Wafer film coating equipment

Abstract

The utility model relates to the field of film laminating equipment, in particular to wafer film laminating equipment which comprises a film laminating box, a cover plate, a conveying roller, a film laminating mechanism, a film cutting mechanism and a static electricity removing fan. The cover plate covers the film covering box and is rotationally connected with the film covering box; the conveying roller is mounted in the film covering box and close to the side, connected with the cover plate, of the film covering box, and the two ends of the conveying roller are rotationally connected with the two opposite inner side walls of the film covering box; the film covering mechanism is mounted in the film covering box, and the film covering mechanism is used for placing a wafer and covering the wafer with a film; the film cutting mechanism is mounted in the film laminating box and on the cover plate and is used for cutting a film; the static electricity removing fan is fixedly connected to the outer side wall of the film covering box, and when the cover plate is in an open state, the air outlet direction of the static electricity removing fan is perpendicular to the film covering platform. The thin film material has the effect of improving the problem that the thin film material easily generates static electricity.

Description

Technical Field

[0001] The present application relates to the field of coating equipment, and in particular to a wafer coating equipment. Background Art

[0002] Wafers are silicon chips used to make silicon semiconductor circuits. During the semiconductor manufacturing process, coating and etching processes need to be performed on the surface of the wafer. The original material of the wafer uses relatively fragile silicon, and the wafer is also easily affected by pollution and oxidation. Therefore, a layer of film that plays a protective and isolating role needs to be covered on the surface of the wafer to prevent damage and pollution to the surface of the wafer. According to factors such as the optical and electrical properties of the wafer surface, the film material also needs to be considered in terms of protection performance, transmittance, high temperature resistance and processing performance. Film materials usually use polypropylene, polycarbonate and polytetrafluoroethylene.

[0003] Thin film materials are usually adhered to the wafer by laminating equipment. Contact, separation or friction between the thin film material and the wafer may cause the transfer and accumulation of charge, thereby causing electrostatic effects between the thin film material and the wafer. Especially after heating, the electrostatic effect will be more serious. Utility Model Content

[0004] In order to improve the problem that thin film materials are prone to static electricity, the present application provides a wafer coating device.

[0005] The wafer coating equipment provided in this application adopts the following technical solution:

[0006] A wafer coating device, comprising a coating box, a cover plate, a conveying roller, a coating mechanism, a film cutting mechanism and a static electricity removing fan;

[0007] The cover plate covers the film laminating box and is rotatably connected to the film laminating box;

[0008] The conveying roller is installed in the film laminating box close to the side where the film laminating box is connected to the cover plate, and the two ends of the conveying roller are rotatably connected to the two opposite inner side walls of the film laminating box;

[0009] The laminating mechanism is installed in the laminating box, and the laminating mechanism is used to place wafers and to laminat the wafers;

[0010] The film cutting mechanism is installed in the film laminating box and on the cover plate to cut the film;

[0011] The static electricity removal fan is fixedly connected to the outer side wall of the film coating box. When the cover is in an open state, the air outlet direction of the static electricity removal fan is perpendicular to the film coating platform.

[0012] By adopting the above technical solution, the film laminating mechanism is used to place the wafer and press the film tightly against the surface of the wafer. The cutting mechanism is used to cut the wafer with the film and the redundant part of the film. The film is wound on the conveying roller, and the conveying roller conveys the film to the position of the film laminating mechanism in the film laminating box. The film laminating mechanism, the cutting mechanism, the conveying roller, etc. are all installed in the film laminating box, and the cover plate is covered above the film laminating box, ensuring the feasibility of the overall process of the film laminating operation. The setting of the static eliminator fan can remove the static electricity generated between the film and the wafer, which is beneficial to improving the efficiency of the wafer film laminating operation.

[0013] Optionally, a connecting frame is provided on the static eliminator fan. The connecting frame is fixedly connected to the outer side wall of the film laminating box, and the connecting frame is rotatably connected to the static eliminator fan.

[0014] By adopting the above technical solution, the setting of the connecting frame can fix the static eliminator fan on the outer side wall of the film laminating box. The rotatable connection between the connecting frame and the static eliminator fan enables the air outlet angle of the static eliminator fan to be adjusted, which is beneficial to improving the static elimination effect between the film and the surface of the wafer.

