HAST testing device and equipment for BGA (Ball Grid Array) packaged chip

Abstract

The utility model relates to a HAST test device and equipment for a BGA (Ball Grid Array) packaged chip. The HAST test device for the BGA packaging chip comprises a test board, a test board and a control module, wherein the test board comprises one or more test positions which are arranged in an array; each test position comprises a signal connection position with the number of pins; the signal connection position is configured to be electrically connected with a power supply port or a grounding port; the number of the pins is the number of the pins of the BGA packaging chip to be tested; one or more test seats, wherein each test seat is used for placing one BGA packaging chip to be tested; the first end of each telescopic test pin is electrically connected with one signal connection position, and when the BGA packaging chip HAST test device is used for testing, the other end of each telescopic test pin is electrically connected with one pin of the to-be-tested BGA packaging chip, and the telescopic test pins are pressed to contract; and the other end of the telescopic test pin comprises an inner concave end part so as to be matched with the pin shape of the BGA packaging chip to be tested. The embodiment of the utility model has the advantages of high test reliability and high test precision.

Description

Technical Field

[0001] The present application relates to the field of hardware testing technology, and in particular to a BGA packaged chip HAST testing device and equipment. Background Art

[0002] In order to ensure the quality of the chip before it leaves the factory, reliability testing is generally required before the chip leaves the factory. The reliability testing required after chip packaging is mainly divided into packaging reliability and product reliability, and high temperature and high humidity bias testing (HAST) is an important test item in packaging reliability testing. Since the HAST test requires the chip to work under high temperature, high humidity and bias conditions for reliability testing, the conditions are relatively harsh, so a HAST test device matching the chip is required.

[0003] Most of the current HAST test devices are designed for dual in-line packaged chips, and cannot be applied to ball grid array (BGA) packaged chips. For example, if the BGA packaged chip is a system-on-chip (SoC), it has a huge number of pins, even hundreds or thousands of pins, and a large number of voltage groups, while the voltage groups and pin numbers of dual in-line packaged chips are smaller. Therefore, the HAST test device designed for dual in-line packaged chips cannot be simply transferred and inspired to BGA packaged chips, and there is a great design difficulty.

[0004] Therefore, it is crucial that the HAST test device can be applied to BGA packaged chips. Utility Model Content

[0005] In view of this, the embodiments of the present application provide a BGA packaged chip HAST testing device and equipment to solve at least one problem existing in the background technology.

[0006] In a first aspect, an embodiment of the present application provides a BGA packaged chip HAST test device, the BGA packaged chip HAST test device comprising:

[0007] A test board, comprising one or more test positions arranged in an array; each of the test positions comprises a signal connection position of a pin number; the signal connection position is configured to be electrically connected to a power port or a ground port; the pin number is the pin number of the BGA packaged chip to be tested;

[0008] One or more test sockets, each of which is used to place a BGA packaged chip to be tested; and

[0009] A telescopic test needle having a plurality of pins, wherein a first end of each of the telescopic test needles is electrically connected to a signal connection position, and when the BGA packaged chip HAST test device is testing, the other end is electrically connected to a pin of the BGA packaged chip to be tested and the telescopic test needle is compressed and contracted; the other end of the telescopic test needle includes a concave end portion to match the pin shape of the BGA packaged chip to be tested.

[0010] In combination with the first aspect, in an optional implementation manner, the power port includes at least one of a first power port, a second power port, a third power port, a fourth power port, a fifth power port, and a sixth power port;

[0011] The first power port is configured to input a 0.75V power supply voltage signal;

[0012] The second power port is configured to input a 1.1V power supply voltage signal;

[0013] The third power port is configured to input a 1.5V power supply voltage signal;

[0014] The fourth power port is configured to input a 2.5V power supply voltage signal;

[0015] The fifth power port is configured to input a 3.3V power supply voltage signal;

[0016] The sixth power port is configured to input a 5V power supply voltage signal.

[0017] In combination with the first aspect, in an optional implementation manner, the BGA packaged chip HAST testing device further includes one or more filter circuits;

[0018] Each of the filter circuits is electrically connected between any power port and the ground port.

[0019] In combination with the first aspect, in an optional implementation, the filter circuit includes a filter capacitor.

[0020] In combination with the first aspect, in an optional implementation manner, the BGA packaged chip HAST testing device further includes one or more overcurrent protection circuits;

[0021] Each of the overcurrent protection circuits is connected in series to an electrical circuit connected to any power port.

