Impedance matching circuit, radio frequency amplifier, power amplifier and radio frequency module

Abstract

The utility model relates to the technical field of integrated circuits, in particular to an impedance matching circuit, a radio frequency amplifier, a power amplifier and a radio frequency module. The impedance matching circuit comprises an input end, an output end and a first impedance matching unit connected between the input end and the output end, the first impedance matching unit comprises a first inductor, a first matching capacitor and a resonance capacitor, and the first matching capacitor and the resonance capacitor are connected with the first inductor. The resonant capacitor and the first inductor form a harmonic suppression unit; according to the mode, the resonant capacitor is arranged in the first impedance matching unit, the resonant capacitor and the first inductor in the first impedance matching unit form the harmonic suppression unit, so that the first impedance matching unit is open-circuited to specific harmonic waves or has zero impedance to the specific harmonic waves, and the impedance matching circuit is multiplexed as a harmonic suppression circuit; impedance matching and harmonic suppression functions can be realized at the same time with a small area, and the circuit structure can be simplified to realize circuit miniaturization.

Description

Technical Field

[0001] The present application relates to the field of integrated circuit technology, and in particular to an impedance matching circuit, a radio frequency amplifier, a power amplifier and a radio frequency module. Background Art

[0002] In the background technology, the output impedance of the front-stage circuit of the power amplifier is generally much smaller than the output impedance of the rear-stage circuit of the power amplifier. In order to reduce the loss of the RF signal, an impedance matching network needs to be set in the power amplifier between the front-stage circuit and the rear-stage circuit to match the output impedance of the front-stage circuit with the input impedance of the rear-stage circuit. In addition, as RF products become increasingly miniaturized, the electromagnetic environment of the antenna tends to be more complex and susceptible to harmonic interference. It is necessary to set up an additional harmonic suppression network in the power amplifier to filter the signals in the resonant frequency band, which will significantly increase the circuit area and is not conducive to the miniaturization of RF products. Utility Model Content

[0003] In view of the above problems, the embodiments of the present application provide an impedance matching circuit, a radio frequency amplifier, a power amplifier and a radio frequency module to solve the above technical problems.

[0004] In a first aspect, an embodiment of the present application provides an impedance matching circuit, comprising an input end, an output end, and a first impedance matching unit connected between the input end and the output end, wherein the first impedance matching unit comprises a first inductor and a first matching capacitor and a resonant capacitor respectively connected to the first inductor, wherein:

[0005] The first inductor is connected in series between the input end and the output end, one end of the first matching capacitor is connected to the first inductor, the other end of the first matching capacitor is grounded, and the resonant capacitor and the first inductor are connected in parallel to form a harmonic suppression unit;

[0006] Alternatively, the first matching capacitor is connected in series between the input end and the output end, one end of the first inductor is connected to the first matching capacitor, the other end of the first inductor is grounded, and the resonant capacitor and the first inductor are connected in series to form a harmonic suppression unit.

[0007] Optionally, one end of the first impedance matching unit is connected to the input end, and the other end of the first impedance matching unit is connected to the output end.

[0008] Optionally, the first inductor is wound on a circuit substrate; the first matching capacitor and the resonant capacitor are integrated into a chip and connected to the first inductor via bonding wires or bumps.

[0009] Optionally, the impedance matching circuit further includes a second impedance matching unit, and the second impedance matching unit includes a second matching capacitor and a second inductor; wherein:

[0010] One end of the second matching capacitor is connected to the output node of the first impedance matching unit, and the other end of the second matching capacitor is connected to the output end; one end of the second inductor is connected to the output end, and the other end of the second inductor is grounded;

[0011] Alternatively, the second inductor is connected in series between the input end and the input node of the first impedance matching unit, one end of the second matching capacitor is connected to the second inductor, and the other end of the second matching capacitor is grounded.

[0012] Optionally, the first inductor is connected in series between the input end and the output end, one end of the first matching capacitor is connected to the first inductor, the other end of the first matching capacitor is grounded, the resonant capacitor and the first inductor are connected in parallel to form a harmonic suppression unit; one end of the second matching capacitor is connected to the output node of the first impedance matching unit, the other end of the second matching capacitor is connected to the output end; one end of the second inductor is connected to the output end, and the other end of the second inductor is grounded.

[0013] Optionally, the impedance of the input end is smaller than the impedance of the output end, and the inductance of the first inductor is smaller than the inductance of the second inductor.

[0014] Optionally, a capacitance value of the first matching capacitor is greater than a capacitance value of the second matching capacitor.

