Heat dissipation device for frequency converter, frequency converter power module and frequency converter

Abstract

The utility model discloses a heat radiation device for a frequency converter, a frequency converter power module and a frequency converter. The heat dissipation device for the frequency converter comprises a first power component and a second power component, the first power component comprises an insulated gate diode transistor, the second power component comprises a rectifier diode, and the heat dissipation device comprises a first heat dissipation substrate which is provided with a first surface and a second surface which are opposite to each other and is arranged on the first surface of the first heat dissipation substrate; the second heat dissipation substrate is provided with a first surface and a second surface which are opposite to each other, the second heat dissipation substrate is opposite to the first heat dissipation substrate, the second surface of the second heat dissipation substrate faces the second surface of the first heat dissipation substrate, and the second power component is arranged on the first surface of the second heat dissipation substrate; the heat dissipation teeth are arranged between the first heat dissipation substrate and the second heat dissipation substrate, and the heat dissipation teeth are connected to the second surface of the first heat dissipation substrate and the second surface of the second heat dissipation substrate respectively. The heat dissipation device is higher in heat dissipation efficiency and saves space at the same time.

Description

Technical Field

[0001] The utility model relates to the technical field of frequency converters, in particular to a heat dissipation device for frequency converters, a frequency converter power module and a frequency converter. Background Art

[0002] Frequency converters are mainly used to adjust the speed of AC motors. Frequency converters can realize the conversion between fixed frequency AC power and variable frequency AC power, and control AC motors by changing the frequency of the motor's working power supply. At present, frequency converters have been widely used in motor frequency conversion and speed regulation in many fields such as metallurgy, mining, electric power, petrochemicals, water machines, water supply and drainage, and central air conditioning, and have become the preferred equipment for enterprises to adopt motor system energy-saving methods. As the market's requirements for transmission products gradually increase, frequency converter speed regulation plays an increasingly important role in many speed control application fields with its own advantages such as wide speed regulation range, high speed regulation accuracy, and good dynamic response.

[0003] The inverter is generally composed of independent transformer cabinets, power component cabinets, control system cabinets, reactor cabinets, cooling devices and other cabinets. As an important part of the inverter, power components mainly use various power components for rectification, filtering, inversion and other processing, which is the main part of the inverter main circuit. In the normal operation of power components, the temperature of these power components will continue to increase, so heat dissipation devices are usually designed in power components.

[0004] At present, the heat sink of the inverter usually adopts an integrated heat sink, that is, all the power components are arranged on the integrated heat sink. Such a structure makes the heat sink large in size, heavy in weight, high in cost, and not conducive to processing and station transportation. In addition, when all the power components are arranged on the heat sink, the loss of the power components varies greatly. If a power component fails, it is easy to affect other components installed on the heat sink, resulting in increased maintenance costs.

[0005] In current inverters (e.g., Siemens' SINAMIC GH180 large-capacity series products), the heat dissipation of the insulated gate bipolar transistor (IGBT) and diode rectifier bridge of the unit is mainly achieved by applying them to a copper or aluminum heat sink and passing the air through the heat sink for heat dissipation. In conventional power module design, the IGBT and rectifier bridge diode are mainly distributed on the heat dissipation substrate, and thermal conductive silicone grease is applied between the power components and the heat dissipation substrate. However, when it is necessary to design a large-capacity power module, the size of the IGBT will be larger. If the conventional single-sided heat dissipation tooth structure layout design is continued, a larger area of ​​the heat dissipation substrate will inevitably be required, which will inevitably cause the size design of the unit to require a larger space to accommodate the heat sink. Secondly, a large-sized heat dissipation substrate is usually equipped with longer and wider heat dissipation teeth, and the longer and wider heat dissipation teeth do not increase linearly with their heat dissipation effect. In fact, the heat dissipation effect is poor at the heat dissipation tooth position far from the heat dissipation substrate, which in turn causes the problem of local overheating and low heat dissipation efficiency of the heat sink.

