Chip test probe device
By setting the guide assembly and buffer assembly in the chip test probe device, the problem of crushing the chip when the probe moves downward is solved, and effective buffering of the squeeze pressure and chip safety protection is achieved.
Patent Information
- Application Number
- CN202420652865.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-01
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2034-04-01
AI Technical Summary
In actual use of existing chip test probe devices, one end of the probe first comes into contact with the chip when the probe is moved downward, causing the buffer spring to lose elasticity, and the strong squeeze pressure can easily cause compression damage to the chip. .
By providing a guide assembly and a buffer assembly, the guide assembly includes a guide rod, a first spring and a guide hole, and the buffer assembly includes a mounting hole, a movable rod, a rubber pad, a second spring, a slide groove and a slide, combining to the movable plate toward the movable plate The pressing pressure below is buffered and unloaded to prevent the chip from causing compression damage to the chip when it comes into contact with the chip.
It effectively prevents damage caused by probe extrusion during the test, ensures the safety of the chip, and improves the accuracy and quality of the test.
Smart Images
Figure CN222439562U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of chip probe testing devices, in particular to a chip testing probe device. Background Art
[0002] Chip probe testing is to detect the performance, function and quality of the chip. The chip's electrical performance, function, power consumption, temperature, etc. can be tested through the probe test device to verify whether the chip meets the design specifications and functional requirements. It is mostly used in electronic manufacturing and semiconductor industries.
[0003] According to Chinese patent application number: 202123140167.2, a chip test probe device is disclosed, including a base, a top plate, a lifting plate, and a motor arranged on the base, the motor is provided with a screw, the base is provided with a guide rail, a slide seat is slidably connected in the guide rail, the slide seat is provided with a guide ball and a buffer cavity, the buffer cavity is provided with a buffer seat and a buffer spring, the buffer seat is provided with an IPT cap rod, the IPT cap rod is provided with a chip, the lifting plate is provided with a mounting block, the mounting block is provided with a locking pin and a probe circuit board, and the probe circuit board is provided with a test probe, which improves the smoothness and anti-slip properties of the slide seat and the IPT cap rod with the chip as a whole in the guide rail, can realize effective buffering and unloading protection of the chip against the downward pressing force of the test probe, avoids the situation where the test probe hard presses the chip and causes the chip to be crushed, realizes the overall convenient disassembly of the probe circuit board and the test probe and replaces a new set of the whole, thereby improving the precision quality of chip testing;
[0004] The comparative case effectively solves the problem that the chip is easily damaged by the extrusion of the probe during the test process, and has the advantage of preventing the probe from damaging the chip. However, in actual use, when the probe is forced to move downward, one end of the probe first contacts the chip, and then the buffer seat is driven by the chip to squeeze the buffer spring, so that the buffer spring buffers the squeezing force. The squeezing force is first given to the chip to buffer the squeezing force through the buffer spring, resulting in that when the buffer spring loses its elasticity, the strong squeezing force is easy to cause crushing damage to the chip.
[0005] To this end, we provide a chip testing probe device to solve the above problems. Utility Model Content
[0006] The utility model aims to provide a chip testing probe device, which solves the problem in the prior art of the probe testing device that, through the coordinated arrangement of a guide component and a buffer component, one end of the probe first contacts the chip when the probe is forced to move downward, and then the buffer seat is driven by the chip to squeeze the buffer spring, so that the buffer spring buffers the squeezing force and relieves the force. The squeezing force is first applied to the chip so that the squeezing force can be buffered by the buffer spring, resulting in the problem that when the buffer spring loses its elasticity, the strong squeezing force is easy to cause crushing damage to the chip.
[0007] In order to solve the above technical problems, the utility model is realized by the following technical solutions:
[0008] The utility model discloses a chip testing probe device, comprising a supporting assembly, wherein the supporting assembly comprises a workbench, a supporting plate and a movable plate, wherein the supporting assembly is used to provide a supporting space, a tester is arranged on one side of the top of the workbench, a chip probe is installed at the bottom of the movable plate, the tester and the chip probe are used to test the chip, guide assemblies are arranged on both sides of the top of the workbench, the guide assembly comprises a guide rod, a first spring and a guide hole, the guide assembly is used to guide the movable plate, buffer assemblies are also arranged on both sides of the top of the workbench, the buffer assembly comprises a mounting hole, a movable rod, a rubber pad, a second spring, a slide groove and a slider, the buffer assembly is used to buffer and unload the extrusion force, a transmission assembly is arranged on the top of the supporting plate, the transmission assembly comprises a mounting box, a servo motor, a threaded rod, a first bevel gear, a second bevel gear and a threaded sleeve, the transmission assembly is used to drive the movable plate to move, a fixing assembly is arranged on the surface of the supporting assembly, the fixing assembly comprises a suction cup, a vacuum pump and a connecting pipe, and the fixing assembly is used to fix the chip.
