Power module and charging device

Abstract

The utility model discloses a power module and charging equipment. The power module comprises a circuit board, a power tube, a heat conduction piece, a cooling plate and a pressing structure. The cooling plate, the heat conduction piece, the pressing structure and the circuit board are sequentially arranged in a stacked mode. The power tube comprises a body and a pin, the pin is exposed out of the body, the body is located between the heat conduction piece and the pressing structure, the pin penetrates through the pressing structure and is connected with the circuit board, and the pressing structure is used for pressing the body and the heat conduction piece. The pressing structure presses the body and the heat conduction piece, so that the body presses the heat conduction piece on the cooling plate, the heat conduction piece can be well and tightly attached to the body and the cooling plate, the possibility that gaps are generated between the power tube and the heat conduction piece and between the heat conduction piece and the cooling plate is reduced, and the heat dissipation capacity of the power tube is improved.

Description

Technical Field

[0001] The present application relates to the field of energy technology, and in particular to a power module and a charging device. Background Art

[0002] With the development of new energy electric vehicles, the field of off-board charging has also developed rapidly. In order to achieve the requirements of fast charging, safe charging, long-term stability of equipment, and small size, the power module is becoming smaller and smaller, while the power density is gradually increasing. This makes the heating phenomenon of power devices (such as power tubes) on the circuit board more and more serious, and the demand for improving heat dissipation capacity is getting higher and higher. In a common power module, the power tube is fixed to the circuit board through wave soldering, and then the power device is fixed to the water cooling plate through thermal conductive glue for heat dissipation. After long-term use, the thermal conductive glue will age and the reliability of the thermal conductive glue will decrease, resulting in a decrease in the heat dissipation efficiency between the power device and the water cooling plate. Utility Model Content

[0003] The technical problem to be solved by the embodiments of the present application is to provide a power module and a charging device that are conducive to improving heat dissipation capabilities.

[0004] In a first aspect, the present application provides a power module, which includes a circuit board, a power tube, a heat conductive member, a cooling plate, and a clamping structure. The cooling plate, the heat conductive member, the clamping structure, and the circuit board are stacked in sequence. The power tube includes a body and pins, the pins are exposed from the body, the body is located between the heat conductive member and the clamping structure, the pins pass through the clamping structure and are connected to the circuit board, and the clamping structure is used to clamp the body and the heat conductive member.

[0005] As the use time increases, the thermal conductive adhesive will age, resulting in gaps between the thermal conductive adhesive and the water cooling plate, and between the thermal conductive adhesive and the power device. Since the thermal resistance of air is large, if there is a gap between the power tube and the thermal conductive adhesive, and between the thermal conductive adhesive and the cooling plate, the heat from the power device to the water cooling plate will be reduced, affecting the heat dissipation efficiency of the water cooling plate to the power device.

[0006] By setting a clamping structure to clamp the body and the heat conductor, the body presses the heat conductor onto the cooling plate. Even after long-term use, the heat conductor can fit tightly with the body and the cooling plate, thereby reducing the possibility of gaps between the power tube and the heat conductor, and between the heat conductor and the cooling plate. This is beneficial to shorten the heat conduction path from the power tube, the heat conductor to the cooling plate, and is beneficial to improving the heat dissipation effect.

[0007] In combination with the first aspect, in a possible implementation, the power module further includes a fastener, one end of the fastener is located on a side of the circuit board facing away from the cooling plate, and the other end of the fastener passes through the circuit board and the clamping structure and is fixedly connected to the cooling plate.

[0008] In this possible implementation, the circuit board, the clamping structure and the cooling plate are fixedly connected by fasteners. Under the fixing action of the fasteners, the main body and the cooling plate can fit tightly against the heat conductor, which is beneficial to improving the connection reliability of the heat conductor, the power tube and the cooling plate, thereby helping to improve the heat dissipation capacity of the power module.

[0009] In combination with the first aspect, in a possible implementation, the clamping structure includes a shell and an elastic member, the elastic member is accommodated in the shell, the shell is provided with a positioning hole, at least part of the main body extends into the shell through the positioning hole, the elastic member is elastically abutted against the main body, and the elastic member is used to apply an elastic force to the main body toward one side of the cooling plate.

[0010] In this possible implementation, the elastic member directly applies elastic force to the power tube, so that the body can press the heat conductor, improve the reliability of the connection between the body and the heat conductor, and help improve the heat dissipation capacity of the power module. In addition, the shell can be made of insulating material, and the elastic member and the circuit board are insulated and protected by the shell, so as to meet the insulation safety requirements between the elastic member and the circuit board, which is beneficial to improve the safety of the power module. In addition, a positioning hole is opened on the shell to position the body when it is extended into the shell, so as to facilitate the alignment of the pins of the power tube with the circuit board for connection and fixation, and the positioning hole can also limit the body. When the elastic member applies elastic force to the body, the possibility of the body shifting in the shell is reduced, which is beneficial for the elastic member to apply a stable elastic force to the heat conductor through the body.

[0011] In combination with the first aspect, in a possible implementation, the clamping structure further includes an insulating member, which is accommodated in the shell, and is disposed between the elastic member and the body, and the elastic member is elastically abutted against the body through the insulating member.