[0015] Optionally, the connecting frame includes a U-shaped frame and an L-shaped plate. The static eliminator fan is rotatably connected to the two opposite inner side walls of the U-shaped frame, and the U-shaped frame is rotatably connected to the side of the L-shaped plate away from the connection with the film laminating box.

[0016] By adopting the above technical solution, the setting of the U-shaped frame is used to fix the static eliminator fan on the one hand and also enables the angle of the static eliminator fan to be adjustable on the other hand. The L-shaped plate is fixedly connected to the film laminating box on the one hand to install the static eliminator fan on the film laminating box, and rotatably connected to the U-shaped frame on the other hand to achieve the effect of angle adjustment.

[0017] Optionally, a lamp holder is provided on the side of the static eliminator fan away from the connection with the connecting frame. A rotating shaft for adjusting the direction of the lamp head is provided on the lamp holder, and the lamp holder is electrically connected to the static eliminator fan.

[0018] By adopting the above technical solution, since the cover plate is made of light-tight material, when the cover plate is in the open state, the indoor light is not sufficient to completely illuminate the inside of the film laminating box, which may affect the operator's inspection of the film laminating situation on the surface of the wafer. The setting of the lamp holder can effectively improve the dim light in the film laminating box.

[0019] Optionally, the number of the lamp holders is two, and the rotating shafts of the two lamp holders are arranged perpendicular to each other.

[0020] By adopting the above technical solution, the lighting lamp heads are arranged in two places in parallel, and the rotation axes of the two lighting lamp heads are arranged perpendicular to each other, so that the lighting ranges of the two lighting lamp heads are not limited.

[0021] Optionally, the laminating mechanism includes a laminating platform and a film pressing roller, the laminating platform is horizontally installed in a laminating box, a placement groove is provided on the laminating platform, a fixing frame for fixing the wafer is provided in the placement groove, the film pressing roller is rotatably connected to two opposite inner walls of the laminating box, the film pressing roller is located between the film pressing platform and the conveying roller and is parallel to the conveying roller.

[0022] By adopting the above technical scheme, the placement groove and the fixed frame are matched to each other, so that the wafer can be placed stably on the film pressing platform, the film pressing roller and the conveying roller are arranged parallel to each other, and the film is conveyed by the conveying roller to between the film pressing roller and the coating platform. The setting of the film pressing roller can press the film tightly against the wafer surface, thereby improving the flatness of the wafer surface coating.

[0023] Optionally, the film cutting mechanism includes a linear cutting head and an annular cutting head, the linear cutting head is fixedly connected to the side of the film laminating box close to the connection with the cover plate, the annular cutting head is provided with a shaft rod and a connecting rod, the shaft rod is passed through the cover plate, the connecting rod is fixedly connected to the end of the shaft rod close to the side of the film laminating box, and the annular cutting head is fixedly connected to one end of the connecting rod and faces the side of the film laminating platform;

[0024] When the cover plate is closed, the annular cutting blade abuts against the edge of the wafer, and the shaft is located on one end of the cover plate away from the coating box and is provided with an operating rod for driving the blade to rotate.

[0025] By adopting the above technical solution, the linear cutting head can separate the film wound on the conveyor roller from the film attached to the film coating platform, and the annular cutting head can cut the excess film beyond the surface of the wafer. When an operator tears off the excess film from the film coating platform, the wafer coating process is completed. The coordinated setting of the rotating shaft and the connecting rod can install the annular cutting head on the cover plate, and the setting of the operating rod can enable the operator to control the annular cutting head when the cover plate is closed, so as to facilitate the cutting of the film.

[0026] Optionally, a pad that abuts against the film pressing roller is provided on the coating platform, and a recessed step is provided on the coating platform for installing the pad. The pad is fixedly connected to the recessed step, and a cutting groove is left between the pad and two opposite side walls of the recessed step for the linear cutting head to enter.

[0027] By adopting the above technical solution, a certain gap is left between the pad and the two opposite side walls of the concave step. The gap formed by the edge of the pad and the side wall of the concave step is the cutting groove. The cutting groove is set to provide a groove for the linear cutting head to fall at the edge of the coating platform, which is convenient for cutting the film, so that the film attached to the coating platform can be separated from the film on the conveying roller.