[0006] Therefore, there is an urgent need for an improved heat dissipation device for a frequency converter, so as to achieve better heat dissipation performance without increasing the volume of the product. Utility Model Content

[0007] In view of this, the utility model proposes a heat dissipation device for a frequency converter, a frequency converter power module and a frequency converter to solve part or all of the above problems.

[0008] According to an embodiment of the utility model, a heat dissipation device for a frequency converter is provided, the frequency converter comprising a first power component and a second power component, the first power component comprising an insulated gate diode transistor, the second power component comprising a rectifier diode, and characterized in that the heat dissipation device comprises: a first heat dissipation substrate, the first heat dissipation substrate having a first surface and a second surface opposite to each other, the first power component being arranged on the first surface of the first heat dissipation substrate; a second heat dissipation substrate, the second heat dissipation substrate having a first surface and a second surface opposite to each other, the second heat dissipation substrate being opposite to the first heat dissipation substrate, and the second surface of the second heat dissipation substrate facing the second surface of the first heat dissipation substrate, the second power component being arranged on the first surface of the second heat dissipation substrate; and heat dissipation teeth, the heat dissipation teeth being arranged between the first heat dissipation substrate and the second heat dissipation substrate, and the heat dissipation teeth being respectively connected to the second surface of the first heat dissipation substrate and the second surface of the second heat dissipation substrate.

[0009] Preferably, a heat conduction unit is provided in at least one of the first heat dissipation substrate and the second heat dissipation substrate.

[0010] Preferably, the heat conduction unit is a heat conduction pipe embedded in at least one of the first heat dissipation substrate and the second heat dissipation substrate, and the heat conduction pipe is filled with a gas-liquid phase change material.

[0011] Preferably, the heat pipe is arranged at a position corresponding to a position where the first power component is arranged on the first surface of the first heat dissipation substrate and / or a position where the second power component is arranged on the first surface of the second heat dissipation substrate.

[0012] Preferably, at least one of the first heat dissipation substrate and the second heat dissipation substrate includes a low thermal conductivity material and a high thermal conductivity material, the thermal conductivity of the high thermal conductivity material is higher than the thermal conductivity of the low thermal conductivity material, the thermal conductive unit is formed by the high thermal conductivity material, the position of the thermal conductive unit on the first heat dissipation substrate corresponds to the position at which the first power component is arranged on the first surface of the first heat dissipation substrate, and / or the position of the thermal conductive unit on the second heat dissipation substrate corresponds to the position at which the second power component is arranged on the first surface of the second heat dissipation substrate.

[0013] Preferably, the heat dissipation teeth include a plurality of heat dissipation teeth arranged perpendicular to the first heat dissipation substrate and the second heat dissipation substrate, and the plurality of heat dissipation teeth are used to release the heat transferred by the first heat dissipation substrate and the second heat dissipation substrate into the air, and the heat dissipation teeth are copper heat dissipation teeth or aluminum heat dissipation teeth.

[0014] According to another aspect of the utility model, an inverter power module is provided, characterized in that the inverter power module includes: a first power component, a second power component, a heat dissipation device for an inverter according to any of the above items, and a shell for accommodating the first power component, the second power component, and the heat dissipation device.

[0015] Preferably, the heat generated by the first power component is greater than the heat generated by the second power component.

[0016] Preferably, the first power component comprises an insulated gate diode transistor, and the second power component comprises a rectifier diode.

[0017] Preferably, each surface of the shell is provided with an air inlet hole, and the cooling airflow enters the shell through the air inlet hole and flows through the heat dissipation device.

[0018] According to another aspect of the present invention, there is provided a frequency converter power module including any one of the above items.

[0019] It can be seen from the above scheme that a heat dissipation device, a frequency converter power module and a frequency converter are provided, which adopt a double-baseboard "sandwich" power module layout design, which can make the size of the power module more compact, and at the same time, the heat dissipation teeth are more uniform in heat distribution, the heat dissipation efficiency is higher, and at the same time, space is saved, and the remaining space of the frequency converter can be fully utilized, thereby making the unit structure more compact and the unit volume smaller, thereby making the overall unit cabinet size smaller, reducing material costs, and improving product competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, so that those skilled in the art will be more aware of the above and other features and advantages of the present invention. In the accompanying drawings:

[0021] Figure 1 A schematic diagram showing the layout of a conventional power module according to the prior art.

