mating plate 210 and the second mating plate 220 which are arranged opposite to each other, and then install the probe 300 into the stepped through hole 230 from the end face of the first mating plate 210 close to the second mating plate 220, or install the probe 300 into the stepped through hole 230 from the end face of the second mating plate 220 close to the first mating plate 210, and finally fix the first mating plate 210 and the second mating plate 220 relative to each other. At the same time, the probe 300 can be accurately accommodated in the stepped through hole 230 to achieve effective fixation of the probe 300.

[0064] In order to further improve the assembly efficiency of the probe 300 and the stepped through hole 230, a chamfer is provided on the end surface of the first mating plate 210 close to the second mating plate 220, and / or a chamfer is provided on the end surface of the second mating plate 220 close to the first mating plate 210. By providing a chamfer on the end surface of the stepped through hole 230 in the first mating plate 210 close to the second mating plate 220, and / or providing a chamfer on the end surface of the stepped through hole 230 in the second mating plate 220 close to the first mating plate 210, the guiding effect of the chamfer can be used to improve the convenience of docking between the probe 300 and the stepped through hole 230, thereby improving the assembly efficiency of the probe 300 and the stepped through hole 230.

[0065] It should be noted that, in this embodiment, the stepped through hole 230 is chamfered on the end surface of the first mating plate 210 close to the second mating plate 220, and the stepped through hole 230 is chamfered on the end surface of the second mating plate 220 close to the first mating plate 210. In other embodiments, only the stepped through hole 230 may be chamfered on the end surface of the first mating plate 210 close to the second mating plate 220, or only the stepped through hole 230 may be chamfered on the end surface of the second mating plate 220 close to the first mating plate 210, which is not specifically limited in this embodiment.

[0066] Furthermore, the specification of the chamfer is 0.5 mm to 1 mm. In this embodiment, the specification of the chamfer is preferably 0.8 mm. In other embodiments, the specification of the chamfer can also be adjusted arbitrarily within the range of 0.5 mm to 1 mm, which is not specifically limited in this embodiment.

[0067] In addition, the first matching plate 210 and the second matching plate 220 are both made of plastic with insulation function to ensure effective insulation of the probe 300 arranged in the first matching plate 210 and the second matching plate 220. It should be noted that in the present embodiment, the first matching plate 210 and the second matching plate 220 are both made of PEEK (polyetheretherketone) material. PEEK has excellent mechanical properties and good insulation. In other embodiments, the first matching plate 210 and the second matching plate 220 can also be made of other plastics with insulation function, which is not specifically limited in the present embodiment.

[0068] In an optional embodiment, the mounting frame 100 includes a frame structure 110 and a support column 120, wherein a receiving cavity is provided in the frame structure 110, the mating seat 200 is fixed in the receiving cavity, the support column 120 is provided between the frame structure 110 and the mounting base, and the support column 120 is configured to support the frame structure 110. By configuring the mounting frame 100 as the frame structure 110 for fixing the mating seat 200 and the support column 120 for supporting the frame structure 110, it is possible to facilitate the detection of the semiconductor chip 2000 to be tested.

[0069] Specifically, the test equipment is set on the mounting base and located below the frame structure 110, the probe 300 is set in the stepped through hole 230 in the mating seat 200 along the vertical direction, the semiconductor chip 2000 to be tested is set on the mating seat 200, and the two second extension parts 320 of the probe 300 are respectively abutted against the semiconductor chip 2000 to be tested and the test equipment to realize the detection of the semiconductor chip 2000 to be tested.

[0070] In order to improve the support stability of the frame structure 110, a plurality of support columns 120 are provided in the mounting frame 100. The plurality of support columns 120 are arranged between the frame structure 110 and the mounting base surface at intervals along the shape of the frame structure 110, and the plurality of support columns 120 jointly support the frame structure 110. It should be noted that, in the present embodiment, the frame structure 110 is rectangular, and four support columns 120 are provided in the mounting frame 100. The four support columns 120 are respectively arranged at the four corners of the rectangular frame structure 110. In other embodiments, the specific number of the support columns 120 can also be adjusted according to actual needs, and this embodiment does not make a specific limitation.