[0012] In this possible implementation, an insulating member is provided between the elastic member and the power tube to provide insulation protection for the elastic member and the power tube, thereby meeting the insulation safety requirements between the elastic member and the power tube, and facilitating improving the safety of the power module.

[0013] In combination with the first aspect, in a possible implementation manner, the insulating member includes a bottom wall and a side wall that are connected, and the bottom wall and the side wall together form a receiving space, and the receiving space is used to receive the elastic member.

[0014] In this possible implementation, the side wall of the insulating member can insulate and protect the side of the elastic member, which is beneficial to improving the insulation safety between the elastic member and other components.

[0015] In combination with the first aspect, in a possible implementation, the shell includes a top shell and a bottom shell, the top shell is connected to the bottom shell, the elastic part and the insulating part are both arranged between the top shell and the bottom shell, and the fasteners pass through the circuit board, the top shell, the elastic part, the insulating part and the bottom shell in sequence and are connected and fixed to the cooling plate.

[0016] In this possible implementation, fasteners are sequentially passed through the circuit board, top shell, elastic member, insulating member and bottom shell and fixedly connected to the cooling plate, the elastic member and the insulating member are fixed, the elastic member is kept in a compressed state, and an elastic force is always applied to the power tube toward the cooling plate side, thereby reducing the possibility of displacement of the elastic member and / or insulating member inside the shell, which is beneficial to improving the reliability of the power module.

[0017] In combination with the first aspect, in a possible implementation, the elastic member includes a connected elastic portion and a bending portion, the bending portions are provided at opposite ends of the elastic portion, the elastic portion is elastically abutted against the body, and the bending portion is bent relative to the elastic portion along the arrangement direction of the cooling plate and the circuit board.

[0018] In this possible implementation, bending portions are provided at opposite ends of the elastic portion, and the elastic member as a whole is roughly in a "U"-shaped structure, which is beneficial to increasing the elastic deformation capacity of the elastic member.

[0019] In combination with the first aspect, in a possible implementation, the power tube further includes a substrate, which is disposed between the body and the heat conductor, wherein a side of the substrate facing away from the cooling plate is connected and fixed to the body, and a side of the substrate facing the cooling plate is in contact with the heat conductor.

[0020] In this possible implementation, the base plate is closely attached between the heat conducting member and the body, so that the body and the cooling plate are insulated and protected. The heat generated by the body can be transferred to the heat conducting member through the base plate, which is beneficial to improve the heat dissipation efficiency of the power tube.

[0021] In combination with the first aspect, in a possible implementation, there are multiple power tubes, and the multiple power tubes are arranged at intervals on the surface of the clamping structure facing away from the circuit board. Each body is connected to a substrate, and the distance between a side of each substrate facing the cooling plate and a side of the circuit board facing the cooling plate is within a preset range.

[0022] In this possible implementation, the side of the substrate facing the cooling plate is the bonding surface of the substrate and the heat conductor, and the distance between the bonding surface and the circuit board is within a preset range, which can be determined based on the assembly tolerance of the power tube and the height of the power tube along the arrangement direction of the cooling plate and the circuit board. In this way, the height difference of the multiple power tubes after welding is as small as possible, ensuring that the height tolerance of the power tubes after welding is within the required range, which is conducive to reducing the possibility of large stress on the power tubes due to excessive differences in the distances from different power tubes to the circuit board, thereby helping to reduce the number of welding times and save costs.

[0023] In combination with the first aspect, in a possible implementation manner, there is a distance between the fastener and the power tube in a direction perpendicular to the arrangement direction of the cooling plate and the circuit board.

[0024] In this possible implementation, a distance is provided between the power tube and the fastener to avoid direct contact between the power tube and the fastener, thereby reducing the occurrence of safety issues and thus facilitating improvement of the safety of the power module.

[0025] In a second aspect, a charging device includes a power module provided in any implementation of the first aspect and a charging gun connected thereto. The power module is used to convert the electric energy inputted from its input end into power and then output it to the charging gun.

[0026] In a third aspect, a method for assembling a power module includes: placing a clamping structure on the surface of a circuit board, extending the main body of the power tube from the side of the clamping structure away from the circuit board into the clamping structure, the pins of the power tube passing through the clamping structure and extending to the side of the circuit board away from the clamping structure, and the substrate is located on the surface of the main body of the power tube away from the circuit board. The hooks of the welding auxiliary tooling are passed through the screw holes on the circuit board, the clamping structure and the welding auxiliary tooling in turn, and connected and fixed with the welding auxiliary tooling. The pins of the power tube are welded and fixed to the circuit board. The welding auxiliary tooling is disassembled, the heat conductor is placed on the substrate, and then the cooling plate is placed on the heat conductor, and the circuit board, the clamping structure and the cooling plate are passed through in turn through the fasteners.

