Circuit board assembly and electronic equipment

Abstract

The utility model provides a circuit board assembly and electronic equipment. The circuit board assembly comprises a circuit board, an adapter plate, a fixing piece, an elastic piece and a functional device. A through hole is formed in the circuit board and penetrates through the circuit board in the thickness direction of the circuit board. The adapter plate and the circuit board are stacked, and the orthographic projection of the adapter plate to the circuit board covers at least part of the through holes. The fixing piece is fixedly connected with the adapter plate and the circuit board. The elastic piece is located between the circuit board and the adapter plate, is spaced from the fixing piece, and is electrically connected between the circuit board and the adapter plate. The functional device penetrates through the through hole and is installed on the surface, facing the through hole, of the adapter plate. According to the circuit board assembly provided by the embodiment of the invention, the reliability of the electric connection between the electronic element and the circuit board can be improved, so that the structural stability and the electric connection stability of the thinned circuit board are not influenced.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a circuit board assembly and an electronic device. Background Art

[0002] As consumers' demands for the appearance and portability of electronic devices increase, lightweight design has become an important trend in the development of electronic devices. In order to meet the demand for lightweight design of electronic devices, circuit board components that occupy a large installation space inside electronic devices need to be thinned to improve the utilization rate of the internal space of electronic devices, so that more devices can be integrated into a smaller space, thereby achieving a higher degree of integration. At present, electronic devices are generally installed on circuit boards, and the thickness of the circuit board assembly is basically equal to the height of the electronic device and the thickness of the circuit board superimposed, which is not conducive to the lightweight design of the circuit board assembly. Utility Model Content

[0003] Embodiments of the present application provide a circuit board assembly and an electronic device, which can improve the reliability of the electrical connection between electronic components and circuit boards.

[0004] In a first aspect, the present application provides a circuit board assembly, including a circuit board, an adapter plate, a fixing member, an elastic member, and a functional device. The circuit board is provided with a through hole, and the through hole penetrates the circuit board along the thickness direction of the circuit board. The adapter plate and the circuit board are stacked, and the orthographic projection of the adapter plate onto the circuit board covers at least part of the through hole. The fixing member fixes the adapter plate and the circuit board. The elastic member is located between the circuit board and the adapter plate, and is spaced apart from the fixing member, and is electrically connected between the circuit board and the adapter plate. The functional device is passed through the through hole and is mounted on the surface of the adapter plate facing the through hole.

[0005] In this embodiment, part of the structure of the functional device is located between the circuit and the adapter board, part of the structure of the functional device is located in the through hole of the circuit board, and the other part of the structure of the functional device can be located on the side of the circuit board away from the adapter board. Since the thickness of the adapter board can be less than the thickness of the circuit board, the thickness of the circuit board assembly can be reduced, and the functional device can use the space in the through hole, so the thickness of the circuit board assembly is not affected by the thickness of the circuit board, so that the circuit board assembly can be further thinned.

[0006] After the overall thinning of the circuit board assembly, the required installation space is reduced, so that the internal space of the electronic device can be reduced, and the electronic device can be further thinned. Thinner circuit board assemblies help achieve thinner product designs and improve product appearance. In electronic devices with limited internal space, such as smartphones, laptops and other compact devices, thinning circuit board assemblies can free up space for other components, so that the electronic device can install more devices, thereby increasing the auxiliary functions that the electronic device can provide to users.

[0007] In a possible implementation manner, one end of the elastic member is fixedly connected to the adapter plate, and the other end of the elastic member abuts against the circuit board.

[0008] Currently, the circuit board and the adapter board are generally electrically connected by welding. During the assembly or use of the circuit board assembly, the circuit board and the adapter board may be deformed due to the installation process or external force, resulting in a change in the distance between the adapter board and the circuit board, thereby causing the welding position to break, resulting in poor electrical connection between the adapter board and the circuit board.

[0009] In this embodiment, since the plurality of elastic members can be pre-compressed between the adapter plate and the circuit board, when the spacing between the circuit board and the adapter plate increases, the height of the elastic member can be increased, thereby ensuring that the end of the elastic member away from the adapter plate can abut against the circuit board. When the spacing between the circuit board and the adapter plate decreases, the elastic member is further compressed and the height can be reduced, and the end of the elastic member away from the adapter plate still abuts against the circuit board.