[0071] like Figure 1 and Figure 2As shown, when the probe 300 provided in this embodiment is applied to the prior art, the placement through hole 3 in the prior art includes a first placement section 31, a second placement section 32 and a third placement section 33, the second placement sections 32 are arranged at both ends of the first placement section 31, the third placement section 33 is arranged at the free end of the second placement section 32, the inner diameter of the first placement section 31 is adapted to the diameter of the first extension portion 310, the first placement section 31 is used to radially position the first extension portion 310, the inner diameter of the second placement section 32 is adapted to the diameter of the second extension portion 320, the second placement section 32 is used to radially position the second extension portion 320, the inner diameter of the third placement section 33 is larger than the inner diameter of the second placement section 32, and the third placement section 33 can facilitate the docking of the semiconductor chip 2000 to be tested with the second extension portion 320. However, the above-mentioned placement through hole 3 can only detect the semiconductor chip 2000 to be tested with a single impedance.

[0072] like Figure 3 and Figure 4 As shown, the stepped through hole 230 in the test socket 1000 provided in this embodiment includes a first limiting portion 231, a second limiting portion 232 and a first adjusting portion 233. The first adjusting portion 233 is arranged corresponding to the first extension portion 310. The first limiting portion 231 is arranged at both ends of the first adjusting portion 233. The second limiting portion 232 is arranged at one end of each first limiting portion 231 away from the first adjusting portion 233. The first limiting portion 231 is configured to radially position the first extension portion 310, the second limiting portion 232 is configured to radially position the second extension portion 320, and the first adjusting portion 233 is configured to reduce the dielectric constant value at the first extension portion 310. By setting the first limiting portion 231 to radially limit and fix the first extension portion 310, and setting the second limiting portion 232 to radially limit and fix the second extension portion 320, the probe 300 can be stably accommodated and fixed. By setting the first adjusting portion 233 to reduce the dielectric constant value at the first extension portion 310, the probe 300 can be adapted to the semiconductor chip 2000 to be tested with different impedances. When it is necessary to further adjust the dielectric constant value at the first extension portion 310, it can be done by changing the axial length and inner diameter of the first adjusting portion 233.

[0073] It can be understood that the axial length and inner diameter of the first adjustment portion 233 are not specifically limited, and can be adaptively adjusted according to the impedance of the semiconductor chip 2000 to be tested. In addition, during the adjustment process, the axial length and inner diameter of the first adjustment portion 233 can be adjusted at the same time, or only the axial length of the first adjustment portion 233 can be adjusted, or only the inner diameter of the first adjustment portion 233 can be adjusted, which is not specifically limited in this embodiment.

[0074] In addition, the stepped through hole 230 further includes a docking portion 234, wherein the docking portion 234 is disposed at one end of the second limiting portion 232 away from the first limiting portion 231, the docking portion 234 is used to accommodate the second extension portion 320, and the inner diameter of the docking portion 234 is greater than the inner diameter of the second limiting portion 232. By arranging the docking portion 234 at one end of the second limiting portion 232 away from the first limiting portion 231, the stable docking of the semiconductor chip 2000 to be tested and the second extension portion 320 can also be ensured.

[0075] Embodiment 2

[0076] The present embodiment provides a test socket 1000. The specific structure of the test socket 1000 provided in the present embodiment is substantially the same as that of the first embodiment, and the specific structure of the test socket 1000 provided in the present embodiment is different from that of the first embodiment in that the type of the probe 300 is different, and the specifications of the stepped through hole 230 for accommodating the positioning probe 300 are different.