[0028] Optionally, a sliding frame is fixedly connected below the coating platform, a slide rail is provided on the bottom of the coating box, and the sliding frame is slidably installed on the slide rail.

[0029] By adopting the above technical solution, the slide frame and the slide rail are arranged in coordination, so that the coating platform and the laminating roller can move relative to each other, making it easier for the laminating roller to press the film onto the wafer surface.

[0030] Optionally, a motor screw is provided in the coating box, a connecting block is threadedly connected to the screw of the motor screw, and the connecting block is fixedly connected to one side of the sliding frame.

[0031] By adopting the above technical solution, the connecting block is threadedly connected to the screw rod and fixedly connected to the sliding frame. Through the cooperation between the connecting block and the motor screw rod, the relative movement between the laminating platform and the laminating roller is controlled.

[0032] In summary, the present application includes at least one of the following beneficial technical effects:

[0033] 1. The laminating mechanism, cutting mechanism and conveying rollers are all installed in the laminating box, and the cover plate is closed on the top of the laminating box to ensure the implementation of the overall laminating process. The static electricity removal fan can remove the static electricity generated between the film and the wafer, which is beneficial to improve the efficiency of the wafer laminating operation;

[0034] 2. The L-shaped frame on the connecting frame is used to fix the anti-static fan and adjust the angle. The L-shaped plate on the connecting frame fixes the anti-static fan to the laminating box and is rotatably connected to the L-shaped frame to achieve angle adjustment.

[0035] 3. The lighting lamp head can improve the dim light in the film laminating box, making it easier for operators to check the film laminating condition on the wafer surface. Two lighting lamp heads are arranged in parallel, and the rotating shafts of the two lighting lamp heads are arranged perpendicular to each other, which expands the lighting range of the lighting lamp heads. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a schematic diagram of the overall structure of a wafer coating device in this embodiment, in which the cover plate is in an open state.

[0037] Figure 2 Schematic diagram of the overall structure of the anti-static fan and the connecting frame in this embodiment.

[0038] Figure 3 It is a schematic diagram of a partial structure of a wafer film coating device according to this embodiment.

[0039] Figure 4 is Figure 3 An enlarged schematic diagram of the middle concave step and the cutting groove.

[0040] Figure 5 It is a schematic diagram of the overall structure of the cover plate of a wafer film coating device according to this embodiment in a closed state.

[0041] Explanation of reference numerals: 1, film coating box; 2, cover plate; 3, conveying roller; 4, film coating mechanism; 41, film coating platform; 411, placement groove; 412, fixing frame; 413, concave step; 42, film pressing roller; 43, backing plate; 431, cutting groove; 44, sliding frame; 45, slide rail; 46, motor screw rod; 47, connecting block; 5, film cutting mechanism; 51, linear cutting tool head; 52, annular cutting tool head; 521, shaft rod; 522, connecting rod; 523, operating rod; 6, static eliminator fan; 7, connecting frame; 71, U-shaped frame; 72, L-shaped plate; 8, lighting head; 81, rotating shaft. Detailed implementation manners

[0042] In order to make the purpose, technical solutions and advantages of this application clearer, the following Figure 1-4 are further described in detail with reference to the attached

[0043] This application embodiment discloses a wafer film coating device. In this embodiment, words used to express positional relationships such as "upper" and "lower" are determined with reference to the placement and installation positions of the wafer film coating device in its normal use state. For example, the wafer is placed above the film coating platform 41, and the L-shaped plate 72 is installed below the U-shaped frame 71, etc.

[0044] Refer to Figure 1 , the wafer film coating device includes a film coating box 1, a cover plate 2, a conveying roller 3, a film coating mechanism 4, a film cutting mechanism 5, a static eliminator fan 6 and a lighting head 8. The cover plate 2 is rotatably connected to the film coating box 1 and covers the upper part of the film coating box 1, and the conveying roller 3 is installed above the film coating box 1 for conveying the film into the film coating box 1.

[0045] The film coating mechanism 4 provides a placement platform for the wafer and presses the film tightly on the upper surface of the wafer. The film cutting mechanism 5 is used to divide the film on the conveying roller 3 from the film on the film coating platform 41, and at the same time also cuts off the excess film beyond the surface range of the wafer. Both the film coating mechanism 4 and the film cutting mechanism 5 are installed in the film coating box 1.