[0022] Figure 2 A schematic diagram showing the layout of a power module according to an embodiment of the utility model is shown.

[0023] Figure 3 A comparative schematic diagram is shown, showing the structure of a conventional power module according to the prior art and the structure of a power module according to an embodiment of the present utility model.

[0024] In the above drawings, the reference numerals used are as follows:

[0025] IGBT 104-1, 104-2, 204-1, 204-2, 320, 304

[0026] Rectifier diodes 102-1, 102-2, 102-3, 202-1, 202-2, 202-3, 316, 310

[0027] Heat dissipation substrate 106, 206-1, 206-2

[0028] Heat dissipation teeth 108, 208

[0029] Housing 302, 314

[0030] Heat dissipation device 312

[0031] Capacitors 308, 318 DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is further described in detail with reference to the following embodiments.

[0033] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present utility model will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0034] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0035] In the present invention, unless otherwise specified, the directional words used, such as "up, down, top, bottom", usually refer to the directions shown in the drawings, or to the components themselves in the vertical, perpendicular or gravity directions; similarly, for ease of understanding and description, "inside and outside" refer to the inside and outside relative to the outline of each component itself, but the above-mentioned directional words are not used to limit the present invention.

[0036] Figure 1 FIG. 1 is a schematic diagram showing the layout of a conventional power module according to the prior art. Figure 1 In the side view of the layout of a conventional power module according to the prior art shown in (A), the power module includes: a rectifier diode 102-1, a rectifier diode 102-2, a rectifier diode 102-3, an insulated gate diode transistor (IGBT) 104-1, an insulated gate diode transistor (IGBT) 104-2, a heat dissipation substrate 106, and a heat dissipation tooth 108. Figure 1 In the top view of the layout of a conventional power module according to the prior art shown in (B), in the conventional power module design, a "straight" layout is usually adopted, in which the IGBT and the rectifier bridge diode are mainly distributed in a "straight" shape on the heat dissipation substrate. Figure 1 The "straight-line" layout shown in the figure mainly distributes the IGBT and rectifier bridge diodes on the heat dissipation substrate, which is coated with thermal conductive silicone grease. Therefore, in the conventional IGBT+rectifier bridge heat sink design, the heat sink used is a single-sided substrate and heat dissipation tooth plate structure, and the other side of the heat sink is open. When the air volume passes through the heat dissipation teeth, part of the circulating air flow cannot exchange heat with the heat dissipation teeth, which causes part of the air volume to become invalid air, resulting in low heat dissipation efficiency. In addition, when the design needs to arrange medium-capacity or even large-capacity power modules, the size of the IGBT will be larger. If you continue to use the following Figure 1The layout of the conventional single-sided heat dissipation tooth structure shown in the figure will inevitably require a larger area of ​​the heat dissipation substrate, which will inevitably cause the unit size design to require a larger space to accommodate the radiator. Secondly, large-sized heat dissipation substrates are usually equipped with longer and wider heat dissipation teeth. However, lengthening and widening the heat dissipation teeth does not lead to a linear increase in the heat dissipation effect of the heat dissipation teeth. In fact, the farther the heat dissipation tooth position is from the heat dissipation substrate, the poorer the heat dissipation effect, which in turn causes the problem of local overheating of the radiator and low heat dissipation efficiency.