[0022] In combination with the first aspect, in an optional implementation manner, the test seat includes a base and a movable cover;

[0023] The base is connected to the test plate and its position corresponds to the test position; the movable cover is rotatably connected to the base;

[0024] The movable cover comprises a bump, which is used to press the BGA packaged chip to be tested so that the retractable test needle is compressed and contracted when the BGA packaged chip HAST test device is testing.

[0025] In combination with the first aspect, in an optional implementation, the retractable test needle is a spring probe.

[0026] In combination with the first aspect, in an optional embodiment, the concave end is evenly provided with a plurality of inverted triangular grooves intersecting on the axis of the telescopic test needle, so as to form a ridge line at the connection of the plurality of grooves;

[0027] The ridges are used to be electrically connected to the pins of the BGA packaged chip to be tested.

[0028] In combination with the first aspect, in an optional implementation manner, the number of the test bits is 8;

[0029] The number of pins is 441;

[0030] The material of the test plate is thermoplastic resin.

[0031] In a second aspect, an embodiment of the present application provides a BGA packaged chip HAST test device, including a test box and the above-mentioned BGA packaged chip HAST test device;

[0032] The test box is used to provide a test environment for the BGA packaged chip HAST test device;

[0033] The BGA packaged chip HAST testing device is contained in the test box to perform a HAST test.

[0034] The beneficial effects brought about by the technical solution provided in the embodiment of the present application include: by configuring a BGA packaged chip HAST test device including a test board, a test socket and a retractable test needle, it is possible to implement HAST testing on one or multiple BGA packaged chips at the same time, and provide a suitable HAST test device for packaging reliability verification of BGA packaged chips. And by using the retractable test needle to achieve electrical connection between the pins of the BGA packaged chip to be tested and the signal connection position, the reliability is improved, and the HAST test accuracy can be improved. And by including a concave end at the other end of the retractable test needle, the matching degree with the ball pin of the BGA packaged chip to be tested can be improved, further improving the reliability of the electrical connection, and reducing damage to the pins.

[0035] Additional aspects and advantages of the embodiments of the present application will be given in part in the description below and in part will become apparent from the description below or will be learned through the practice of the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0037] Figure 1 This is a structural schematic diagram of a specific example of a HAST testing device for a BGA packaged chip in an embodiment of the present application;

[0038] Figure 2 for Figure 1 A partial enlarged view of the middle A;

[0039] Figure 3 A schematic diagram of a partial three-dimensional structure of a specific example of a BGA packaged chip HAST test device in an embodiment of the present application;

[0040] Figure 4 A cross-sectional schematic diagram of a specific example of a HAST testing device for a BGA packaged chip in an embodiment of the present application;

[0041] Figure 5 This is a structural schematic diagram of a specific example of a test board in an embodiment of the present application;

[0042] Figure 6 A schematic diagram of a three-dimensional structure of a specific example of a test socket in an embodiment of the present application;

[0043] Figure 7 It is a schematic diagram of the three-dimensional structure of a specific example of the retractable test needle in the embodiment of the present application. DETAILED DESCRIPTION

[0044] In order to make the technical solutions and beneficial effects of the embodiments of the present application more obvious and understandable, the following is a clear and complete description by listing specific embodiments. Obviously, the enumerated embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present application. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0045] It should be noted that the terms "first", "second", etc. can be used in this article to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the first element from another element. When describing "first", it does not mean that "second" necessarily exists; and when discussing "second", it does not mean that "first" necessarily exists in this application. The singular forms of "one", "an" and "said / the" may also be intended to include plural forms, unless the context clearly indicates another way. The term "includes" is to determine the existence of the included features, but does not exclude the existence or addition of one or more other features. The term "and / or" includes any and all combinations of the relevant listed items. The term "multiple" means two or more. "Connection" can be a direct connection between two components, or an indirect connection established through other components, or a connection between the two components, or any other possible connection form.

[0046] An embodiment of the present application provides a BGA packaged chip HAST testing device, which can be used in conjunction with a test chamber that can continuously maintain a specified temperature and relative humidity. It can provide electrical connections for BGA packaged chips (such as SoC chips) under specified high temperature, high humidity and bias conditions to achieve HAST testing.

