Steel mesh structure for brushing solder paste on PCB

Abstract

The utility model relates to the related technical field of PCB (printed circuit board) brushing, in particular to a steel mesh structure for brushing solder paste on a PCB, which comprises a base and a support, the support is mounted on the upper surface of the base, a replacement mechanism is arranged on the upper surface of the support, and a clamping mechanism is arranged on the upper surface of the base. According to the steel mesh structure for brushing the solder paste on the PCB, by pulling a pull button, a connecting rod can be easily driven to a fixing block to move, when the connecting rod drives a clamping block to contract, a second spring is extruded to achieve contraction, the PCB can be conveniently placed on a base, after the pull button is loosened, the second spring can push the clamping block to move, and therefore the PCB can be conveniently brushed. The rubber pad is tightly attached to the PCB to clamp the PCB, the connecting frame is placed on the inner side of the support and fixed through the support, and then the pressing block is used for pressing, so that the steel mesh can be replaced simply and quickly, only the steps need to be repeated, the design can improve the efficiency and precision of brushing solder paste on the PCB, and the production process is smoother.

Description

Technical Field

[0001] The utility model relates to the technical field related to PCB board brushes, in particular to a steel mesh structure for brushing solder paste on a PCB board. Background Art

[0002] PCB solder paste brushing refers to the process of applying a layer of solder paste on the surface of the circuit board by brushing during the PCB manufacturing process. This step is usually used in the surface mounting process to cover the pad area on the circuit board that needs to be soldered. The main purpose of brushing solder paste is to improve the accuracy and reliability of welding, improve the efficiency of welding, and reduce the defects that may occur during the welding process. Solder paste is usually composed of metal components such as tin and lead and flux. Its characteristics include moderate viscosity, good fluidity, high temperature resistance, good welding performance, etc. The process of brushing solder paste is generally achieved by mechanical brushing or printing machines to ensure that the solder paste is evenly covered on the pad. After the welding is completed, the solder paste will be melted in the welding furnace to form a reliable welding connection to connect electronic components and circuits Board, complete the manufacturing process of circuit boards, brushing solder paste is a crucial step in PCB manufacturing, which directly affects the quality and performance of circuit boards. The PCB board brushing solder paste requires a steel mesh that is easy to replace because the shape and size of the solder paste coverage required for PCB boards of different designs or batches need to be frequently replaced during the manufacturing process. The steel mesh, as a mold for coating solder paste, must match the design of each PCB board. Since the pad layout and size of different PCB boards may be different, the steel mesh needs to be customized according to specific requirements to ensure accurate and consistent coating of solder paste. Quick replacement of steel mesh can improve production efficiency, reduce downtime, and make the production process more flexible to adapt to different production needs. Therefore, a steel mesh structure for brushing solder paste on PCB boards is particularly needed.

[0003] However, the existing steel mesh structure for brushing solder paste on PCB boards still needs to be manually fixed by handrails when in use. This may cause the steel mesh to move, causing the PCB board to be brushed unevenly, and different steel mesh templates must be replaced when using different PCB boards. Utility Model Content

[0004] The purpose of the utility model is to provide a steel mesh structure for brushing solder paste on a PCB board, so as to solve the problem that the existing steel mesh structure for brushing solder paste on a PCB board proposed in the above background technology still needs to be manually fixed by an armrest when in use, which may cause the steel mesh to move, resulting in uneven brushing of the PCB board, and different steel mesh templates need to be replaced when different PCB boards are used.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a steel mesh structure for brushing solder paste on a PCB, comprising a base and a bracket, the upper surface of the base is equipped with a bracket, the upper surface of the bracket is provided with a replacement mechanism, and the upper surface of the base is provided with a clamping mechanism;

[0006] The replacement mechanism includes a connecting frame, a placement groove, a first spring, a pressing block, a steel mesh and a card slot. A connecting frame is placed on the upper surface of the bracket, a placement groove is provided on the inner surface of the connecting frame, a first spring is fixedly connected to the inner surface of the placement groove, a pressing block is fixedly connected to one side surface of the first spring, a steel mesh is placed on the inner surface of the connecting frame, and a card slot is provided on one side surface of the steel mesh.

[0007] Preferably, the brackets are provided in four groups and are symmetrically distributed.

[0008] Preferably, the first spring is connected to the pressing block to form a telescopic structure.