[0037] Figure 2 FIG. 1 is a schematic diagram showing the layout of a power module according to an embodiment of the present utility model. Figure 2 In the side view of the layout of a power module according to an embodiment of the present invention shown in (A), the power module includes: a rectifier diode 202-1, a rectifier diode 202-2, a rectifier diode 202-3, an insulated gate diode transistor (IGBT) 204-1, an insulated gate diode transistor (IGBT) 204-2, a heat sink 206-1, a heat sink 206-2 and a heat sink 208. Figure 2 As shown in (A), the heat dissipation substrate 206-1 has a first surface and a second surface opposite to each other, and the rectifier diodes 202-1, 202-2, and 202-3 are arranged on the first surface of the heat dissipation substrate 206-1; the heat dissipation substrate 206-2 has a first surface and a second surface opposite to each other, the heat dissipation substrate 206-2 is opposite to the heat dissipation substrate 206-, and the second surface of the heat dissipation substrate 206-2 faces the second surface of the heat dissipation substrate 206-1, and the insulated gate diode transistor (IGBT) 204-1 and the insulated gate diode transistor (IGBT) 204-2 are arranged on the first surface of the heat dissipation substrate 206-2; and the heat dissipation teeth 208 are arranged between the heat dissipation substrate 206-1 and the heat dissipation substrate 206-2, and the heat dissipation teeth 208 are respectively connected (for example, by welding) to the second surface of the heat dissipation substrate 206-1 and the second surface of the heat dissipation substrate 206-2. As shown in FIG. Figure 2As shown in (A), the heat dissipation teeth 208 include a plurality of heat dissipation teeth arranged perpendicular to the heat dissipation substrate 206-1 and the heat dissipation substrate 206-2. The plurality of heat dissipation teeth are used to release the heat transferred by the heat dissipation substrate 206-1 and the heat dissipation substrate 206-2 into the air. The heat dissipation teeth are copper heat dissipation teeth or aluminum heat dissipation teeth. As known to those skilled in the art, the heat generated by the insulated gate diode transistor (IGBT) is usually greater than the heat generated by the rectifier diode. Therefore, in order to further dissipate the heat of the power components with large heat generation, a heat conduction unit (not shown) can be provided at least in the heat dissipation substrate 206-2. In addition, a heat conduction unit can also be provided in the heat dissipation substrate 206-1 at the same time. Because the heat generation of the IGBT and the diode rectifier bridge is different, a pre-embedded heat pipe structure is designed in the double heat dissipation substrate, that is, the heat dissipation material with better heat conduction effect is pre-embedded in the heat dissipation substrate in advance, and the heat from the area with higher heat generation is transferred to the area with lower heat generation for heat dissipation, so that the heat dissipation effect of the radiator is better. For example, the heat conduction unit may be a heat pipe embedded in at least one of the heat dissipation substrate 206-1 and the heat dissipation substrate 206-2, and the heat conduction pipe is a closed hollow tube in which a gas-liquid phase change material is filled. Therefore, by arranging the heat conduction pipe at a position corresponding to the position where the insulated gate diode transistor (IGBT) 204-1 and the insulated gate diode transistor (IGBT) 204-2 are arranged on the first surface of the heat dissipation substrate 206-2 and / or the position where the rectifier diode 202-1, the rectifier diode 202-2 and the rectifier diode 202-3 are arranged on the first surface of the heat dissipation substrate 206-1, the heat dissipation performance of the power module can be further improved. For example, at least one of the heat dissipation substrate 206-1 and the heat dissipation substrate 206-2 includes a low thermal conductivity material and a high thermal conductivity material, the thermal conductivity of the high thermal conductivity material is higher than the thermal conductivity of the low thermal conductivity material, the thermal conductive unit is formed by the high thermal conductivity material, the position of the thermal conductive unit on the heat dissipation substrate 206-2 corresponds to the position where the insulated gate diode (IGBT) 204-1 and the insulated gate diode (IGBT) 204-2 are set on the first surface of the heat dissipation substrate 206-2, and / or the position of the thermal conductive unit on the heat dissipation substrate 206-1 corresponds to the position where the rectifier diode 202-1, the rectifier diode 202-2, and the rectifier diode 202-3 are set on the first surface of the heat dissipation substrate 206-1. Therefore, by making the positions of the high thermal conductivity material formed on the heat dissipation substrate 206-1 and the heat dissipation substrate 206-2 correspond to the positions where the insulated gate diode transistors (IGBT) 204-1 and 204-2 are arranged on the first surface of the heat dissipation substrate 206-2 and / or the positions where the rectifier diodes 202-1, 202-2, and 202-3 are arranged on the first surface of the heat dissipation substrate 206-1, the heat dissipation performance of the power module can be further improved. Figure 2 (B) shows a top view of a power module according to an embodiment of the present utility model, Figure 2(C) in FIG. 1 shows a top view of a power module according to an embodiment of the present utility model. Figure 2 The layout of the power module according to an embodiment of the utility model shown in the figure adopts a double substrate structure, with the heat dissipation teeth (or "heat dissipation teeth") sandwiched in the middle, and the IGBT and the rectifier diode are arranged on the two substrates respectively. Such a design can not only shorten the length of the heat dissipation substrate, but also make the unit smaller in size design and more compact in structure. The heat dissipation teeth are sandwiched between the double substrates, and the heat dissipation air passes through the middle, which can greatly improve the heat exchange effect between the air volume and the heat sink, thereby improving the heat exchange efficiency of the air, and at the same time can better achieve thermal balance.