[0009] The utility model is further configured that one end of the support plate is fixedly connected to the workbench, and the movable plate is located in the inner cavity of the support plate.
[0010] The utility model is further configured as follows: the guide hole is opened on the surface of the movable plate, one end of the guide rod is fixedly connected to the workbench, the other end of the guide rod passes through the guide hole and is fixedly connected to the support plate, and is slidably connected to the inner cavity of the guide hole, the first spring is sleeved on the surface of the guide rod, and one end of the first spring is fixedly connected to the workbench.
[0011] The utility model is further configured such that the mounting hole is opened on the surface of the workbench, the second spring is fixed to the inner cavity of the mounting hole, one end of the movable rod extends to the inner cavity of the mounting hole and is fixedly connected to the second spring, and the other end of the movable rod is fixedly connected to the rubber pad.
[0012] The utility model is further configured that the slide groove is opened on the inner wall of the mounting hole, one end of the slider is fixedly connected to the movable rod, and the other end of the slider extends to the inner cavity of the slide groove and is slidably connected to the inner cavity of the slide groove.
[0013] The utility model is further configured that the suction cup is fixed on the top of the workbench, the vacuum pump is installed in the inner cavity of the workbench, and the two ends of the connecting pipe are respectively connected with the vacuum pump and the suction cup.
[0014] The utility model is further configured as follows: the mounting box and the servo motor are both fixedly connected to the support plate, the first bevel gear and the second bevel gear are installed in the inner cavity of the mounting box, one end of the threaded sleeve is fixedly connected to the movable plate, one end of the threaded rod is movably connected to the workbench through a bearing, and the other end of the workbench passes through the threaded sleeve and extends to the inner cavity of the mounting box, and is fixedly connected to the second bevel gear.
[0015] The utility model is further configured such that the first bevel gear and the second bevel gear are meshed, and the output shaft of the servo motor passes through the inner cavity of the installation box and is transmission-connected with the first bevel gear.
[0016] The utility model has the following beneficial effects:
[0017] 1. The utility model has the effect of buffering and unloading the downward squeezing force of the movable plate by arranging the guide assembly and the buffer assembly. When the movable plate moves downward, it contacts the rubber pad, so that the rubber pad is forced to push the movable rod downward. When the movable rod moves downward, it squeezes the second spring, thereby buffering the squeezing force. The movable plate continues to move downward to squeeze the first spring, so that the first spring can buffer the squeezing force again, thereby preventing the chip from being crushed when the chip probe contacts the chip.
[0018] 2. The utility model can fix the chip by setting a fixing component, thereby preventing the chip from being displaced during the test. By setting a transmission component, it can drive the movable plate to move, so that the movable plate can drive the chip probe to detect the chip. By setting a tester and a chip probe, the chip can be detected. The chip probe is used to detect the chip, and the detection data is received and analyzed by the tester, so that the chip can be detected.
[0019] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0021] Figure 1 This is a schematic diagram of the main structure of a chip testing probe device.
[0022] Figure 2 The present invention is a schematic diagram of the connection state structure of a supporting component, a transmission component and a fixing component in a chip testing probe device.
[0023] Figure 3 The present invention is a schematic diagram of the structure of a separated state of a buffer component in a chip test probe device.
[0024] Figure 4 The present invention is a schematic diagram of the connection status structure of a fixed component in a chip test probe device.
[0025] Figure 5 The present invention is a schematic diagram of the connection state structure of a transmission component in a chip testing probe device.
[0026] Figure 6 The present invention is a schematic diagram of the structure of a movable plate in a chip testing probe device when viewed from above.
