Circuit board with anti-seismic structure

Abstract

The utility model discloses a circuit board with an anti-seismic structure, which comprises a lower-layer circuit board, a plurality of lower connecting elements, an upper-layer circuit board provided with a plurality of upper-layer circuit elements, a plurality of upper connecting elements, a first anti-seismic structure arranged between the lower connecting elements and the upper connecting elements, and a second anti-seismic structure arranged between the lower connecting elements and the upper connecting elements. The upper circuit element is arranged on the surface of the upper circuit element. The first anti-seismic structure is arranged between the lower connecting element and the upper connecting element, when the upper-layer circuit board is vibrated, vibration impact is absorbed through the first anti-seismic structure, and vibration transmitted to the lower-layer circuit board is reduced or even avoided, so that vibration transmission between the upper-layer circuit board and the lower-layer circuit board is reduced, and the overall anti-seismic effect of the circuit board is improved; meanwhile, the second anti-seismic structure is arranged on the surface of the upper-layer circuit element, external vibration impact is absorbed through the second anti-seismic structure, vibration transmitted to the upper-layer circuit board is reduced or even avoided, then vibration impact borne by the upper-layer circuit board is reduced, and the overall anti-seismic effect of the circuit board is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board with an anti-seismic structure. Background Art

[0002] Circuit boards are providers of electrical connections for electronic components; they have a history of more than 100 years; their design is mainly layout design; the main advantage of using circuit boards is that they greatly reduce wiring and assembly errors, improve the level of automation and production labor rate; according to the number of layers of the circuit board, they can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards.

[0003] The connection between the upper and lower layers of the existing double-layer circuit boards is mostly achieved by plugging electronic connection elements into each other. However, in this connection method, the electronic connection elements are in direct contact with each other, forming a hard connection. When the upper circuit board is affected by vibration, the vibration will be directly transmitted to the lower circuit board without buffer protection. The circuit board has poor seismic performance, which affects normal use. Summary of the invention

[0004] In order to overcome the deficiencies of the prior art, the utility model provides a circuit board with a shock-resistant structure.

[0005] The technical solution adopted by the utility model to solve its technical problems is:

[0006] A circuit board with a seismic-resistant structure, comprising:

[0007] A lower circuit board, on which a plurality of lower circuit elements and a plurality of connection ports are mounted;

[0008] A plurality of lower connection elements are arranged on the peripheral side of the upper surface of the lower circuit board;

[0009] An upper circuit board is arranged above the lower circuit board and has a plurality of upper circuit elements arranged thereon;

[0010] A plurality of upper connection elements, arranged on the peripheral side of the lower surface of the upper circuit board, capable of being plugged into the corresponding lower connection elements to connect the lower circuit board and the upper circuit board;

[0011] A first anti-seismic structure is provided between the lower connecting element and the upper connecting element, and is used to reduce the vibration transmission between the two;

[0012] The second anti-vibration structure is arranged on the surface of the upper circuit element and is used to reduce the external force applied to the upper circuit element.

[0013] In the circuit board with a shock-resistant structure as described above, the first shock-resistant structure includes a first shock-resistant layer disposed on the upper surface of the lower connecting element, and a second shock-resistant layer disposed on the lower surface of the upper connecting element.

[0014] In the circuit board with a shock-resistant structure as described above, the first shock-resistant layer and the second shock-resistant layer are correspondingly laminated.

[0015] In the circuit board with a shock-resistant structure as described above, the material of the first shock-resistant layer and the second shock-resistant layer includes one of foam board, pearl cotton, rubber or silicone foam.

[0016] In the circuit board with a seismic-resistant structure as described above, the lower connecting element is provided with a plurality of plug holes, and the upper connecting element is also provided with connecting pins that can be inserted into the plug holes accordingly, and the connecting pins are plugged into the lower connecting element to form an electrical connection.

[0017] In the circuit board with a shock-resistant structure as described above, the second shock-resistant structure includes a buffer component correspondingly arranged on the upper circuit element.

[0018] In the circuit board with a shock-resistant structure as described above, the buffer component is further provided with a plurality of through grooves arranged and distributed.

[0019] In the circuit board with a shock-resistant structure as described above, the material of the buffer component includes one of foam board, pearl cotton, rubber or silicone foam.

[0020] In the circuit board with a seismic-resistant structure as described above, the upper end of the wiring port is further provided with a third seismic-resistant layer for contacting the upper circuit board.

