Chip flip quartz crystal oscillator base mechanism

Abstract

The utility model discloses a quartz crystal oscillator base mechanism with a flip chip, which is characterized by comprising a base; the base is composed of a substrate layer, an integrated chip mounting layer, a vibrator electrode layer and a kovar ring in sequence from bottom to top. A first cavity is arranged in the integrated chip mounting layer, and a temperature compensation oscillating circuit integrated chip is arranged in the first cavity; a second cavity is arranged in the vibrator electrode layer, the first cavity and the second cavity are communicated, and a quartz vibrator is arranged in the second cavity. Through the application of the quartz crystal oscillator base mechanism with the flip chip, the flip chip technology is adopted, the circuit integrated chip is arranged, the circuit is simple and stable, the production technology is simple and convenient, the production cycle is further effectively shortened, the production efficiency is improved, environmental protection and energy saving are achieved, the base structure is simplified, and the product is more miniaturized.

Description

Technical Field

[0001] The utility model relates to the relevant technical fields of quartz crystal oscillators, and in particular to a base mechanism of a flip-chip quartz crystal oscillator. Background Art

[0002] In the field of quartz crystal oscillators, the key lies in frequency stability and size. Smaller products can be used in more sophisticated equipment and instruments. At the same time, the trend of miniaturization of electronic products is obvious, and more and more electronic products strive to be smaller, more sophisticated, and more efficient. In order to make quartz crystal oscillators smaller, it is necessary to combine the base and wafer of corresponding size for processing.

[0003] In the existing technology, the smallest size that can be achieved is 1.65mm*1.25mm, but the base structure of this size is currently not suitable for "wire bonding" to connect the base and the chip. Utility Model Content

[0004] In view of this, in order to solve the above problems, the purpose of the utility model is to provide a flip-chip quartz crystal oscillator base mechanism, characterized in that it includes:

[0005] Pedestal;

[0006] The base is composed of a substrate layer, an integrated chip mounting layer, a vibrator electrode layer and a ferrite ring from bottom to top;

[0007] A first cavity is provided in the integrated chip mounting layer, and a temperature compensation oscillation circuit integrated chip is arranged in the first cavity;

[0008] A second cavity is disposed in the vibrator electrode layer, and the first cavity and the second cavity are connected to each other. A quartz vibrator is disposed in the second cavity.

[0009] The above-mentioned flip-chip quartz crystal oscillator base mechanism is characterized in that the inner wall of the second cavity is provided with a lead-out PAD.

[0010] The above-mentioned flip-chip quartz crystal oscillator base structure is characterized in that it also includes: four first conductive grooves, the four first conductive grooves extend from the four corners of the substrate layer to the four corners of the vibrator electrode layer, and each of the first conductive grooves is arc-shaped.

[0011] The above-mentioned flip-chip quartz crystal oscillator base structure is characterized in that it also includes: two second conductive grooves, the two second conductive grooves extend from the length direction of the substrate layer to the vibrator electrode layer, and each second conductive groove is "U"-shaped.

[0012] The above-mentioned flip-chip quartz crystal oscillator base structure is characterized in that a plurality of external electrode pads are provided on the lower surface of the substrate layer.

[0013] The above-mentioned flip-chip quartz crystal oscillator base mechanism is characterized in that the temperature-compensated oscillation circuit integrated chip is soldered to the integrated chip mounting layer by gold ball flip-chip bonding.

[0014] The above-mentioned flip-chip quartz crystal oscillator base structure is characterized in that the quartz vibrator is bonded to the vibrator electrode layer by conductive adhesive.

[0015] The above-mentioned flip-chip quartz crystal oscillator base mechanism is characterized in that a positive electrode and a negative electrode are provided on the quartz resonator, and the quartz resonator is connected to the pin electrode of the temperature compensation oscillation circuit integrated chip through the first conductive groove and the second conductive groove.