[0027] In the accompanying drawings: 1. Support assembly; 101. Workbench; 102. Support plate; 103. Movable plate; 2. Tester; 3. Chip probe; 4. Guide assembly; 401. Guide rod; 402. First spring; 403. Guide hole; 5. Buffer assembly; 501. Mounting hole; 502. Movable rod; 503. Rubber pad; 504. Second spring; 505. Slide groove; 506. Slider; 6. Transmission assembly; 601. Mounting box; 602. Servo motor; 603. Threaded rod; 604. First bevel gear; 605. Second bevel gear; 606. Threaded sleeve; 7. Fixing assembly; 701. Suction cup; 702. Vacuum pump; 703. Connecting pipe. DETAILED DESCRIPTION
[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. Specific embodiment 1
[0030] See also Figure 1-6 The utility model is a chip test probe device, including a support component 1, the support component 1 includes a workbench 101, a support plate 102 and a movable plate 103, the support component 1 is used to provide a support space, a tester 2 is arranged on one side of the top of the workbench 101, a chip probe 3 is installed at the bottom of the movable plate 103, the tester 2 and the chip probe 3 are used to test the chip, both sides of the top of the workbench 101 are provided with guide components 4, the guide component 4 includes a guide rod 401, a first spring 402 and a guide hole 403, the guide component 4 is used to guide the movable plate 103, and buffer components are also arranged on both sides of the top of the workbench 101 5. The buffer component 5 includes a mounting hole 501, a movable rod 502, a rubber pad 503, a second spring 504, a slide groove 505 and a slider 506. The buffer component 5 is used to buffer and unload the extrusion force. A transmission component 6 is installed on the top of the support plate 102. The transmission component 6 includes a mounting box 601, a servo motor 602, a threaded rod 603, a first bevel gear 604, a second bevel gear 605 and a threaded sleeve 606. The transmission component 6 is used to drive the movable plate 103 to move. A fixing component 7 is arranged on the surface of the support component 1. The fixing component 7 includes a suction cup 701, a vacuum pump 702 and a connecting pipe 703. The fixing component 7 is used to fix the chip.
[0031] Specifically: first, the chip is placed on the top of the suction cup 701, and the chip is fixed by the fixing component 7. The servo motor 602, the threaded rod 603, the first bevel gear 604, the second bevel gear 605 and the threaded sleeve 606 cooperate to drive the movable plate 103 to move downward, so that the movable plate 103 drives the chip probe 3 to move downward. When the movable plate 103 moves downward, it contacts with the rubber pad 503 and squeezes the rubber pad 503, so that the rubber pad 503 is forced to move downward. When the rubber pad 503 moves downward, it squeezes the second spring 504, so that the second spring 504 can be The spring 504 buffers the downward squeezing force of the movable plate 103, and the movable plate 103 continues to move downward to contact and squeeze the first spring 402, causing the first spring 402 to deform under force. The first spring 402 can buffer the downward squeezing force of the movable plate 103 again, thereby achieving the effect of unloading force. Finally, the movable plate 103 drives the chip probe 3 to contact the chip, so that the chip probe 3 detects the chip. The chip probe 3 sends the detection signal to the tester 2 and is analyzed by the tester 2, thereby being able to detect the chip. Specific embodiment 2
[0033] See also Figure 1-6On the basis of the specific embodiment 1, one end of the support plate 102 is fixedly connected to the workbench 101, the movable plate 103 is located in the inner cavity of the support plate 102, the guide hole 403 is opened on the surface of the movable plate 103, one end of the guide rod 401 is fixedly connected to the workbench 101, the other end of the guide rod 401 passes through the guide hole 403 and is fixedly connected to the support plate 102, and is slidably connected to the inner cavity of the guide hole 403, the first spring 402 is sleeved on the surface of the guide rod 401, and one end of the first spring 402 is fixedly connected to the workbench 101. 1 is fixedly connected, the mounting hole 501 is opened on the surface of the workbench 101, the second spring 504 is fixed to the inner cavity of the mounting hole 501, one end of the movable rod 502 extends to the inner cavity of the mounting hole 501 and is fixedly connected to the second spring 504, the other end of the movable rod 502 is fixedly connected to the rubber pad 503, the slide groove 505 is opened on the inner wall of the mounting hole 501, one end of the slider 506 is fixedly connected to the movable rod 502, and the other end of the slider 506 extends to the inner cavity of the slide groove 505 and is slidably connected to the inner cavity of the slide groove 505.