[0010] Secondly, when the circuit board assembly is impacted by external force, the relative position of the circuit board and the adapter board may change instantaneously. At this time, the elastic member can adapt to the relative position change of the circuit board and the adapter board through elastic deformation to make the electrical connection between the circuit board and the adapter board more stable.

[0011] In a possible implementation, the circuit board is provided with a first connection hole, the first connection hole penetrates the circuit board along the thickness direction of the circuit board and is spaced apart from the through hole;

[0012] The adapter plate is provided with a second connection hole, which penetrates the adapter plate along the thickness direction of the adapter plate and is connected with the first connection hole;

[0013] The fixing piece is inserted through the first connection hole and the second connection hole, and the fixing piece abuts against the surface of the circuit board away from the adapter board, and the surface of the adapter board away from the circuit board.

[0014] In this embodiment, the fixing member can directly fix the circuit board and the adapter board to improve the connection stability between the circuit board and the adapter board, and ensure that the distance between the circuit board and the adapter board does not exceed the height of the elastic member when it is not compressed, so that the elastic member can be in a compressed state, ensuring that the elastic member can abut against the circuit board, thereby improving the electrical connection stability between the circuit board and the adapter board.

[0015] In a possible implementation, the fixing member includes a connector, a first colloid and a second colloid, the connector is located between the circuit board and the adapter board, the first colloid is bonded between the connector and the circuit board, and the second colloid is bonded between the connector and the adapter board.

[0016] In this embodiment, the circuit board and the adapter board do not need to be provided with connection holes, and reducing the punching process for the circuit board and the adapter board can shorten the processing time of the circuit board and the adapter board, improve the efficiency of the production line, and reduce the consumption of the processing drill bit, reduce the manufacturing cost, especially in mass production, the cost saving is more obvious. In fact, each hole on the circuit board and the adapter board is a potential failure point, and reducing the number of holes can reduce the risk of open circuit or short circuit caused by the holes. Fewer holes means that the materials of the circuit board and the adapter board are more complete, which can improve their overall mechanical strength and pressure resistance. Reducing the number of holes in the circuit board and the adapter board can increase the area of ​​the copper foil, thereby improving the thermal conductivity and heat dissipation efficiency of the circuit board and the adapter board. Reducing the punching can also give designers more freedom to optimize the circuit layout of the circuit board and the adapter board and improve the overall performance of the design. Fewer holes means that there are fewer points to pay attention to when repairing the circuit board and the adapter board, which helps to simplify the repair process. As electronic equipment develops towards smaller size, reducing the holes in the circuit board and the adapter board can meet the needs of more sophisticated circuit design.

[0017] In a possible implementation manner, there are two fixing members, and the two fixing members are respectively located at two opposite sides of the through hole.

[0018] In this embodiment, when the functional devices on the adapter board are of small mass, or when the application scenario of the circuit board assembly is relatively safe and not easily affected by external forces, the circuit board and the adapter board only need to be connected through two fixings. At this time, the connection strength between the circuit board and the adapter board meets the use requirements of the circuit board assembly, and since the number of fixings is small, the assembly process is relatively simple, thereby reducing the time cost of assembling the circuit board assembly.

[0019] In a possible implementation manner, the number of the fixing members is three or more, and the plurality of fixing members surround the functional device and are spaced apart from the functional device.

[0020] In this embodiment, since there are a large number of fixing members and they are arranged around the through holes, the dispersed distribution of the fixing members helps to reduce the local stress concentration of the circuit board and the adapter board, and improve the fatigue life of the connection area between the circuit board and the adapter board.

[0021] Furthermore, the fixing part does not need to connect the circuit board and the adapter board by welding, and the assembly process of the fixing part does not require high temperature, so it will not affect the heat treatment state of the circuit board and the adapter board or cause a heat-affected zone.

[0022] In a possible implementation manner, there are multiple elastic members, the elastic members are located in a gap between the fixing member and the functional device, and the multiple elastic members surround the functional device.

[0023] In a possible implementation manner, the functional component is disposed protrudingly relative to a surface of the circuit board facing away from the adapter board.

