Heat dissipation device for computer processor

Abstract

The utility model provides a heat dissipation device for a computer processor, and relates to the technical field of processor heat dissipation, the heat dissipation device comprises a first heat dissipation fin, the upper end of the first heat dissipation fin is fixedly connected with an axial flow fan through a bolt, one side of the first heat dissipation fin is integrally provided with a heat conduction pipe, and one end of the heat conduction pipe is fixedly provided with a heat conduction sheet; a water cooling device is fixedly arranged on the periphery of the heat conduction pipe, a dustproof mechanism is arranged at the upper end of the axial flow fan and comprises an air inlet pipe, a frame, an air outlet pipe, a dustproof plate and a guide pipe, the lower end of the air inlet pipe is fixedly connected and communicated with the air inlet end of the axial flow fan, and the frame is arranged on one side of the air inlet pipe. The dustproof mechanism can recycle airflow at the air outlet end of the axial flow fan, and finally the airflow is sprayed out from the nozzle, so that a large amount of dust cannot be adsorbed to the surface of the dustproof plate, dust and blockage are further prevented, and the heat dissipation effect after long-time use is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of processor heat dissipation, in particular to a heat dissipation device for a computer processor. Background Art

[0002] Integrated circuits are widely used in computer components. As we all know, high temperature is the enemy of integrated circuits. High temperature will not only cause unstable system operation and shorten service life, but may even burn some components. The heat that causes high temperature does not come from outside the computer, but from inside the computer, or inside the integrated circuit. The function of the heat sink is to absorb this heat and then dissipate it to the inside or outside of the chassis to ensure that the temperature of computer components is normal. Usually, it is mainly achieved by bonding the heat conductive sheet to the surface of the processor and cooperating with a fan to achieve the heat dissipation effect;

[0003] For example, the patent document with the prior art application number 202223091625.2 provides a heat dissipation device for a computer central processing unit, including a first heat dissipation fan, a heat conductor, a first heat pipe, a heat conductor, a water inlet hose, a water outlet hose and a heat dissipation box, wherein the first heat dissipation fan is connected to the heat conductor through the first heat pipe; the heat conductor includes a lower cover body, an upper cover body and two movable heat conduction mechanisms, the lower cover body and the upper cover body are rotatably connected, the movable heat conduction mechanism includes a second heat pipe and an elastic member, and a recess is provided on the second heat pipe; one of the second heat pipes is connected to the bottom wall of the lower cover body through the elastic member, and the second heat pipe is connected to the heat dissipation box through the water inlet hose; the other second heat pipe is connected to the top wall of the upper cover body through the elastic member, and the second heat pipe is connected to the heat dissipation box through the water outlet hose;

[0004] The above scheme is known through actual use. It is mainly achieved by fitting the heat conductive sheet with the surface of the processor and cooperating with the fan to achieve the purpose of heat dissipation. However, it is found in use that a large amount of dust is easily generated in the fan after long-term use, and it is easily adsorbed to the surface of the fan blade, resulting in a decrease in the heat dissipation level. For this reason, we propose a heat dissipation device for a computer processor based on actual usage conditions to solve the problems encountered above. Utility Model Content

[0005] The main purpose of the utility model is to provide a heat dissipation device for a computer processor, which can effectively solve the problems in the background technology.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] A heat dissipation device for a computer processor comprises a first heat dissipation fin, the upper end of the first heat dissipation fin is fixedly connected to an axial flow fan by means of bolts, a heat conduction pipe is integrally arranged on one side of the first heat dissipation fin and a heat conduction sheet is fixedly arranged on one end of the heat conduction pipe, a water cooling device is fixedly arranged on the periphery of the heat conduction pipe, and a dust prevention mechanism is arranged on the upper end of the axial flow fan.