[0021] In the circuit board with a shock-resistant structure as described above, the material of the third shock-resistant layer includes one of foam board, pearl cotton, rubber or silicone foam.

[0022] The beneficial effects of the utility model are as follows: the utility model has a simple structure, and a first seismic-resistant structure is provided between the lower connecting element and the upper connecting element. When the upper circuit board is affected by vibration, the first seismic-resistant structure absorbs the vibration impact, reduces or even avoids the vibration being transmitted to the lower circuit board, thereby reducing the vibration transmission between the two, improving the overall seismic-resistant effect of the circuit board, and is practical and convenient; at the same time, a second seismic-resistant structure is provided on the surface of the upper circuit element, and the second seismic-resistant structure absorbs external vibration impact, reduces or even avoids the vibration being transmitted to the upper circuit board, thereby reducing the vibration impact on the upper circuit board, improving the overall seismic-resistant effect of the circuit board, and is practical and convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 It is a structural schematic diagram of a circuit board with a seismic-resistant structure according to an embodiment of the utility model.

[0025] Figure 2 This is one of the structural exploded views of a circuit board with a seismic-resistant structure according to an embodiment of the utility model.

[0026] Figure 3 This is the second structural exploded view of a circuit board with a seismic-resistant structure according to an embodiment of the utility model. DETAILED DESCRIPTION

[0027] The technical solution of the utility model is described in detail below in conjunction with the accompanying drawings and embodiments.

[0028] See also Figures 1 to 3 As shown, the embodiment of the present application provides a circuit board with a seismic-resistant structure, including:

[0029] A lower circuit board 1, on which a plurality of lower circuit elements 100 and a plurality of connection ports 101 are mounted;

[0030] A plurality of lower connecting elements 2 are arranged on the peripheral side of the upper surface of the lower circuit board 1;

[0031] An upper circuit board 3 is arranged above the lower circuit board 1 and has a plurality of upper circuit elements 102 arranged thereon;

[0032] A plurality of upper connection elements 4, arranged on the peripheral side of the lower surface of the upper circuit board 3, capable of being plugged into the corresponding lower connection elements 2 to connect the lower circuit board 1 and the upper circuit board 3;

[0033] A first anti-seismic structure 5 is provided between the lower connecting element 2 and the upper connecting element 4 to reduce the vibration transmission therebetween;

[0034] The second anti-vibration structure 6 is disposed on the surface of the upper circuit element 102 to reduce the external force applied to the upper circuit element 102 .

[0035] By setting a first seismic-resistant structure 5 between the lower connecting element 2 and the upper connecting element 4, when the upper circuit board 3 is affected by vibration, the first seismic-resistant structure 5 absorbs the vibration impact, reduces or even avoids the vibration being transmitted to the lower circuit board 1, thereby reducing the vibration transmission between the two and improving the overall seismic-resistant effect of the circuit board, which is practical and convenient; at the same time, a second seismic-resistant structure 6 is set on the surface of the upper circuit element 102, and the second seismic-resistant structure 6 absorbs external vibration impact, reduces or even avoids the vibration being transmitted to the upper circuit board 3, thereby reducing the vibration impact on the upper circuit board 3 and improving the overall seismic-resistant effect of the circuit board, which is practical and convenient.

[0036] Furthermore, the first earthquake-resistant structure 5 includes a first earthquake-resistant layer 51 disposed on the upper surface of the lower connecting element 2 , and a second earthquake-resistant layer 52 disposed on the lower surface of the upper connecting element 4 .

[0037] Specifically, the first earthquake-resistant layer 51 and the second earthquake-resistant layer 52 are arranged in close contact with each other.

[0038] Through the coordinated use of the first shock-resistant layer 51 and the second shock-resistant layer 52, most of the vibration transmission between the lower connecting element 2 and the upper connecting element 4 can be absorbed, thereby reducing or even avoiding the vibration transmission between the upper circuit board 3 and the lower circuit board 1, improving the overall shock-resistant effect of the circuit board, and being practical and convenient.

[0039] Specifically, the material of the first shock-resistant layer 51 and the second shock-resistant layer 52 includes one of foam board, pearl cotton, rubber or silicone foam.

[0040] Foam board has good shock-proof and cushioning performance and high compressive strength, and is inexpensive; pearl cotton has the characteristics of low density, good flexibility, and high recovery rate; rubber and silicone foam have good elasticity and resistance to compression deformation. You can choose the appropriate material according to the specific use situation, which is practical and convenient.

