Center conductor with discrete structure

Abstract

The utility model discloses a central conductor with a discrete structure. The central conductor comprises a conductor layer, an insulating layer, a connecting piece and a ferrite, the three conductor layers and the three insulating layers are alternately and sequentially stacked to form discrete parts; the conductor layer comprises inductance lines, and an included angle is formed between any two inductance lines; the conductor layer on the outermost side of the discrete component is fixedly connected with the ferrite; the connecting pieces are connected to the conductor layers on the outermost sides of the discrete components, and the two ends of the inductance line are electrically connected with the connecting pieces respectively. According to the central conductor of the discrete structure, the inductance wires are arranged to be of the discrete structure, the inductance wires are arranged in an addition growth mode, and compared with the mode that three inductance wires are sequentially bent to wrap the ferrite, the phenomena of inductance wire deformation and magnet cracking can be effectively avoided, the production efficiency can be improved, and the wrapping precision is improved. And the connecting piece can be connected with the PCB support plate by adopting a surface mounting process and a reflow soldering process, so that the efficiency is higher. The connecting piece is connected to the conductor layer on the outermost side, so that the risk of electric leakage caused by contact with a foreign object can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of circulator manufacturing, in particular to a discrete structure central conductor. Background Art

[0002] The manufacturing method of the traditional center conductor assembly of the lumped circulator and isolator is to wrap the three inductance lines (inner conductors) with ferrite in sequence, and use a dielectric film to isolate each inductance line to obtain a center conductor assembly containing ferrite. This process has risks such as low wrapping accuracy, easy deformation of the inductance line, and easy cracking of the magnet. The production efficiency is also low, and the subsequent connection with the carrier board cannot be connected using the more efficient reflow soldering process, which greatly affects the mass production efficiency of the finished product. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a discrete structure central conductor with high production yield.

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is: a discrete structure central conductor, including a conductor layer, an insulating layer, a connector and a ferrite; three of the conductor layers and three of the insulating layers are stacked alternately in sequence to form a discrete component; the conductor layer includes an inductor, and there is an angle between any two of the inductors; the outermost conductor layer of the discrete component is fixedly connected to the ferrite; the connector is connected to the outermost conductor layer of the discrete component, and the two ends of the inductor are respectively electrically connected to one of the connectors.

[0005] Furthermore, the discrete component is provided with a first metallized hole, and the first metallized hole is electrically connected to the inductor and the connecting member respectively.

[0006] Furthermore, the outer peripheral edge of the discrete component is circular or rectangular.

[0007] Furthermore, a protruding lug is provided on the side wall of the discrete component, and the end of the inductor is arranged in the lug.

[0008] Furthermore, the connecting piece is made of copper, aluminum or molybdenum-copper alloy; or, the connecting piece is a silver-plated piece.

[0009] Furthermore, the connecting component includes a substrate and copper clad layers arranged at both ends of the substrate, the substrate is provided with second metallized holes, and the second metallized holes are electrically connected to the two copper clad layers respectively; the copper clad layers are electrically connected to the inductor line.

[0010] Furthermore, the substrate is made of ceramic or resin.

[0011] Furthermore, the connecting member includes a substrate and a conducting portion provided on a side wall surface of the substrate, and two ends of the conducting portion extend to opposite end surfaces of the substrate respectively; and the ends of the conducting portion are electrically connected to the inductor line.

[0012] Furthermore, the discrete components are multi-layer PCBs or multi-layer FPCs.

[0013] Furthermore, the insulating layer is made of FR-4 or PI material.