[0015] Optionally, a quality factor of the first inductor is greater than or equal to a quality factor of the second inductor.

[0016] Optionally, the first inductor is wound on a circuit substrate; the first matching capacitor and the resonant capacitor are integrated into a chip and connected to the first inductor via bonding wires or bumps;

[0017] The second matching capacitor and the second inductor are arranged on the circuit substrate, and the first matching capacitor is connected to the second matching capacitor through a bonding wire or a bump; or, the second matching capacitor and the second inductor are integrated into the chip.

[0018] In a second aspect, an embodiment of the present application provides a radio frequency amplifier, comprising a radio frequency amplification circuit and the above-mentioned impedance matching circuit, wherein the impedance matching circuit is connected to an input end or an output end of the radio frequency amplification circuit.

[0019] Optionally, the radio frequency amplifier circuit is a low noise amplifier circuit or a power amplifier circuit.

[0020] In a third aspect, an embodiment of the present application provides a power amplifier, comprising: a power amplifier circuit and an impedance matching circuit connected to an output end of the power amplifier circuit, wherein the impedance matching circuit comprises a first impedance matching unit and a second impedance matching unit;

[0021] The first impedance matching unit includes a first inductor, a first matching capacitor and a resonant capacitor, wherein the first inductor is connected to the output end of the power amplifier circuit, one end of the first matching capacitor is connected to the first inductor, the other end of the first matching capacitor is grounded, and the resonant capacitor is connected in parallel with the first inductor to form a harmonic suppression unit;

[0022] The second impedance matching unit includes a second matching capacitor and a second inductor, wherein one end of the second matching capacitor is connected to the output node of the first impedance matching unit, and the other end of the second matching capacitor is connected to the output end of the power amplifier; one end of the second inductor is connected to the output end of the power amplifier, and the other end of the second inductor is grounded.

[0023] In a third aspect, an embodiment of the present application provides a radio frequency module, comprising the above-mentioned radio frequency amplifier or the above-mentioned power amplifier.

[0024] Optionally, the radio frequency module further includes a circuit substrate and a chip arranged on the circuit substrate;

[0025] A radio frequency amplifier circuit or a power amplifier circuit, a first matching capacitor, and a resonant capacitor are integrated in the chip; a first inductor is arranged on the circuit substrate; and the first matching capacitor and the resonant capacitor are connected to the first inductor via bonding wires or bumps.

[0026] Optionally, the second matching capacitor and the second inductor are respectively arranged on the circuit substrate, and the first matching capacitor is connected to the second matching capacitor through a bonding wire or a bump.

[0027] The impedance matching circuit, radio frequency amplifier, power amplifier and radio frequency module provided in the embodiments of the present application include an input end, an output end and a first impedance matching unit connected between the input end and the output end, wherein the first impedance matching unit includes a first inductor and a first matching capacitor and a resonant capacitor respectively connected to the first inductor, wherein: the first inductor is connected in series between the input end and the output end, one end of the first matching capacitor is connected to the first inductor, the other end of the first matching capacitor is grounded, and the resonant capacitor is connected in parallel with the first inductor to form a harmonic suppression unit; or, the first matching capacitor is connected in series between the input end and the output end, one end of the first inductor is connected to the first matching capacitor, the other end of the first inductor is grounded, and the resonant capacitor is connected in series with the first inductor to form a harmonic suppression unit; in the above manner, a resonant capacitor is set in the first impedance matching unit, and the resonant capacitor and the first inductor in the first impedance matching unit form a harmonic suppression unit, so that the first impedance matching unit is open circuited to a specific harmonic or the impedance to a specific harmonic is zero, thereby multiplexing the impedance matching circuit as a harmonic suppression circuit, and can simultaneously realize impedance matching and harmonic suppression functions with a smaller area, which is conducive to simplifying the circuit structure to achieve circuit miniaturization.

[0028] These and other aspects of the present application will become more clearly understood in the description of the following embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 The diagram shows an application scenario of the impedance matching circuit provided in an embodiment of the present application.

[0030] Figure 2 A schematic diagram of the structure of an impedance matching circuit provided in an embodiment of the present application is shown.

[0031] Figure 3 A schematic diagram of the structure of an impedance matching circuit provided in an embodiment of the present application is shown.

[0032] Figure 4 A schematic diagram of the structure of an impedance matching circuit provided in an embodiment of the present application is shown.

[0033] Figure 5 A schematic diagram of the structure of an impedance matching circuit provided in an embodiment of the present application is shown.

[0034] Figure 6 A schematic diagram of the structure of a radio frequency amplifier provided in an embodiment of the present application is shown.