[0008] The water cooling device comprises a No. 2 heat sink fin, a water tank, a circulating water pump, a No. 1 hose and a No. 2 hose;

[0009] The upper surface of the water tank is fixed with a No. 2 heat sink fin by bolts, and the lower end of the water tank is fixed with a fixing plate by bolts. The upper surface of the No. 2 heat sink fin is fixedly connected to a circulating water pump, the output end of the circulating water pump is fixedly connected to a No. 1 hose, and the input end of the circulating water pump is fixedly connected to a No. 2 hose.

[0010] One end of the No. 1 hose is fixedly connected to one end of the water tank and the two ends are interconnected, and the other end of the water tank is fixedly connected to the No. 2 hose and the two ends are interconnected.

[0011] The dustproof mechanism comprises an air inlet pipe and a frame, an air outlet pipe, a dustproof plate and a duct;

[0012] The lower end of the air inlet pipe is fixedly connected to the air inlet end of the axial flow fan and communicates with each other, and a frame is provided on one side of the air inlet pipe;

[0013] A cavity is provided in the frame and the cavity is communicated with an air outlet pipe, one end of the air outlet pipe is fixedly connected to an output end of the axial flow fan and the two are communicated with each other;

[0014] A dustproof plate is installed in the frame.

[0015] An air collecting box is fixedly arranged at one end of the air outlet pipe, and the air collecting box and the air outlet pipe are communicated with each other, and one side of the air collecting box is integrally connected with the frame and is communicated with each other.

[0016] A sliding groove is provided on the inner wall of the frame, and the inner wall of the sliding groove is tightly pressed against the outer surface of the dustproof plate.

[0017] The inner wall of the frame is integrally connected with a conduit, the conduit is arranged in a conical shape, a connecting pipe is fixedly arranged at one end of the conduit, the connecting pipe is communicated with the frame; a nozzle is fixedly connected to one end of the connecting pipe, one side of the nozzle is tightly pressed against the side of the dustproof plate.

[0018] Compared with the prior art, the utility model has the following beneficial effects:

[0019] A dustproof mechanism is provided at the upper end of the axial flow fan, and a dustproof plate in the dustproof mechanism can effectively prevent dust from entering the interior of the axial flow fan;

[0020] In order to further prevent dust, the dust-proof mechanism will recycle the airflow at the outlet end of the axial fan. The recycled airflow is transported to the cavity inside the frame by the air outlet pipe in the dust-proof mechanism, and finally ejected from the nozzle. The ejected airflow will blow away the dust on the surface of the dust-proof plate, so that the dust will not be adsorbed on the surface of the dust-proof plate in large quantities, thereby further preventing dust and clogging, thereby improving the heat dissipation effect of long-term use;

[0021] At the same time, a second cooling fin is arranged on the outer surface of the water cooling device, which can dissipate the heat of the circulating water pump while also dissipating the heat of the water flow inside the water tank, further increasing the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the overall structure of a heat dissipation device for a computer processor according to the utility model;

[0023] Figure 2 This is a schematic diagram of a dust-proof mechanism of a heat dissipation device for a computer processor according to the utility model;

[0024] Figure 3 This is an enlarged structural schematic diagram of point a of a heat dissipation device for a computer processor of the utility model;

[0025] Figure 4 This is an enlarged structural schematic diagram of point b of a heat dissipation device for a computer processor of the utility model.

[0026] In the figure: 1. Radiating fin No. 1; 2. Heat conducting pipe; 3. Heat conducting sheet; 4. Dust-proof mechanism; 401. Air collecting box; 402. Air inlet pipe; 403. Frame; 404. Air outlet pipe; 405. Dust-proof plate; 406. Conduit; 407. Slide; 408. Connecting pipe; 409. Nozzle; 5. Water tank; 6. Radiating fin No. 2; 7. Circulating water pump; 8. Hose No. 1; 9. Hose No. 2; 10. Axial fan. DETAILED DESCRIPTION

