Flash IC bonding pad structure easy to weld
By designing the pad structure of the Flash IC, the left and right sides of the pad structure body are connected to the edge of the chip, which solves the problem of welding difficulty in the prior art and achieves a higher welding success rate.
Patent Information
- Application Number
- CN202421023829.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-11
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-05-11
AI Technical Summary
The pad design of existing Flash ICs makes it difficult to solder, especially the partial soldering of the pad close to the middle of the Flash IC is unsuccessful.
Design a Flash IC pad structure that is easy to solder, where the left and right sides of the pad structure body are connected to the left and right edges of the chip, increasing the size of the pad, thereby increasing the bonding force between the solder joints and the pad body. .
By increasing the pad size and improving the welding sequence, the difficulty of welding is reduced and the success rate of welding is improved.
Smart Images
Figure CN222462916U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a soldering pad structure of a flash IC which is easy to solder. Background Art
[0002] With the requirement of electronic products to be light and small, IC chip packaging tends to be thin and small. The miniaturization and thinness of chip packaging is particularly important. In current electronic products, memory chips occupy a very important position, and FlashIC (flash memory chip) is one of the core products.
[0003] The soldering pads of the Flash IC in the prior art are evenly distributed on the left and right sides of the back of the Flash IC. The Flash IC is soldered to the corresponding printed circuit board through the soldering pads. When soldering is performed manually, the soldering pads are a certain distance away from the edge of the Flash IC and are designed to be retracted, which makes soldering difficult, resulting in unsuccessful soldering of the soldering pads near the middle position of the Flash IC. Utility Model Content
[0004] The utility model aims to overcome the shortcomings of the prior art and provide a soldering pad structure of a flash IC which is easy to solder.
[0005] The purpose of this utility model is achieved through the following technical solutions:
[0006] A pad structure of a flash IC that is easy to weld comprises: a chip, a pad structure body is arranged on one side of the chip, the pad structure body is located on the back of the chip, and the left and right sides of the pad structure body are respectively connected to the left and right edges of the chip.
[0007] In one embodiment, the pad structure body includes a plurality of pad bodies, and the plurality of pad bodies are divided into two groups, and the two groups of pad bodies are respectively located near left and right edges of the chip.
[0008] In one embodiment, there are six pad bodies, which are divided into two groups. Each group of pad bodies has three pad bodies. The three pad bodies in each group of pad bodies are equidistantly distributed along the length direction of the chip, and the two groups of pad bodies are symmetrically distributed.
[0009] In one embodiment, the spacing between the two groups of pad bodies is 0.35 mm-0.5 mm.
[0010] In one embodiment, the pad body located on the left side of the chip extends to the left edge of the chip, and the pad body located on the left side of the chip is connected to the left edge of the chip.
[0011] In one embodiment, the pad body located on the right side of the chip extends to the right edge of the chip, and the pad body located on the right side of the chip is connected to the right edge of the chip.
[0012] In one embodiment, the pad structure body includes a plurality of pad bodies arranged in a long strip shape, the lengths of the plurality of pad bodies are the same as the width of the chip, and the plurality of pad bodies are equidistantly distributed along the length direction of the chip.
[0013] In one embodiment, the distance between two adjacent pad bodies is 0.25 mm-0.5 mm.
[0014] In one embodiment, two opposite outer sides of the plurality of pad bodies are respectively connected to left and right side edges of the chip.
[0015] In one embodiment, the pad body is made of copper.
[0016] Compared with the prior art, the utility model has at least the following advantages:
[0017] The utility model discloses a soldering pad structure of a flash IC which is easy to solder. The two outer sides of the soldering pad structure body are respectively connected to the left and right side edges of the chip, thereby increasing the size of the soldering pad so that the bonding force between the soldering point and the soldering pad body becomes larger. During soldering, the solder ball is contact-heated by a soldering pen to start soldering from the two sides of the soldering pad body, and the soldering pad body is soldered to the printed circuit board, thereby increasing the amount of tin on the soldering pad, reducing the difficulty of soldering, and improving the success rate of soldering. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.
[0019] Figure 1 A schematic diagram of the front structure of a soldering pad structure of a flash IC that is easy to solder provided by the utility model;
[0020] Figure 2 A schematic diagram of the chip back structure of Example 1 in a soldering pad structure of a flash IC that is easy to solder provided by the utility model;
[0021] Figure 3The present invention is a schematic diagram of the chip back structure of Example 2 in a flash IC pad structure that is easy to weld.
[0022] Description of the drawings: 10. Chip; 20. Pad structure body; 30. Pad body. DETAILED DESCRIPTION
[0023] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.
[0024] Embodiment 1:
[0025] A pad structure of a flash IC that is easy to solder, refer to Figure 1 and Figure 2 , including a chip 10, a pad structure body 20 is provided on one side of the chip 10, and the pad structure body 20 is located on the back of the chip 10. The left and right sides of the pad structure body 20 are respectively connected to the left and right edges of the back of the chip 10 to reduce the difficulty of welding and improve the success rate of welding.
[0026] Reference Figure 2 The pad structure body 20 includes a plurality of pad bodies 30, and the plurality of pad bodies 30 are divided into two groups. The two groups of pad bodies 30 are respectively located near the left and right edges of the chip 10. In this embodiment, there are six pad bodies 30, and the six pad bodies 30 are divided into two groups, each group has three pad bodies 30, and the two groups of pad bodies 30 are respectively located near the left and right sides of the chip 10. The three pad bodies 30 in each group of pad bodies 30 are equidistantly distributed along the length direction of the chip 10, and the two groups of pad bodies 30 are symmetrically distributed.
