Surface-mounted inductor

Abstract

The utility model discloses a surface-mounted inductor which comprises a bottom plate and a shell, the bottom plate and the shell define a space for containing a magnetic core and a winding wire, a containing groove is formed in the upper surface of the bottom plate, and the bottom of the magnetic core is mounted in the containing groove in a surface-mounted mode. The winding wire is wound on the peripheral side of the magnetic core; conductive columns are arranged at the two ends of the bottom plate, and the leading-out end of the winding wire is communicated with the conductive columns; a first heat dissipation through hole is formed in the side edge of the containing groove, the first heat dissipation through hole is in a broken line shape, one end of the first heat dissipation through hole abuts against the bottom of the magnetic core, and the other end of the first heat dissipation through hole penetrates through the bottom plate. According to the patch type inductor, the first heat dissipation through holes abutting against the magnetic core are formed, heat generated by the magnetic core is effectively discharged out of the outer side of the bottom plate, the heat dissipation efficiency of the patch type inductor is improved, and long-time stable operation of the patch type inductor is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of inductor heat dissipation, in particular to a chip inductor. Background Art

[0002] Chip inductors are usually mounted on the base plate with the core and winding using insulating glue. During the mounting process, the thermal conductivity of bonding materials such as insulating glue is poor, resulting in the inductor's heat not being dissipated in time during operation. If the core is in a high temperature state for a long time, it will affect the normal performance of the inductor.

[0003] The prior art discloses opening a heat dissipation groove in the bottom plate to improve the heat dissipation performance of the inductor, but the heat dissipation groove is usually unable to directly contact the magnetic core, that is, it is unable to directly conduct heat to the magnetic core. This results in the existing heat dissipation groove having low heat dissipation efficiency and being unable to meet the long-term stable operation requirements of the inductor. Utility Model Content

[0004] In view of this, the present application aims to solve the problems in the related art to at least a certain extent. One of the purposes of the present application is to provide a chip inductor, which effectively discharges the heat generated by the magnetic core to the outside of the base plate by setting a first heat dissipation through-hole abutting against the magnetic core, thereby improving the heat dissipation efficiency of the chip inductor and ensuring its long-term stable operation.

[0005] In order to achieve the above-mentioned purpose, the present application adopts the following technical solution: a chip inductor, comprising a bottom plate and a shell, wherein the bottom plate and the shell enclose a space for accommodating a magnetic core and a winding, the upper surface of the bottom plate is provided with an accommodating groove, and the bottom of the magnetic core is mounted in the accommodating groove; the winding is wound around the outer periphery of the magnetic core; conductive columns are provided at both ends of the bottom plate, and the lead-out ends of the winding are connected to the conductive columns;

[0006] A first heat dissipation through hole is arranged on the side of the accommodating groove. The first heat dissipation through hole is in a fold line shape, and one end of the first heat dissipation through hole abuts against the bottom of the magnetic core, and the other end passes through the bottom plate.

[0007] Furthermore, the first heat dissipation through holes are symmetrically arranged on both sides of the accommodating groove; and the number of first heat dissipation through holes located on one side of the accommodating groove is M and is arranged in parallel, where M is an integer greater than 2.

[0008] Furthermore, the first heat dissipation through hole includes a first inner heat dissipation section, a first middle heat dissipation section and a first outer heat dissipation section, wherein the first inner heat dissipation section is parallel to the first outer heat dissipation section and perpendicular to the first middle heat dissipation section, the first inner heat dissipation section is connected to the accommodating groove, and the first outer heat dissipation section is connected to the environment outside the base plate.

[0009] Further, the first inner heat dissipation section and the first outer heat dissipation section extend along a vertical direction, and the first middle heat dissipation section extends along a horizontal direction.

[0010] Furthermore, there are two conductive pillars, which are symmetrically located on both sides of the accommodating groove, and the accommodating groove is located at an end of the first heat dissipation through hole away from the accommodating groove, and the accommodating groove is located at an edge corner of the bottom plate.