[0035] Figure 7 A schematic diagram of the structure of a radio frequency amplifier provided in an embodiment of the present application is shown.

[0036] Figure 8A schematic diagram of the structure of a power amplifier provided in an embodiment of the present application is shown.

[0037] Fig. 9 A schematic diagram of the structure of the radio frequency module provided in an embodiment of the present application is shown.

[0038] Fig.10 A schematic diagram of the structure of the radio frequency module provided in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0039] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0040] In order to enable those skilled in the art to better understand the solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application.

[0041] In the embodiments of the present application, it should be noted that, in this article, relational terms such as first and second, etc. are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.

[0042] Moreover, the terms "comprises," "comprising," or any other variation thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0043] In the description of the embodiments of the present application, words such as "example" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "example" or "for example" in the embodiments of the present application is not to be interpreted as being more preferred or having more advantages than another embodiment or design. The use of words such as "example" or "for example" is intended to present relative concepts in a clear manner.

[0044] In addition, the "plurality" in the embodiments of the present application refers to two or more than two. In view of this, in the embodiments of the present application, "plurality" can also be understood as "at least two". "At least one" can be understood as one or more, for example, one, two or more. For example, including at least one means including one, two or more, and there is no limit on which ones are included. For example, including at least one of A, B and C, then A, B, C, A and B, A and C, B and C, or A, B and C can be included.

[0045] It should be noted that, in the embodiments of the present application, "and / or" describes the association relationship of the associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / ", unless otherwise specified, generally indicates that the associated objects before and after are in an "or" relationship.

[0046] It should be noted that in the embodiments of the present application, "connection" can be understood as electrical connection, and the connection between two electrical components can be a direct or indirect connection between the two electrical components. For example, the connection between A and B can be either a direct connection between A and B or an indirect connection between A and B through one or more other electrical components.

[0047] The impedance matching circuit 100 provided in the present application can be applied to Figure 1 The RF front-end module 200 shown, specifically, includes a power amplifier 201, and an impedance matching circuit 100 is applied to the power amplifier 201 in the RF front-end module 200, for matching the output impedance of the front-stage circuit 202 of the power amplifier 201 with the input impedance of the rear-stage circuit 301, and is also used to filter harmonics of a preset frequency band in the power signal of the front-stage circuit 202.

[0048] An embodiment of the present application provides an impedance matching circuit 100. Figure 2 and Figure 3 As shown, the impedance matching circuit 100 of this embodiment includes: an input end 11, an output end 12 and a first impedance matching unit 13, the first impedance matching unit 13 is connected between the input end 11 and the output end 12, wherein the first impedance matching unit 13 includes a first inductor L1, a first matching capacitor C1 and a resonant capacitor C3, the first matching capacitor C1 is connected to the first inductor L1, and the resonant capacitor C3 is connected to the first inductor L1.

[0049] See also Figure 2As shown, the first inductor L1 is connected in series between the input terminal 11 and the output terminal 12, one end of the first matching capacitor C1 is connected to the first inductor L1, the other end of the first matching capacitor C1 is grounded, and the resonant capacitor C3 is connected in parallel with the first inductor L1 to form a harmonic suppression unit. By adjusting the capacitance value of the resonant capacitor C3 and / or the inductance value of the first inductor L1, the harmonic suppression unit formed by the resonant capacitor C3 and the first inductor L1 in parallel can be opened to a specific harmonic, so that the impedance matching circuit 100 of this embodiment can simultaneously achieve impedance matching and harmonic suppression functions. For example, the capacitance value of the resonant capacitor C3 and the inductance value of the first inductor L1 can be adjusted, and the resonant frequency of the harmonic suppression unit can be set in the third-order harmonic frequency band, so that the harmonic suppression unit is open to the third-order harmonic, thereby achieving third-order harmonic suppression.

[0050] In this embodiment, the first inductor L1 is connected in series between the input terminal 11 and the output terminal 12, which can increase the imaginary part of the impedance. The first matching capacitor C1 is connected in parallel to one end of the first inductor L1, which can reduce the imaginary part of the impedance and increase the real part of the impedance. Therefore, the real part of the impedance can be increased and the imaginary part of the impedance can be adjusted by the first inductor L1 and the first matching capacitor C1 to meet the impedance matching requirements.