[0027] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Example

[0029] like Figures 1 to 4As shown, a heat dissipation device for a computer processor comprises a first heat dissipation fin 1, the upper end of the first heat dissipation fin 1 is fixedly connected to an axial flow fan 10 by bolts, a heat pipe 2 is integrally arranged on one side of the first heat dissipation fin 1, and a heat conducting plate 3 is fixedly arranged on one end of the heat dissipation fin 2, a water cooling device is fixedly arranged on the periphery of the heat dissipation fin 2, and a dustproof mechanism 4 is arranged on the upper end of the axial flow fan 10. The water cooling device comprises a second heat dissipation fin 6, a water tank 5, a circulating water pump 7, a first hose 8, and a second hose 9; the second heat dissipation fin 6 is fixedly arranged on the upper surface of the water tank 5 by bolts, the upper surface of the second heat dissipation fin 6 is fixedly connected to the circulating water pump 7, the output end of the circulating water pump 7 is fixedly connected to the first hose 8, and the input end of the circulating water pump 7 is fixedly connected to the second hose 9. One end of the first hose 8 is fixedly connected to one end of the water tank 5 and they are connected to each other, and the other end of the water tank 5 is fixedly connected to the second hose 9 and they are connected to each other. The dustproof mechanism 4 includes an air inlet pipe 402, a frame 403, an air outlet pipe 404, a dustproof plate 405, and a guide tube 406; the lower end of the air inlet pipe 402 is fixedly connected to the air inlet end of the axial flow fan 10 and communicates with each other, and a frame 403 is arranged on one side of the air inlet pipe 402; a cavity is arranged in the frame 403 and the cavity is communicated with the air outlet pipe 404, and one end of the air outlet pipe 404 is fixedly connected to the output end of the axial flow fan 10 and communicates with each other; a dustproof plate 405 is installed in the frame 403. An air collecting box 401 is fixedly arranged at one end of the air outlet pipe 404 and the air collecting box 401 and the air outlet pipe 404 are communicated with each other, and one side of the air collecting box 401 is integrally connected with the frame 403 and communicates with each other.

[0030] refer to Figure 1 , in the present application, the lower end of the water tank 5 is fixed with a fixing plate by bolts;

[0031] Through the above solution, the fixing plate is connected to the water tank 5 by bolts, and the fixing plate and the water tank 5 surround the heat pipe 2. The water tank 5 is made of metal steel or aluminum, and cooperates with the second heat dissipation fin 6 for better heat dissipation.

[0032] refer to Figure 2 and Figure 3 In the present application, a slide groove 407 is provided on the inner wall of the frame 403, and the inner wall of the slide groove 407 is pressed against the outer surface of the dustproof plate 405. A conduit 406 is integrally connected to the inner wall of the frame 403, and the conduit 406 is arranged in a conical shape. A connecting pipe 408 is fixedly provided at one end of the conduit 406, and the connecting pipe 408 is connected to the frame 403; a nozzle 409 is fixedly connected to one end of the connecting pipe 408, and one side of the nozzle 409 is pressed against the side of the dustproof plate 405.

[0033] Through the above solution, the conical shape of the duct 406 can accelerate the airflow speed, so that the airflow ejected from the nozzle 409 is accelerated to blow on the surface of the dustproof plate 405. The dustproof plate 405 can be flexibly taken out or installed from the slide slot 407, which increases the convenience of maintenance.

[0034] Working principle of a heat sink for a computer processor:

[0035] First, the first heat sink 1 cooperates with the water cooling device and the heat conducting sheet 3, and the temperature of the processor will eventually be transferred to the first heat sink 1, and the first heat sink 1 will be used to disperse the heat. At the same time, when the axial flow fan 10 is started, the air will be accelerated to the surface of the first heat sink 1, so as to achieve the purpose of rapid heat dissipation;

[0036] A dustproof mechanism 4 is provided at the upper end of the axial flow fan 10, and a dustproof plate 405 in the dustproof mechanism 4 can effectively prevent dust from entering the interior of the axial flow fan 10;