[0014] The beneficial effect of the utility model is that the discrete structure center conductor sets multiple inductance lines as discrete structures, and adopts additive growth to set multiple inductance lines. Compared with bending three inductance lines in sequence to wrap ferrite, it can effectively avoid the phenomenon of inductance line deformation and magnet cracking, which is conducive to improving production efficiency and wrapping accuracy. The connector can be connected to the PCB carrier board by patch process and reflow soldering process, which is more efficient. The connector is connected to the outermost conductor layer, which can reduce the risk of leakage caused by contact with foreign objects. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic structural diagram of a discrete structure center conductor of Embodiment 1 of the utility model;

[0016] Figure 2 It is a partial structural exploded view of the discrete structure center conductor of the first embodiment of the utility model;

[0017] Figure 3 This is a structural view of a conductor layer in a discrete structure center conductor of Embodiment 1 of the utility model;

[0018] Figure 4 It is a cross-sectional view of a discrete structure center conductor of the first embodiment of the utility model;

[0019] Figure 5 This is a schematic diagram of the structure of the discrete structure center conductor of the second embodiment of the utility model;

[0020] Figure 6 This is a schematic diagram of the structure of the discrete structure center conductor of the third embodiment of the utility model;

[0021] Figure 7 This is a schematic diagram of the structure of the discrete structure center conductor of the fourth embodiment of the utility model;

[0022] Figure 8 It is a cross-sectional view of a discrete structure center conductor of the fourth embodiment of the utility model;

[0023] Fig. 9 This is a schematic structural diagram of a discrete structure center conductor of Embodiment 5 of the present utility model.

[0024] Description of labels:

[0025] 1. Discrete components; 11. Conductor layer; 111. Inductor line; 112. Conductive contact; 12. Insulation layer; 13. First metallized hole; 14. Lug;

[0026] 2. Ferrite;

[0027] 3. Connector; 31. Substrate; 32. Copper cladding layer; 33. Second metallized hole; 34. Conductive portion. DETAILED DESCRIPTION

[0028] In order to explain the technical content, achieved objectives and effects of the present invention in detail, the following is an explanation in conjunction with the implementation modes and the accompanying drawings.

[0029] Please refer to Figures 1 to 9 A discrete structure center conductor comprises a conductor layer 11, an insulating layer 12, a connector 3 and a ferrite 2; three conductor layers 11 and three insulating layers 12 are stacked alternately in sequence to form a discrete component 1; the conductor layer 11 comprises an inductor 111, and an angle exists between any two of the inductor 111; the outermost conductor layer 11 of the discrete component 1 is fixedly connected to the ferrite 2; the connector 3 is connected to the outermost conductor layer 11 of the discrete component 1, and the two ends of the inductor 111 are electrically connected to one of the connectors 3 respectively.

[0030] From the above description, it can be seen that the beneficial effect of the utility model is that: the discrete structure center conductor sets multiple inductance lines 111 as a discrete structure, and adopts an additive growth method to set multiple inductance lines 111. Compared with bending three inductance lines 111 in sequence to wrap the ferrite 2, it can effectively avoid the deformation of the inductance line 111 and the cracking of the magnet, which is conducive to improving production efficiency and improving wrapping accuracy. The connector 3 can be connected to the PCB carrier board using a patch process and a reflow soldering process, which is more efficient. The connector 3 is connected to the outermost conductor layer 11, which can reduce the risk of leakage caused by contact with foreign objects.

[0031] Furthermore, the discrete component 1 is provided with a first metallized hole 13 , and the first metallized hole 13 is electrically connected to the inductor line 111 and the connector 3 respectively.

[0032] It can be seen from the above description that the first metallized hole 13 can keep the inductor 111 in a flat sheet shape, which is convenient for processing and production, and can prevent the inductor 111 from extending outward and easily contacting with foreign objects to cause leakage.

[0033] Furthermore, the outer peripheral edge of the discrete component 1 is circular or rectangular.

[0034] It can be seen from the above description that the shape of the discrete component 1 can be set according to usage requirements.

[0035] Furthermore, a protruding lug 14 is provided on the side wall of the discrete component 1 , and the end of the inductor 111 is disposed in the lug 14 .

