Signal switching substrate and signal switching device
By using signal adapter substrates in automation equipment, reducing manual wiring, solving the problems of traditional low wiring efficiency and high error rate, achieving more efficient wiring and simplified maintenance processes.
Patent Information
- Application Number
- CN202420197310.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-26
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-01-26
AI Technical Summary
Traditional automation equipment is inefficient and has high error rate during wiring, and it is difficult to find faults during subsequent maintenance.
A signal adapter substrate is provided, including a signal input module and a signal output module, through which signals are received and outputted, reducing manual wiring requirements.
It improves the wiring efficiency of operators, reduces wiring difficulty, and simplifies the equipment maintenance process.
Smart Images
Figure CN222464729U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of automation equipment, in particular to a signal switching substrate and a signal switching device. Background Art
[0002] Traditional automation equipment usually requires operators to make connectors according to the locations of various electrical components, route the wires to the programmable logic controller (PLC) module, and complete the wiring inside the equipment.
[0003] At present, operators need to make various wires required for wiring on site, which will result in multiple cables inside the equipment. Not only is the wiring efficiency low and the wiring error rate high, but wiring faults are also difficult to find during subsequent on-site maintenance of the equipment. Utility Model Content
[0004] Based on this, the embodiments of the present application provide a signal switching substrate and a signal switching device, which can improve the wiring efficiency of operators and reduce the difficulty of wiring.
[0005] According to some embodiments, the present application provides, on one hand, a signal transfer substrate, which is applied to multiple components in a device, including a substrate body and a signal input module and a signal output module disposed on the substrate body;
[0006] The signal input module is used to connect to an external programmable logic controller and receive a transmission signal input by the programmable logic controller;
[0007] The signal output module is connected to the signal input module and to each of the components; the signal output module acquires the transmission signal and outputs the transmission signal to each of the components;
[0008] Wherein, the signal input module and the signal output module are arranged side by side and spaced apart.
[0009] In some embodiments, the signal input module includes a plurality of signal input submodules, and the signal output module includes a plurality of signal output submodules connected to the plurality of signal input submodules in a one-to-one correspondence;
[0010] The arrangement of the plurality of signal input submodules is the same as the arrangement of the plurality of signal output submodules.
[0011] In some embodiments, the plurality of signal input submodules are distributed in an array, and the plurality of signal output submodules are distributed in an array.
[0012] In some embodiments, the signal transfer substrate further includes:
[0013] A power supply, connected to the signal input module and the signal output module, and used to supply power to the signal input module and the signal output module;
[0014] A power input safety protection circuit module is connected to the power supply; the power input safety protection circuit module is configured to cut off the connection between the power supply and the signal input module and the signal output module when it is detected that the positive and negative poles of the power supply are reversely connected.
[0015] In some embodiments, the signal transfer substrate further includes:
[0016] A first indicator light is connected to the power input safety protection circuit module; the first indicator light lights up when the power input safety protection circuit module detects that the positive and negative poles of the power supply are correctly connected.
[0017] In some embodiments, the power supply is disposed on a side of the signal input module away from the signal output module, and is spaced apart from the signal input module;
[0018] The first indicator light is disposed between the signal input module and the power supply, and is spaced apart from the signal input module and the power supply.
[0019] In some embodiments, the signal input module is disposed near the top side of the substrate body;
[0020] The plurality of signal input submodules include a first part and a second part; the plurality of signal input submodules of the first part are distributed in an array in a first area, and the plurality of signal input submodules of the second part are arranged in a second area; the distance between the first area and the top side of the substrate body is smaller than the distance between the second area and the top side of the substrate body;
[0021] The power source is disposed on a side of the first area close to the second area and is located between the second area and the top side of the substrate body.
[0022] In some embodiments, each of the signal input submodules includes a plurality of input terminals arranged side by side and spaced apart; each of the signal output submodules includes a plurality of output terminals arranged side by side and spaced apart;
[0023] The plurality of input terminals on the signal input submodule are connected in a one-to-one correspondence with the plurality of output terminals on the signal output submodule corresponding to the signal input submodule.
[0024] In some embodiments, each of the signal input submodules includes at least 6 input terminals; each of the signal output submodules includes at least 6 output terminals.