[0024] In this embodiment, both sides of the height of the functional device can extend from the through hole. In this case, the functional device can use the space on both sides of the circuit board thickness direction at the same time, rather than just occupying the space on one side of the circuit board. In this case, the thickness of the circuit board assembly is less than the height of the functional device plus the thickness of the circuit board, achieving the effect of thinning the circuit board assembly.

[0025] In a possible implementation manner, a projection of the elastic member onto the circuit board is spaced apart from the through hole.

[0026] In this embodiment, the elastic member is at a certain distance from the through hole. When the elastic member is compressed, the end of the elastic member facing away from the adapter board will not extend out of the through hole during the deformation process and lose contact with the circuit board, thereby avoiding failure of the electrical connection between the circuit board and the adapter board.

[0027] In a second aspect, the present application also provides an electronic device, comprising a housing and the circuit board assembly as described above, wherein the circuit board assembly is installed on the inner side of the housing.

[0028] In this embodiment, the electronic device is provided with a thinned circuit board assembly as described above, and thinner circuit board assemblies have a smaller heat capacity, which means that they can dissipate the heat generated by electronic components more quickly. This helps to improve the overall heat dissipation efficiency of electronic devices, which is particularly important for high-performance computing, power electronics and other fields. In electronic devices, excessively high operating temperatures may seriously affect the life of components and the stability of the system. Therefore, improving heat dissipation performance helps to enhance the reliability and durability of electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the implementation manner will be briefly introduced below. Obviously, the drawings described below are only some implementation manners of the present application. For ordinary technicians in this field, other drawings can be obtained like these drawings without paying any creative work.

[0030] Figure 1 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0031] Figure 2 yes Figure 1 A schematic diagram of the structure of the circuit board assembly shown;

[0032] Figure 3 yes Figure 2 An exploded schematic diagram of the circuit board assembly shown;

[0033] Figure 4 yes Figure 2 The schematic cross-sectional view of the first embodiment of the circuit board assembly shown is taken at AA;

[0034] Figure 5 yes Figure 4 A schematic diagram of the structure of the fixing member shown;

[0035] Figure 6 yes Figure 1 A schematic cross-sectional view of a second embodiment of a circuit board assembly is shown;

[0036] Figure 7 yes Figure 2 A structural schematic diagram of the elastic member shown;

[0037] Figure 8 yes Figure 2 Another structural schematic diagram of the elastic member is shown. DETAILED DESCRIPTION

[0038] The specific embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can also be implemented in other ways different from those described herein, and therefore, the present application is not limited to the following embodiments.

[0039] For ease of understanding, the terms involved in the embodiments of the present application are first explained.

[0040] Multiple: refers to two or more than two.

[0041] Connection: should be understood in a broad sense. For example, A and B are connected, which can be either direct or indirect through an intermediary.

[0042] The specific implementation of the present application will be clearly described below in conjunction with the accompanying drawings.

[0043] See also Figure 1 , Figure 1 1 is a schematic diagram of the structure of an electronic device 100 provided in an embodiment of the present application. The electronic device 100 includes a housing 10 and a circuit board assembly 20. The circuit board assembly 20 is connected to the inside of the housing 10.

[0044] Exemplarily, the electronic device 100 may be a mobile phone, a tablet computer, an e-reader, a laptop computer, a digital camera, a vehicle-mounted device, or a wearable device, etc. The electronic device 100 may also be a base station, a car, an aviation instrument, a router, a smart speaker, a drone, etc. Figure 1 The illustrated embodiment is described by taking the electronic device 100 as a mobile phone as an example. The electronic device 100 may be any terminal electronic device that pursues a thinner thickness. The present application does not limit the usage scenario of the electronic device 100.

[0045] It should be noted that Figure 1The purpose is only to schematically describe the connection relationship between the circuit board assembly 20 and the housing 10, and it does not specifically limit the connection position, specific structure and quantity of each device. The structure illustrated in the embodiment of the present application does not constitute a specific limitation on the electronic device 100. In other embodiments of the present application, the electronic device 100 may include more or fewer components than shown in the figure, or combine some components, or split some components, or arrange the components differently.