[0011] Furthermore, a wiring channel is provided between one of the first outer heat dissipation segments and the conductive column on the same side, the wiring channel is located inside the base plate, and one end of the wiring channel is connected to the first outer heat dissipation segment, and the other end is connected to the conductive column; the end of the winding is connected to the conductive column through the first heat dissipation through hole where the wiring channel is located and the wiring channel.

[0012] Furthermore, a fastening screw is provided in the wiring channel, the moving direction of the fastening screw is perpendicular to the connection direction of the wiring channel, and the end of the fastening screw is located on the outside of the bottom plate; the fastening screw is used to tighten or loosen the wires in the wiring channel.

[0013] Furthermore, a top heat conducting plate is provided at the top of the magnetic core, and a bottom heat conducting plate is provided at the bottom of the magnetic core; the bottom heat conducting plate is located inside the accommodating groove; and the top heat conducting plate abuts against the top of the shell.

[0014] Furthermore, a plurality of second heat dissipation through holes are arranged on the top of the shell, one end of the second heat dissipation through hole is in contact with the top heat conduction plate, and the other end passes through the shell, and the second heat dissipation through hole is in a fold line shape.

[0015] Furthermore, the second heat dissipation through hole includes a second inner heat dissipation section, a second middle heat dissipation section and a second outer heat dissipation section, wherein the second inner heat dissipation section is parallel to the second outer heat dissipation section and perpendicular to the second middle heat dissipation section, the second inner heat dissipation section is connected to the top heat conduction plate, and the second outer heat dissipation section is connected to the environment outside the shell.

[0016] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art: the chip inductor of the present application includes a base plate and a shell, the base plate and the shell enclose a space for accommodating a magnetic core and a winding, the upper surface of the base plate is provided with a accommodating groove, and the bottom of the magnetic core is mounted in the accommodating groove; the winding is wound around the outer circumference of the magnetic core; conductive columns are provided at both ends of the base plate, and the lead-out ends of the winding are connected to the conductive columns; a first heat dissipation through hole is provided on the side of the accommodating groove, the first heat dissipation through hole is in the shape of a broken line, and one end of the first heat dissipation through hole abuts against the bottom of the magnetic core, and the other end passes through the base plate. In the present application, the first heat dissipation through hole is a zigzag structure that penetrates the bottom plate, and one end of the first heat dissipation through hole is directly in contact with the magnetic core, and the other end is connected to the environment outside the bottom plate. When the magnetic core is working, the heat in the magnetic core can be quickly and effectively conducted to the environment outside the bottom plate. At the same time, the first heat dissipation through hole in the present application is a bent structure. The bent structure ensures that impurities on the outside of the bottom plate are not easy to enter the inside of the bottom plate through the first heat dissipation through hole, and can form a protective barrier for the inductor inside the bottom plate while dissipating heat, thereby achieving shielding and heat dissipation effects, thereby ensuring the long-term stable operation of the chip inductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0019] Attached photos

[0020] Figure 1 It is a cross-sectional schematic diagram of a chip inductor;

[0021] Figure 2 is a top view of the top of the housing;

[0022] Figure 3 This is a bottom view of the bottom of the base plate.

[0023] Reference numerals:

[0024] 11. Bottom plate; 111. First heat dissipation hole; 112. Wiring channel; 113. Fastening screw; 12. Housing; 121. Second heat dissipation hole; 21. Top heat conduction plate; 22. Bottom heat conduction plate; 23. Wire winding; 24. Conductive column. DETAILED DESCRIPTION

[0025] In order to have a clearer understanding of the technical features, purposes and effects of the present application, the specific implementation methods of the present application are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "back", "up", "down", "left", "right", "longitudinal", "horizontal", "vertical", "horizontal", "top", "bottom", "inside", "outside", "head", "tail", etc. are based on the directions or positional relationships shown in the accompanying drawings, are constructed and operated in a specific direction, and are only for the convenience of describing the present technical solution, rather than indicating that the mechanism or element referred to must have a specific direction, and therefore cannot be understood as a limitation to the present application.