[0046] The static eliminator fan 6 is installed on the outer side wall of the film laminating box 1, and the air outlet of the static eliminator fan 6 faces the wafer and the film. The lamp holder 8 is installed on the static eliminator fan. When the cover plate 2 is in the open state, the static eliminator fan 6 can remove the static electricity generated between the wafer surface and the film, and the lamp holder 8 enhances the brightness inside the film laminating box 1, facilitating the operator to view and adjust the film laminating condition of the wafer.

[0047] Refer to Figure 2 , a connecting frame 7 is provided on the static eliminator fan 6. The connecting frame 7 includes two parts: a U-shaped frame 71 and an L-shaped plate 72. The static eliminator fan 6 is installed on the U-shaped frame 71 and is rotatably connected between the two opposite side plates of the U-shaped frame 71. The L-shaped plate 72 is fixedly connected to the outer side wall of the film laminating box 1. The bottom of the U-shaped frame 71 is rotatably connected to the side of the L-shaped plate 72 away from the connection with the film laminating box 1. Thus, the static eliminator fan 6 can adjust various air outlet directions and angles through two rotational connections.

[0048] The lamp holder 8 is installed on the side of the static eliminator fan 6 away from the connection with the connecting frame 7. In this embodiment, the number of lamp holders 8 is preferably two, and the two lamp holders 8 are arranged adjacent to each other. Rotating shafts 81 for adjusting the lighting direction are provided on both lamp holders 8, and the rotating directions of the two rotating shafts 81 are perpendicular to each other.

[0049] Refer to Figure 1 and Figure 3 , the film laminating mechanism 4 includes a film laminating platform 41 and a film pressing roller 42. A sliding frame 44 is fixedly connected to the lower part of the film laminating platform 41. A slide rail 45 for the sliding frame 44 to slide is fixedly connected to the bottom of the film laminating groove. The sliding frame 44 is slidably connected to the slide rail 45. A placement groove 411 is formed on the film laminating platform 41, and a fixing frame 412 is snap-fitted and fixed in the placement groove 411. The wafer is placed on the fixing frame 412.

[0050] The film pressing roller 42 is installed in the film laminating groove and above the film laminating platform 41, and the film pressing roller 42 is arranged parallel to the conveyor roller 3.

[0051] An electric motor screw rod 46 is arranged at an adjacent position of the sliding frame 44. The electric motor screw rod 46 is located between the inner side wall of the film laminating groove and the sliding frame 44. A connecting block 47 is fixedly connected to the bottom plate of the sliding frame 44. The connecting block 47 is threadedly connected to the screw rod of the electric motor screw rod 46. Under the driving action of the electric motor screw rod 46, the sliding frame 44 drives the film laminating platform 41 to slide.

[0052] Refer to Figure 4 and Figure 5The film cutting mechanism 5 includes a linear cutting head 51 and an annular cutting head 52. The linear cutting head 51 is arranged at a position adjacent to the film pressing roller 42 and is parallel to the film pressing roller 42. A concave step 413 is provided on one side of the film pressing platform close to the linear cutting head 51. A pad 43 is fixedly connected above the concave step 413. A cutting groove 431 for the linear cutting head 51 to enter is formed between the side wall of the pad 43 and the concave step 413 of the film pressing platform.

[0053] Combination Figure 1 The annular cutting head 52 is arranged on the side of the cover plate 2 close to the film coating box 1. The annular cutting head 52 is provided with a shaft 521 and a connecting rod 522. The shaft 521 is passed through and rotatably connected to the cover plate 2. The connecting rod 522 is vertically fixedly connected to the end of the shaft 521 close to the film coating box 1. The annular cutting head 52 is fixedly connected to the end of the connecting rod 522. When the cover plate 2 is in the covering state, the annular cutting head 52 abuts against the side wall of the wafer. An operating rod 523 is fixedly connected to one end of the shaft 521 away from the film coating box 1. When the cover plate 2 is in the covering state, the operator can control the operating rod 523 to achieve the cutting of the film.