[0051] Alternatively, see Figure 3 As shown, the first matching capacitor C1 is connected in series between the input terminal 11 and the output terminal 12, one end of the first inductor L1 is connected to the first matching capacitor C1, the other end of the first inductor L1 is grounded, and the resonant capacitor C3 is connected in series with the first inductor L1 to form a harmonic suppression unit. By adjusting the capacitance value of the resonant capacitor C3 and the inductance value of the first inductor L1, the resonant capacitor C3 and the first inductor L1 can be connected in series to form a harmonic suppression unit with zero impedance to a specific harmonic so as to short the harmonic to the ground, so that the impedance matching circuit 100 of this embodiment can simultaneously achieve impedance matching and harmonic suppression functions. For example, the capacitance value of the resonant capacitor C3 and the inductance value of the first inductor L1 can be adjusted so that the impedance of the harmonic suppression unit to the second-order harmonic is zero, thereby shorting the second-order harmonic to the ground and achieving second-order harmonic suppression.

[0052] In this embodiment, the first matching capacitor C1 is connected in series between the input terminal 11 and the output terminal 12, which can reduce the imaginary part of the impedance. The first inductor L1 is connected in parallel to one end of the first matching capacitor C1, which can increase the real part and the imaginary part of the impedance. Therefore, the real part of the impedance can be increased and the imaginary part of the impedance can be adjusted by the first inductor L1 and the first matching capacitor C1 to meet the impedance matching requirements.

[0053] As an implementation method, Figure 2 and Figure 3In the circuit shown, the values ​​of the first inductor L1 and the first matching capacitor C1 can be set according to the impedance matching requirements. Specifically, after the inductance value of the first inductor L1 is set according to the impedance matching requirements, the capacitance value of the third capacitor C3 can be set according to the harmonic suppression requirements, so that the first inductor L1 and the third capacitor C3 resonate within the harmonic frequency band to be suppressed. In this way, a good impedance matching effect can be maintained while achieving harmonic suppression.

[0054] In this embodiment, a resonant capacitor is provided in the first impedance matching unit, and the resonant capacitor and the first inductor in the first impedance matching unit form a harmonic suppression unit, so that the first impedance matching unit is open circuited to a specific harmonic or the impedance to a specific harmonic is zero, thereby multiplexing the impedance matching circuit as a harmonic suppression circuit, and being able to simultaneously realize impedance matching and harmonic suppression functions with a smaller area, which is conducive to simplifying the circuit structure to achieve circuit miniaturization.

[0055] As an implementation mode, one end of the first impedance matching unit 13 is connected to the input end 11, and the other end of the first impedance matching unit 13 is connected to the output end 12. In this implementation mode, only the first impedance matching unit is provided as an impedance matching network, and the impedance matching and harmonic suppression functions are realized at the same time, which is conducive to simplifying the circuit structure.

[0056] As an implementation mode, the first inductor L1 is wound on the circuit substrate; the first matching capacitor C1 and the resonant capacitor C3 are integrated in the chip and connected to the first inductor L1 through bonding wires or bumps. In this implementation mode, since the impedance of the input terminal 11 is small and the current is large, the quality factor of the first impedance matching unit 13 is required to be high. Compared with being integrated in the chip, the first inductor L1 is wound on the circuit substrate, which is conducive to improving the quality factor.

[0057] As an implementation, see Figure 4 and Figure 5 As shown, the impedance matching circuit 100 of this embodiment further includes a second impedance matching unit 14, and the second impedance matching unit 14 includes a second matching capacitor C2 and a second inductor L2.

[0058] Among them, see Figure 4 As shown, one end of the second matching capacitor C2 is connected to the output node 13a of the first impedance matching unit 13, the output node 13a is the connection node of the first inductor L1 and the first matching capacitor C1, and the other end of the second matching capacitor C2 is connected to the output terminal 12; one end of the second inductor L2 is connected to the output terminal 12, and the other end of the second inductor L2 is grounded. Figure 4In the impedance matching circuit 100 shown, the first impedance matching unit 13 is a first-stage impedance matching network, and the second impedance matching unit 14 is a second-stage impedance matching network. The first-stage impedance matching network realizes impedance matching and harmonic suppression functions simultaneously, and the second-stage matching network realizes impedance matching.

[0059] Alternatively, see Figure 5 As shown, the second inductor L2 is connected in series between the input terminal 11 and the input node 13b of the first impedance matching unit 13, the input node 13b is an end of the first inductor L1 close to the input terminal 11, one end of the second matching capacitor C2 is connected to the second inductor L2, and the other end of the second matching capacitor C2 is grounded. Figure 5 In the impedance matching circuit 100 shown, the second impedance matching unit 14 is a first-stage impedance matching network, and the first impedance matching unit 13 is a second-stage impedance matching network. The first-stage impedance matching network realizes impedance matching, and the second-stage matching network realizes impedance matching and harmonic suppression functions simultaneously.