[0036] It can be seen from the above description that arranging the two ends of the inductor 111 in the lugs 14 can effectively reduce the overall volume of the discrete component 1 and save costs.

[0037] Furthermore, the connecting piece 3 is made of copper, aluminum or molybdenum-copper alloy; or, the connecting piece 3 is a silver-plated piece.

[0038] It can be seen from the above description that the material of the connecting member 3 can be selected according to actual use requirements or production conditions.

[0039] Furthermore, the connector 3 includes a substrate 31 and copper clad layers 32 disposed at both ends of the substrate 31 , the substrate 31 is provided with second metallized holes 33 , and the second metallized holes 33 are electrically connected to the two copper clad layers 32 respectively; the copper clad layers 32 are electrically connected to the inductor 111 .

[0040] It can be seen from the above description that the use of the second metallized hole 33 can achieve electrical connection and avoid the phenomenon of leakage caused by the side of the connector 3 contacting with foreign objects.

[0041] Furthermore, the substrate 31 is made of ceramic or resin.

[0042] It can be seen from the above description that the material of the substrate 31 can be selected according to actual use requirements or production conditions.

[0043] Furthermore, the connecting member 3 includes a substrate 31 and a conducting portion 34 disposed on a side wall surface of the substrate 31 , and two ends of the conducting portion 34 extend to opposite end surfaces of the substrate 31 ; the ends of the conducting portion 34 are electrically connected to the inductor line 111 .

[0044] It can be seen from the above description that using the conductive portion 34 disposed on the side wall surface of the substrate 31 to achieve electrical connection can reduce the production difficulty of the connector 3 and reduce the manufacturing cost.

[0045] Furthermore, the discrete component 1 is a multi-layer PCB or a multi-layer FPC.

[0046] It can be seen from the above description that the discrete component 1 is easy to manufacture and has high production efficiency.

[0047] Furthermore, the insulating layer 12 is made of FR-4 or PI material.

[0048] It can be seen from the above description that the material of the insulating layer 12 can be selected according to actual use requirements or production conditions.

[0049] Please refer to Figures 1 to 4 The first embodiment of the utility model is: a discrete structure central conductor, including a conductor layer 11, an insulating layer 12, a connector 3 and a ferrite 2; three conductor layers 11 and three insulating layers 12 are alternately stacked in sequence to form a discrete component 1; the conductor layer 11 includes an inductor 111, and there is an angle between any two inductors 111; the outermost conductor layer 11 of the discrete component 1 is fixedly connected to the ferrite 2; the connector 3 is connected to the outermost conductor layer 11 of the discrete component 1, and the two ends of the inductor 111 are electrically connected to a connector 3 respectively.

[0050] Specifically, the angle between any two inductance lines 111 is 60°. The insulating layer 12 is made of FR-4 or PI. The discrete component 1 is a multi-layer PCB or multi-layer FPC structure. The insulating layer 12 is made of FR-4 or PI. The discrete component 1 is in the shape of a rectangular plate, and the outer peripheral edge of the discrete component 1 is rectangular. Each conductor layer 11 includes six conductive contacts 112 and an inductance line 111, and the two ends of the inductance line 111 are respectively connected to the two conductive contacts 112. The conductive contacts 112 of the three conductor layers 11 are arranged one by one up and down. The ferrite 2 is in the shape of a rectangular plate. The ferrite 2 and the connector 3 are both connected to the side of the outermost conductor layer 11 away from the insulating layer 12. The discrete component 1 and the ferrite 2 are bonded by dispensing, gluing, or hot pressing. The connector 3 is in the shape of a rectangular body, and there are six connectors 3. The six connectors 3 are arranged around the ferrite 2, and the six connectors 3 are respectively connected to the six conduction contacts 112 located on the outermost conductor layer 11. The discrete component 1 and the connector 3 are connected and fixed by solder paste printing and reflow soldering process. Optionally, the connector 3 is made of copper, aluminum or molybdenum-copper alloy; or, the connector 3 is a silver-plated part. The central conductor of this discrete structure can be connected and fixed to the connector 3 and the PCB carrier board by patch and reflow soldering process.