[0077] Specifically, the probe 300 is a single-action type, and the probe 300 includes a third extension portion 330 , a fourth extension portion 340 and a fifth extension portion 350 . The third extension portion 330 and the fifth extension portion 350 are respectively arranged at two ends of the fourth extension portion 340 , and the fourth extension portion 340 can move axially relative to the fifth extension portion 350 .

[0078] In the prior art, Figure 5 and Figure 6 As shown, for the above-mentioned single-action probe, the existing placement through hole 3 includes a fourth placement section 34, a fifth placement section 35 and a sixth placement section 36, the fourth placement section 34 is used to radially position the fifth extension 350, the fifth placement section 35 is used to radially position the fourth extension 340, and the sixth placement section 36 is used to radially position the third extension 330. Similarly, the above-mentioned placement through hole 3 also cannot match the multi-impedance of the semiconductor chip 2000 to be tested.

[0079] like Figure 7 and Figure 8As shown, the stepped through hole 230 in the test socket 1000 provided in this embodiment includes a third limiting portion 235, a fourth limiting portion 236, a second adjusting portion 237 and a fifth limiting portion 238. The second adjusting portion 237 is arranged corresponding to the fourth extension portion 340. The fourth limiting portion 236 is arranged at both ends of the second adjusting portion 237. The third limiting portion 235 and the fifth limiting portion 238 are respectively arranged at one end of the two fourth limiting portions 236 away from the second adjusting portion 237. The third limiting portion 235 is configured to radially position the third extension portion 330, the fourth limiting portion 236 is configured to radially position the fourth extension portion 340, the fifth limiting portion 238 is configured to radially position the fifth extension portion 350, and the second adjusting portion 237 is configured to reduce the dielectric constant value at the fourth extension portion 340. By setting the third limiting portion 235 to radially limit the third extension portion 330, setting the fourth limiting portion 236 to radially position the fourth extension portion 340, and setting the fifth limiting portion 238 to radially position the fifth extension portion 350, effective positioning of the probe 300 is achieved. By setting the second adjusting portion 237, the dielectric constant value at the fourth extension portion 340 can be reduced, so that the probe 300 can be adapted to the semiconductor chip 2000 to be tested with different impedances. When it is necessary to further adjust the dielectric constant value at the fourth extension portion 340, it can be done by changing the axial length and inner diameter of the second adjusting portion 237.

[0080] It can be understood that the axial length and inner diameter of the second adjustment portion 237 are not specifically limited, and can be adaptively adjusted according to the impedance of the semiconductor chip 2000 to be tested. In addition, during the adjustment process, the axial length and inner diameter of the second adjustment portion 237 can be adjusted at the same time, or only the axial length of the second adjustment portion 237 can be adjusted, or only the inner diameter of the second adjustment portion 237 can be adjusted, which is not specifically limited in this embodiment.

[0081] Embodiment 3

[0082] The present embodiment provides a test socket 1000. The specific structure of the test socket 1000 provided in the present embodiment is substantially the same as that of the first embodiment, and the specific structure of the test socket 1000 provided in the present embodiment is different from that of the first embodiment in that the type of the probe 300 is different, and the specifications of the stepped through hole 230 for accommodating the positioning probe 300 are different.

[0083] Specifically, the probe 300 is a ring-type probe, comprising a sixth extension portion 360, a seventh extension portion 370 and a collar 380, wherein the collar 380 is fixed on the sixth extension portion 360, and the sixth extension portion 360 can move axially relative to the seventh extension portion 370;

[0084] In the prior art, Fig. 9 and Fig.10As shown, for the above-mentioned ring-type probe, the existing placement through hole 3 includes a seventh placement section 37, an eighth placement section 38 and a ninth placement section 39, the seventh placement section 37 is used to radially position the sixth extension 360, the eighth placement section 38 is used to radially position the seventh extension 370, and the ninth placement section 39 is used to radially position the collar 380. Similarly, the above-mentioned placement through hole 3 also cannot match the multi-impedance of the semiconductor chip 2000 to be tested.