[0046] Some electronic devices today are moving towards being thinner and lighter, and the demand for thinning the thickness of circuit board components is becoming stronger and stronger. In order to meet the requirements of thinner and lighter design of electronic devices, the electronic components with higher heights in electronic devices are generally electrically connected to the circuit board by using a sinker installation method, thereby reducing the height of the electronic components on the circuit board, which is conducive to the realization of thinner and lighter design of electronic devices. Since the electronic components need to be electrically connected to the circuit board through an adapter board, the stability of the electrical connection between the adapter board and the circuit board directly affects the stability of the electrical connection between the electronic components and the circuit board.

[0047] In addition, since the adapter board and the circuit board need to be electrically connected by welding, etc., when the circuit board assembly is impacted by external force, the welding part between the adapter board and the circuit board is prone to breakage, and the disconnection of the electrical connection between the adapter board and the circuit board will cause the electronic components on the adapter board to fail.

[0048] Based on this, please refer to Figure 2 and Figure 3 , Figure 2 yes Figure 1 A schematic structural diagram of the circuit board assembly 20 is shown. Figure 3 yes Figure 2 The schematic diagram of the exploded view of the circuit board assembly 20 shown. The present application provides a circuit board assembly 20, which can simultaneously ensure the mechanical connection stability and electrical connection stability of the circuit board and the adapter board. The circuit board assembly 20 includes a circuit board 21, an adapter board 22, a fixing member 23, an elastic member 24 and a functional device 25. The circuit board 21 and the adapter board 22 are stacked and spaced apart. The fixing member 23 fixes the circuit board 21 and the adapter board 22 in connection. The elastic member 24 is electrically connected between the circuit board 21 and the adapter board 22. The functional device 25 is electrically connected to the adapter board 22.

[0049] The circuit board 21 may be a main board of the electronic device 100. The circuit board 21 may include a first board body 211 and a first solder pad (not shown). The first solder pad is connected to a surface of the first board body 211 facing the adapter board 22.

[0050] The first board body 211 is a basic structure of the circuit board 21. The first board body 211 has a conductive pattern inside.

[0051] The first pad is a metal part on the circuit board 21. The first pad is connected to a side surface of the first board 211 facing the adapter board 22. The first pad is used to connect the electronic component and the conductive pattern inside the first board 211. The first pad is usually made of copper or other conductive materials, and the first pad can be accurately positioned and arranged on the first board 211 so that each electronic component and the conductive pattern can be correctly connected. Among them, the number of the first pads is multiple. Multiple first pads are arranged around the through hole of the circuit board 21.

[0052] The circuit board 21 is provided with a through hole 212. The through hole 212 penetrates the first plate body 211 of the circuit board 21 along the thickness direction of the circuit board 21. Exemplarily, the through hole 212 may be located in the middle area of ​​the first plate body 211 of the circuit board 21. That is, the through hole 212 may be spaced apart from the peripheral side surface of the first plate body 211 of the circuit board 21. Alternatively, the through hole 212 may be located in the edge area of ​​the first plate body 211 of the circuit board 21. That is, the through hole 212 also penetrates part of the peripheral side surface of the first plate body 211 of the circuit board 21. The position of the through hole 212 in the embodiment of the present application may be set according to the required installation position of the functional device 25 in actual use, and the present application does not limit the specific position or number of the through hole 212.

[0053] In some possible implementations, the circuit board 21 may be a printed circuit board (PCB) or a flexible circuit board. Depending on the number of electronic components carried on the circuit board 21, the circuit board 21 may be a single-sided board or a double-sided board. A single-sided board may refer to a circuit board that carries electronic components on one side, and a double-sided board may refer to a circuit board that carries electronic components on both sides. Depending on the type of electronic components carried on the circuit board 21, the circuit board 21 may be a radio frequency (RF) board or an application processor (AP) board. The RF board may be used to carry radio frequency chips (RFIC), radio frequency power amplifiers (RFPA), wireless fidelity (WIFI) chips, and the like. For example, the AP board may be used to carry system on chip (SOC) components, double data rate (DDR) memory, main power management unit (PMU), auxiliary PMU, and the like.

[0054] In the thickness direction of the circuit board assembly 20, the adapter board 22 is stacked and spaced apart from the circuit board 21. The orthographic projection of the adapter board 22 onto the circuit board 21 covers at least part of the through hole 212. Exemplarily, the adapter board 22 may be a high-density Land Grid Array (LGA). The adapter board 22 has high thermal conductivity, which is beneficial to heat dissipation. At the same time, the electrical performance of the LGA board is very good, with low contact resistance and capacitance effect. In some other embodiments, the adapter board 22 may be a small additional circuit board having pads, pins or connectors corresponding to the functional device 25 and the circuit board 21, so as to be connected to the corresponding positions on the circuit board 21.