[0041] Furthermore, the second anti-vibration structure 6 includes a buffer member 61 correspondingly arranged on the upper circuit element 102 .

[0042] By providing the buffer member 61 , most of the external vibration impacts can be absorbed, thereby reducing or even avoiding the vibration impact on the upper circuit board 3 , improving the overall anti-vibration effect of the circuit board, and being practical and convenient.

[0043] Specifically, the buffer member 61 is provided with a plurality of through slots 62 arranged in an arranged manner. Under the premise of not affecting the overall performance, the cost can be saved by reducing the use of materials, which is practical and convenient.

[0044] Specifically, the material of the buffer member 61 includes one of foam board, pearl cotton, rubber or silicone foam.

[0045] Furthermore, a third anti-vibration layer 53 for contacting the upper circuit board 3 is provided at the upper end of the wiring port 101 .

[0046] By providing the third anti-vibration layer 53, most of the vibration transmission between the connection port 101 and the upper circuit board 3 can be absorbed, thereby reducing or even avoiding the vibration transmission between the upper circuit board 3 and the connection port 101, improving the overall anti-vibration effect of the circuit board, and being practical and convenient.

[0047] The material of the third shock-resistant layer 53 includes one of foam board, pearl cotton, rubber or silicone foam.

[0048] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure made using the contents of the specification and drawings of the present invention, or directly or indirectly used in other related technical fields, is also included in the patent protection scope of the present invention.

Claims

1. A circuit board with a seismic-resistant structure, characterized in that: Included are: A lower layer circuit board (1) on which a plurality of lower layer circuit elements (100) and a plurality of connection ports (101) are mounted; A plurality of lower connection elements (2) are arranged on the peripheral side of the upper surface of the lower circuit board (1); An upper circuit board (3) is arranged above the lower circuit board (1) and has a plurality of upper circuit elements (102) arranged thereon; A plurality of upper connection elements (4) are arranged on the peripheral side of the lower surface of the upper circuit board (3) and can be plugged into the corresponding lower connection elements (2) to connect the lower circuit board (1) and the upper circuit board (3); A first anti-vibration structure (5) is provided between the lower connecting element (2) and the upper connecting element (4) and is used to reduce vibration transmission between the two; The second anti-vibration structure (6) is arranged on the surface of the upper circuit element (102) and is used to reduce the external force applied to the upper circuit element (102).

2. The circuit board with a seismic-resistant structure according to claim 1, characterized in that: The first earthquake-resistant structure (5) comprises a first earthquake-resistant layer (51) provided on the upper surface of the lower connecting element (2), and a second earthquake-resistant layer (52) provided on the lower surface of the upper connecting element (4).

3. The circuit board with a seismic-resistant structure according to claim 2, characterized in that: The first earthquake-resistant layer (51) and the second earthquake-resistant layer (52) are arranged in a corresponding manner.

4. A circuit board with a seismic-resistant structure according to claim 2 or 3, characterized in that: The material of the first shock-resistant layer (51) and the second shock-resistant layer (52) comprises one of foam board, pearl cotton, rubber or silicone foam.

5. The circuit board with a seismic-resistant structure according to claim 1, characterized in that: The lower connecting element (2) is provided with a plurality of plug holes (20), and the upper connecting element (4) is also provided with connecting pins (40) which can be correspondingly inserted into the plug holes (20), and the connecting pins (40) and the lower connecting element (2) are plugged together to form an electrical connection.

6. The circuit board with a seismic-resistant structure according to claim 1, characterized in that: The second anti-vibration structure (6) comprises a buffer component (61) correspondingly arranged on the upper circuit element (102).

7. The circuit board with a seismic-resistant structure according to claim 6, characterized in that: The buffer member (61) is also provided with a plurality of through slots (62) arranged and distributed.

8. The circuit board with a seismic-resistant structure according to claim 6, characterized in that: The material of the buffer (61) includes one of foam board, pearl cotton, rubber or silicone foam.

9. The circuit board with a seismic-resistant structure according to claim 1, characterized in that: The upper end of the wiring port (101) is also provided with a third anti-vibration layer (53) for contacting the upper circuit board (3).

10. The circuit board with a seismic-resistant structure according to claim 9, characterized in that: The material of the third shock-resistant layer (53) includes one of foam board, pearl cotton, rubber or silicone foam.

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