[0016] The above-mentioned flip-chip quartz crystal oscillator base structure is characterized in that the substrate layer, the integrated chip mounting layer and the vibrator electrode layer are all made of ceramic materials.

[0017] Compared with the prior art, the above technical solution has the following positive effects:

[0018] Through the application of the utility model, a chip flip-chip quartz crystal oscillator base mechanism is provided, which adopts the flip-chip process and sets the circuit integrated chip. The circuit is simple and stable, the production process is simple, and the production cycle is further effectively shortened, the production efficiency is improved, the environment is environmentally friendly and energy-saving, and the base structure is simplified, making the product more miniaturized. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 The utility model is a schematic diagram of a base mechanism of a flip-chip quartz crystal oscillator.

[0020] Figure 2 It is a schematic diagram of the substrate layer in the utility model.

[0021] Figure 3 It is a schematic diagram of the temperature compensation oscillation circuit integrated chip in the utility model.

[0022] Figure 4 It is a schematic diagram of the quartz oscillator in the utility model.

[0023] Figure 5 It is a schematic diagram of the installation of the integrated chip of the temperature compensation oscillation circuit in the utility model.

[0024] Figure 6 This is a schematic diagram of the installation of the quartz vibrator in the utility model.

[0025] 1. Substrate layer; 2. Integrated chip mounting layer; 3. Vibrator electrode layer; 4. Coil; 5. Lead PAD; 6. First conductive groove; 7. Second conductive groove; 8. External electrode pad; 9. Temperature compensation oscillation circuit integrated chip; 10. Pin; 11. Quartz vibrator; 12. Positive electrode; 13. Negative electrode; 14. Conductive glue; 15. Conductive glue. DETAILED DESCRIPTION

[0026] The present invention will be further described below in conjunction with the accompanying drawings and specific implementations, but they are not intended to limit the present invention.

[0027] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effect that the utility model can produce and the purpose that can be achieved, should still fall within the scope of the technical content disclosed by the utility model. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the utility model. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the utility model without substantial change of the technical content.

[0028] like Figures 1 to 6 As shown, a chip flip-chip quartz crystal oscillator base mechanism of a preferred embodiment is shown, characterized in that it includes: a base.

[0029] The base is composed of a substrate layer 1, an integrated chip mounting layer 2, a vibrator electrode layer 3 and a variator ring 4 from bottom to top; a first cavity is provided in the integrated chip mounting layer 2, and a temperature compensation oscillation circuit integrated chip 9 is arranged in the first cavity; a second cavity is provided in the vibrator electrode layer 3, and the first cavity and the second cavity are connected, and a quartz vibrator 11 is arranged in the second cavity.

[0030] In actual use, the size of the base is 1.65mm*1.25mm, and a first cavity is provided in the integrated chip mounting layer 2, so that the temperature compensation oscillation circuit integrated chip 9 is flipped on the base, effectively avoiding the technical difficulty of the "wire bonding" operation. In addition, the area of ​​the first cavity is larger than that of the second cavity, and the cutting ring 4 is arranged around the edge of the second cavity.

[0031] The utility model also has the following implementation methods based on the above:

[0032] Furthermore, a flip-chip quartz crystal oscillator base mechanism is characterized in that the inner wall of the second cavity is provided with a lead-out PAD 5. Specifically, a lead-out PAD 5 with a length of 0.08-0.16 mm and a width of 0.20 mm is provided on the vibrating electron electrode layer 3 of the base to prevent the chip from sagging after mounting.

[0033] Furthermore, a flip-chip quartz crystal oscillator base structure is characterized in that it also includes: four first conductive slots 6, the four first conductive slots 6 extend from the four corners of the substrate layer 1 to the four corners of the vibrator electrode layer 3, and each first conductive slot 6 is arc-shaped.