[0060] exist Figure 4 and Figure 5 In the illustrated embodiment, the impedance matching is performed by the first impedance matching unit 13 and the second impedance matching unit 14 working together to more accurately convert the impedance of the output end 12 into the impedance value required by the subsequent circuit.

[0061] In some embodiments, see Figure 4 As shown, the first inductor L1 is connected in series between the input terminal 11 and the output terminal 12, one end of the first matching capacitor C1 is connected to the first inductor L2, the other end of the first matching capacitor C1 is grounded, and the resonant capacitor C3 is connected in parallel with the first inductor L1 to form a harmonic suppression unit; one end of the second matching capacitor C2 is connected to the output node 13a of the first impedance matching unit 13, and the other end of the second matching capacitor C2 is connected to the output terminal 12; one end of the second inductor L2 is connected to the output terminal 12, and the other end of the second inductor L2 is grounded. The first impedance matching unit 13 is a first-stage impedance matching network, and the second impedance matching unit 14 is a second-stage impedance matching network. The first-stage impedance matching network realizes impedance matching and harmonic suppression functions at the same time, and the second-stage matching network realizes impedance matching.

[0062] In some embodiments, the impedance matching circuit 100 can be applied to the output impedance matching of the power amplifier. In this case, the input terminal 11 of the impedance matching circuit 100 is connected to the output terminal of the power amplifier. Specifically, the power amplifier may include a transistor or a plurality of transistors connected in parallel, which are used to realize the power amplification of the radio frequency signal. Optionally, the transistor may be a metal oxide semiconductor (MOS) field effect transistor or a bipolar junction transistor (bipolar junction transistor, BJT) or a heterojunction bipolar transistor (Heterojunction bipolar transistor, HBT). Taking the HBT tube as an example, the input terminal of the impedance matching circuit 100 is connected to the collector of the HBT tube. The impedance matching circuit 100 is used to convert the low impedance of the output terminal of the power amplifier into a high impedance that matches the subsequent circuit of the power amplifier, thereby reducing the loss in the process of transmitting the radio frequency signal to the subsequent circuit. In this case, the impedance of the input terminal 11 of the impedance matching circuit 100 is less than the impedance of the output terminal 12.

[0063] In some embodiments, see Figure 4 As shown, since the impedance of the input terminal 11 of the impedance matching circuit 100 is smaller than the impedance of the output terminal 12, the current of the input terminal 11 is larger than the current of the output terminal 12. In order to reduce the loss of RF power on the impedance matching circuit 100, the inductance of the first inductor L1 is smaller than the inductance of the second inductor L2, so that the loss caused by the large current of the input terminal 11 passing through the first inductor L1 can be reduced. Exemplarily, the inductance of the first inductor L1 is 1 to 3 nH, and the inductance of the second inductor L2 is 5 to 10 nH.

[0064] In some embodiments, see Figure 4 As shown, the capacitance value of the first matching capacitor C1 is greater than the capacitance value of the second matching capacitor C2. Exemplarily, the capacitance value of the first matching capacitor C1 can be set to three times the capacitance value of the second matching capacitor C2, for example, the capacitance value of the first matching capacitor C1 is 15pF, and the capacitance value of the second matching capacitor C2 is 5pF.

[0065] In some embodiments, the quality factor of the first inductor L1 is greater than or equal to the quality factor of the second inductor L2. In this embodiment, the first impedance matching unit 13 is relatively close to the input end 11 with a smaller impedance, and the second impedance matching unit 14 is relatively close to the output end 12 with a larger impedance. The current on the first inductor L1 is larger, and the current on the second inductor L2 is smaller. The quality factor of the first inductor L1 is set to be greater than or equal to the quality factor of the second inductor L2, which can reduce the insertion loss of the impedance matching circuit 100.

[0066] In some embodiments, Figure 4In the impedance matching circuit 100 shown, the first inductor L1 is wound on the circuit substrate; the first matching capacitor C1 and the resonant capacitor C3 are integrated in the chip and connected to the first inductor L1 through bonding wires or bumps; the second matching capacitor C2 and the second inductor L2 are arranged on the circuit substrate, and the first matching capacitor C1 is installed on the substrate through bonding wires or bumps and connected to the second matching capacitor C2; the arrangement of the first inductor L1 wound on the circuit substrate is conducive to increasing the quality factor of the first inductor L1. Optionally, the second inductor L2 can be wound on the circuit substrate, or it can be implemented by a surface mount component SMD. Exemplarily, the first inductor L1 is wound on the circuit substrate, and the second inductor L2 with a larger inductance adopts an SMD component mounted on the surface of the circuit substrate, which can further reduce the area occupied by the impedance matching circuit 100 while ensuring that the insertion loss of the impedance matching circuit 100 is small. Of course, in other examples, the second matching capacitor C2 and the second inductor L2 can also be integrated in the chip.