[0037] In order to further prevent dust, the airflow at the outlet end of the axial flow fan 10 is transported to the cavity inside the frame 403 through the air outlet pipe 404 in the dustproof mechanism 4, and finally ejected from the nozzle 409. The ejected airflow will blow up the dust on the surface of the dustproof plate 405, so that the dust will not be adsorbed on the surface of the dustproof plate 405 in large quantities, thereby further preventing dust and clogging, thereby improving the heat dissipation effect of long-term use;

[0038] At the same time, a second heat dissipation fin 6 is arranged on the outer surface of the water cooling device, which can dissipate heat for the circulating water pump 7 as well as the water flow inside the water tank 5, further increasing the heat dissipation effect.

[0039] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made on the basis of the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the protection scope of the present invention.

Claims

1. A heat dissipation device for a computer processor, comprising a first heat dissipation fin (1), the upper end of the first heat dissipation fin (1) being fixedly connected to an axial flow fan (10) by means of bolts, a heat conduction pipe (2) being integrally arranged on one side of the first heat dissipation fin (1) and a heat conduction sheet (3) being fixedly arranged on one end of the heat conduction pipe (2), characterized in that: A water cooling device is fixedly arranged on the periphery of the heat conducting pipe (2), and a dust prevention mechanism (4) is arranged on the upper end of the axial flow fan (10).

2. A heat dissipation device for a computer processor according to claim 1, characterized in that: The water cooling device comprises a No. 2 heat dissipation fin (6), a water tank (5), a circulating water pump (7), a No. 1 hose (8), and a No. 2 hose (9); A No. 2 heat sink fin (6) is fixedly arranged on the upper surface of the water tank (5) by means of bolts, a fixing plate is installed on the lower end of the water tank (5) by means of bolts, the upper surface of the No. 2 heat sink fin (6) is fixedly connected to a circulating water pump (7), the output end of the circulating water pump (7) is fixedly connected to a No. 1 hose (8), and the input end of the circulating water pump (7) is fixedly connected to a No. 2 hose (9).

3. A heat dissipation device for a computer processor according to claim 2, characterized in that: One end of the No. 1 hose (8) is fixedly connected to one end of the water tank (5) and the two are in communication with each other, and the other end of the water tank (5) is fixedly connected to the No. 2 hose (9) and the two are in communication with each other.

4. A heat dissipation device for a computer processor according to claim 1, characterized in that: The dustproof mechanism (4) comprises an air inlet pipe (402), a frame (403), an air outlet pipe (404), a dustproof plate (405) and a guide tube (406); The lower end of the air intake pipe (402) is fixedly connected to the air intake end of the axial flow fan (10) and is in communication with each other, and a frame (403) is provided on one side of the air intake pipe (402); A cavity is provided in the frame (403) and the cavity is in communication with an air outlet pipe (404); one end of the air outlet pipe (404) is fixedly connected to an output end of the axial flow fan (10) and the two are in communication with each other; A dustproof plate (405) is installed inside the frame (403).

5. A heat dissipation device for a computer processor according to claim 4, characterized in that: An air collecting box (401) is fixedly provided at one end of the air outlet pipe (404), and the air collecting box (401) and the air outlet pipe (404) are in communication with each other. One side of the air collecting box (401) is integrally connected to the frame (403) and is in communication with each other.

6. A heat dissipation device for a computer processor according to claim 5, characterized in that: The inner wall of the frame (403) is provided with a slide groove (407), and the inner wall of the slide groove (407) is tightly pressed against the outer surface of the dustproof plate (405).

7. A heat dissipation device for a computer processor according to claim 4, characterized in that: The inner wall of the frame (403) is integrally connected with a conduit (406), the conduit (406) being arranged in a conical shape, a connecting pipe (408) being fixedly arranged at one end of the conduit (406), the connecting pipe (408) being communicated with the frame (403); a nozzle (409) being fixedly connected at one end of the connecting pipe (408), one side of the nozzle (409) being pressed against a side surface of the dustproof plate (405).

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