[0027] In the power module of the present application, the power tube is welded and positioned by welding auxiliary tooling, so that the distance between the side of each substrate facing the cooling plate and the side of the circuit board facing the cooling plate is within a preset range, ensuring that the height tolerance of the power tube after welding is within the required range, reducing the pin stress problem of the power tube, thereby reducing the post-welding or secondary wave soldering process and saving manufacturing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0029] Figure 1 A schematic diagram of the structure of a charging system provided in one embodiment of the present application;

[0030] Figure 2 for Figure 1 A schematic diagram of the connection structure of the charging system shown in (a);

[0031] Figure 3 A schematic diagram of the three-dimensional structure of a power module provided in one embodiment of the present application;

[0032] Figure 4 for Figure 3 A partial cross-sectional schematic diagram of the power module shown along line IV-IV;

[0033] Figure 5A schematic diagram of a partially exploded structure of a power module provided in one embodiment of the present application;

[0034] Figure 6 A schematic diagram of the exploded structure of a compression structure provided in one embodiment of the present application;

[0035] Figure 7 A schematic diagram of assembling a power tube and a welding auxiliary tooling provided in an embodiment of the present application;

[0036] Figure 8 A schematic diagram of the assembly process of a power module provided in one embodiment of the present application.

[0037] Description of reference numerals:

[0038] Power module-100, housing-10, circuit board-20, cooling plate-30, heat conducting member-40, power tube-50, body-51, pin-52, substrate-53, pressing structure-70, housing-71, bottom shell-711, top shell-712, inner cavity-713, positioning pin-714, positioning hole-715, mounting hole-716, elastic member-72, elastic part-721, bending part-722, insulating member-73, bottom Wall-731, side wall-732, fastener-80, welding auxiliary tooling-200, hook-201, charging device-300, charging host-301, AC-DC conversion module-3011, DC-DC conversion module-3012, DC bus-3013, power distribution module-3014, charging terminal-302, charging gun-303, electric vehicle-400, power grid-500, charging system-1000. DETAILED DESCRIPTION

[0039] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0040] First, to facilitate understanding of the technical solutions provided by the embodiments of the present application, application scenarios applicable to the embodiments of the present application are first introduced.

[0041] Please refer to Figure 1 , Figure 1 A schematic diagram of a charging system 1000 provided in one embodiment of the present application. Figure 1 In (a) and (b), the charging system 1000 may include a charging device 300 and an electric vehicle 400. The charging device 300 is used to receive the output AC power, convert the AC power into stable DC power, and then transmit it to the electric vehicle 400 to charge the electric vehicle 400. Alternatively, the electric vehicle 400 may also output electric energy in reverse through the power grid 500 of the charging device 300.

[0042] The charging device 300 includes a power module 100 and a charging gun 303 connected to the power module 100 . The power module 100 is used to convert the electric energy inputted from its input end into power and then output the power to the charging gun 303 .

[0043] In some embodiments, such as Figure 1 As shown in (a) in the figure, the charging device 300 is a split-type charging device. Specifically, the charging device 300 includes a charging host 301, at least one charging terminal 302 and at least one charging gun 303, wherein the charging host 301 is connected to each charging terminal 302, at least one charging terminal 302 is connected to at least one charging gun 303, and each charging gun 303 is used to connect to an electric vehicle 400. In a specific implementation, one charging terminal 302 is connected to one or more charging guns 303, and one or more charging guns 303 are connected to one electric vehicle 400.

[0044] The charging host 301 includes a plurality of power modules 100, which are used to convert the AC power outputted by the power grid 500 into stable DC power and then transmit it to the charging terminal 302. The plurality of power modules include, for example, an alternating current-direct current (AC-DC) conversion module and a DC-DC conversion module. The charging terminal 302 transmits the stable DC power to the electric vehicle 400 through the connected charging gun 303.

[0045] The charging terminal 302 includes a housing, a human-machine interaction interface, a charging control unit, a metering and billing unit, etc., and is used for information exchange, energy transmission, metering and billing, etc. with the electric vehicle 400.

[0046] The electric vehicle 400 is a vehicle that is driven by electric energy and is a pure electric vehicle (pure EV / battery EV), a hybrid electric vehicle (HEV), a range extended electric vehicle (REEV), or a plug-in hybrid electric vehicle (PHEV).

[0047] In other embodiments, Figure 1As shown in (b), the charging device 300 is an integrated charging device. Specifically, the human-machine interface, charging control unit, metering and billing unit, etc. in the charging device 300 are directly set in the charging host 301, so that the charging device 300 only includes the charging host 301 and at least one charging gun 303 connected to the charging host 301, but does not include the charging terminal 302. In a specific implementation, the multiple power conversion modules in the charging host 301 convert the AC power output by the power grid 500 into stable DC power, and then directly transmit it to the electric vehicle 400 through the charging gun 303. Among them, the multiple power conversion modules include, for example, AC-DC conversion modules.

[0048] Below Figure 1 Taking the charging system 1000 shown in (a) as an example, the structure of the charging host 301 is further introduced.

[0049] Figure 2 An example is shown Figure 1 FIG. 1 is a schematic diagram of the connection structure of the charging system 1000 shown in (a).

[0050] See also Figure 2 The charging host 301 includes multiple AC-DC conversion modules 3011, multiple DC-DC conversion modules 3012, a DC bus 3013, and a power distribution module 3014. The input end of each AC-DC conversion module 3011 is connected to the power grid 500, and the output end of each AC-DC conversion module 3011 is connected to the DC bus 3013. The input end of each DC-DC conversion module 3012 is connected to the DC bus 3013, and the output end of each DC-DC conversion module 3012 is connected to the input end of the power distribution module 3014. The output end of the power distribution module 3014 is connected to the charging gun 303 through the charging terminal 302.

