Wafer photoresist removing and soaking device
By designing a wafer resist removal immersion device, a servo motor-driven rinsing nozzle is used to spray the wafer surface with chemical solution, solving the problem of residual resist on the wafer surface and achieving thorough resist removal and convenient operation.
Patent Information
- Application Number
- CN202421139659.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-23
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2034-05-23
AI Technical Summary
In existing technologies, some adhesive residue remains on the wafer surface after immersion in adhesive removal, resulting in incomplete adhesive removal.
A wafer adhesive removal immersion device was designed, comprising a dust-free chamber, an immersion chamber, a wafer carrier that can move up and down, and a servo motor-driven rinsing nozzle. The device thoroughly removes residual adhesive by spraying a chemical solution onto the wafer surface after immersion.
It achieves complete removal of adhesive from the wafer surface, avoiding residual adhesive and facilitating wafer placement and removal.
Smart Images
Figure CN222440544U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer degumming, in particular to a wafer degumming immersion device. Background Art
[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single crystal silicon.
[0003] In order to remove the glue that has been plated on the wafer after photolithography and metal ion evaporation, it is necessary to soak it in a chemical solution to remove the glue.
[0004] However, in the prior art, the wafer is usually immersed in a soaking chamber to remove the glue, and the glue and the wafer surface are separated. However, the solution used for removing the glue lacks fluidity, so that after the wafer is taken out of the solution after immersion, part of the glue is separated from the wafer surface but still remains on the wafer surface, resulting in residual glue on the wafer surface. Utility Model Content
[0005] The utility model aims to provide a wafer degumming and immersion device to solve the problems raised in the above-mentioned background technology.
[0006] The purpose of the utility model can be achieved through the following technical solutions:
[0007] A wafer degumming and soaking device comprises a dust-free chamber, wherein a soaking chamber is fixedly installed inside the dust-free chamber, the soaking chamber contains a liquid for degumming, and a wafer carrier which can move up and down is arranged in the soaking chamber.
[0008] A motor bracket is fixedly connected to the top of the inner wall of the dust-free bin, a servo motor is mounted on the motor bracket, an adjusting nozzle is fixedly connected to the bottom of the servo motor via a connecting rod, a flushing nozzle is fixedly connected to one end of the adjusting nozzle and located above the wafer carrier, an input hose is fixedly connected to the adjusting nozzle, and one end of the input hose passes through the dust-free bin and extends to the outside of the dust-free bin.
[0009] Preferably, a first waterproof telescopic rod is fixedly connected in the soaking chamber, a support platform is fixedly connected to the top of the first waterproof telescopic rod, and the wafer carrier is arranged on the top of the support platform and moves up and down with the support platform.
[0010] Preferably, the bottom of the support platform is fixedly connected with a transverse limit plate in a ring array, the transverse limit plate is slidably connected with a limit slider, the top of the limit slider is fixedly connected with a movable connecting rod, and one end of the movable connecting rod is fixedly connected with a movable recessed block.
[0011] Preferably, a fixed outer ring is fixedly connected to the outer surface of the wafer carrier, and a horizontal cutout is provided on the outer surface of the fixed outer ring, and the horizontal cutout of the fixed outer ring is matched with the movable concave block.
[0012] Preferably, a second waterproof telescopic rod is fixedly connected in the soaking bin, a horizontal connecting plate is fixedly connected to the top of the second waterproof telescopic rod, a lifting ring is fixedly connected to the horizontal connecting plate, and a driving connecting plate in a ring array is rotatably connected to the outer surface of the lifting ring. The end of the driving connecting plate away from the lifting ring is rotatably connected to the bottom of the limit slider, so as to drive the limit slider to slide on the transverse limit plate.
[0013] Preferably, a liquid inlet pipe and a liquid outlet pipe are fixedly connected to the soaking bin, and both the liquid inlet pipe and the liquid outlet pipe are provided with solenoid valves.
[0014] Beneficial effects of the utility model:
[0015] The utility model can spray liquid onto the surface of the wafer through the flushing nozzle after the wafer is soaked, so that the wafer can be more fully and thoroughly debonded, and avoids debonding only by soaking, where part of the glue remains on the surface of the wafer after being separated from the surface of the wafer, resulting in residual glue on the surface of the wafer. After flushing is completed, the regulating nozzle and the flushing nozzle can be rotated to a position away from the top of the wafer carrier, so as to facilitate the placement and removal of the wafer and the wafer carrier. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings required for use in the embodiments or the prior art description are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0018] Figure 2 This utility model Figure 1 Schematic diagram of the structure of the bottom of the dust-free bin;
[0019] Figure 3 This utility model Figure 1 Structural schematic diagram of the middle soaking chamber;
[0020] Figure 4 This utility model Figure 3 Schematic diagram of the structure inside the middle soaking chamber;
[0021] Figure 5 This utility model Figure 4 Schematic diagram of the structure at the bottom of the wafer carrier.
