Semiconductor water-cooling refrigeration air assembly

Abstract

The utility model discloses a semiconductor water-cooling refrigeration air assembly which comprises an upper shell and a lower shell which are both provided with an air inlet and an air outlet, the upper shell and the lower shell are correspondingly provided with a first air channel and a second air channel, a water bag is arranged between the upper shell and the lower shell, and the water bag covers the first air channel and the second air channel. The water inlet end and the water outlet end of the water bag are connected with external cold heads respectively, the cold heads are attached to the cold face of the semiconductor chilling plate, the semiconductor chilling plate is adopted to refrigerate the water bag, due to the fact that the specific heat capacity of water is large, the refrigerating capacity of a semiconductor can be fully stored through the water, and the refrigerating capacity of the semiconductor can be fully stored. In addition, in the air suction and air blowing process, only by means of circulation of air flow in the closed space, air does not need to be sucked from the outside for supplement, a miniature air conditioner is formed, and the refrigeration effect is further improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of refrigeration devices, in particular to a semiconductor water-cooled refrigeration wind component. Background Art

[0002] Semiconductor refrigeration chips are widely used in small refrigeration products such as wine refrigerators, hot and cold dual-purpose boxes for automobiles, and electronic ice cream machines due to their small size, compact structure, and convenient refrigeration capacity control. In addition, there are corresponding air cooling systems based on semiconductor refrigeration chip technology, such as the Chinese public patent document "CN105444462B, semiconductor refrigeration system". Based on this technical solution, the semiconductor refrigeration system mainly studies the distance D set within the following range: (LF-LT) / 2≤D≤(LF / 2+LT / 5), where LF>LT, which can significantly improve the equivalent heat exchange performance of the semiconductor refrigeration system, thereby effectively increasing the cooling capacity;

[0003] Based on the above theory, although the heat exchange effect of semiconductor refrigeration plates can be improved, the effect of the air cooling system does not only rely on the energy conversion effect. It also requires a reasonable air duct design and reduced energy heat dissipation to further improve the cooling effect. Utility Model Content

[0004] The purpose of the utility model is to provide a semiconductor water-cooled refrigeration wind component to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A semiconductor water-cooled refrigeration wind component includes an upper shell and a lower shell both having an air inlet and an air outlet, the upper shell and the lower shell are respectively provided with air duct one and air duct two, a water bag is provided between the upper shell and the lower shell, the water bag covers air duct one and air duct two, fans are provided at the air outlet ends of air duct one and air duct two, the water inlet end and the water outlet end of the water bag are respectively connected to an external cold head, and the cold head is in contact with the cold surface of the semiconductor refrigeration plate.

[0007] According to a further technical solution, the air duct one and the air duct two have the same layout, both of which are in an "S" shape or a combination of multiple "S"-shaped connections.

[0008] According to a further technical solution, the air outlet ends of the upper shell and the lower shell are provided with air bins, the fan is installed in the air bins, the air bins are provided with air outlets and air inlets, and the air inlet end of the fan is sealed and connected to the air inlet.

[0009] According to a further technical solution, the maximum air flow rate of the air outlet is less than the maximum air flow output rate of the fan.

[0010] According to a further technical solution, a notch is provided in the air bin to connect the air bin with the first air duct and the second air duct.

[0011] According to a further technical solution, the upper shell, the lower shell and the water bag are flat, and the air duct one and the air duct two each have a plurality of air outlet ends thereof being connected to the air bin.

[0012] Beneficial effects of the utility model:

[0013] The utility model adopts semiconductor refrigeration sheet to cool the water bag. Since the specific heat capacity of water is large, water can fully store the cooling capacity of semiconductor, and reduce the waste in energy exchange, so that the temperature of water is lowered. In addition, in the process of air suction and blowing, it only relies on the circulation of air flow inside the closed space, and does not need to inhale air from the outside to supplement, forming a miniature air conditioner, which further improves the cooling effect.

[0014] In addition, the fan displacement and temperature can be controlled by controlling the fan speed.

[0015] Other features and advantages of the present invention will be described in detail in the subsequent specific implementation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 : The overall structure diagram of the utility model.

[0017] Figure 2 : Structural diagram of the upper shell, water bag and lower shell of the utility model.

[0018] Figure 3 : Disassembly diagram of the upper shell, water bag and lower shell of the utility model.

[0019] Figure 4 : A schematic diagram of the connection of the various components of the utility model.

[0020] Figure 5 : Schematic diagram of airflow of the utility model.