[0047] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the BGA package chip HAST test device includes:

[0048] The test board 10 includes one or more test positions 101 arranged in an array; each test position 101 includes a signal connection position 102 with a pin number N; the signal connection position 102 is configured to be electrically connected to a power port or a ground port; the pin number N is the pin number of the BGA package chip to be tested;

[0049] One or more test sockets 20, each test socket 20 is used to place a BGA packaged chip to be tested; and

[0050] A telescopic test needle 30 with N pins, a first end of each telescopic test needle is electrically connected to a signal connection position 102, and when the BGA packaged chip HAST test device is testing, the other end is electrically connected to a pin of the BGA packaged chip to be tested and the telescopic test needle is compressed and contracted; the other end of the telescopic test needle 30 includes a concave end portion 301 to match the pin shape of the BGA packaged chip to be tested.

[0051] In the embodiment of the present application, one or more test sockets 20 can be fixed on the test board 10, so as to realize flexible testing of BGA packaged chips. For example, multiple BGA packaged chips can be subjected to HAST testing at the same time, or only one BGA packaged chip can be subjected to HAST testing. The test board 10 can realize electrical connection with the test box through the gold fingers arranged thereon.

[0052] The signal connection position can be electrically connected to the power port or the ground port through a detachable connection member. For example, the detachable connection member can be a jumper cap, etc. The detachable connection member can realize the switching of the signal connection position between the electrically connected power port and the electrically connected ground port, thereby improving the test flexibility.

[0053] The telescopic method of the telescopic test needle 30 can be set according to actual needs, for example, it can be elastic telescopic, etc. When elastically telescopic, the telescopic test needle 30 can include an extended state and a contracted state. In the extended state, the telescopic test needle 30 is not under pressure, and the BGA packaged chip HAST test device does not perform a test; in the contracted state, the telescopic test needle 30 is under pressure to contract, and the BGA packaged chip HAST test device performs a test. Each test socket 20 and the test board 10 are electrically connected through the telescopic test needle 30. When performing the HAST test, a variety of power supply voltage signals or ground voltage signals can be provided to the pins of the BGA packaged chip to be tested through the signal connection position electrically connected to the power port or the ground port to achieve pull-up or pull-down of the pins, thereby completing the test. Since the retractable test needle 30 generates elastic restoring force when it is pressurized, the pre-tightening force of the two ends of the retractable test needle 30 in contact with the BGA package chip pin to be tested and the signal connection position 102 is increased, thereby improving the reliability of the electrical connection between the BGA package chip pin to be tested and the signal connection position 102, and further improving the HAST test accuracy.

[0054] The embodiment of the present application is configured with a BGA packaged chip HAST test device including a test board, a test socket and a retractable test needle, which can realize HAST testing of one or multiple BGA packaged chips at the same time, and provides a suitable HAST test device for packaging reliability verification of BGA packaged chips. And the electrical connection between the pins of the BGA packaged chip to be tested and the signal connection position is achieved by retracting the test needle, which improves the reliability and thus can improve the accuracy of the HAST test. And by including a concave end at the other end of the retractable test needle, the matching degree with the ball pin of the BGA packaged chip to be tested can be improved, further improving the reliability of the electrical connection and reducing the damage to the pin.

[0055] In an alternative embodiment, if Figure 5As shown, the power port 103 includes at least one of a first power port PS1, a second power port PS2, a third power port PS3, a fourth power port PS4, a fifth power port PS5, and a sixth power port PS6;

[0056] The first power port PS1 is configured to input a 0.75V power supply voltage signal;

[0057] The second power port PS2 is configured to input a 1.1V power supply voltage signal;

[0058] The third power port PS3 is configured to input a 1.5V power supply voltage signal;

[0059] The fourth power port PS4 is configured to input a 2.5V power supply voltage signal;

[0060] The fifth power port PS5 is configured to input a 3.3V power supply voltage signal;

[0061] The sixth power port PS6 is configured to input a 5V power supply voltage signal.

[0062] In the embodiment of the present application, the first power port PS1, the second power port PS2, the third power port PS3, the fourth power port PS4, the fifth power port PS5 and the sixth power port PS6 can be one or more, and can be set according to actual needs, so as to obtain multiple groups of power groups required by actual needs. Each power port is matched with a ground port 104, and the two can be in a one-to-one correspondence. The test board 10 of the embodiment of the present application is provided with these six power ports, which can meet the HAST test requirements of most SoC chips (such as a specific SoC chip with 441 pins).