[0022] The reference numerals in the figures are as follows:
[0023] 1. Dust-free chamber, 2. Soaking chamber, 3. Wafer carrier, 4. Motor bracket, 5. Servo motor, 6. Adjustment nozzle, 7. Flushing nozzle, 8. Input hose, 9. First waterproof telescopic rod, 10. Support table, 11. Horizontal limit plate, 12. Limit slider, 13. Movable connecting rod, 14. Movable concave block, 15. Fixed outer ring, 16. Second waterproof telescopic rod, 17. Horizontal connecting plate, 18. Lifting ring, 19. Driving connecting plate, 20. Liquid inlet pipe, 21. Liquid outlet pipe. DETAILED DESCRIPTION
[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0025] A wafer degumming and soaking device comprises a dust-free chamber 1, wherein a soaking chamber 2 is fixedly installed inside the dust-free chamber 1, wherein the soaking chamber 2 contains a liquid for degumming, and wherein a wafer carrier 3 which can move up and down is arranged inside the soaking chamber 2.
[0026] A motor bracket 4 is fixedly connected to the top of the inner wall of the dust-free bin 1, a servo motor 5 is mounted on the motor bracket 4, an adjusting nozzle 6 is fixedly connected to the bottom of the servo motor 5 via a connecting rod, a flushing nozzle 7 is fixedly connected to one end of the adjusting nozzle 6 and located above the wafer carrier 3, an input hose 8 is fixedly connected to the adjusting nozzle 6, and one end of the input hose 8 passes through the dust-free bin 1 and extends to the outside of the dust-free bin 1.
[0027] like Figure 1 and Figure 2 The dust-free chamber 1 is a prior art and can provide a dust-free environment for wafer degumming. The outside of the dust-free chamber 1 has a chamber door that can be opened and closed to facilitate the placement and removal of wafers. The wafer carrier 3 is used to carry the wafer. The servo motor 5 is externally connected to a power supply and has a corresponding control switch on the outside. The input hose 8 is located at one end outside the dust-free chamber 1 and is connected to an external liquid delivery device.
[0028] A first waterproof telescopic rod 9 is fixedly connected in the soaking chamber 2 , a support platform 10 is fixedly connected to the top of the first waterproof telescopic rod 9 , and the wafer carrier 3 is arranged on the top of the support platform 10 and moves up and down with the support platform 10 .
[0029] like Figure 1 and Figure 3 The first waterproof telescopic rod 9 is an electric telescopic rod and can be used in water.
[0030] The bottom of the support platform 10 is fixedly connected with a transverse limit plate 11 in a ring array, and the transverse limit plate 11 is slidably connected with a limit slider 12. The top of the limit slider 12 is fixedly connected with a movable connecting rod 13, and one end of the movable connecting rod 13 is fixedly connected with a movable recessed block 14.
[0031] like Figure 1 , Figure 3 , Figure 4 and Figure 5 By utilizing the sliding connection between the limit slider 12 and the transverse limit plate 11 , the limit slider 12 and the movable recessed block 14 can only move horizontally.
[0032] The outer surface of the wafer carrier 3 is fixedly connected with a fixed outer ring 15 . The outer surface of the fixed outer ring 15 is provided with a horizontal cutout. The horizontal cutout of the fixed outer ring 15 is matched with the movable concave block 14 .
[0033] like Figure 3 , Figure 4 and Figure 5 The horizontal cutout of the fixed outer ring 15 is stuck in the inner concave part of the movable concave block 14 to position the fixed outer ring 15.
[0034] A second waterproof telescopic rod 16 is fixedly connected in the soaking bin 2, a horizontal connecting plate 17 is fixedly connected to the top of the second waterproof telescopic rod 16, a lifting ring 18 is fixedly connected to the horizontal connecting plate 17, and a driving connecting plate 19 in a ring array is rotatably connected to the outer surface of the lifting ring 18. The end of the driving connecting plate 19 away from the lifting ring 18 is rotatably connected to the bottom of the limit slider 12, and is used to drive the limit slider 12 to slide on the transverse limit plate 11.
[0035] like Figure 4 and Figure 5 The second waterproof telescopic rod 16 is an electric telescopic rod that can be used underwater. Each driving connecting plate 19 is connected to a corresponding limiting slider 12.
[0036] The soaking bin 2 is fixedly connected with a liquid inlet pipe 20 and a liquid outlet pipe 21 , and both the liquid inlet pipe 20 and the liquid outlet pipe 21 are provided with solenoid valves.
[0037] like Figure 1 The liquid inlet pipe 20 and the liquid outlet pipe 21 are used to input the liquid medicine into the interior of the soaking chamber 2, or to output the liquid medicine in the soaking chamber 2.