[0034] Specifically: when the movable plate 103 moves downward, it moves downward along the surface of the guide rod 401 through the guide hole 403. The guide rod 401 and the guide hole 403 cooperate to limit the movement trajectory of the movable plate 103 to prevent the movable plate 103 from deviating during movement. When the movable plate 103 moves downward, it first contacts the rubber pad 503. The rubber pad 503 is driven by the extrusion force of the movable plate 103 to drive the movable rod 502 to move downward, so that the movable rod 502 drives the slider 506 to move downward along the inner cavity of the slide groove 505. The slide groove 505 and the slider 506 can limit the movable rod 502. The movement trajectory of 502 is limited, and the movable rod 502 moves toward the inner cavity of the mounting hole 501 while squeezing the second spring 504, so that the second spring 504 is deformed by the force, thereby buffering the downward squeezing force of the movable plate 103; the movable plate 103 continues to move downward and contacts the first spring 402, and squeezes the guide hole 403, so that the first spring 402 is deformed by the force, thereby enabling the first spring 402 to buffer the downward squeezing force of the movable plate 103 again, thereby preventing the chip probe 3 from causing pressure damage to the chip. Specific embodiment three
[0036] See also Figure 1-6On the basis of the first and second specific embodiments, the suction cup 701 is fixed to the top of the workbench 101, the vacuum pump 702 is installed in the inner cavity of the workbench 101, the two ends of the connecting pipe 703 are respectively connected to the vacuum pump 702 and the suction cup 701, the installation box 601 and the servo motor 602 are fixedly connected to the support plate 102, the first bevel gear 604 and the second bevel gear 605 are installed in the inner cavity of the installation box 601, one end of the threaded sleeve 606 is fixedly connected to the movable plate 103, one end of the threaded rod 603 is movably connected to the workbench 101 through a bearing, the other end of the workbench 101 passes through the threaded sleeve 606 and extends to the inner cavity of the installation box 601, and is fixedly connected to the second bevel gear 605, the first bevel gear 604 and the second bevel gear 605 are meshed, and the output shaft of the servo motor 602 passes through the inner cavity of the installation box 601 and is transmission-connected to the first bevel gear 604.
[0037] Specifically: first, place the chip on the top of the suction cup 701, and then start the vacuum pump 702. The vacuum pump 702 draws out the airflow at the bottom of the chip through the connecting pipe 703 to form a vacuum, thereby generating suction to adsorb and fix the chip. The output shaft of the servo motor 602 rotates forward to drive the first bevel gear 604 to rotate. When the first bevel gear 604 rotates, it drives the second bevel gear 605 to rotate. When the second bevel gear 605 rotates, it drives the threaded sleeve 606 to move downward. When the threaded sleeve 606 moves downward, it drives the movable plate 103 to move downward, so that the movable plate 103 can drive the chip probe 3 to detect the chip.
[0038] The working principle of the utility model is as follows: first, a chip is placed on the top of the suction cup 701, and then the vacuum pump 702 is started. The vacuum pump 702 draws out the airflow at the bottom of the chip through the connecting pipe 703, so that a vacuum is formed, thereby generating suction to adsorb and fix the chip. The output shaft of the servo motor 602 rotates forward to drive the first bevel gear 604 to rotate. When the first bevel gear 604 rotates, it drives the second bevel gear 605 to rotate. When the second bevel gear 605 rotates, it drives the threaded sleeve 606 to move downward. When the threaded sleeve 606 moves downward, it drives the movable plate 103 to move downward. When the movable plate 103 moves downward, it moves downward along the surface of the guide rod 401 through the guide hole 403. The guide rod 401 and the guide hole 403 cooperate to limit the movement trajectory of the movable plate 103 to prevent the movable plate 103 from deviating during movement. The movable plate 103 moves downward. When moving downward, it first contacts with the rubber pad 503, and the rubber pad 503 is driven by the squeezing force of the movable plate 103 to move downward, so that the movable rod 502 drives the slider 506 to move downward along the inner cavity of the slide groove 505, and the slide groove 505 and the slider 506 can limit the movement trajectory of the movable rod 502. When the movable rod 502 moves toward the inner cavity of the mounting hole 501, it squeezes the second spring 504, so that the second spring 504 is deformed by the force, thereby buffering the downward squeezing force of the movable plate 103. The movable plate 103 continues to move downward and contacts with the first spring 402, and squeezes the guide hole 403, so that the first spring 402 is deformed by the force, so that the first spring 402 can buffer the downward squeezing force of the movable plate 103 again, thereby preventing the chip probe 3 from causing pressure damage to the chip.