[0051] Preferably, the discrete component 1 is provided with a first metallized hole 13, and the first metallized hole 13 is electrically connected to the inductor 111 and the connector 3, respectively. Specifically, the cross-section of the first metallized hole 13 can be set to a circular, elliptical or other polygonal shape. The first metallized hole 13 is electrically connected to the conductive contacts 112 respectively located in the three conductor layers 11 and facing each other up and down. Each conductive contact 112 is electrically connected to at least one first metallized hole 13. The two ends of the inductor 111 located in the outermost conductor layer 11 are directly electrically connected to the connector 3 through the conductive contacts 112, and the two ends of the inductor 111 of the other two conductor layers 11 are electrically connected to the connector 3 through the first metallized hole 13 and the conductive contacts 112 in turn.

[0052] The processing technology of the discrete structure center conductor of the first embodiment of the utility model includes the following steps:

[0053] S1, using a multi-layer PCB or multi-layer FPC molding process, stacking three conductor layers 11 and three insulation layers 12 alternately in sequence to form a discrete component 1;

[0054] S2, fabricating a surface circuit on the ferrite 2 by using a process such as sputtering, pad printing, screen printing or roll printing;

[0055] S3, using dispensing, gluing or hot pressing to fit and fix the outermost conductor layer 11 to the side of the ferrite 2 away from the surface circuit;

[0056] S4, sequentially adopting solder paste printing, SMD connector 3 and reflow soldering process to connect and fix connector 3 to the outermost conductor layer 11.

[0057] Please refer to Figure 5 The second embodiment of the present invention is a further improvement of the discrete component 1 based on the first embodiment, and the difference from the first embodiment is that the outer peripheral edge of the discrete component 1 is circular. Specifically, the discrete component 1 is in the shape of a circular plate. In other embodiments, the discrete component 1 can be set to be an elliptical plate or other polygonal plate.

[0058] Please refer to Figure 6 The third embodiment of the present invention is a further improvement on the discrete component 1 based on the first embodiment, and is different from the first embodiment in that: a protruding lug 14 is provided on the side wall of the discrete component 1, and the end of the inductor 111 is arranged in the lug 14. Specifically, the discrete component 1 includes a rectangular body and two rectangular lugs 14 protruding outward from both ends of the body, and the two ends of one inductor 111 are arranged in the two lugs 14 respectively.

[0059] Please refer to Figure 7 and Figure 8, Embodiment 4 of the present utility model is a further improvement on the connecting member 3 based on Embodiment 1. The difference from Embodiment 1 is that: the connecting member 3 includes a substrate 31 and copper-clad layers 32 provided at both ends of the substrate 31. The substrate 31 is provided with second metallized holes 33, and the second metallized holes 33 are electrically connected to the two copper-clad layers 32 respectively; the copper-clad layer 32 is electrically connected to the inductor wire 111. The substrate 31 is made of ceramic material, such as alumina, aluminum nitride, zirconia; or, the substrate 31 is made of resin material, such as FR-4. The substrate 31 is in a rectangular body shape, and the copper-clad layer 32 is rectangular. The number of the second metallized holes 33 is one. The cross-section of the second metallized hole 33 can be set as circular, elliptical or other polygons. In other embodiments, the number of the second metallized holes 33 can be set as two, three or more. One copper-clad layer 32 of the connecting member 3 is used for electrically connecting with the inductor wire 111 of the discrete component 1, and the other copper-clad layer 32 is used for electrically connecting with the PCB carrier board.