[0021] Figure numerals: 11 -upper shell, 12 -air duct one, 21 -lower shell, 22 -air duct two, 31 -water bag, 4 -fan, 5 -cold head, 6 -semiconductor refrigeration plate, 71 -air chamber, 72 -air outlet, 73 -gap. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0023] Please refer to Figure 1-5 ;

[0024] The refrigeration assembly described in the utility model aims to improve the refrigeration effect and realize the adjustability of the cold air temperature and air volume, and specifically includes an upper shell 11 and a lower shell 21 that are both mounted together, and the upper shell 11 and the lower shell 21 are respectively provided with an air duct 12 and an air duct 22, wherein the air duct 12 and the air duct 22 can adopt the same design or different designs, which is not limited here, but the two side surfaces of the water bag 31 arranged between the upper shell 11 and the lower shell 21 are respectively covered by the air duct 12 and the air duct 22; it should be noted that when the upper shell 11 and the lower shell 21 are separated, the air duct 12 and the air duct 22 are respectively a groove, and after the upper shell 11 and the lower shell 21 and the water bag 31 are assembled together, the two sides of the water bag 31 cover the air duct 12 One side of the air duct 1 12 and the air duct 2 22 is closed to form an air duct with an air outlet end and an air inlet end respectively. The air outlet ends of the air duct 1 12 and the air duct 2 22 are provided with fans 4, which of course correspond to the air inlet end of the fan 4; the water inlet end and the water outlet end of the water bag 31 are respectively connected to the external cold head 5, and the cold head 5 is in contact with the cold surface of the semiconductor refrigeration plate 6. In this embodiment, a water pump should be provided, wherein the water pump can be independent or integrated in the cold head 5, such as the cold head with a pump used in the water cooling system of the computer system. If the water pump is independent, its output end or input end is connected to the input end or output end of the water bag 31, and the other end is connected to the cold head 5. The use of a water pump to provide circulation power is a common technical means and will not be described in detail here.

[0025] When working, the semiconductor refrigeration sheet 6 and the fan 4 work simultaneously. In this process, the semiconductor refrigeration sheet 6 reduces the temperature of the liquid through the cold head 5, and then flows back into the water bag 31, so that the overall temperature of the water bag 31 decreases, and the circulation refrigeration is performed in this way. Preferably, the liquid temperature of the water bag 31 is below 10°C;

[0026] When the fan 4 is started, the airflow enters from the air inlet ends of the air duct 1 12 and the air duct 2 22 respectively, and then enters the fan 4 from the air outlet end and is blown out. In this process, the airflow passing through the air duct 1 12 and the air duct 2 22 will contact the side of the water bag 31. The longer the distance between the air duct 1 12 and the air duct 2 22, the longer the airflow passes through, and the longer the contact time with the water bag 31. At this time, the temperature of the water bag 31 is relatively low, and the water bag 31 absorbs heat in the airflow to reduce the temperature, and finally blows out a low-temperature airflow from the fan 4.

[0027] In actual application, the upper shell 11, the water bag 31 and the lower shell 21 are assembled and placed in a closed space, and then started according to the above principle. At this time, the air entering from the air inlet end is in the closed space, and the airflow blown out after cooling will enter the closed space here, that is, the airflow circulation in the closed space is realized to form a miniature air conditioner. It should be noted that the volume of the closed space is small here, and the water bag 31 is used as a medium for absorbing the heat of the airflow to enable the airflow to fully contact and reduce the temperature of the airflow as much as possible. At the same time, the liquid in the water bag 31 has a large specific heat capacity and can absorb more heat. The semiconductor refrigeration sheet 6 is sufficient to cool it and ensure the cooling effect of the liquid.

[0028] In addition, such an air duct design is adopted, so that part of the exhaust gas of the fan outlet is discharged from the outlet, and part is discharged into the air duct, so as to achieve a higher heat exchange efficiency. At the same time, the fan exhaust volume and temperature can be controlled by controlling the fan speed. The utility model utilizes the cooling capacity of the water storage semiconductor and conducts it to the sheet water bag. Through the setting of the air duct and the air outlet, the temperature and flow of the cold air can be adjusted.

[0029] Furthermore, an external controller may be provided, the controller being connected to the fan, and the wind speed may be adjusted by setting a plurality of gears, thereby ultimately adjusting the air volume.

[0030] In the utility model, a semiconductor refrigeration sheet 6 is used to cool the water bag 31, and then the water bag 31 is fully in contact with the airflow to absorb its heat, so that its temperature drops and the refrigeration effect is improved. In the process of inhaling and blowing air, it only relies on the circulation of the airflow inside the closed space, and there is no need to inhale air from the outside to supplement it, forming a miniature air conditioner, which further improves the refrigeration effect.