[0026] It should also be noted that, unless otherwise clearly specified and limited, the terms such as "installed", "connected", "connected", "fixed", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. When an element is referred to as being "on" or "under" another element, the element can be "directly" or "indirectly" located on the other element, or there may be one or more intermediate elements. The terms "first", "second", "third", etc. are only for the convenience of describing the present technical solution, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", "third", etc. can explicitly or implicitly include one or more of the features. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0027] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application. Example 1

[0028] like Figure 1-Figure 3 As shown, the chip inductor proposed in the present application includes a bottom plate 11 and a shell 12, wherein the bottom plate 11 and the shell 12 enclose a space for accommodating a magnetic core and a winding 23, and an accommodating groove is provided on the upper surface of the bottom plate 11, and the bottom of the magnetic core is mounted in the accommodating groove; the winding 23 is wound around the outer periphery of the magnetic core; conductive posts 24 are provided at both ends of the bottom plate 11, and the lead-out ends of the winding 23 are connected to the conductive posts 24;

[0029] A first heat dissipation through hole 111 is disposed on the side of the accommodating groove. The first heat dissipation through hole 111 is in a fold line shape, and one end of the first heat dissipation through hole 111 abuts against the bottom of the magnetic core, and the other end passes through the bottom plate 11 .

[0030] In the present application, the first heat dissipation through hole 111 is a zigzag structure that penetrates the bottom plate 11, and one end of the first heat dissipation through hole 111 is directly in contact with the magnetic core, and the other end is connected to the environment outside the bottom plate 11. When the magnetic core is working, the heat in the magnetic core can be quickly and effectively conducted to the environment outside the bottom plate 11; at the same time, in the present application, the first heat dissipation through hole 111 is a bent structure, and the bent structure ensures that impurities on the outside of the bottom plate 11 are not easy to enter the inside of the bottom plate 11 through the first heat dissipation through hole 111, and can form a protective barrier for the inductor inside the bottom plate 11 while dissipating heat, thereby achieving shielding and heat dissipation effects, and ensuring the long-term stable operation of the chip inductor. Example 2

[0031] like Figure 1 As shown, the chip inductor proposed in the present application includes a base plate 11 and a shell 12, the base plate 11 and the shell 12 enclose a space for accommodating a magnetic core and a winding 23, the upper surface of the base plate 11 is provided with a accommodating groove, and the bottom of the magnetic core is mounted in the accommodating groove; the winding 23 is wound around the outer periphery of the magnetic core; conductive columns 24 are provided at both ends of the base plate 11, and the lead-out ends of the winding 23 are connected to the conductive columns 24; a first heat dissipation through hole 111 is provided on the side of the accommodating groove, and the first heat dissipation through hole 111 is in the shape of a broken line, and one end of the first heat dissipation through hole 111 is in contact with the bottom of the magnetic core, and the other end passes through the base plate 11.

[0032] In the present application, a top heat conducting plate 21 is disposed at the top of the magnetic core, and a bottom heat conducting plate 22 is disposed at the bottom of the magnetic core; the bottom heat conducting plate 22 is located inside the accommodating groove; and the top heat conducting plate 21 abuts against the top of the housing 12. The bottom heat conducting plate 22 and the top heat conducting plate 21 can be integrally formed with the magnetic core.

[0033] like Figure 1 and Figure 3 As shown, the size and dimension of the receiving groove are adapted to the bottom heat conducting plate 22, and the bottom heat conducting plate 22 is adapted to be installed inside the receiving groove. Since the size of the receiving groove and the bottom heat conducting plate 22 is larger than the first heat dissipation through hole 111, the present application can set a plurality of first heat dissipation through holes 111 to uniformly dissipate heat at various positions of the bottom heat conducting plate 22.

[0034] Specifically, Figure 3 As shown, the first heat dissipation through holes 111 are symmetrically arranged on both sides of the receiving groove; and the first heat dissipation through holes 111 located on one side of the receiving groove are arranged in parallel in M ​​numbers, where M is an integer greater than 2. Figure 3 In the embodiment, the number of heat dissipation through holes located on the same side of the accommodating groove is five.