[0009] Preferably, the clamping mechanism includes a fixed block, a connecting rod, a clamping block, a second spring, a pull button and a rubber pad, a fixed block is installed on one side surface of the bracket, a connecting rod is connected through one side surface of the fixed block, a clamping block is fixedly connected to one side surface of the connecting rod, a second spring is sleeved on the outer side surface of the connecting rod, a pull button is sleeved on the outer side surface of the connecting rod, and a rubber pad is attached to one side surface of the clamping block.

[0010] Preferably, a second spring is fixedly connected to one side surface of the clamping block.

[0011] Preferably, a second spring is fixedly connected to one side surface of the fixing block.

[0012] Preferably, the connecting rod pulls the clamping block to squeeze the second spring to form a telescopic structure.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows: the steel mesh structure of the PCB board solder paste brush can easily drive the connecting rod to the fixed block for movement by pulling the pull button, and when the connecting rod drives the clamping block to shrink, the second spring is squeezed to achieve shrinkage, so that the PCB board can be conveniently placed on the base, and after loosening the pull button, the second spring will push the clamping block to move, and the rubber pad will clamp the PCB board tightly, and after the connecting frame is placed on the inner side of the bracket and fixed by the bracket, the pressing block is pressed, and when the pressing block squeezes the first spring to the specified position inside the placement groove, the steel mesh can be easily placed in, and when the steel mesh reaches the specified position inside the connecting frame, the first spring will push the pressing block from the placement groove to the specified position inside the card slot. This structure makes the replacement of the steel mesh simple and quick, and only the above steps need to be repeated. Such a design can improve the efficiency and accuracy of PCB board solder paste brushing and make the production process smoother. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a front view structural diagram of the utility model;

[0015] Figure 2 This is a schematic diagram of the structure of the replacement mechanism of the utility model;

[0016] Figure 3 This is a schematic diagram of the structure of the clamping mechanism of the utility model;

[0017] Figure 4 For this utility model Figure 2 Enlarged structural diagram at A in the middle.

[0018] In the figure: 1. base; 2. bracket; 3. replacement mechanism; 301. connection frame; 302. placement slot; 303. first spring; 304. pressing block; 305. steel mesh; 306. slot; 4. clamping mechanism; 401. fixing block; 402. connecting rod; 403. clamping block; 404. second spring; 405. pull button; 406. rubber pad. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-4 The utility model provides a technical solution: a steel mesh structure for brushing solder paste on a PCB, comprising a base 1 and a bracket 2, the bracket 2 is installed on the upper surface of the base 1, a replacement mechanism 3 is arranged on the upper surface of the bracket 2, and a clamping mechanism 4 is arranged on the upper surface of the base 1;

[0021] The replacement mechanism 3 includes a connecting frame 301, a placement slot 302, a first spring 303, a pressing block 304, a steel mesh 305 and a card slot 306. The connecting frame 301 is placed on the upper surface of the bracket 2, and the inner surface of the connecting frame 301 is provided with a placement slot 302. The inner surface of the placement slot 302 is fixedly connected to the first spring 303. The pressing block 304 is fixedly connected to one side surface of the first spring 303. The steel mesh 305 is placed on the inner surface of the connecting frame 301. The card slot 306 is opened on one side surface of the steel mesh 305. The setting makes it easier to replace the steel mesh 305. First, place the connecting frame 301 on the inner side of the bracket 2 and fix it with the bracket 2. Then press the pressing block 304. When the pressing block 304 squeezes the first spring 303 to the specified position inside the placement groove 302, the steel mesh 305 can be placed in. When the steel mesh 305 reaches the specified position inside the connecting frame 301, the first spring 303 will push the pressing block 304 from the inside of the placement groove 302 to the specified position inside the card slot 306. When the steel mesh 305 needs to be replaced, the above steps can be repeated to replace it, and then the solder paste can be applied.

[0022] Furthermore, four groups of brackets 2 are provided and symmetrically distributed. Through the provision of the brackets 2, the connection frame 301 can be placed more stably.

[0023] Furthermore, the first spring 303 is connected to the pressing block 304 to form a telescopic structure. Through the arrangement of the first spring 303, the pressing block 304 can be automatically popped out after being pressed.