[0055] Specifically, the adapter board 22 includes a second board body 221 and a second solder pad (not shown). The second solder pad is connected to the second board body 221 .

[0056] In the thickness direction of the circuit board assembly 20, the second board 221 is stacked and spaced apart from the first board 211 of the circuit board 21. The second board 221 can provide physical support for the functional device 25 and serve as a medium for electrical connection between the functional device 25 and the circuit board 21.

[0057] The second pad is a group of metal contact points. The second pad is located on the side surface of the second plate body 221 of the adapter board 22 facing the circuit board 21. The second pad can be arranged in the form of a grid or an array. A portion of the second pads can correspond to the contact points on the functional device 25, and is used to achieve the electrical connection between the functional device 25 and the adapter board 22. Another portion of the second pads can be arranged around the functional device 25, so as to be electrically connected to the first pad of the circuit board 21 through the elastic member 24. The second pad is usually made of metal, such as copper or tin-lead alloy, lead-free solder, etc.

[0058] The functional device 25 is connected to the surface of the adapter board 22 facing the circuit board 21. At least part of the functional device 25 can be located in the through hole 212 of the circuit board 21. And the functional device 25 can extend from the through hole 212, so that the functional device 25 is protruded relative to the surface of the circuit board 21 away from the adapter board 22.

[0059] Exemplarily, the number of the functional devices 25 may be multiple, and the functional devices 25 may be commonly seen devices with a relatively high height on a circuit board. For example, the functional device 25 may be a double data rate (DDR) memory, a central processing unit (CPU), a polymer capacitor, a power inductor, a storage chip, etc.

[0060] In this example, see Figure 4 , Figure 4 yes Figure 2 The circuit board assembly 20 shown is a schematic cross-sectional view of the first embodiment at AA. Part of the structure of the functional device 25 is located on the side of the circuit board 21 facing the adapter board 22, part of the structure of the functional device 25 is located in the through hole 212 of the circuit board 21, and the other part of the structure of the functional device 25 can be located on the side of the circuit board 21 away from the adapter board 22. That is, both sides of the height of the functional device 25 extend from the through hole 212. At this time, the functional device 25 can simultaneously utilize the space on both sides of the thickness direction of the circuit board 21, rather than just occupying the space on one side of the circuit board 21. At this time, the thickness of the circuit board assembly 20 is less than the height of the functional device 25 plus the thickness of the circuit board 21. The thickness of the circuit board assembly 20 can be the thickness of the adapter board 22 plus the thickness of the functional device 25. Since the thickness of the adapter board 22 is less than the thickness of the circuit board 21, the effect of thinning the circuit board assembly 20 can be achieved.

[0061] After the circuit board assembly 20 is thinned as a whole, the required installation space is reduced, so that the internal space of the electronic device 100 can be reduced, and the electronic device 100 can be further thinned. A thinner circuit board assembly 20 helps to achieve a thinner product design and improve the product appearance. In electronic devices 100 with limited internal space, such as smart phones, laptops and other compact devices, the thinning of the circuit board assembly 20 can make room for other components, so that the electronic device 100 can install more devices, thereby increasing the auxiliary functions that the electronic device 100 can provide to users.

[0062] Thinner and lighter circuit board assemblies 20 have smaller heat capacity, which means they can dissipate heat generated by electronic components more quickly. This helps improve the overall heat dissipation efficiency of the electronic device 100, which is particularly important for high-performance computing, power electronics and other fields. In the electronic device 100, excessively high operating temperatures may seriously affect the life of components and the stability of the system. Therefore, improving heat dissipation performance helps to enhance the reliability and durability of the electronic device 100.

[0063] The present application also provides a variety of fixing members 23 to exemplify the mechanical connection between the circuit board 21 and the adapter board 22 .

[0064] In the first possible embodiment, please refer to Figure 4 and Figure 5 , Figure 5 yes Figure 4 The structural schematic diagram of the fixing member 23 is shown. The fixing member 23 can pass through the circuit board 21 and the adapter board 22 to fix the circuit board 21 and the adapter board 22 together.