[0035] The first heat dissipation holes 111 located on both sides of the accommodating groove are symmetrically distributed, and the first heat dissipation holes 111 located on the same side of the accommodating groove are arranged in parallel. The bending structure in the present application can be a bending of any structure. The purpose of the bending is to protect the internal space of the bottom plate 11 while dissipating heat, and to prevent impurities from entering the bottom plate 11 through the linear first heat dissipation holes 111. The more bending degrees and corners of the bending structure, the better the shielding protection effect of the inductor inside the bottom plate 11; however, the complexity of the bending needle will also increase the cost. In practical applications, it is only necessary to ensure that the two ends of the first heat dissipation hole 111 do not overlap in the vertical direction.

[0036] like Figure 1 As shown, specifically, the first heat dissipation hole 111 includes a first inner heat dissipation section, a first middle heat dissipation section and a first outer heat dissipation section, wherein the first inner heat dissipation section is parallel to the first outer heat dissipation section and perpendicular to the first middle heat dissipation section, the first inner heat dissipation section is connected to the accommodating groove, and the first outer heat dissipation section is connected to the outer environment of the base plate 11.

[0037] The first inner heat dissipation section and the first outer heat dissipation section extend in the vertical direction, and the first middle heat dissipation section extends in the horizontal direction. The vertical direction here refers to the direction perpendicular to the plane where the bottom plate 11 is located when the upper surface of the bottom plate 11 faces upward.

[0038] Taking one of the first heat dissipation through holes 111 as an example, the first inner heat dissipation section is located inside the bottom plate 11, one end of which is located on the side of the receiving groove and is connected to the receiving groove, and the other end extends toward the direction close to the lower surface of the bottom plate 11. The first middle heat dissipation section is perpendicular to the first inner heat dissipation section, and one end of the first middle heat dissipation section is connected to the first inner heat dissipation section, and the other end is connected to the first outer heat dissipation section, and the first outer heat dissipation section continues to extend toward the direction close to the lower surface of the bottom plate 11. The bent first heat dissipation through hole 111 is formed by three sections of bending, so that the two ends of the first heat dissipation through hole 111 are staggered in the vertical direction, so as to realize the connection between the receiving groove and the external environment of the bottom plate 11, and at the same time, it can also play a shielding and protective role for the internal space of the bottom plate 11.

[0039] like Figure 1 and Figure 3 As shown, there are two conductive pillars 24 symmetrically located on both sides of the accommodating groove, and the accommodating groove is located at one end of the first heat dissipation through hole 111 away from the accommodating groove, and the accommodating groove is located at the edge corner of the bottom plate 11.

[0040] The conductive column 24 is located at the edge corner of the bottom plate 11, which is conducive to the connection between the conductive column 24 and the external wiring. At the same time, since there is a certain distance between the conductive column 24 and the winding 23, the present application can use one of the first heat dissipation through holes 111 to achieve the connection between the conductive column 24 and the end of the winding 23.

[0041] Specifically, a wiring channel 112 is provided between one of the first outer heat dissipation segments and the conductive column 24 on the same side, the wiring channel 112 is located inside the base plate 11, and one end of the wiring channel 112 is connected to the first outer heat dissipation segment, and the other end is connected to the conductive column 24; the end of the winding 23 is connected to the conductive column 24 through the first heat dissipation through hole 111 where the wiring channel 112 is located and the wiring channel 112.

[0042] An extra wire can be set at the end of the winding 23, or a wire other than the winding 23 can be used to pass the wire through the first inner heat dissipation section, the first middle heat dissipation section, part of the first outer heat dissipation section and the wiring channel 112 until it is connected to the position of the conductive column 24. It should be noted that the inner diameter of the first heat dissipation through hole 111 and the wiring channel 112 in the present application is much larger than the outer diameter of the wire. When installing the wire, the conductive column 24 can be removed from the bottom plate 11 first, and then the conductive column 24 can be installed after the wire is installed. It is also possible to install the wire in the above-mentioned channel at one time, and detachably connect the end of the wire to the end of the winding 23, and detachably connect the end of the wire to the conductive column 24, so as to avoid the need to reinstall the wire every time.

[0043] like Figure 3 As shown, one of the heat dissipation through holes that overlaps with the conductive column 24 in the horizontal direction can be selected as a wiring through hole for the wire.