[0024] Furthermore, the clamping mechanism 4 includes a fixing block 401, a connecting rod 402, a clamping block 403, a second spring 404, a pull button 405 and a rubber pad 406. The fixing block 401 is installed on one side surface of the bracket 2, and the connecting rod 402 is connected to the fixing block 401 on one side surface. The clamping block 403 is fixedly connected to the connecting rod 402 on one side surface. The second spring 404 is sleeved on the outer surface of the connecting rod 402, and the pull button 405 is sleeved on the outer surface of the connecting rod 402. The rubber pad 406 is attached to the one side surface of the clamping block 403. The arrangement of 403, the second spring 404, the pull button 405 and the rubber pad 406 can better fix the PCB board. First, pull the pull button 405, and then the pull button 405 can drive the connecting rod 402 to move on the fixing block 401. When the connecting rod 402 drives the clamping block 403 to shrink, it will squeeze the second spring 404 to shrink, and then the PCB board can be placed on the base 1. Then loosen the pull button 405 and then the second spring 404 can push the clamping block 403 to move, and then the rubber pad 406 can clamp the PCB board.

[0025] Furthermore, a second spring 404 is fixedly connected to one side surface of the clamping block 403 , and the PCB board can be clamped by the arrangement of the clamping block 403 .

[0026] Furthermore, a second spring 404 is fixedly connected to one side surface of the fixing block 401 , and the connection rod 402 can be placed by the setting of the fixing block 401 .

[0027] Furthermore, the connecting rod 402 pulls the clamping block 403 to squeeze the second spring 404 to form a telescopic structure. Through the arrangement of the second spring 404, the clamping block 403 can be pushed.

[0028] Working principle: first pull the pull button 405, and then the pull button 405 can drive the connecting rod 402 to move on the fixed block 401. When the connecting rod 402 drives the clamping block 403 to shrink, it will squeeze the second spring 404 to shrink, and then the PCB board can be placed on the base 1. Then loosen the pull button 405 and the second spring 404 can push the clamping block 403 to move, and then the rubber pad 406 can clamp the PCB board, and place the connecting frame 301 on the inner side of the bracket 2. Fix it with the bracket 2, and then press the pressing block 304. When the pressing block 304 squeezes the first spring 303 to the specified position inside the placement groove 302, the steel mesh 305 can be placed in it. When the steel mesh 305 reaches the specified position inside the connecting frame 301, the first spring 303 will push the pressing block 304 from the inside of the placement groove 302 to the specified position inside the card slot 306. When the steel mesh 305 needs to be replaced, the above steps can be repeated to replace it, and then the solder paste can be applied.

[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A steel mesh structure for brushing solder paste on a PCB, comprising a base (1) and a bracket (2), characterized in that: A bracket (2) is installed on the upper surface of the base (1), a replacement mechanism (3) is provided on the upper surface of the bracket (2), and a clamping mechanism (4) is provided on the upper surface of the base (1); The replacement mechanism (3) comprises a connection frame (301), a placement groove (302), a first spring (303), a pressing block (304), a steel mesh (305) and a clamping groove (306); the connection frame (301) is placed on the upper surface of the bracket (2); the inner surface of the connection frame (301) is provided with a placement groove (302); the inner surface of the placement groove (302) is fixedly connected with the first spring (303); one side surface of the first spring (303) is fixedly connected with the pressing block (304); the inner surface of the connection frame (301) is placed with a steel mesh (305); and one side surface of the steel mesh (305) is provided with a clamping groove (306).

2. A steel mesh structure for brushing solder paste on a PCB according to claim 1, characterized in that: The brackets (2) are arranged in four groups and are symmetrically distributed.

3. A steel mesh structure for brushing solder paste on a PCB according to claim 1, characterized in that: The first spring (303) is connected to the pressing block (304) to form a telescopic structure.

4. The steel mesh structure for brushing solder paste on a PCB according to claim 1, characterized in that: The clamping mechanism (4) comprises a fixed block (401), a connecting rod (402), a clamping block (403), a second spring (404), a pull button (405) and a rubber pad (406); a fixed block (401) is installed on one side surface of the bracket (2); a connecting rod (402) is connected through one side surface of the fixed block (401); a clamping block (403) is fixedly connected to one side surface of the connecting rod (402); a second spring (404) is sleeved on the outer side surface of the connecting rod (402); a pull button (405) is sleeved on the outer side surface of the connecting rod (402); and a rubber pad (406) is attached to one side surface of the clamping block (403).

5. A steel mesh structure for brushing solder paste on a PCB according to claim 4, characterized in that: A second spring (404) is fixedly connected to one side surface of the clamping block (403).

6. A steel mesh structure for brushing solder paste on a PCB according to claim 4, characterized in that: A second spring (404) is fixedly connected to a surface of one side of the fixing block (401).

7. The steel mesh structure for brushing solder paste on a PCB according to claim 4, characterized in that: The connecting rod (402) pulls the clamping block (403) to squeeze the second spring (404) to form a telescopic structure.

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