[0025] According to some embodiments, the present application provides a signal switching device on the other hand, including a programmable logic controller and the signal switching substrate as described in some of the above embodiments.
[0026] The embodiments of the present application may or at least have the following advantages:
[0027] In the signal transfer substrate provided in the embodiment of the present application, a signal input module and a signal output module are provided on the substrate body, and the transmission signal input by the external programmable logic controller can be received through the signal input module, and transferred to each component through the signal output module. In this way, there is no need for the operator to manually wire, and the wiring is done in the open, which is conducive to improving the wiring efficiency of the operator and reducing the difficulty of wiring. In addition, the signal transfer substrate provided in the embodiment of the present application has a simple structure and is easy to use, so it also has high practicality.
[0028] The signal switching device provided in the embodiment of the present application includes the aforementioned signal switching substrate, so the technical effects that can be achieved by the aforementioned signal switching substrate can also be achieved by the signal switching device, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0030] Figure 1 A schematic diagram of application scenarios of the signal transfer substrate provided in some embodiments of the present application;
[0031] Figure 2 A schematic diagram of the structure of a signal transfer substrate provided in some embodiments of the present application;
[0032] Figure 3 A schematic diagram of the structure of a signal transfer substrate provided in some other embodiments of the present application;
[0033] Figure 4 A schematic diagram of the structure of a signal transfer substrate provided in some further embodiments of the present application;
[0034] Figure 5 A connection block diagram of a power input safety protection circuit module in a signal transfer substrate provided in some embodiments of the present application.
[0035] Description of reference numerals:
[0036] 1. Signal transfer substrate; 2. Component; 3. Programmable logic controller; 100. Substrate body; 110. Signal input module; 120. Signal output module; 110a. Signal input submodule; 120a. Signal output submodule; 410. Power supply; 420. Power input safety protection circuit module; 430. First indicator light. DETAILED DESCRIPTION
[0037] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.
[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.
[0039] It is understood that the terms "first", "second", etc. used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, without departing from the scope of this application, a first area may be referred to as a second area, and similarly, a second area may be referred to as a first area. Both the first area and the second area are areas, but they are not the same area.
[0040] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if the connected circuits, modules, units, etc. have electrical signals or data transmission between each other.
[0041] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. At the same time, the term "and / or" used in this specification includes any and all combinations of the relevant listed items.
[0042] At present, operators need to make various wires required for wiring on site, which will result in multiple cables inside the equipment. Not only is the wiring efficiency low and the wiring error rate high, but wiring faults are also difficult to find during subsequent on-site maintenance of the equipment.
[0043] Based on this, the embodiments of the present application provide a signal transfer substrate and a signal transfer device, which can improve the wiring efficiency of operators and reduce the wiring difficulty. The details will be described in the subsequent embodiments.
[0044] See also Figure 1 According to some embodiments, the present application provides a signal transfer substrate 1, which is applied to multiple components 2 in a device.
[0045] See also Figure 2 The signal transfer substrate 1 may include a substrate body 100 and a signal input module 110 and a signal output module 120 disposed on the substrate body 100. The signal input module 110 may be used to connect to an external programmable logic controller 3 and receive a transmission signal input by the programmable logic controller 3. The signal output module 120 is connected to the signal input module 110 and to each component 2; the signal output module 120 may be used to obtain the aforementioned transmission signal and output the transmission signal to each component 2.
[0046] As an example, the signal input module 110 and the signal output module 120 may be arranged side by side and spaced apart.
[0047] In the signal transfer substrate 1 provided in the above embodiment, a signal input module 110 and a signal output module 120 are provided on the substrate body 100, and the transmission signal input by the external programmable logic controller 3 can be received through the signal input module 110, and transferred to each component 2 through the signal output module 120. In this way, there is no need for operators to manually wire, and the wiring is done in the open, which is conducive to improving the wiring efficiency of operators and reducing the difficulty of wiring. In addition, the signal transfer substrate 1 provided in the above embodiment has a simple structure and is easy to use, so it also has high practicality.
[0048] In some embodiments, the signal input module 110 may include a plurality of signal input sub-modules 110 a , and the signal output module 120 may include a plurality of signal output sub-modules 120 a connected to the plurality of signal input sub-modules 110 a in a one-to-one correspondence.