[0034] Furthermore, a flip-chip quartz crystal oscillator base mechanism is characterized in that it also includes: two second conductive slots 7, and the two second conductive slots 7 extend from the length direction of the substrate layer 1 to the vibrator electrode layer 3. Specifically, the substrate layer 1, the integrated chip mounting layer 2, and the vibrator motor layer 3 are connected to the circuit through the first conductive slot 6 and the second conductive slot 7, and each second conductive slot 7 is "U" shaped.

[0035] Furthermore, a flip-chip quartz crystal oscillator base structure is characterized in that a plurality of external electrode pads are provided on the lower surface of the substrate layer 1. Specifically, the external electrode pads on the lower surface of the substrate layer 1 are connected to external components.

[0036] Furthermore, a flip-chip quartz crystal oscillator base mechanism is characterized in that the temperature compensation oscillation circuit integrated chip 9 is flip-chip soldered to the integrated chip mounting layer 2 by gold ball flip-chip soldering. Specifically, the flip-chip soldering has high quality, high soldering efficiency and good soldering stability.

[0037] Furthermore, a flip-chip quartz crystal oscillator base structure is characterized in that the quartz vibrator is bonded to the vibrator electrode layer by conductive adhesive.

[0038] Furthermore, a flip-chip quartz crystal oscillator base mechanism is provided, characterized in that a positive electrode 12 and a negative electrode 13 are provided on the quartz resonator 11, and the quartz resonator 11 is connected to the pin electrodes of the temperature compensation oscillation circuit integrated chip 9 through the first conductive groove 6 and the second conductive groove 7.

[0039] Furthermore, a flip-chip quartz crystal oscillator base structure is characterized in that the substrate layer 1, the integrated chip mounting layer 2 and the vibrator electrode layer 3 are all made of ceramic materials.

[0040] The above description is only a preferred embodiment of the present invention, and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A flip-chip quartz crystal oscillator base mechanism, characterized in that: include: Pedestal; The base is composed of a substrate layer, an integrated chip mounting layer, a vibrator electrode layer and a ferrite ring from bottom to top; A first cavity is provided in the integrated chip mounting layer, and a temperature compensation oscillation circuit integrated chip is arranged in the first cavity; A second cavity is disposed in the vibrator electrode layer, and the first cavity and the second cavity are connected to each other. A quartz vibrator is disposed in the second cavity.

2. A flip-chip quartz crystal oscillator base mechanism according to claim 1, characterized in that: The inner wall of the second cavity is provided with a lead-out PAD.

3. A flip-chip quartz crystal oscillator base mechanism according to claim 2, characterized in that: Also includes: Four first conductive slots are provided, wherein the four first conductive slots extend from four corners of the substrate layer to four corners of the vibrator electrode layer, and each of the first conductive slots is arc-shaped.

4. A flip-chip quartz crystal oscillator base mechanism according to claim 3, characterized in that: Also includes: Two second conductive grooves are extended from the length direction of the substrate layer to the vibrator electrode layer, and each of the second conductive grooves is in a "U" shape.

5. The flip-chip quartz crystal oscillator base mechanism according to claim 1, characterized in that: A plurality of external electrode pads are arranged on the lower surface of the substrate layer.

6. The flip-chip quartz crystal oscillator base mechanism according to claim 1, characterized in that: The temperature compensation oscillation circuit integrated chip is flip-chip soldered to the integrated chip mounting layer by gold ball.

7. The flip-chip quartz crystal oscillator base mechanism according to claim 1, characterized in that: The quartz vibrator is bonded to the vibrator electrode layer by conductive adhesive.

8. The flip-chip quartz crystal oscillator base mechanism according to claim 4, characterized in that: The quartz vibrator is provided with a positive electrode and a negative electrode, and the quartz vibrator is electrically connected to the pin electrodes of the temperature compensation oscillation circuit integrated chip through the first conductive slot and the second conductive slot.

9. The flip-chip quartz crystal oscillator base mechanism according to claim 1, characterized in that: The substrate layer, the integrated chip mounting layer and the vibrator electrode layer are all made of ceramic materials.

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