[0067] An embodiment of the present application provides a radio frequency amplifier. Figure 6 and Figure 7 As shown, the RF amplifier 400 includes a RF amplifying circuit 41 and an impedance matching circuit 100 , and the impedance matching circuit 100 is connected to an input end or an output end of the RF amplifying circuit 41 .

[0068] Among them, see Figure 6 As shown, the impedance matching circuit 100 is connected to the input end of the RF amplifier circuit 41, and is used to match the impedance between the pre-stage circuit and the input end of the RF amplifier circuit 41, and suppress harmonics of a preset frequency band carried in the RF input signal.

[0069] Alternatively, see Figure 7 As shown, the impedance matching circuit 100 is connected to the output end of the RF amplifier circuit 41, and is used to match the impedance between the output end of the RF amplifier circuit 41 and the subsequent circuit, and to suppress harmonics of a preset frequency band in the RF output signal.

[0070] In this embodiment, a resonant capacitor is provided in the first impedance matching unit, and the resonant capacitor and the first inductor in the first impedance matching unit form a harmonic suppression unit, so that the first impedance matching unit is open circuited to a specific harmonic or the impedance to a specific harmonic is zero, thereby multiplexing the impedance matching circuit as a harmonic suppression circuit, and being able to simultaneously realize impedance matching and harmonic suppression functions with a smaller area, which is conducive to simplifying the circuit structure to achieve circuit miniaturization.

[0071] As an implementation manner, the RF amplifier 400 of this embodiment is a low noise amplifier or a power amplifier, and the RF amplifying circuit 41 is a low noise amplifying circuit or a power amplifying circuit.

[0072] An embodiment of the present application provides a power amplifier. Figure 8 As shown, the power amplifier 500 includes a power amplifier circuit 51 and an impedance matching circuit 100 connected to an output terminal 51 a of the power amplifier circuit 51 . The impedance matching circuit 100 includes a first impedance matching unit 13 and a second impedance matching unit 14 .

[0073] Among them, the first impedance matching unit 13 includes a first inductor L1, a first matching capacitor C1 and a resonant capacitor C3, the first inductor L1 is connected to the output terminal 51a of the power amplifier circuit 51, one end of the first matching capacitor C1 is connected to the first inductor L1, the other end of the first matching capacitor C1 is grounded, and the resonant capacitor C3 is connected in parallel with the first inductor L1 to form a harmonic suppression unit.

[0074] Among them, the second impedance matching unit 14 includes a second matching capacitor C2 and a second inductor L2, one end of the second matching capacitor C2 is connected to the output node 13a of the first impedance matching unit 13, and the other end of the second matching capacitor C2 is connected to the output end 500a of the power amplifier 500; one end of the second inductor L2 is connected to the output end 500a of the power amplifier 500, and the other end of the second inductor L2 is grounded.

[0075] In this embodiment, the first impedance matching unit 13 is a first-level impedance matching network, and the second impedance matching unit 14 is a second-level impedance matching network. The first-level impedance matching network realizes impedance matching and harmonic suppression functions at the same time, and the second-level matching network realizes impedance matching. By adjusting the capacitance value of the resonant capacitor C3 and the inductance value of the first inductor L1, the harmonic suppression unit formed by the resonant capacitor C3 and the first inductor L1 in parallel can be opened to a specific harmonic, so that the impedance matching circuit 100 of this embodiment can realize impedance matching and harmonic suppression functions at the same time. For example, the capacitance value of the resonant capacitor C3 and the inductance value of the first inductor L1 can be adjusted, and the resonant frequency of the harmonic suppression unit can be set in the third-order harmonic frequency band, so that the harmonic suppression unit is open to the third-order harmonic, thereby realizing third-order harmonic suppression. For another example, after determining the inductance value of the first inductor L1 according to the impedance matching requirement, the capacitance value of the third capacitor C3 can be set according to the harmonic suppression requirement, so that the first inductor L1 and the third capacitor C3 resonate within the harmonic frequency band to be suppressed. In this way, it is possible to achieve harmonic suppression while maintaining a good impedance matching effect.