[0063] In an optional embodiment, the BGA packaged chip HAST testing device further includes one or more filter circuits;

[0064] Each filter circuit is electrically connected between any power supply port and a ground port.

[0065] In the embodiment of the present application, a filter circuit is electrically connected between each power port (including the above six types of power ports) and its corresponding ground port to filter out interference signals and improve test accuracy.

[0066] In an optional embodiment, the filter circuit includes a filter capacitor. Those skilled in the art should understand that the filter circuit is not limited to using a filter capacitor, and other devices or circuits that can achieve a filtering function are applicable. The filter capacitor can be a plug-in monolithic capacitor, a surface-mount ceramic capacitor, etc.

[0067] In an optional embodiment, the BGA packaged chip HAST testing device further includes one or more overcurrent protection circuits;

[0068] Each overcurrent protection circuit is connected in series to an electrical line connected to any power port.

[0069] In the embodiment of the present application, all or part of all the power ports on the test board can be configured with an overcurrent protection circuit electrically connected thereto, which can be set according to actual needs. The overcurrent protection circuit can cut off the electrical connection when the current in the electrical circuit exceeds a preset threshold, thereby protecting the safe operation of the BGA packaged chip to be tested and improving the safety of the HAST test process.

[0070] In an optional implementation, the overcurrent protection circuit includes a fuse. Those skilled in the art should understand that the overcurrent protection circuit is not limited to using a fuse, and other devices or circuits that can achieve the overcurrent protection function are applicable.

[0071] The BGA package chip HAST test device of the embodiment of the present application may further include a crystal oscillator start-up adjustment circuit connected in parallel to both ends of the crystal oscillator. For example, the crystal oscillator start-up adjustment circuit includes a resistor, which can adjust the impedance matching of the crystal oscillator to overcome the problem of the crystal oscillator not oscillating.

[0072] In an alternative embodiment, if Figure 6 As shown, the test seat includes a base 201 and a movable cover 202;

[0073] The base 201 is connected to the test board and its position corresponds to the test position 101; the movable cover 202 is rotatably connected to the base 201;

[0074] The movable cover 202 includes a bump 203, which is used to press the BGA packaged chip to be tested so that the retractable test needle 30 is compressed and contracted when the BGA packaged chip HAST test device is testing.

[0075] The embodiment of the present application can improve the connection tightness between the chip and the telescopic test needle through the movable cover 202 and the bump 203, further improve the reliability of the electrical connection, and improve the test accuracy. The maximum angle between the movable cover 202 and the base 201 can be 95° to 120°, for example, it can be 100°, so as to improve the stability when the movable cover 202 is fully opened, and also make it easier to install or remove the chip. The material of the bump 203 can be set according to actual needs, for example, it can be an elastic material, etc., to improve the degree of compression.

[0076] In an optional embodiment, the retractable test needle 30 is a spring probe and can be made of a metal with very good high-frequency conductivity.

[0077] In an alternative embodiment, if Figure 7 As shown, the concave end portion 301 is evenly provided with a plurality of inverted triangular grooves 302 intersecting on the axis of the telescopic test needle 30, so as to form an edge line 303 at the connection between two adjacent grooves 302;

[0078] The edge line 303 is used to be electrically connected to the pins of the BGA packaged chip to be tested.

[0079] In the embodiment of the present application, the inverted triangle can be understood as being narrow at the bottom and wide at the top with flat sides. Figure 6 It is shown that the concave end 301 is evenly provided with four grooves 302, which intersect in a "cross" shape. Intersecting on the axis of the telescopic test needle 30 can be understood as the intersection of the lower sides of the multiple inverted triangle grooves 302 is located on the axis, or the geometric center of the overlapping area of ​​the bottom surface of the multiple inverted triangle grooves 302 is located on the axis. Therefore, the pins of the BGA packaged chip to be tested can only contact the ridge line 303, and will not contact the side of the groove 302, which can further reduce the damage to the pins and ensure the reliability of the electrical connection.

[0080] As a specific example, Figure 1 As shown, the number of test bits is 8, namely, a first test bit DUT1, a second test bit DUT2, a third test bit DUT3, a fourth test bit DUT4, a fifth test bit DUT5, a sixth test bit DUT6, a seventh test bit DUT7 and an eighth test bit DUT8;

[0081] The number of pins is 441;

[0082] The material of the test plate 10 is thermoplastic resin.