[0051] Among them, multiple AC-DC conversion modules 3011 are used to receive the alternating current output by the power grid 500, and convert the alternating current into direct current and output it to the direct current bus 3013. Multiple DC-DC conversion modules 3012 are used to obtain direct current from the direct current bus 3013, and further convert the obtained direct current into direct current suitable for the electric vehicle 400 and output it to the power distribution module 3014. The power distribution module 3014 is used to dynamically distribute the direct current output by the multiple DC-DC conversion modules 3012 according to the actual charging power required by the electric vehicle 400, and transmit the distributed charging power to the electric vehicle 400 through the charging gun 303.

[0052] With the development of new energy electric vehicles, the field of off-board charging has also developed rapidly. In order to achieve the requirements of fast charging, safe charging, long-term stability of equipment, and small size, the power module is becoming smaller and smaller, while the power density is gradually increasing. This makes the heating phenomenon of power devices (such as power tubes) on the circuit board more and more serious, and the demand for improving heat dissipation capacity is getting higher and higher. In a common power module, the power tube is fixed to the circuit board through wave soldering, and then the power device is fixed to the water cooling plate through thermal conductive glue for heat dissipation. After long-term use, the thermal conductive glue will age and the reliability of the thermal conductive glue will decrease, resulting in a decrease in the heat dissipation efficiency between the power device and the water cooling plate.

[0053] To solve the above problems, the present application provides a power module 100 that is conducive to improving heat dissipation capacity, so that the power utilization rate of the power module 100 can be improved while meeting the charging power requirements of different loads. This is conducive to enabling the charging device 300 to achieve a charging speed of one kilometer per second, and bringing users a charging experience of "a cup of coffee, full time departure".

[0054] See also Figure 3 and Figure 4 , Figure 3 Schematic diagram of the three-dimensional structure of a power module 100 provided in one embodiment of the present application. Figure 4 for Figure 3 The power module 100 shown is a partial cross-sectional schematic diagram along the IV-IV line. The power module 100 includes a housing 10, a circuit board 20, a cooling plate 30, a heat conductor 40, a power tube 50, a clamping structure 70 and a fastener 80. The circuit board 20, the cooling plate 30, the heat conductor 40, the clamping structure 70 and the power tube 50 are all accommodated inside the housing 10. Among them, the cooling plate 30 is connected and fixed to the housing 10. For example, the cooling plate 30 and the housing 10 can be integrated into one body, which simplifies the installation process. The circuit board 20, the clamping structure 70, the heat conductor 40 and the cooling plate 30 are stacked in sequence, and the circuit board 20, the clamping structure 70 and the cooling plate 30 are fixedly connected by fasteners 80 (such as screws), so that the clamping structure 70 can stably apply force to the power tube 50. The power tube 50 is arranged between the circuit board 20 and the cooling plate 30 . The side of the power tube 50 facing the heat conductor 40 is used to fit with the heat conductor 40 . The end of the power tube 50 away from the heat conductor 40 is penetrated by the clamping structure 70 and connected to the circuit board 20 .

[0055] As the use time increases, the thermal conductive adhesive will age, resulting in gaps between the thermal conductive adhesive and the water cooling plate, and between the thermal conductive adhesive and the power device. Since the thermal resistance of air is large, if there is a gap between the power tube and the thermal conductive adhesive, and between the thermal conductive adhesive and the cooling plate, the heat from the power device to the water cooling plate will be reduced, affecting the heat dissipation efficiency of the water cooling plate to the power device.

[0056] In the present application, the pressing structure 70 is used to apply a force to the power tube 50 toward the side of the cooling plate 30, so that the power tube 50 presses the heat conductor 40 against the cooling plate 30. Even after long-term use, the heat conductor 40 can be well fitted with the power tube 50 and the cooling plate 30, thereby reducing the possibility of a gap between the power tube 50 and the heat conductor 40, and between the heat conductor 40 and the cooling plate 30, thereby facilitating the shortening of the heat conduction path from the power tube 50 and the heat conductor 40 to the cooling plate 30, and facilitating the improvement of the heat dissipation effect. The pressing structure 70 and the cooling plate 30 are connected and fixed by fasteners 80, and the power tube 50 and the cooling plate 30 can be closely fitted with the heat conductor 40, which is conducive to improving the connection reliability of the heat conductor 40, the power tube 50 and the cooling plate 30, and thus facilitating the improvement of the heat dissipation capacity of the power tube 50. In addition, since the pressing structure 70 does not directly apply a force to the circuit board 20, the degree of damage to the circuit board 20 is effectively reduced, which is conducive to improving the service life of the circuit board 20.

[0057] For example, the cooling plate 30 may be a liquid cooling plate, and a coolant may flow into the cooling plate 30 to dissipate heat for the power tube 50 .

[0058] The heat conductive member 40 is a heat conductive gel, heat conductive silicone grease or a heat conductive pad. The heat conductive member 40 can be deformed under the force of the pressing structure 70 on the power tube 50 to fill the gap between the power tube 50 and the cooling plate 30 to accelerate the heat dissipation of the power tube 50.