[0085] like Fig.11 and Fig.12 The stepped through hole 230 in the test socket 1000 provided in this embodiment includes a sixth limiting portion 239, a seventh limiting portion 2310, an eighth limiting portion 2311 and a third adjusting portion 2312, wherein the sixth limiting portion 239 is disposed at both ends of the seventh limiting portion 2310, and the eighth limiting portion 2311 and the third adjusting portion 2312 are respectively disposed at one end of the two sixth limiting portions 233 away from the seventh limiting portion 2310, the collar 380 can move in the seventh limiting portion 2310, the seventh limiting portion 2310 is configured to radially position the collar 380, the sixth limiting portion 239 is configured to radially position the sixth extension portion 360, the eighth limiting portion 2311 is configured to radially position the seventh extension portion 370, and the third adjusting portion 2312 is configured to reduce the dielectric constant value at the sixth extension portion 360. By setting the sixth limiting portion 239 to radially position the sixth extension portion 360, setting the seventh limiting portion 2310 to radially position the ring 380, and setting the eighth limiting portion 2311 to radially position the seventh extension portion 370, effective positioning of the probe 300 can be achieved. By setting the third adjusting portion 2312, the dielectric constant value of the sixth extension portion 360 can be reduced, so that the probe 300 can be adapted to the semiconductor chip 2000 to be tested with different impedances. When it is necessary to further adjust the dielectric constant value at the sixth extension portion 360, it can be done by changing the axial length and inner diameter of the third adjusting portion 2312.

[0086] It can be understood that the axial length and inner diameter of the third adjustment portion 2312 are not specifically limited, and can be adaptively adjusted according to the impedance of the semiconductor chip 2000 to be tested. In addition, during the adjustment process, the axial length and inner diameter of the third adjustment portion 2312 can be adjusted at the same time, or only the axial length of the third adjustment portion 2312 can be adjusted, or only the inner diameter of the third adjustment portion 2312 can be adjusted, which is not specifically limited in this embodiment.

[0087] In addition, if Fig.12 As shown, since the inner diameter of the seventh limiting portion 2310 is too large, in order to facilitate processing, the seventh limiting portion 2310 can be directly cut and a groove can be formed to facilitate processing.

[0088] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A test socket, characterized in that: include: Mounting frame (100); A matching seat (200) and a probe (300), wherein the matching seat (200) is fixed in the mounting frame (100), a stepped through hole (230) is provided in the matching seat (200), and the probe (300) is accommodated in the stepped through hole (230); The stepped through hole (230) comprises a limiting portion and an adjusting portion, the inner diameter of the limiting portion is matched to the inner diameter of the probe (300), the inner diameter of the adjusting portion is larger than the inner diameter of the limiting portion, the gap between the adjusting portion and the probe (300) is configured to reduce the dielectric constant value of the test socket, and the impedance of the semiconductor chip (2000) to be tested is proportional to the axial length of the adjusting portion and / or the inner diameter of the adjusting portion.

2. The test socket according to claim 1, characterized in that: The probe (300) is of a double-action type, comprising a first extension portion (310) and second extension portions (320) arranged at both ends of the first extension portion (310), wherein the second extension portion (320) is capable of moving axially relative to the first extension portion (310); The stepped through hole (230) comprises a first limiting portion (231), a second limiting portion (232) and a first adjusting portion (233); the first adjusting portion (233) is arranged corresponding to the first extending portion (310); both ends of the first adjusting portion (233) are provided with the first limiting portion (231); and one end of each of the first limiting portions (231) away from the first adjusting portion (233) is provided with the second limiting portion (232); The first limiting portion (231) is configured to radially position the first extension portion (310), the second limiting portion (232) is configured to radially position the second extension portion (320), and the first adjusting portion (233) is configured to reduce the dielectric constant value at the first extension portion (310).