[0038] Figure 3 A comparative schematic diagram is shown, showing the structure of a conventional power module according to the prior art and the structure of a power module according to an embodiment of the present utility model. Figure 3 (A) and (B) show the structure of a conventional power module according to the prior art and the flow direction of the air cooling airflow. Specifically, Figure 3 (A) shows the structure of a conventional power module according to the prior art and the flow direction of the air-cooling airflow in a top view, Figure 3 (B) shows the structure of a conventional power module according to the prior art and the flow direction of the air-cooling airflow in a side view. The conventional power module includes a first power component (e.g., IGBT) 304, a second power component (e.g., a rectifier diode) 310, a heat sink 306 for the inverter, a capacitor 308, and a housing 302 for accommodating the first power component 304, the second power component 310, the capacitor 308, and the heat sink 306. At least two opposite surfaces of the housing are provided with air inlets, and the air-cooling airflow 1 enters the housing 302 through the air inlet holes, and flows through the capacitor 308, the first power component 304, the second power component 310, and the heat sink 306, and the airflow 2 carrying the heat of the power module flows out of the housing 302. Figure 3 (C) and (D) show the structure of the power module according to the utility model and the flow direction of the air-cooling airflow. Specifically, Figure 3 (C) shows the structure of a conventional power module according to the present invention and the flow direction of the air-cooling airflow in a top view, Figure 3(D) shows the structure of the power module according to the utility model and the flow direction of the air-cooling airflow in a side view. The power module includes a first power component (e.g., IGBT) 320, a second power component (e.g., a rectifier diode) 316, a heat sink 312 for the inverter, a capacitor 318, and a shell 314 for accommodating the first power component 320, the second power component 316, the capacitor 318, and the heat sink 312. At least two opposite surfaces of the shell 314 are provided with air inlets, and the air-cooling airflow 1 enters the shell 314 through the air inlet holes, and flows through the capacitor 318, the first power component 320, the second power component 316, the heat sink 312, and the airflow 2 carrying the heat of the power module flows out of the shell 314.

[0039] like Figure 3 A comparative schematic diagram is shown. According to a power module of an embodiment of the utility model, the heat sink is innovatively designed as a double-substrate structure, the heat dissipation teeth are sandwiched in the middle, and the IGBT and the rectifier diode are respectively arranged on the two substrates. Such a design can not only shorten the length of the heat dissipation substrate, but also make the unit smaller in size design and more compact in structure. The heat dissipation teeth are sandwiched between the double substrates, and the heat dissipation air passes through the middle, which can greatly improve the heat exchange effect between the air volume and the heat sink, thereby improving the heat delivery efficiency of the air, and better achieving thermal balance. The heat sink innovatively adopts a double-substrate structure design, which can greatly reduce the length of the heat sink and improve the heat dissipation efficiency of the air, making the unit space more compact and the unit volume smaller.

[0040] It can be seen from the above scheme that in the dual-base heat sink design, an effective air cavity can be formed between the two base plates, so that the air passing through can better exchange heat with the heat dissipation tooth plate, greatly improving the heat dissipation effect of the air and reducing the output of invalid wind. At present, the unit power modules in the inverter all adopt the "one-line" layout design. This structure will not only make the unit shell space larger, but also the heat source on the heat dissipation teeth is unevenly distributed due to the single-sided heat source, resulting in low heat dissipation efficiency of the heat sink teeth. The dual-base "sandwich" power module layout design can make the size of the power module more compact, and the heat distribution of the heat dissipation teeth is more uniform, and the heat dissipation efficiency is higher. At the same time, the part of the space given up can be fully utilized, making the unit structure more compact and the unit volume smaller, thereby making the overall unit cabinet size smaller, reducing material costs and improving product competitiveness.