[0059] For example, the power tube 50 can be an insulated gate bipolar transistor (IGBT) or an insulated gate field effect transistor (MOSFET, MOS tube for short), or a diode. It can be understood that the power tube 50 can also be other types, which are not specifically limited.

[0060] Please combine Figure 5 , Figure 5A schematic diagram of a partially exploded structure of a power module 100 provided in an embodiment of the present application. The power tube 50 can be fixedly connected to the circuit board 20 by wave soldering. Specifically, the power tube 50 includes a body 51, a pin 52 and a substrate 53, the body 51 is connected and fixed with the pin 52, the pin 52 is exposed from the body 51, the pin 52 is passed through a clamping structure 70 and connected and fixed with the circuit board 20, wherein the pin 52 is connected and fixed with the circuit board 20 by wave soldering. The substrate 53 is arranged between the body 51 and the heat conductor 40, the side of the substrate 53 facing away from the cooling plate 30 is fixedly connected with the body 51, and the side of the substrate 53 facing the cooling plate 30 is attached to the heat conductor 40. In this way, by closely attaching the substrate 53 between the heat conductor 40 and the body 51, the body 51 and the cooling plate 30 are insulated and protected, wherein the heat generated by the body 51 can be conducted to the heat conductor 40 through the closely attached substrate 53, which is conducive to improving the heat dissipation efficiency of the power tube 50.

[0061] There can be multiple power tubes 50, which are arranged at intervals on the surface of the clamping structure 70 away from the circuit board 20. Each power tube 50 can be connected to a corresponding heat conductor 40. In this way, the material of the heat conductor 40 can be effectively saved, which is conducive to cost saving.

[0062] For example, when there are multiple power tubes 50, each power tube is connected to a corresponding substrate 53. Such a configuration is conducive to improving the flatness of the substrate 53, and the substrate 53 fits better with the heat conductor 40, thereby helping to improve the heat dissipation efficiency.

[0063] After the multiple power tubes 50 are fixedly connected to the circuit board 20, the clamping structure 70 simultaneously applies a force to the multiple bodies 51 toward the side of the cooling plate 30. If the height difference between the surface of the different substrates 53 facing the side of the cooling plate 30 and the circuit board 20 along the arrangement direction of the cooling plate 30 and the circuit board 20 is too large, it is easy to cause the pins 52 of some power tubes 50 to have excessive stress. In order to reduce the stress problem of the pins 52 of the power tube 50, it is necessary to perform post-soldering or wave soldering again after wave soldering, which makes the welding processing method of the power tube 50 complicated, the processing efficiency is low, and the cost is high.

[0064] The distance between the side of each substrate 53 facing the cooling plate 30 and the side of the circuit board 20 facing the cooling plate 30 is within a preset range. The side of the substrate 53 facing the cooling plate 30 is the bonding surface of the substrate 53 and the heat conductor 40, and the distance between the bonding surface and the circuit board 20 is within a preset range, which can be determined according to the assembly tolerance of the power tube 50 and the height of the power tube 50 along the arrangement direction of the cooling plate 30 and the circuit board 20. In this way, the height difference of the multiple power tubes 50 after welding is as small as possible, ensuring that the height tolerance of the power tubes 50 after welding is within the required range, which is conducive to reducing the possibility of large stress on the power tube 50 due to excessive differences in the distances between different power tubes 50 and the circuit board 20, thereby helping to reduce the number of welding times and save costs.

[0065] Preferably, the surfaces of the multiple substrates 53 facing the cooling plate 30 are located on the same plane, which is perpendicular to the arrangement direction of the cooling plate 30 and the circuit board 20. This is beneficial to improving the consistency of the distances between the multiple power tubes 50 and the circuit board 20, so that after the multiple power tubes 50 are welded and fixed to the circuit board 20, the stress of the pins 52 is basically consistent, reducing the possibility of high stress in the pins 52 of the power tubes 50 due to the different distances between different power tubes 50 and the circuit board 20, and reducing the occurrence of post-welding or secondary wave soldering, thereby helping to improve processing efficiency and reduce costs. At the same time, it is beneficial to improve the reliability of the connection between the power tube 50 and the circuit board 20.

[0066] like Figure 4 As shown, for example, in a direction perpendicular to the arrangement direction of the cooling plate 30 and the circuit board 20, there is a distance between the fastener 80 and the power tube 50. The fastener 80 is connected and fixed to the circuit board 20, and a distance is set between the fastener 80 and the power tube 50 to prevent the fastener 80 from directly contacting the power tube 50, which is beneficial to improving the safety of the power module 100.

[0067] Please combine Figure 6 , Figure 6A schematic diagram of the exploded structure of a clamping structure 70 provided in an embodiment of the present application. The clamping structure 70 includes a shell 71, an elastic member 72 and an insulating member 73. The shell 71 is used to accommodate the elastic member 72, the insulating member 73 and at least part of the body 51. The elastic member 72, the insulating member 73 and the power tube 50 are stacked along the arrangement direction of the cooling plate 30 and the circuit board 20, and the elastic member 72 elastically abuts against the body 51, specifically, the elastic member 72 elastically abuts against the body 51 through the insulating member 73, and the elastic member 72 is used to apply an elastic force to the body 51 toward one side of the cooling plate 30. It should be noted that the elastic member 72 can be connected and fixed to the shell 71 to apply a stable elastic force to the body 51. By directly applying an elastic force to the body 51 through the elastic member 72, the body 51 can compress the heat conductive member 40, improve the reliability of the connection between the body 51 and the heat conductive member 40, and help to improve the heat dissipation capacity of the power module 100.