[0049] The embodiment of the present application does not specifically limit the number of the signal input submodules 110a in the signal input module 110. As an example, the signal input module 110 may include 16 signal input submodules 110a, such as Figure 2 It may also include 8 signal input submodules 110a, such as Figure 3 It may also include two signal input submodules 110a, such as Figure 4 shown.
[0050] As an example, the arrangement of the plurality of signal input submodules 110 a may be the same as the arrangement of the plurality of signal output submodules 120 a .
[0051] Please continue reading Figures 2 to 4 In some embodiments, the plurality of signal input submodules 110a are distributed in an array, and the plurality of signal output submodules 120a are distributed in an array.
[0052] See also Figure 5 In some embodiments, the signal transfer substrate 1 may further include a power supply 410 and a power input safety protection circuit module 420 .
[0053] The power supply 410 is connected to the signal input module 110 and the signal output module 120 , and is used to supply power to the signal input module 110 and the signal output module 120 .
[0054] The power input safety protection circuit module 420 is connected to the power supply 410. The power input safety protection circuit module 420 can cut off the connection between the power supply 410 and the signal input module 110 and the signal output module 120 when detecting that the positive and negative poles of the power supply 410 are reversely connected. Therefore, the provision of the power input safety protection circuit module 420 can effectively protect the automation equipment from being damaged due to the reverse connection of the positive and negative poles of the power supply 410, thereby improving the reliability of the use of the automation equipment.
[0055] Please continue reading Figure 5 In some embodiments, the signal transfer substrate 1 may further include a first indicator light 430 .
[0056] The first indicator light 430 is connected to the power input safety protection circuit module 420 , and the first indicator light 430 may light up when the power input safety protection circuit module 420 detects that the positive and negative poles of the power supply 410 are correctly connected.
[0057] With the signal transfer device provided in the above embodiment, when the positive and negative poles of the power supply 410 are reversely connected, the first indicator light 430 is off, indicating that the power supply 410 is connected incorrectly, and the power input safety protection circuit module 420 cuts off the connection with the power supply 410. When the positive and negative poles of the power supply 410 are correctly connected, the first indicator light 430 is on, and the power input safety protection circuit module 420 is in a normal conduction state, and the power supply 410 supplies power to each component 2 via each control circuit.
[0058] In some embodiments, Figure 2 As shown, the power supply 410 may be disposed on a side of the signal input module 110 away from the signal output module 120 , and be spaced apart from the signal input module 110 .
[0059] As an example, Figure 2 As shown, the first indicator light 430 may be disposed between the signal input module 110 and the power supply 410 , and may be spaced apart from the signal input module 110 and the power supply 410 .
[0060] In some embodiments, Figure 2 As shown, the signal input module 110 may be disposed close to the top side of the substrate body 100 .
[0061] For ease of description, in some embodiments, the plurality of signal input submodules 110a are defined as including a first part and a second part. Figure 2 It is understood that the first part of the plurality of signal input submodules 110a are arrayed in the first area A, and the second part of the plurality of signal input submodules 110a are arranged in the second area B. The distance between the first area A and the top side of the substrate body 100 is smaller than the distance between the second area B and the top side of the substrate body 100.
[0062] In some embodiments, Figure 2 As shown, the power source 410 is disposed on a side of the first region A close to the second region B, and is located between the second region B and the top side of the substrate body 100 .
[0063] Please continue reading Figure 2 In some embodiments, each signal input submodule 110a may include a plurality of input terminals arranged side by side and spaced apart, and each signal output submodule 120a may include a plurality of output terminals arranged side by side and spaced apart. The plurality of input terminals on the signal input submodule 110a are connected one-to-one with the plurality of output terminals on the signal output submodule 120a corresponding to the signal input submodule 110a.
[0064] The embodiment of the present application does not specifically limit the number of input terminals provided on each signal input submodule 110a. As an example, each signal input submodule 110a may include at least 6 input terminals; illustratively, the number of input terminals provided on each signal input submodule 110a may be 6, 8, 10, 12 or 14, etc.
[0065] For example Figures 2 to 4 As shown, each signal input submodule 110 a may include 12 input terminals.