[0076] In some embodiments, the first inductor L1 is wound on the circuit substrate; the first matching capacitor C1 and the resonant capacitor C3 are integrated into the chip and connected to the first inductor L1 through bonding wires or bumps; the second matching capacitor C2 and the second inductor L2 are arranged on the circuit substrate, and the first matching capacitor C1 is connected to the second matching capacitor C2 through bonding wires or bumps; in this embodiment, the arrangement of the first inductor L1 wound on the circuit substrate is conducive to increasing the quality factor of the first inductor L1. Optionally, the second inductor L2 can be wound on the circuit substrate, or it can be implemented by a surface mount component SMD. Exemplarily, the first inductor L1 is wound on the circuit substrate, and the second inductor L2 with a larger inductance adopts an SMD component mounted on the surface of the circuit substrate, which can further reduce the area occupied by the impedance matching circuit 100 while ensuring that the insertion loss of the impedance matching circuit 100 is small. Of course, in other examples, the second matching capacitor C2 and the second inductor L2 can also be integrated into the chip.

[0077] An embodiment of the present application provides a radio frequency module. Fig. 9 As shown, the RF module 600 includes the RF amplifier 400 mentioned above.

[0078] In this embodiment, a resonant capacitor is provided in the first impedance matching unit, and the resonant capacitor and the first inductor in the first impedance matching unit form a harmonic suppression unit, so that the first impedance matching unit is open circuited to a specific harmonic or the impedance to a specific harmonic is zero, thereby multiplexing the impedance matching circuit as a harmonic suppression circuit, and being able to simultaneously realize impedance matching and harmonic suppression functions with a smaller area, which is conducive to simplifying the circuit structure to achieve circuit miniaturization.

[0079] As an implementation manner, the RF module 600 of this embodiment further includes a circuit substrate and a chip disposed on the circuit substrate.

[0080] Among them, the radio frequency amplification circuit, the first matching capacitor, and the resonant capacitor are integrated in the chip; the first inductor is arranged on the circuit substrate; the first matching capacitor and the resonant capacitor are connected to the first inductor through bonding wires or bumps.

[0081] In some embodiments, the second matching capacitor and the second inductor are respectively disposed on the circuit substrate, and the first matching capacitor is connected to the second matching capacitor via a bonding wire or a bump.

[0082] An embodiment of the present application provides a radio frequency module. Fig.10 As shown, the RF module 700 includes the above-mentioned power amplifier 500.

[0083] In this embodiment, a resonant capacitor is provided in the first impedance matching unit, and the resonant capacitor and the first inductor in the first impedance matching unit form a harmonic suppression unit, so that the first impedance matching unit is open circuited to a specific harmonic or the impedance to a specific harmonic is zero, thereby multiplexing the impedance matching circuit as a harmonic suppression circuit, and being able to simultaneously realize impedance matching and harmonic suppression functions with a smaller area, which is conducive to simplifying the circuit structure to achieve circuit miniaturization.

[0084] As an implementation manner, the RF module 700 of this embodiment further includes a circuit substrate and a chip disposed on the circuit substrate.

[0085] Among them, the power amplifier circuit, the first matching capacitor, and the resonant capacitor are integrated in the chip; the first inductor is arranged on the circuit substrate; the first matching capacitor and the resonant capacitor are connected to the first inductor through bonding wires or bumps.

[0086] In some embodiments, the second matching capacitor and the second inductor are respectively arranged on the circuit substrate, and the first matching capacitor is connected to the second matching capacitor via a bonding wire or a bump. The second matching capacitor and the second inductor are arranged on the same carrier, which can simplify the connection wiring path between the second matching capacitor and the second inductor, make the layout of the RF module 700 more neat and compact, and can also reduce the coupling caused by redundant wiring.

[0087] The above is only an implementation method of the present application. It should be pointed out that a person skilled in the art can make improvements without departing from the inventive concept of the present application, but these improvements are within the scope of protection of the present application.

Claims

1. An impedance matching circuit, characterized in that: The device comprises an input end, an output end, and a first impedance matching unit connected between the input end and the output end, wherein the first impedance matching unit comprises a first inductor and a first matching capacitor and a resonant capacitor respectively connected to the first inductor, wherein: The first inductor is connected in series between the input end and the output end, one end of the first matching capacitor is connected to the first inductor, the other end of the first matching capacitor is grounded, and the resonant capacitor and the first inductor are connected in parallel to form a harmonic suppression unit; Alternatively, the first matching capacitor is connected in series between the input end and the output end, one end of the first inductor is connected to the first matching capacitor, the other end of the first inductor is grounded, and the resonant capacitor and the first inductor are connected in series to form a harmonic suppression unit.