[0041] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat dissipation device (312) for a frequency converter, the frequency converter comprising a first power component (204-1, 204-2, 320) and a second power component (202-1, 202-2, 202-3, 316), the first power component comprising an insulated gate diode transistor, the second power component comprising a rectifier diode, characterized in that: The heat dissipation device comprises: a first heat dissipation substrate (206-2), the first heat dissipation substrate having a first surface and a second surface opposite to each other, the first power component being arranged on the first surface of the first heat dissipation substrate; a second heat dissipation substrate (206-1), the second heat dissipation substrate having a first surface and a second surface opposite to each other, the second heat dissipation substrate being opposite to the first heat dissipation substrate, and the second surface of the second heat dissipation substrate facing the second surface of the first heat dissipation substrate, the second power component being arranged on the first surface of the second heat dissipation substrate; and Heat dissipation teeth (208), which are arranged between the first heat dissipation substrate and the second heat dissipation substrate, and are respectively connected to the second surface of the first heat dissipation substrate and the second surface of the second heat dissipation substrate.

2. The heat dissipation device for a frequency converter according to claim 1, characterized in that: A heat conduction unit is provided in at least one of the first heat dissipation substrate and the second heat dissipation substrate.

3. The heat dissipation device for a frequency converter according to claim 2, characterized in that: The heat conduction unit includes a heat conduction pipe embedded in at least one of the first heat dissipation substrate and the second heat dissipation substrate, and the heat conduction pipe is filled with a gas-liquid phase change material.

4. The heat dissipation device for a frequency converter according to claim 3, characterized in that: The heat pipe is disposed at a position corresponding to a position where the first power component is disposed on the first surface of the first heat dissipation substrate and / or a position where the second power component is disposed on the first surface of the second heat dissipation substrate.

5. The heat dissipation device for a frequency converter according to claim 2, characterized in that: At least one of the first heat dissipation substrate and the second heat dissipation substrate includes a low thermal conductivity material and a high thermal conductivity material, the thermal conductivity of the high thermal conductivity material is higher than the thermal conductivity of the low thermal conductivity material, the thermal conductive unit is formed by the high thermal conductivity material, the position of the thermal conductive unit on the first heat dissipation substrate corresponds to the position at which the first power component is arranged on the first surface of the first heat dissipation substrate, and / or the position of the thermal conductive unit on the second heat dissipation substrate corresponds to the position at which the second power component is arranged on the first surface of the second heat dissipation substrate.

6. The heat dissipation device for a frequency converter according to claim 1, characterized in that: The heat dissipation teeth include a plurality of heat dissipation teeth arranged perpendicular to the first heat dissipation substrate and the second heat dissipation substrate, and the plurality of heat dissipation teeth are used to release the heat transferred by the first heat dissipation substrate and the second heat dissipation substrate into the air. The heat dissipation teeth are copper heat dissipation teeth or aluminum heat dissipation teeth.

7. A frequency converter power module, characterized in that: The inverter power module comprises: a first power component (204-1, 204-2, 320), a second power component (202-1, 202-2, 202-3, 316), a heat sink (312) for an inverter according to any one of claims 1 to 6, and a housing (314) for accommodating the first power component, the second power component, and the heat sink.

8. The inverter power module according to claim 7, characterized in that: The heat generated by the first power component is greater than the heat generated by the second power component.

9. The inverter power module according to claim 8, characterized in that: The first power component includes an insulated gate diode transistor, and the second power component includes a rectifier diode.

10. The inverter power module according to claim 7, characterized in that: Air inlet holes are provided on each surface of the shell, and the cooling airflow enters the shell through the air inlet holes and flows through the heat dissipation device.

11. A frequency converter, characterized in that: The invention comprises a frequency converter power module according to any one of claims 7 to 10.

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