[0065] Specifically, the circuit board 21 may be provided with a plurality of first connection holes 214. The first connection holes 214 penetrate the circuit board 21 along the thickness direction of the circuit board 21. The first connection holes 214 are arranged at intervals from the through hole 212. The plurality of first connection holes 214 may be arranged around the through hole 212.

[0066] The adapter plate 22 is provided with a second connection hole 224. The second connection hole 224 penetrates the adapter plate 22 along the thickness direction of the adapter plate 22. The plurality of second connection holes 224 and the plurality of first connection holes 214 are arranged opposite to each other in the thickness direction of the circuit board assembly 20. That is, each second connection hole 224 is connected to one first connection hole 214.

[0067] The number of the fixing members 23 is multiple. The fixing member 23 includes a first fixing portion 231, a second fixing portion 232 and a connecting portion 233. The first fixing portion 231 and the second fixing portion 232 are connected to opposite ends of the connecting portion 233. The radial dimensions of the first fixing portion 231 and the second fixing portion 232 are greater than the radial dimensions of the connecting portion 233. Exemplarily, the first fixing portion 231 and the second fixing portion 232 can be detachably connected to the connecting portion 233. The fixing member 23 can be a pin or a rivet.

[0068] A connecting portion 233 passes through a first connecting hole 214 and a second connecting hole 224, a first fixing portion 231 and a second fixing portion 232 are connected to opposite ends of the connecting portion 233, the first fixing portion 231 abuts against a surface of the circuit board 21 that is away from the adapter board 22, and the second fixing portion 232 abuts against a surface of the adapter board 22 that is away from the circuit board 21. A plurality of fixing members 23 may surround the functional device 25 and be spaced apart from the functional device 25.

[0069] In some possible implementations, the connection portion 233 , the hole wall of the first connection hole 214 , and the hole wall of the second connection hole 224 may all be provided with threads. The threads of the connection portion 233 may be connected to the hole wall threads of the first connection hole 214 and the hole wall threads of the second connection hole 224 .

[0070] In this embodiment, the gap between the first fixing portion 231 and the second fixing portion 232 is used to accommodate the circuit board 21 and the adapter board 22. There is a certain gap between the circuit board 21 and the adapter board 22 located between the first fixing portion 231 and the second fixing portion 232. Since the first fixing portion 231 and the second fixing portion 232 can limit the circuit board 21 and the adapter board 22, the fixing member 23 can increase the connection stability between the circuit board 21 and the adapter board 22, so that the circuit board assembly 20 can be used in a variety of environmental conditions, including environments such as humidity, vibration, and temperature changes.

[0071] In addition, the structure of the fixing member 23 provided in the embodiment of the present application is relatively simple, and can be quickly assembled by simple manual or automated equipment during the production process, which is suitable for large-scale production. Since the process of connecting the circuit board 21 and the adapter board 22 by the fixing member 23 is reversible, it is easy to disassemble and separate the adapter board 22 and the circuit board 21, so as to replace and repair the damaged parts.

[0072] In addition, since there are a large number of fixing members 23 and they are arranged around the through hole 212, the dispersed distribution of the fixing members 23 helps to reduce the local stress concentration of the circuit board 21 and the adapter board 22, and improve the fatigue life of the connection area between the circuit board 21 and the adapter board 22.

[0073] Furthermore, the fixing member 23 does not need to connect the circuit board 21 and the adapter board 22 by welding, and the assembly process of the fixing member 23 does not require high temperature, so it will not affect the heat treatment state of the circuit board 21 and the adapter board 22 or cause a heat-affected zone.

[0074] In the second possible embodiment, different from the first possible embodiment, the number of the first connection holes 214 of the circuit board assembly 20 of this embodiment can be two, and the two first connection holes 214 are located at opposite sides of the through hole 212. The number of the second connection holes 224 is two. The two second connection holes 224 are respectively located at opposite ends of the adapter board 22. The number of the fixing members 23 is two. Each fixing member 23 passes through a first connection hole 214 and a second connection hole 224 to connect the circuit board 21 and the adapter board 22. The two fixing members 23 are respectively located at opposite sides of the through hole 212.