[0068] Among them, the insulating member 73 is arranged between the elastic member 72 and the power tube 50 and is used to insulate and protect the power tube 50 and the elastic member 72 to meet the insulation safety requirements between the elastic member 72 and the power tube 50; at the same time, the shell 71 serves as an insulating protection device between the elastic member 72 and the circuit board 20, realizing the insulation safety requirements between the elastic member 72 and the circuit board 20, which is beneficial to improving the safety of the power module 100.

[0069] The shell 71 can be made of insulating plastic material and has a certain rigidity. The shell 71 is not easily deformed and plays a role in supporting and fixing the elastic member 72 .

[0070] The housing 71 includes a bottom housing 711 and a top housing 712. The bottom housing 711 and the top housing 712 are connected and fixed to form an inner cavity 713. The inner cavity 713 is used to accommodate the elastic member 72, the insulating member 73 and at least part of the body 51. The top housing 712 and the bottom housing 711 are the external structures of the entire compression structure 70. The main functions are to provide installation space for the internal elastic member 72 and the insulating member 73, and to protect the internal elastic member 72 from direct contact with the circuit or device on the circuit board 20, which is beneficial to improve the safety of the power module 100.

[0071] For example, the top shell 712, the elastic member 72, the insulating member 73 and the bottom shell 711 are stacked in sequence, and the top shell 712 is fixed on the circuit board 20. The fastener 80 passes through the circuit board 20, the top shell 712, the elastic member 72, the insulating member 73 and the bottom shell 711 in sequence and is connected and fixed to the cooling plate 30, fixes the elastic member 72 and the insulating member 73, keeps the elastic member 72 in a compressed state, and always applies an elastic force toward the cooling plate 30 side to the body 51, reduces the possibility of displacement of the elastic member 72 and / or the insulating member 73 inside the housing 71, and is conducive to improving the reliability of the power module 100.

[0072] It should be noted that after the fastener 80 passes through the circuit board 20 and the clamping structure 70 is fixed on the cooling plate 30, the elastic member 72 will produce a certain elastic deformation under the pressure of the fastener 80, thereby providing an elastic force for the main body 51. Under the elastic force of the elastic member 72, the heat conductor 40 fully fills the gap between the substrate 53 and the cooling plate 30, thereby improving the heat dissipation effect of the power tube 50.

[0073] For example, a positioning pin 714 is provided on the bottom shell 711, and a hole corresponding to the positioning pin 714 is provided on the circuit board 20. The positioning pin 714 can pass through the top shell 712 and cooperate with the hole on the circuit board 20 to ensure that the relative position of the clamping structure 70 is not easily changed, and plays a positioning role for the subsequent assembly of the power tube 50.

[0074] For example, the bottom shell 711 is further provided with a positioning hole 715 and a mounting hole 716, and the positioning hole 715 and the mounting hole 716 are spaced apart from each other. The positioning hole 715 is used for the body 51 of the power tube 50 to extend into the inner cavity 713 of the shell 71 and to abut against the elastic member 72 through the insulating member 73, and the mounting hole 716 is used for the pins 52 of the power tube 50 to pass through the bottom shell 711 and be connected and fixed to the circuit board 20. The number of the positioning holes 715 is the same as the number of the power tubes 50, and one positioning hole 715 may correspond to one or more mounting holes 716, so that after the body 51 of the power tube 50 passes through the positioning hole 715, one or more pins 52 of the power tube 50 may be connected and fixed to the circuit board 20 through the corresponding mounting holes 716.

[0075] Specifically, the size of the opening of the positioning hole 715 is adapted to the size of the body 51 of the power tube 50, and the positioning hole 715 can further position the power tube 50, so that the pins 52 of the power tube 50 can be more accurately passed through the mounting holes 716 and connected and fixed to the circuit board 20. The positioning hole 715 can also limit the body 51, and when the elastic member 72 applies elastic force to the body 51, the possibility of the body 51 being offset in the housing 71 is reduced, which is conducive to the elastic member 72 applying a stable elastic force to the heat conducting member 40 through the body 51.

[0076] In the present application, along the arrangement direction of the circuit board 20 and the cooling plate 30, the orthographic projection area of ​​the bottom shell 711 on the circuit board 20 is larger than the orthographic projection area of ​​the top shell 712 on the circuit board 20, that is, the bottom shell 711 covers the orthographic projection area of ​​the top shell 712 on the circuit board 20. With such a configuration, after the power tube 50 extends into the inner cavity 713 from the side of the bottom shell 711 away from the top shell 712, one or more pins 52 of the power tube 50 only need to be aligned with the mounting holes 716 on the bottom shell 711 to be aligned with the holes on the circuit board 20. One or more pins 52 of the power tube 50 do not need to pass through the top shell 712 to be connected to the circuit board 20. In this way, the installation accuracy is reduced, and the assembly of the power tube 50 with multiple pins 52 is facilitated, which is beneficial to improving the installation efficiency.