[0027] Reference Figure 2 The spacing between the two groups of pad bodies 30 is 0.35 mm to 0.5 mm. The spacing between the pad body 30 located on the left side of the chip 10 and the pad body 30 located on the right side of the chip 10 is 0.35 mm to 0.5 mm.
[0028] Reference Figure 2The pad body 30 is arranged in a rectangular shape, and the pad body 30 located on the left side of the chip 10 extends to the left edge of the chip 10, so that the pad body 30 located on the left side of the chip 10 is connected to the left edge of the chip 10. The pad body 30 located on the right side of the chip 10 extends to the right edge of the chip 10, so that the pad body 30 located on the right side of the chip 10 is connected to the right edge of the chip 10. By extending the pad body 30 to the edge of the chip 10, when welding, the solder ball is welded from the edge of the pad body 30 by the soldering pen, and the pad body 30 is welded to the printed circuit board, which shortens the welding distance, facilitates heat conduction, reduces the welding difficulty, and improves the success rate, so that the chip 10 is welded to the printed circuit board.
[0029] Embodiment 2:
[0030] The difference between this embodiment and the first embodiment is that the pad structure body 20 is different.
[0031] Reference Figure 3 The pad structure body 20 includes a plurality of pad bodies 30 arranged in a long strip shape, the lengths of the plurality of pad bodies 30 are the same as the width of the chip 10 , and the plurality of pad bodies 30 are equidistantly distributed along the length direction of the chip 10 .
[0032] Further, refer to Figure 3 The distance between two adjacent pad bodies 30 is 0.25 mm-0.5 mm.
[0033] Reference Figure 3 , the two opposite outer sides of the plurality of pad bodies 30 are respectively connected to the left and right edges of the chip 10, so that the plurality of pad bodies 30 connect the left and right edges of the chip 10. The pad structure in this embodiment increases the pad size so that the bonding force between the solder joint and the pad body 30 becomes larger, and changes the pad body 30 on the left and right sides of the traditional chip 10, and combines the pad bodies 30 on the left and right sides into a long strip of pad body 30. According to the principle of stress mechanics, when other conditions are the same, the larger the pad diameter, the smaller the stress it bears. The increase in the pad diameter will increase the bonding area between the solder joint and the solder, thereby increasing the bonding force between the solder joint and the pad. During welding, the solder ball is contact-heated by the soldering pen and welding is started from the two sides of the pad body 30, and the pad body 30 is welded to the printed circuit board, which increases the amount of tin on the pad, reduces the difficulty of welding, and improves the success rate of welding.
[0034] Further, refer to Figure 3 , the material of the pad body 30 is copper.
[0035] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A pad structure of a flash IC that is easy to solder, characterized in that: include: A chip (10), wherein a pad structure body (20) is provided on one side of the chip (10), the pad structure body (20) is located on the back side of the chip (10), and the left and right sides of the pad structure body (20) are respectively connected to the left and right edges of the chip (10).
2. The soldering pad structure of a flash IC that is easy to solder according to claim 1, characterized in that: The pad structure body (20) comprises a plurality of pad bodies (30), the plurality of pad bodies (30) are divided into two groups, and the two groups of pad bodies (30) are respectively located near left and right side edges of the chip (10).
3. The soldering pad structure of a flash IC that is easy to solder according to claim 2, characterized in that: There are six pad bodies (30), and the six pad bodies (30) are divided into two groups, each group of pad bodies (30) has three pad bodies (30), and the three pad bodies (30) in each group of pad bodies (30) are distributed at equal distances along the length direction of the chip (10), and the two groups of pad bodies (30) are symmetrically distributed.
4. The soldering pad structure of a flash IC that is easy to solder according to claim 3, characterized in that: The distance between the two groups of pad bodies (30) is 0.35 mm-0.5 mm.
5. The soldering pad structure of a flash IC that is easy to solder according to claim 4, characterized in that: The pad body (30) located on the left side of the chip (10) extends to the left edge of the chip (10), and the pad body (30) located on the left side of the chip (10) is connected to the left edge of the chip (10).
6. The soldering pad structure of a flash IC that is easy to solder according to claim 5, characterized in that: The pad body (30) located on the right side of the chip (10) extends to the right edge of the chip (10), and the pad body (30) located on the right side of the chip (10) is connected to the right edge of the chip (10).
7. The soldering pad structure of a flash IC that is easy to solder according to claim 1, characterized in that: The pad structure body (20) comprises a plurality of pad bodies (30) arranged in a long strip shape, the lengths of the plurality of pad bodies (30) are the same as the width of the chip (10), and the plurality of pad bodies (30) are distributed at equal distances along the length direction of the chip (10).
8. The soldering pad structure of a flash IC that is easy to solder according to claim 7, characterized in that: The distance between two adjacent pad bodies (30) is 0.25 mm to 0.5 mm.
9. The soldering pad structure of a flash IC that is easy to solder according to claim 8, characterized in that: Two opposite outer sides of the plurality of pad bodies (30) are respectively connected to the left and right side edges of the chip (10).
10. The soldering pad structure of a flash IC that is easy to solder according to claim 9, characterized in that: The material of the pad body (30) is copper.