[0038] The working principle of a wafer degumming and soaking device provided by the utility model is as follows:
[0039] When the wafer needs to be soaked for degumming, the wafer is placed on the wafer carrier 3, and the first waterproof telescopic rod 9 is retracted, driving the wafer carrier 3 and the wafer to move down into the liquid in the soaking chamber 2 for soaking and degumming;
[0040] After the soaking is completed, the first waterproof telescopic rod 9 is extended to drive the wafer carrier 3 and the wafer to move up to the top of the liquid medicine, and the servo motor 5 drives the regulating nozzle 6 and the rinsing nozzle 7 to rotate to the top of the wafer. The external liquid medicine is input through the input hose 8 and sprayed out through the rinsing nozzle 7 to rinse off the residual glue on the surface of the wafer. The servo motor 5 then drives the regulating nozzle 6 and the rinsing nozzle 7 to rotate to a position away from the top of the wafer.
[0041] After the flushing is completed, the second waterproof telescopic rod 16 extends and pushes the lifting ring 18 upward. The lifting ring 18 moves upward and pushes the limit slider 12 through the driving connecting plate 19. The limit slider 12 drives the movable concave block 14 and the fixed outer ring 15 to separate through the movable connecting rod 13. At this time, the debonded wafer carrier 3 and the wafers thereon can be transferred, and a new wafer carrier 3 and wafers can be placed. Then the second waterproof telescopic rod 16 contracts and drives the lifting ring 18 to move downward. The lifting ring 18 moves downward and pulls the limit slider 12 through the driving connecting plate 19. The limit slider 12 drives the movable concave block 14 to be stuck on the fixed outer ring 15 through the movable connecting rod 13, which is convenient for the next round of wafer debonding.
[0042] Compared with the related art, the wafer degumming and soaking device provided by the utility model has the following beneficial effects:
[0043] The utility model can spray the liquid onto the surface of the wafer through the flushing nozzle 7 after the wafer is soaked, so that the degumming of the wafer is more thorough and complete, and avoids the degumming only by soaking, and part of the glue remains on the surface of the wafer after being separated from the surface of the wafer, resulting in residual glue on the surface of the wafer. After flushing is completed, the adjustment nozzle 6 and the flushing nozzle 7 can be rotated to a position away from the top of the wafer carrier 3, so as to facilitate the placement and removal of the wafer and the wafer carrier 3.
[0044] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.
Claims
1. A wafer degumming and soaking device, comprising a dust-free chamber (1), wherein a soaking chamber (2) is fixedly installed inside the dust-free chamber (1), and the soaking chamber (2) contains a liquid for degumming, characterized in that: A wafer carrier (3) that can move up and down is arranged in the soaking chamber (2); The top of the inner wall of the dust-free bin (1) is fixedly connected to a motor bracket (4), a servo motor (5) is mounted on the motor bracket (4), the bottom of the servo motor (5) is fixedly connected to an adjusting nozzle (6) via a connecting rod, one end of the adjusting nozzle (6) is fixedly connected to a flushing nozzle (7) located above the wafer carrier (3), an input hose (8) is fixedly connected to the adjusting nozzle (6), one end of the input hose (8) passes through the dust-free bin (1) and extends to the outside of the dust-free bin (1).
2. The wafer degumming and immersion device according to claim 1, characterized in that: A first waterproof telescopic rod (9) is fixedly connected inside the soaking chamber (2), a support platform (10) is fixedly connected to the top of the first waterproof telescopic rod (9), and a wafer carrier (3) is arranged on the top of the support platform (10) and moves up and down with the support platform (10).
3. The wafer degumming and immersion device according to claim 2, characterized in that: The bottom of the support platform (10) is fixedly connected to a transverse limit plate (11) in a ring array, a limit slider (12) is slidably connected to the transverse limit plate (11), a movable connecting rod (13) is fixedly connected to the top of the limit slider (12), and one end of the movable connecting rod (13) is fixedly connected to a movable recessed block (14).
4. The wafer degumming and immersion device according to claim 3, characterized in that: The outer surface of the wafer carrier (3) is fixedly connected to a fixed outer ring (15), the outer surface of the fixed outer ring (15) is provided with a horizontal cutout, and the horizontal cutout of the fixed outer ring (15) is matched with the movable recessed block (14).
5. The wafer degumming and immersion device according to claim 3, characterized in that: A second waterproof telescopic rod (16) is fixedly connected inside the soaking bin (2); a horizontal connecting plate (17) is fixedly connected to the top of the second waterproof telescopic rod (16); a lifting ring (18) is fixedly connected to the horizontal connecting plate (17); an outer surface of the lifting ring (18) is rotatably connected to a driving connecting plate (19) in a ring array; an end of the driving connecting plate (19) away from the lifting ring (18) is rotatably connected to the bottom of the limit slider (12) for driving the limit slider (12) to slide on the transverse limit plate (11).
6. The wafer degumming and immersion device according to claim 1, characterized in that: The soaking bin (2) is fixedly connected with a liquid inlet pipe (20) and a liquid outlet pipe (21), and both the liquid inlet pipe (20) and the liquid outlet pipe (21) are provided with electromagnetic valves.