[0077] The elastic member 72 includes a connected elastic portion 721 and a bending portion 722, and the bending portions 722 are provided at opposite ends of the elastic portion 721. The elastic portion 721 elastically abuts against the body 51, for example, the elastic portion 721 elastically abuts against the body 51 of the power tube 50 through the insulating member 73 to provide elastic force to the body 51 of the power tube 50. The bending portion 722 is bent relative to the elastic portion 721 along the arrangement direction of the cooling plate 30 and the circuit board 20, for example, along the arrangement direction of the cooling plate 30 and the circuit board 20, the bending portion 722 is bent relative to the elastic portion 721 toward the circuit board 20; for another example, along the arrangement direction of the cooling plate 30 and the circuit board 20, the bending portion 722 can be bent relative to the elastic portion 721 toward the cooling plate 30. With such a configuration, the elastic member 72 is generally in a "U"-shaped structure as a whole, which is conducive to increasing the elastic deformation capacity of the elastic member 72.

[0078] For example, the elastic member 72 may be a metal spring, which simultaneously applies elastic force to the multiple power tubes 50 toward the cooling plate 30, thereby improving the consistency of the forces on the multiple bodies 51, so that the distance from the surface of the multiple substrates 53 away from the circuit board 20 to the circuit board 20 is within a preset range, thereby ensuring that the height tolerance of the power tubes 50 after welding is within the required range. It is understood that the elastic member 72 may also be an elastic device made of insulating material, which is not specifically limited.

[0079] For example, the insulating member 73 may be an insulating film, which may be attached to the surface of the elastic member 72 facing the power tube 50 . The insulating member 73 may also be made of other types of insulating materials, which are not specifically limited.

[0080] For example, the insulating member 73 includes a bottom wall 731 and a side wall 732 connected to each other, for example, the side wall 732 is connected to the outer edge of the bottom wall 731. The side wall 732 and the bottom wall 731 together form a receiving space 733, and the receiving space 733 is used to receive the elastic member 72. In this way, at least part of the elastic member 72 is received in the insulating member 73, and the side wall 732 of the insulating member 73 can wrap the side portion around the elastic member 72 and play a role of insulation protection, which is conducive to improving the insulation safety of the elastic member 72 and other components.

[0081] Please combine Figure 7 , Figure 7A schematic diagram of the assembly of a power tube 50 and a welding auxiliary tooling 200 provided in an embodiment of the present application. The present application also provides a welding auxiliary tooling 200, which is used to cooperate with a clamping structure 70 to perform welding positioning on the power tube 50. The welding auxiliary tooling 200 can be a flat structure and is provided with screw holes, and the screw holes are used for hooks 201 to pass through to simulate the locking effect of screws. The welding auxiliary tooling 200 is used to make the distance between the side of the multiple substrates 53 away from the circuit board 20 and the side of the circuit board 20 facing the cooling plate 30 within a preset range, thereby ensuring that the height tolerance of the power tube 50 after wave soldering is within the required range.

[0082] Please combine Figure 8 , Figure 8 The power module 100 of the present application can be assembled in combination with the welding auxiliary tooling 200. The assembly method of the power module 100 includes steps S801-S804:

[0083] S801: Place the clamping structure 70 on the surface of the circuit board 20, extend the body 51 of the power tube 50 from the side of the clamping structure 70 away from the circuit board 20 into the clamping structure 70, and the pin 52 of the power tube 50 passes through the clamping structure 70 and extends to the side of the circuit board 20 away from the clamping structure 70. The substrate 53 is located on the surface of the body 51 on the side away from the circuit board 20.

[0084] The step S801 is performed during the plug-in assembly stage before the circuit board 20 is subjected to wave soldering.

[0085] S802: The hook claw 201 of the welding auxiliary tool 200 is sequentially inserted through the screw holes on the circuit board 20, the clamping structure 70 and the welding auxiliary tool 200, and is connected and fixed to the welding auxiliary tool 200.

[0086] In step S802, after the hook 201 fixes the circuit board 20, the clamping structure 70 and the auxiliary welding fixture 200, the elastic member 72 generates a certain elastic deformation under the pressure of the hook 201, and the elastic restoring force of the elastic member 72 is directed toward the auxiliary welding fixture 200. Under the action of the auxiliary welding fixture 200, the distance from the surface of the auxiliary welding fixture 200 facing the circuit board 20 to the surface of the circuit board 20 facing the clamping structure 70 is controlled within a suitable range to ensure that the height tolerance of the power tube 50 after wave soldering is within the required range.

[0087] S803: Fix the pin 52 of the power tube 50 to the circuit board 20 by welding.

[0088] In step S803, the pins 52 of the power tube 50 can be fixed to the circuit board 20 by wave soldering. After the power tube 50 is fixed to the circuit board 20, the distance between the side of each substrate 53 facing away from the circuit board 20 and the side of the circuit board 20 facing the cooling plate 30 is within a preset range.

[0089] S804: dismantle the welding auxiliary tooling 200, place the heat conducting member 40 on the substrate 53, then place the cooling plate 30 on the heat conducting member 40, and sequentially penetrate the circuit board 20, the clamping structure 70 and the cooling plate 30 through the fastener 80.