[0044] In order to ensure good contact between the wire and the conductive column 24, a fastening screw 113 is provided in the wiring channel 112 of the present application. The moving direction of the fastening screw 113 is perpendicular to the connection direction of the wiring channel 112, and the end of the fastening screw 113 is located on the outside of the base plate 11; the fastening screw 113 is used to tighten or loosen the wire in the wiring channel 112.

[0045] When the fastening screw 113 is tightened, that is, the fastening screw 113 moves toward the direction close to the wire in the wiring through hole until the wire is fixed in the wiring through hole, this can prevent the wire from shaking inside the wiring through hole and affect the electrical connection between the wire and the conductive column 24.

[0046] When the fastening screw 113 is loosened, that is, the fastening screw 113 moves in a direction away from the wire in the wiring through hole, the wire can move freely, and the wire can be replaced, and the coil and the conductive column 24 can be disassembled.

[0047] One end of the fastening screw 113 is located on the outside of the bottom plate 11 , and specifically may be located at the bottom of the bottom plate 11 , or may be located at a side edge of the bottom plate 11 .

[0048] When the magnetic core is installed inside the shell 12 and the base plate 11, the top heat conducting plate 21 abuts against the top of the shell 12. In order to achieve efficient heat conduction of the magnetic core, the present application provides a plurality of second heat dissipation holes 121 on the top of the shell 12. One end of the second heat dissipation hole 121 abuts against the top heat conducting plate 21, and the other end passes through the shell 12. The second heat dissipation hole 121 is in the shape of a broken line.

[0049] Specifically, the second heat dissipation hole 121 includes a second inner heat dissipation section, a second middle heat dissipation section and a second outer heat dissipation section, wherein the second inner heat dissipation section is parallel to the second outer heat dissipation section and perpendicular to the second middle heat dissipation section, the second inner heat dissipation section is connected to the top heat conduction plate 21, and the second outer heat dissipation section is connected to the outer environment of the outer shell 12.

[0050] like Figure 2 As shown, the structure and distribution position of the second heat dissipation through hole 121 are similar to those of the first heat dissipation through hole 111, and the second heat dissipation through holes 121 are symmetrically arranged on both sides of the accommodating groove; and the second heat dissipation through holes 121 on one side of the top heat conducting plate 21 are arranged in parallel in N numbers, where N is an integer greater than 2. Figure 2 In the embodiment, the number of heat dissipation through holes located on the same side of the top heat conducting plate 21 is five.

[0051] The second heat dissipation holes 121 located on both sides of the top heat conducting plate 21 are symmetrically distributed, and the second heat dissipation holes 121 located on the same side of the top heat conducting plate 21 are arranged in parallel. The bending structure in the present application can be a bending of any structure, and the purpose of the bending is to protect the internal space of the shell 12 while dissipating heat, and prevent impurities from entering the inside of the shell 12 through the straight second heat dissipation holes 121. The more bending degrees and corners of the bending structure, the better the shielding protection effect of the inductor inside the shell 12; however, the complexity of the bending needle will also increase the cost. In practical applications, it is only necessary to ensure that the two ends of the second heat dissipation hole 121 do not overlap in the vertical direction.

[0052] like Figure 1 As shown, specifically, the second heat dissipation hole 121 includes a second inner heat dissipation section, a second middle heat dissipation section and a second outer heat dissipation section, wherein the second inner heat dissipation section is parallel to the second outer heat dissipation section and perpendicular to the second middle heat dissipation section, the second inner heat dissipation section is abutted against the top heat conduction plate 21, and the second outer heat dissipation section is connected to the outer environment of the outer shell 12.

[0053] The second inner heat dissipation section and the second outer heat dissipation section extend in a vertical direction, and the second middle heat dissipation section extends in a horizontal direction.

[0054] In the present application, the first heat dissipation through hole 111 needs to be arranged on the side of the accommodating groove, and the second heat dissipation through hole 121 can be directly arranged at a position abutting against the top heat conducting plate 21. In practical applications, the second heat dissipation through hole 121 can be a symmetrically distributed two-side structure, or a ring structure, a matrix structure, etc., as long as it can achieve heat dissipation of the top heat conducting plate 21.