[0031] In addition, it should also include a heat dissipation module and a power supply, wherein the heat dissipation module is used to dissipate heat from the hot surface of the semiconductor refrigeration plate to avoid affecting the cooling effect. In one embodiment of the heat dissipation module, it includes another cold head connected to the hot surface of the semiconductor refrigeration plate, the cold head is connected to another water bag, and a heat dissipation component is connected between the water and the cold head. The cold head transfers heat to the liquid, and the liquid first flows into the heat dissipation component for cooling, then flows back to the water bag for storage, and then flows into the cold head to absorb heat.

[0032] The utility model further describes the air duct 1 12 and the air duct 2 22, wherein the air duct 1 12 and the air duct 2 22 have the same layout, both of which are "S"-shaped or a combination of multiple "S"-shaped connections. The multiple "S" design is that one end of the first channel is connected to one end of the second channel. Through such a winding design, the time for the air flow to pass through the air duct can be lengthened, that is, the time of contact with the water bag 31 is increased, which is conducive to further reducing the temperature.

[0033] In the embodiment of the utility model, an air bin 71 is provided at the air outlet end of the upper shell 11 and the lower shell 21. The air bin 71 provides an installation position for the fan 4, and at the same time, the air flow can be gathered in the air bin 71 and then blown out from the air outlet 72 of the air bin 71, thereby improving the air tightness. In addition, the air bin is also provided with an air inlet, and the air inlet end of the fan is sealed and connected to the air inlet to ensure the heat exchange effect.

[0034] Further expanding, the air outlet 72 of the air bin 71 is smaller, so that the maximum air flow rate of the air outlet 72 is smaller than the maximum air flow output rate of the fan 4. This can increase the air pressure inside the air bin 71, thereby speeding up the air flow rate blown out of the air outlet 72.

[0035] In addition, the air bin 71 is provided with a gap 73 to connect the air bin 71 with the air duct. The air outlet 72 of the air bin 71 is relatively small, which will cause the air pressure inside the air bin 71 to increase. Therefore, the air bin 71 is provided with a gap 73 to connect the air bin 71 with the air duct. Part of the air flow can flow back to the air duct 1 12 and the air duct 2 22 through the gap 73 for circulation, ensuring that the air flow in the heat exchange air duct repeatedly circulates at a higher speed, thereby improving the heat exchange efficiency, while ensuring the air intake of the fan, and then ensuring the air flow rate at the air outlet.

[0036] The upper shell 11, the lower shell 21 and the water bag 31 are flat, and the air duct 1 12 and the air duct 2 22 have a plurality of strips, that is, they have two air inlet ends and an air outlet end. The air outlet ends of the two are connected to the air bin 71, which can increase the air volume and fully contact the water bag 31 to maximize the cooling effect.

[0037] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0038] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor water-cooled refrigeration wind assembly, characterized in that: The invention comprises an upper shell (11) and a lower shell (21), each of which has an air inlet and an air outlet (72); the upper shell (11) and the lower shell (21) are respectively provided with an air duct one (12) and an air duct two (22); a water bag (31) is provided between the upper shell (11) and the lower shell (21); the water bag (31) covers the air duct one (12) and the air duct two (22); a fan (4) is provided at the air outlet end of the air duct one (12) and the air duct two (22); the water inlet end and the water outlet end of the water bag (31) are respectively connected to an external cold head (5); the cold head (5) is in contact with the cold surface of a semiconductor refrigeration plate (6).

2. A semiconductor water-cooled refrigeration wind assembly according to claim 1, characterized in that: The air outlet ends of the upper shell (11) and the lower shell (21) are provided with air bins (71), the fan (4) is installed in the air bin (71), the air bin (71) is provided with an air outlet (72) and an air inlet, and the air inlet end of the fan is sealed and connected to the air inlet.

3. A semiconductor water-cooled refrigeration wind assembly according to claim 2, characterized in that: The maximum air flow rate of the air outlet (72) is less than the maximum air flow output rate of the fan (4), and the air bin (71) is provided with a notch (73) so that the air bin (71) is connected with the air duct one (12) and the air duct two (22).

4. A semiconductor water-cooled refrigeration wind assembly according to claim 1, characterized in that: The air duct one (12) and the air duct two (22) have the same layout, both of which are in an "S" shape or a combination of multiple "S" shapes.

5. A semiconductor water-cooled refrigeration wind assembly according to any one of claims 2 to 4, characterized in that: The upper shell (11), the lower shell (21) and the water bag (31) are flat, and the air duct one (12) and the air duct two (22) each have a plurality of air outlets, and the air outlet ends of the two are connected to the air bin (71).

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