[0090] In step S804, after the welding auxiliary tooling 200 is disassembled, since the power tube 50 has been fixed on the circuit board 20, the substrate 53 disposed on the power tube 50 is not easily displaced under the elastic force of the elastic member 72. After the circuit board 20, the clamping structure 70 and the cooling plate 30 are connected and fixed, the elastic force of the elastic member 72 to restore the elastic deformation will push the power tube 50 and the substrate 53 toward the heat conducting member 40 to a certain extent, so that the heat conducting member 40 fully fills the gap between the substrate 53 and the cooling plate 30, which is conducive to improving the heat dissipation capacity of the power tube 50.

[0091] In summary, in the power module 100 of the present application, the heat generated by the power tube 50 is conducted to the cooling plate 30 through the heat conductive member 40 to achieve heat dissipation, and the heat conduction path is short, which is conducive to improving the heat dissipation efficiency. The method of increasing the pressure on the heat conductive member 40 through the elastic member 72 in the clamping structure 70 is highly reliable, which is conducive to improving the reliability of the connection between the power tube 50 and the heat conductive member 40, thereby facilitating the heat dissipation capacity of the power tube 50. The clamping structure 70 as a whole integrates the positioning of the power tube 50, provides the force for the power tube 50 to fit the cooling plate 30, and insulates the internal metal elastic member 72 and the peripheral circuit or the power tube 50, which simplifies the assembly process of the power module 100 and helps reduce costs. In addition, in the power module 100 of the present application, the power tube 50 is welded and positioned by means of a welding auxiliary tooling 200, so that the distance between the side of each substrate 53 facing the cooling plate 30 and the side of the circuit board 20 facing the cooling plate 30 is within a preset range, thereby ensuring that the height tolerance of the power tube 50 after welding is within the required range, reducing the stress problem of the pin 52 of the power tube 50, thereby reducing the process of post-welding or secondary wave soldering, and saving manufacturing costs.

[0092] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0093] The first, second and various numerical numbers involved in this document are only distinguished for the convenience of description and are not intended to limit the scope of the present application.

[0094] It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0095] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A power module, characterized in that: It includes a circuit board, a power tube, a heat conducting member, a cooling plate and a pressing structure, wherein the cooling plate, the heat conducting member, the pressing structure and the circuit board are stacked in sequence; wherein, The power tube includes a body and pins, wherein the pins are exposed from the body, the body is located between the heat conductive member and the clamping structure, the pins pass through the clamping structure and are connected to the circuit board, and the clamping structure is used to clamp the body and the heat conductive member.

2. The power module according to claim 1, characterized in that: The power module further comprises a fastener, one end of which is located on a side of the circuit board away from the cooling plate, and the other end of the fastener passes through the circuit board and the clamping structure and is fixedly connected to the cooling plate.

3. The power module according to claim 2, characterized in that: The clamping structure includes a shell and an elastic member, the elastic member is accommodated in the shell, the shell is provided with a positioning hole, at least part of the body extends into the shell through the positioning hole, the elastic member elastically abuts against the body, and the elastic member is used to apply an elastic force to the body toward one side of the cooling plate.

4. The power module according to claim 3, characterized in that: The pressing structure further includes an insulating member, which is accommodated in the shell and disposed between the elastic member and the body. The elastic member is in elastic contact with the body through the insulating member.

5. The power module according to claim 4, characterized in that: The insulating member comprises a bottom wall and a side wall connected to each other. The bottom wall and the side wall together form a receiving space, and the receiving space is used to receive the elastic member.

6. The power module according to claim 5, characterized in that: The shell includes a top shell and a bottom shell, the top shell is connected to the bottom shell, the elastic member and the insulating member are both arranged between the top shell and the bottom shell, and the fastener passes through the circuit board, the top shell, the elastic member, the insulating member and the bottom shell in sequence and is connected and fixed to the cooling plate.

7. The power module according to claim 3, characterized in that: The elastic member comprises an elastic portion and a bending portion which are connected to each other. The bending portions are connected to both opposite ends of the elastic portion. The elastic portion is in elastic contact with the body, and the bending portion protrudes relative to the elastic portion.

8. The power module according to claim 1, characterized in that: The power tube further comprises a substrate, which is arranged between the body and the heat conductive member, wherein a side of the substrate facing away from the cooling plate is fixedly connected to the body, and a side of the substrate facing the cooling plate is in contact with the heat conductive member.

9. The power module according to claim 8, characterized in that: There are multiple power tubes, which are arranged at intervals on the surface of the clamping structure away from the circuit board. Each of the bodies is connected to a corresponding substrate, and the distance between a side of each substrate facing the cooling plate and a side of the circuit board facing the cooling plate is within a preset range.

10. The power module according to claim 2, characterized in that: In a direction perpendicular to the arrangement direction of the cooling plate and the circuit board, there is a distance between the fastener and the power tube.

11. A charging device, characterized in that: It comprises a power module as described in any one of claims 1 to 10 and a charging gun connected to the power module, wherein the power module is used to perform power conversion on the electric energy input to its input end and output the power to the charging gun.

Images