[0083] In the embodiment of the present application, since the BGA packaged chip HAST testing device needs to be under high temperature, high humidity and bias conditions during the HAST test, for example, the temperature and humidity can be as high as 130°C and 85% RH, the air pressure can reach 230Kpa, and the test time can be a long time such as 96 hours, it is necessary to select a suitable test board 10, for example, a test board material such as thermoplastic resin (polymide) can be used.

[0084] The embodiment of the present application also provides a BGA packaged chip HAST test device, including a test box and the above-mentioned BGA packaged chip HAST test device;

[0085] The test chamber is used to provide a test environment for the BGA package chip HAST test device;

[0086] The BGA packaged chip HAST test device is contained in the test box to perform the HAST test.

[0087] It should be understood that the above embodiments are exemplary and are not intended to include all possible implementations included in the claims. Various modifications and changes may be made on the basis of the above embodiments without departing from the scope of the present disclosure. Similarly, the various technical features of the above embodiments may be arbitrarily combined to form other embodiments of the present application that may not be explicitly described. Therefore, the above embodiments only express several implementations of the present application and do not limit the scope of protection of the patent of this application.

Claims

1. A BGA packaged chip HAST test device, characterized in that: The BGA packaged chip HAST testing device comprises: A test board, comprising one or more test positions arranged in an array; each of the test positions comprises a signal connection position of a pin number; the signal connection position is configured to be electrically connected to a power port or a ground port; the pin number is the pin number of the BGA packaged chip to be tested; One or more test sockets, each of which is used to place a BGA packaged chip to be tested; and A telescopic test needle having a plurality of pins, wherein a first end of each of the telescopic test needles is electrically connected to a signal connection position, and when the BGA packaged chip HAST test device is testing, the other end is electrically connected to a pin of the BGA packaged chip to be tested and the telescopic test needle is compressed and contracted; the other end of the telescopic test needle includes a concave end portion to match the pin shape of the BGA packaged chip to be tested.

2. The BGA packaged chip HAST testing device according to claim 1, characterized in that: The power port includes at least one of a first power port, a second power port, a third power port, a fourth power port, a fifth power port and a sixth power port; The first power port is configured to input a 0.75V power supply voltage signal; The second power port is configured to input a 1.1V power supply voltage signal; The third power port is configured to input a 1.5V power supply voltage signal; The fourth power port is configured to input a 2.5V power supply voltage signal; The fifth power port is configured to input a 3.3V power supply voltage signal; The sixth power port is configured to input a 5V power supply voltage signal.

3. The BGA packaged chip HAST testing device according to claim 2, characterized in that: The BGA packaged chip HAST testing device also includes one or more filter circuits; Each of the filter circuits is electrically connected between any power port and the ground port.

4. The BGA packaged chip HAST testing device according to claim 3, characterized in that: The filter circuit includes a filter capacitor.

5. The BGA packaged chip HAST testing device according to claim 2, characterized in that: The BGA packaged chip HAST testing device also includes one or more overcurrent protection circuits; Each of the overcurrent protection circuits is connected in series to an electrical circuit connected to any power port.

6. The BGA packaged chip HAST testing device according to claim 1, characterized in that: The test seat comprises a base and a movable cover; The base is connected to the test plate and its position corresponds to the test position; the movable cover is rotatably connected to the base; The movable cover comprises a bump, which is used to press the BGA packaged chip to be tested so that the retractable test needle is compressed and contracted when the BGA packaged chip HAST test device is testing.

7. The BGA packaged chip HAST testing device according to claim 1, characterized in that: The retractable test needle is a spring probe.

8. The BGA packaged chip HAST testing device according to claim 1, characterized in that: The concave end is evenly provided with a plurality of inverted triangular grooves intersecting on the axis of the telescopic test needle, so as to form a ridge line at the connection of the plurality of grooves; The ridges are used to be electrically connected to the pins of the BGA packaged chip to be tested.

9. The BGA packaged chip HAST testing device according to any one of claims 1 to 8, characterized in that: The number of test bits is 8; The number of pins is 441; The material of the test plate is thermoplastic resin.

10. A BGA packaged chip HAST test equipment, characterized in that: It comprises a test box and a BGA packaged chip HAST test device as claimed in any one of claims 1 to 9; The test box is used to provide a test environment for the BGA packaged chip HAST test device; The BGA packaged chip HAST testing device is contained in the test box to perform a HAST test.

Images