[0039] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0040] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.
Claims
1. A chip testing probe device, comprising a support assembly (1), characterized in that: The support assembly (1) comprises a workbench (101), a support plate (102) and a movable plate (103), wherein the support assembly (1) is used to provide a support space, a tester (2) is arranged on one side of the top of the workbench (101), a chip probe (3) is installed at the bottom of the movable plate (103), and the tester (2) and the chip probe (3) are used to test the chip, guide assemblies (4) are arranged on both sides of the top of the workbench (101), and the guide assembly (4) comprises a guide rod (401), a first spring (402) and a guide hole (403), and the guide assembly (4) is used to guide the movable plate (103), and buffer assemblies (5) are also arranged on both sides of the top of the workbench (101), and the buffer assembly (5) comprises a mounting hole ( 501), a movable rod (502), a rubber pad (503), a second spring (504), a slide groove (505) and a slider (506); the buffer assembly (5) is used to buffer and unload the extrusion force; a transmission assembly (6) is installed on the top of the support plate (102); the transmission assembly (6) includes a mounting box (601), a servo motor (602), a threaded rod (603), a first bevel gear (604), a second bevel gear (605) and a threaded sleeve (606); the transmission assembly (6) is used to drive the movable plate (103) to move; a fixing assembly (7) is arranged on the surface of the support assembly (1); the fixing assembly (7) includes a suction cup (701), a vacuum pump (702) and a connecting pipe (703); the fixing assembly (7) is used to fix the chip.
2. A chip testing probe device according to claim 1, characterized in that: One end of the support plate (102) is fixedly connected to the workbench (101), and the movable plate (103) is located in the inner cavity of the support plate (102).
3. A chip testing probe device according to claim 1, characterized in that: The guide hole (403) is opened on the surface of the movable plate (103), one end of the guide rod (401) is fixedly connected to the workbench (101), the other end of the guide rod (401) passes through the guide hole (403) and is fixedly connected to the support plate (102), and is slidably connected to the inner cavity of the guide hole (403), the first spring (402) is sleeved on the surface of the guide rod (401), and one end of the first spring (402) is fixedly connected to the workbench (101).
4. A chip testing probe device according to claim 1, characterized in that: The mounting hole (501) is opened on the surface of the workbench (101), the second spring (504) is fixed to the inner cavity of the mounting hole (501), one end of the movable rod (502) extends to the inner cavity of the mounting hole (501) and is fixedly connected to the second spring (504), and the other end of the movable rod (502) is fixedly connected to the rubber pad (503).
5. A chip testing probe device according to claim 1, characterized in that: The slide groove (505) is opened on the inner wall of the mounting hole (501), one end of the slider (506) is fixedly connected to the movable rod (502), and the other end of the slider (506) extends to the inner cavity of the slide groove (505) and is slidably connected to the inner cavity of the slide groove (505).
6. A chip testing probe device according to claim 1, characterized in that: The suction cup (701) is fixed to the top of the workbench (101), the vacuum pump (702) is installed in the inner cavity of the workbench (101), and the two ends of the connecting pipe (703) are respectively connected to the vacuum pump (702) and the suction cup (701).
7. A chip testing probe device according to claim 1, characterized in that: The installation box (601) and the servo motor (602) are both fixedly connected to the support plate (102); the first bevel gear (604) and the second bevel gear (605) are installed in the inner cavity of the installation box (601); one end of the threaded sleeve (606) is fixedly connected to the movable plate (103); one end of the threaded rod (603) is movably connected to the workbench (101) through a bearing; the other end of the workbench (101) passes through the threaded sleeve (606) and extends to the inner cavity of the installation box (601), and is fixedly connected to the second bevel gear (605).
8. A chip testing probe device according to claim 1, characterized in that: The first bevel gear (604) is meshed with the second bevel gear (605), and the output shaft of the servo motor (602) passes through the inner cavity of the installation box (601) and is drivingly connected to the first bevel gear (604).