[0054] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A wafer coating device, characterized in that: It includes a film-covering box (1), a cover plate (2), a conveying roller (3), a film-covering mechanism (4), a film-cutting mechanism (5) and an anti-static fan (6); The cover plate (2) is rotatably connected to the film-covering box (1) and covers the film-covering box (1); The conveying roller (3) is installed inside the film-covering box (1) near the side where the film-covering box (1) is connected to the cover plate (2), and both ends of the conveying roller (3) are rotatably connected to two opposite inner side walls of the film-covering box (1); The film-covering mechanism (4) is installed inside the film-covering box (1), and the film-covering mechanism (4) is for placing a wafer and covering the wafer with a film; The film-cutting mechanism (5) is installed inside the film-covering box (1) and on the cover plate (2) for cutting the film; The film-covering mechanism (4) includes a film-covering platform (41) and a film-pressing roller (42). The film-covering platform (41) is horizontally installed inside the film-covering box (1). A placement groove (411) is formed on the film-covering platform (41), and a fixing frame (412) for fixing the wafer is arranged in the placement groove (411). The film-pressing roller (42) is rotatably connected to two opposite inner side walls of the film-covering box (1). The film-pressing roller (42) is located between the film-covering platform (41) and the conveying roller (3) and is parallel to the conveying roller (3); The anti-static fan (6) is fixedly connected to the outer side wall of the film-covering box (1). When the cover plate (2) is in an open state, the air outlet direction of the anti-static fan (6) is perpendicular to the film-covering platform (41).

2. The wafer coating device according to claim 1, characterized in that: A connecting frame (7) is arranged on the anti-static fan (6), and the connecting frame (7) is fixedly connected to the outer side wall of the film-covering box (1), and the connecting frame (7) is rotatably connected to the anti-static fan (6).

3. The wafer coating device according to claim 2, characterized in that: The connecting frame (7) includes a U-shaped frame (71) and an L-shaped plate (72). The anti-static fan (6) is rotatably connected to two opposite inner side walls of the U-shaped frame (71), and the U-shaped frame (71) is rotatably connected to the side of the L-shaped plate (72) away from the connection with the film-covering box (1).

4. The wafer coating device according to claim 3, characterized in that: A lamp holder (8) is arranged on the side of the anti-static fan (6) away from the connection with the connecting frame (7). A rotating shaft (81) for adjusting the lamp head direction is arranged on the lamp holder (8), and the lamp holder (8) is electrically connected to the anti-static fan (6).

5. The wafer coating device according to claim 4, characterized in that: The number of the lamp holders (8) is two, and the rotating shafts (81) of the two lamp holders (8) are perpendicularly arranged to each other.

6. The wafer coating device according to claim 1, characterized in that: The film cutting mechanism (5) comprises a straight cutting head (51) and an annular cutting head (52); the straight cutting head (51) is fixedly connected to the side of the film coating box (1) close to the connection with the cover plate (2); the annular cutting head (52) is provided with an axle rod (521) and a connecting rod (522); the axle rod (521) is passed through the cover plate (2); the connecting rod (522) is fixedly connected to the end of the axle rod (521) close to the side of the film coating box (1); the annular cutting head (52) is fixedly connected to one end of the connecting rod (522) and faces the side of the film coating platform (41); When the cover plate (2) is closed, the annular cutting blade (52) abuts against the edge of the wafer, and the shaft (521) is located at one end of the cover plate (2) away from the coating box (1) and is provided with an operating rod (523) for driving the blade to rotate.

7. The wafer coating device according to claim 6, characterized in that: The coating platform (41) is provided with a pad (43) which abuts against the coating roller (42); the coating platform (41) is provided with a recessed step (413) for installing the pad (43); the pad (43) is fixedly connected to the recessed step (413); and a cutting groove (431) for the linear cutting head (51) to enter is reserved between the pad (43) and two opposite side walls of the recessed step (413).

8. The wafer coating device according to claim 7, characterized in that: A sliding frame (44) is fixedly connected below the coating platform (41), a sliding rail (45) is provided on the bottom of the coating box (1), and the sliding frame (44) is slidably mounted on the sliding rail (45).

9. The wafer coating device according to claim 8, characterized in that: A motor screw (46) is arranged in the film coating box (1), a connecting block (47) is threadedly connected to the screw of the motor screw (46), and the connecting block (47) is fixedly connected to one side of the sliding frame (44).

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