[0060] Please refer to Fig. 9 , Embodiment 5 of the present utility model is a further improvement on the connecting member 3 based on Embodiment 1. The difference from Embodiment 1 is that: the connecting member 3 includes a substrate 31 and a conduction part 34 provided on the side wall surface of the substrate 31. Both ends of the conduction part 34 extend to the opposite end surfaces of the substrate 31 respectively; the end part of the conduction part 34 is electrically connected to the inductor wire 111. The substrate 31 is made of ceramic material, such as alumina, aluminum nitride, zirconia. Specifically, the substrate 31 is in a rectangular body shape. The conduction part 34 is in a C shape, including a connecting arm and two contact points respectively provided at both ends of the connecting arm. The connecting arm of the conduction part 34 can be arranged on any side surface of the substrate 31. One contact point of the conduction part 34 is used for electrically connecting with the inductor wire 111 of the discrete component 1, and the other contact point is used for electrically connecting with the PCB carrier board. The number of the conduction parts 34 is two, and the two conduction parts 34 are symmetrically arranged with the substrate 31 as the center.

[0061] Optionally, the conduction part 34 can be formed by sputtering process; or the conduction part 34 is formed by pasting silver, copper, gold paste; or, the conduction part 34 is formed by printing silver, copper or gold paste and then performing curing and electroplating processes.

[0062] In summary, the discrete structure center conductor provided by the present utility model sets multiple inductor wires as a discrete structure and sets multiple inductor wires in an additive growth manner. Compared with bending three inductor wires in sequence to wrap the ferrite, it can effectively avoid the phenomena of inductor wire deformation and magnet cracking, which is beneficial to improving production efficiency and packaging accuracy. The connecting member can be connected to the PCB carrier board by the chip mounting process and the reflow soldering process, with higher efficiency. The connecting member is connected to the outermost conductor layer, which can reduce the risk of leakage caused by contact with external objects.

[0063] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent transformations made using the contents of the specification and drawings of the present invention, or directly or indirectly applied in the relevant technical field, are also included in the patent protection scope of the present invention.

Claims

1. A discrete structure central conductor, characterized in that: It comprises a conductor layer, an insulating layer, a connector and a ferrite; three conductor layers and three insulating layers are alternately stacked in sequence to form a discrete component; the conductor layer comprises an inductor, and there is an angle between any two of the inductors; the outermost conductor layer of the discrete component is fixedly connected to the ferrite; the connector is connected to the outermost conductor layer of the discrete component, and both ends of the inductor are electrically connected to one of the connectors respectively.

2. The discrete structure center conductor according to claim 1, characterized in that: The discrete component is provided with a first metallized hole, and the first metallized hole is electrically connected to the inductor and the connecting member respectively.

3. The discrete structure center conductor according to claim 1, characterized in that: The peripheral edge of the discrete component is circular or rectangular.

4. The discrete structure center conductor according to claim 1, characterized in that: A protruding lug is provided on the side wall of the discrete component, and the end of the inductor is arranged in the lug.

5. The discrete structure center conductor according to claim 1, characterized in that: The connecting piece is made of copper, aluminum or molybdenum-copper alloy; or, the connecting piece is a silver-plated piece.

6. The discrete structure center conductor according to claim 1, characterized in that: The connecting component includes a substrate and copper clad layers arranged at both ends of the substrate. The substrate is provided with second metallized holes, and the second metallized holes are electrically connected to the two copper clad layers respectively; the copper clad layers are electrically connected to the inductor line.

7. The discrete structure center conductor according to claim 6, characterized in that: The substrate is made of ceramic or resin.

8. The discrete structure center conductor according to claim 1, characterized in that: The connecting member includes a substrate and a conducting portion arranged on a side wall surface of the substrate, and two ends of the conducting portion extend to opposite end surfaces of the substrate respectively; and the ends of the conducting portion are electrically connected to the inductor line.

9. The discrete structure center conductor according to claim 1, characterized in that: The discrete component is a multi-layer PCB or a multi-layer FPC.

10. The discrete structure center conductor according to claim 1, characterized in that: The insulating layer is made of FR-4 or PI material.

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