2. The impedance matching circuit according to claim 1, characterized in that: One end of the first impedance matching unit is connected to the input end, and the other end of the first impedance matching unit is connected to the output end.

3. The impedance matching circuit according to claim 1, characterized in that: The first inductor is wound on a circuit substrate; the first matching capacitor and the resonant capacitor are integrated in a chip and connected to the first inductor via bonding wires or bumps.

4. The impedance matching circuit according to claim 1, characterized in that: The impedance matching circuit further includes a second impedance matching unit, and the second impedance matching unit includes a second matching capacitor and a second inductor; wherein: One end of the second matching capacitor is connected to the output node of the first impedance matching unit, and the other end of the second matching capacitor is connected to the output end; one end of the second inductor is connected to the output end, and the other end of the second inductor is grounded; Alternatively, the second inductor is connected in series between the input end and the input node of the first impedance matching unit, one end of the second matching capacitor is connected to the second inductor, and the other end of the second matching capacitor is grounded.

5. The impedance matching circuit according to claim 4, characterized in that: The first inductor is connected in series between the input end and the output end, one end of the first matching capacitor is connected to the first inductor, the other end of the first matching capacitor is grounded, the resonant capacitor and the first inductor are connected in parallel to form a harmonic suppression unit; one end of the second matching capacitor is connected to the output node of the first impedance matching unit, the other end of the second matching capacitor is connected to the output end; one end of the second inductor is connected to the output end, the other end of the second inductor is grounded.

6. The impedance matching circuit according to claim 5, characterized in that: The impedance of the input end is smaller than the impedance of the output end, and the inductance of the first inductor is smaller than the inductance of the second inductor.

7. The impedance matching circuit according to claim 6, characterized in that: The capacitance value of the first matching capacitor is greater than the capacitance value of the second matching capacitor.

8. The impedance matching circuit according to claim 5, characterized in that: A quality factor of the first inductor is greater than or equal to a quality factor of the second inductor.

9. The impedance matching circuit according to claim 5, characterized in that: The first inductor is wound on a circuit substrate; the first matching capacitor and the resonant capacitor are integrated into a chip and connected to the first inductor via bonding wires or bumps; The second matching capacitor and the second inductor are arranged on the circuit substrate, and the first matching capacitor is connected to the second matching capacitor through a bonding wire or a bump; or, the second matching capacitor and the second inductor are integrated into the chip.

10. A radio frequency amplifier, characterized in that: It comprises a radio frequency amplifying circuit and an impedance matching circuit as claimed in any one of claims 1 to 9, wherein the impedance matching circuit is connected to an input end or an output end of the radio frequency amplifying circuit.

11. The radio frequency amplifier according to claim 10, characterized in that: The radio frequency amplifier circuit is a low noise amplifier circuit or a power amplifier circuit.

12. A power amplifier, characterized in that: include: A power amplifier circuit and an impedance matching circuit connected to an output end of the power amplifier circuit, wherein the impedance matching circuit comprises a first impedance matching unit and a second impedance matching unit; The first impedance matching unit includes a first inductor, a first matching capacitor and a resonant capacitor, wherein the first inductor is connected to the output end of the power amplifier circuit, one end of the first matching capacitor is connected to the first inductor, the other end of the first matching capacitor is grounded, and the resonant capacitor is connected in parallel with the first inductor to form a harmonic suppression unit; The second impedance matching unit includes a second matching capacitor and a second inductor, wherein one end of the second matching capacitor is connected to the output node of the first impedance matching unit, and the other end of the second matching capacitor is connected to the output end of the power amplifier; one end of the second inductor is connected to the output end of the power amplifier, and the other end of the second inductor is grounded.

13. A radio frequency module, characterized in that: It comprises the radio frequency amplifier as claimed in claim 10 or 11 or the power amplifier as claimed in claim 12.

14. The radio frequency module according to claim 13, characterized in that: The radio frequency module also includes a circuit substrate and a chip arranged on the circuit substrate; A radio frequency amplifier circuit or a power amplifier circuit, a first matching capacitor, and a resonant capacitor are integrated in the chip; a first inductor is arranged on the circuit substrate; and the first matching capacitor and the resonant capacitor are connected to the first inductor via bonding wires or bumps.

15. The radio frequency module according to claim 14, characterized in that: The second matching capacitor and the second inductor are respectively arranged on the circuit substrate, and the first matching capacitor is connected to the second matching capacitor through a bonding wire or a bump.

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