[0066] The embodiment of the present application does not specifically limit the number of output terminals provided on each signal output submodule 120a. As an example, each signal output submodule 120a may include at least 6 output terminals; illustratively, the number of output terminals provided on each signal output submodule 120a may be 6, 8, 10, 12 or 14, etc.
[0067] For example Figures 2 to 4 As shown, each signal output submodule 120a may include at least 12 output terminals.
[0068] According to some embodiments, the present application also provides a signal switching device, which may include a programmable logic controller 3 and a signal switching substrate 1 provided in some of the above embodiments.
[0069] The signal switching device provided in the above embodiment includes the above-mentioned signal switching substrate 1. Therefore, the technical effects that can be achieved by the above-mentioned signal switching substrate 1 can also be achieved by the signal switching device, which will not be described in detail here.
[0070] It can be understood that the signal switching device in the embodiment of the present application includes the aforementioned signal switching substrate 1, so the technical features between the signal switching substrate embodiment and the signal switching device embodiment can be replaced and supplemented with each other without causing conflicts, so that technical personnel in this field can understand the technical content of the present application.
[0071] In the description of this specification, the descriptions with reference to the terms "some embodiments", "other embodiments", "ideal embodiments", etc., mean that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the utility model. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.
[0072] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0073] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A signal transfer substrate, characterized in that: A plurality of components applied to a device, including a substrate body and a signal input module and a signal output module arranged on the substrate body; The signal input module is used to connect to an external programmable logic controller and receive a transmission signal input by the programmable logic controller; The signal output module is connected to the signal input module and to each of the components; the signal output module acquires the transmission signal and outputs the transmission signal to each of the components; Wherein, the signal input module and the signal output module are arranged side by side and spaced apart.
2. The signal transfer substrate according to claim 1, characterized in that: The signal input module includes a plurality of signal input submodules, and the signal output module includes a plurality of signal output submodules connected to the plurality of signal input submodules in a one-to-one correspondence; The arrangement of the plurality of signal input submodules is the same as the arrangement of the plurality of signal output submodules.
3. The signal transfer substrate according to claim 2, characterized in that: The plurality of signal input submodules are distributed in an array, and the plurality of signal output submodules are distributed in an array.
4. The signal transfer substrate according to claim 2, characterized in that: Also includes: A power supply, connected to the signal input module and the signal output module, and used to supply power to the signal input module and the signal output module; A power input safety protection circuit module is connected to the power supply; the power input safety protection circuit module is configured to cut off the connection between the power supply and the signal input module and the signal output module when it is detected that the positive and negative poles of the power supply are reversely connected.
5. The signal transfer substrate according to claim 4, characterized in that: Also includes: A first indicator light is connected to the power input safety protection circuit module; the first indicator light lights up when the power input safety protection circuit module detects that the positive and negative poles of the power supply are correctly connected.
6. The signal transfer substrate according to claim 5, characterized in that: The power supply is arranged on a side of the signal input module away from the signal output module, and is spaced apart from the signal input module; The first indicator light is disposed between the signal input module and the power supply, and is spaced apart from the signal input module and the power supply.
7. The signal transfer substrate according to claim 6, characterized in that: The signal input module is arranged close to the top side of the substrate body; The plurality of signal input submodules include a first part and a second part; the plurality of signal input submodules of the first part are distributed in an array in a first area, and the plurality of signal input submodules of the second part are arranged in a second area; The distance between the first region and the top side of the substrate body is smaller than the distance between the second region and the top side of the substrate body; The power source is disposed on a side of the first area close to the second area and is located between the second area and the top side of the substrate body.
8. The signal transfer substrate according to claim 2, characterized in that: Each of the signal input submodules includes a plurality of input terminals arranged side by side and spaced apart; each of the signal output submodules includes a plurality of output terminals arranged side by side and spaced apart; The plurality of input terminals on the signal input submodule are connected in a one-to-one correspondence with the plurality of output terminals on the signal output submodule corresponding to the signal input submodule.
9. The signal transfer substrate according to claim 8, characterized in that: Each of the signal input submodules includes at least 6 input terminals; each of the signal output submodules includes at least 6 output terminals.
10. A signal switching device, characterized in that: It comprises a programmable logic controller and a signal transfer substrate as claimed in any one of claims 1 to 9.