[0055] It can be understood that the above embodiments only express the preferred implementation methods of the present application, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present application; it should be pointed out that for ordinary technicians in this field, without departing from the concept of the present application, the above-mentioned technical features can be freely combined, and several deformations and improvements can be made, which all belong to the protection scope of the present application; therefore, all equivalent changes and modifications made to the scope of the claims of the present application should belong to the scope covered by the claims of the present application.

Claims

1. A chip inductor, characterized in that: The device comprises a bottom plate and a shell, wherein the bottom plate and the shell enclose a space for accommodating a magnetic core and a winding wire, wherein an accommodating groove is provided on the upper surface of the bottom plate, and the bottom of the magnetic core is mounted in the accommodating groove; the winding wire is wound around the outer periphery of the magnetic core; conductive posts are provided at both ends of the bottom plate, and the lead-out ends of the winding wire are connected to the conductive posts; A first heat dissipation through hole is arranged on the side of the accommodating groove. The first heat dissipation through hole is in a fold line shape, and one end of the first heat dissipation through hole abuts against the bottom of the magnetic core, and the other end passes through the bottom plate.

2. A chip inductor according to claim 1, characterized in that: The first heat dissipation through holes are symmetrically arranged on both sides of the accommodating groove; and M first heat dissipation through holes located on one side of the accommodating groove are arranged in parallel, where M is an integer greater than 2.

3. A chip inductor according to claim 2, characterized in that: The first heat dissipation through hole includes a first inner heat dissipation section, a first middle heat dissipation section and a first outer heat dissipation section, wherein the first inner heat dissipation section is parallel to the first outer heat dissipation section and perpendicular to the first middle heat dissipation section, the first inner heat dissipation section is connected to the accommodating groove, and the first outer heat dissipation section is connected to the environment outside the base plate.

4. A chip inductor according to claim 3, characterized in that: The first inner heat dissipation section and the first outer heat dissipation section extend along a vertical direction, and the first middle heat dissipation section extends along a horizontal direction.

5. The chip inductor according to claim 3, characterized in that: There are two conductive pillars, which are symmetrically located on both sides of the accommodating groove. The accommodating groove is located at an end of the first heat dissipation through hole away from the accommodating groove. The accommodating groove is located at the edge corner of the bottom plate.

6. A chip inductor according to claim 5, characterized in that: A wiring channel is provided between one of the first outer heat dissipation segments and the conductive column on the same side. The wiring channel is located inside the base plate, and one end of the wiring channel is connected to the first outer heat dissipation segment, and the other end is connected to the conductive column; the end of the winding is connected to the conductive column through the first heat dissipation through hole where the wiring channel is located and the wiring channel.

7. A chip inductor according to claim 6, characterized in that: A fastening screw is provided in the wiring channel, the moving direction of the fastening screw is perpendicular to the connection direction of the wiring channel, and the end of the fastening screw is located on the outside of the bottom plate; the fastening screw is used to tighten or loosen the wires in the wiring channel.

8. The chip inductor according to claim 1, characterized in that: A top heat conducting plate is arranged at the top of the magnetic core, and a bottom heat conducting plate is arranged at the bottom of the magnetic core; the bottom heat conducting plate is located inside the accommodating groove; and the top heat conducting plate abuts against the top of the shell.

9. A chip inductor according to claim 8, characterized in that: A plurality of second heat dissipation through holes are arranged on the top of the shell, one end of the second heat dissipation through hole is in contact with the top heat conduction plate, and the other end passes through the shell, and the second heat dissipation through hole is in a fold line shape.

10. A chip inductor according to claim 9, characterized in that: The second heat dissipation through hole includes a second inner heat dissipation segment, a second middle heat dissipation segment and a second outer heat dissipation segment, wherein the second inner heat dissipation segment is parallel to the second outer heat dissipation segment and perpendicular to the second middle heat dissipation segment, the second inner heat dissipation segment is connected to the top heat conduction plate, and the second outer heat dissipation segment is connected to the environment outside the shell.

Images