3. The test socket according to claim 2, characterized in that: The stepped through hole (230) further comprises: A docking portion (234), wherein the docking portion (234) is arranged at an end of the second limiting portion (232) away from the first limiting portion (231), the docking portion (234) is used to accommodate the second extending portion (320), and the inner diameter of the docking portion (234) is greater than the inner diameter of the second limiting portion (232).

4. The test socket according to claim 1, characterized in that: The probe (300) is of a single-action type, and comprises a third extension portion (330), a fourth extension portion (340) and a fifth extension portion (350), wherein the third extension portion (330) and the fifth extension portion (350) are respectively arranged at two ends of the fourth extension portion (340), and the fourth extension portion (340) can move axially relative to the fifth extension portion (350); The stepped through hole (230) comprises a third limiting portion (235), a fourth limiting portion (236), a second adjusting portion (237) and a fifth limiting portion (238); the second adjusting portion (237) is arranged corresponding to the fourth extending portion (340); both ends of the second adjusting portion (237) are provided with the fourth limiting portions (236); and the ends of the two fourth limiting portions (236) away from the second adjusting portion (237) are respectively provided with the third limiting portion (235) and the fifth limiting portion (238); The third limiting portion (235) is configured to radially position the third extension portion (330), the fourth limiting portion (236) is configured to radially position the fourth extension portion (340), the fifth limiting portion (238) is configured to radially position the fifth extension portion (350), and the second adjusting portion (237) is configured to reduce the dielectric constant value at the fourth extension portion (340).

5. The test socket according to claim 1, characterized in that: The probe (300) is of a ring type, comprising a sixth extension portion (360), a seventh extension portion (370) and a collar (380), wherein the collar (380) is fixed on the sixth extension portion (360), and the sixth extension portion (360) is capable of axial movement relative to the seventh extension portion (370); The stepped through hole (230) comprises a sixth limiting portion (239), a seventh limiting portion (2310), an eighth limiting portion (2311) and a third adjusting portion (2312); the sixth limiting portion (239) is disposed at both ends of the seventh limiting portion (2310); and the eighth limiting portion (2311) and the third adjusting portion (2312) are disposed at one end of the two sixth limiting portions (239) away from the seventh limiting portion (2310); The ring (380) is capable of moving within the seventh limiting portion (2310), the seventh limiting portion (2310) is configured to radially position the ring (380), the sixth limiting portion (239) is configured to radially position the sixth extension portion (360), the eighth limiting portion (2311) is configured to radially position the seventh extension portion (370), and the third adjustment portion (2312) is configured to reduce the dielectric constant value at the sixth extension portion (360).

6. The test socket according to claim 1, characterized in that: The mating seat (200) comprises: A first mating plate (210) and a second mating plate (220) are arranged opposite to each other, the stepped through hole (230) penetrates both the first mating plate (210) and the second mating plate (220), and the probe (300) is installed into the stepped through hole (230) from opposite end surfaces of the first mating plate (210) and the second mating plate (220).

7. The test socket according to claim 6, characterized in that: The stepped through hole (230) is chamfered on the end surface of the first matching plate (210) close to the second matching plate (220); and / or The stepped through hole (230) is chamfered on the end surface of the second matching plate (220) close to the first matching plate (210).

8. The test socket according to claim 1, characterized in that: The matching seat (200) is made of plastic with insulation function.

9. The test socket according to claim 1, characterized in that: The mounting frame (100) comprises: A frame structure (110), wherein a receiving cavity is provided in the frame structure (110), and the matching seat (200) is fixed in the receiving cavity; and A support column (120), wherein the support column (120) is disposed between the surrounding frame structure (110) and a mounting base surface, and the support column (120) is configured to support the surrounding frame structure (110).

10. The test socket according to claim 9, characterized in that: A plurality of support columns (120) are arranged in the mounting frame (100); the plurality of support columns (120) are arranged at intervals between the frame structure (110) and the mounting base surface along the shape of the frame structure (110); and the plurality of support columns (120) jointly support the frame structure (110).

Images