[0075] In this embodiment, when the functional device 25 on the adapter board 22 is of small mass, or when the application scenario of the circuit board assembly 20 is relatively safe and not easily affected by external forces, the circuit board 21 and the adapter board 22 only need to be connected through two fixings 23. At this time, the connection strength between the circuit board 21 and the adapter board 22 meets the use requirements of the circuit board assembly 20, and since the number of fixings 23 is small, the assembly process is relatively simple, thereby reducing the time cost of assembling the circuit board assembly 20.

[0076] For a third possible embodiment, see Figure 6 , Figure 6 yes Figure 1 The schematic cross-sectional view of the second embodiment of the circuit board assembly 20 is shown. Different from the circuit board assembly 20 provided in the first possible embodiment, the circuit board 21 is not provided with the first connection hole 214, the adapter board 22 is not provided with the second connection hole 224, and the fixing member 23 is bonded between the circuit board 21 and the adapter board 22.

[0077] Specifically, the fixing member 23 includes a connector 234, a first colloid 235, and a second colloid 236. The connector 234 is located between the circuit board 21 and the adapter board 22, one end of the connector 234 is fixedly connected to the circuit board 21 through the first colloid 235, and the other end of the connector 234 is fixedly connected to the adapter board 22 through the second colloid 236. Exemplarily, the material of the connector 234 may include a copper column.

[0078] In this embodiment, the circuit board 21 and the adapter board 22 do not need to be provided with connection holes. Reducing the punching process for the circuit board 21 and the adapter board 22 can shorten the processing time of the circuit board 21 and the adapter board 22, improve the efficiency of the production line, and reduce the consumption of processing drills, reduce manufacturing costs, especially in mass production, the cost savings are more obvious. In fact, each hole on the circuit board 21 and the adapter board 22 is a potential failure point, and reducing the number of holes can reduce the risk of open circuit or short circuit caused by the holes. Fewer holes means that the materials of the circuit board 21 and the adapter board 22 are more complete, which can improve their overall mechanical strength and pressure resistance. Reducing the number of holes in the circuit board 21 and the adapter board 22 can increase the area of ​​the copper foil, thereby improving the thermal conductivity and heat dissipation efficiency of the circuit board 21 and the adapter board 22. Reducing the number of holes can also give designers more freedom to optimize the circuit layout of the circuit board 21 and the adapter board 22, and improve the overall performance of the design. Fewer holes means that there are fewer points to pay attention to when repairing the circuit board 21 and the adapter board 22, which helps to simplify the repair process. As the electronic device 100 develops toward smaller size, reducing the number of holes in the circuit board 21 and the adapter board 22 can meet the requirements of more sophisticated circuit design.

[0079] In addition, the connector 234 is made of a copper column, which is directly in contact with the heat source of the circuit board 21 and then disperses the heat to the external environment. In addition, since the copper column has a higher heat capacity, it can temporarily store more heat, thereby reducing the rapid rise in temperature when the heat source of the circuit board 21 generates heat. The copper column can provide long-term stable heat dissipation performance due to its good mechanical and thermal stability.

[0080] The elastic member 24 is a conductor. One end of the elastic member 24 is fixedly connected to the adapter plate 22 , and the other end of the elastic member 24 abuts against the circuit board 21 , so that the adapter plate 22 is connected to the circuit board 21 .

[0081] Specifically, in one possible implementation, see Figure 7 , Figure 7 yes Figure 2A structural schematic diagram of the elastic member 24 shown, wherein the elastic member 24 is in an undeformed state and a compressed state, respectively. The elastic member 24 includes a fixed portion 241 and an elastic portion 242. The elastic portion 242 is connected to the fixed portion 241. The elastic portion 242 can be elastically deformed. The fixed portion 241 is fixedly connected to the second soldering pad of the adapter board 22. One end of the elastic portion 242 away from the fixed portion 241 abuts against the first soldering pad of the circuit board 21.

[0082] For another possible implementation, see Figure 8 , Figure 8 yes Figure 2 Another schematic diagram of the structure of the elastic member 24 is shown. The elastic member 24 includes a fixing portion 241 , a first elastic portion 243 , a second elastic portion 244 , an abutting portion 245 and a supporting portion 246 .

[0083] The number of the supporting parts 246 can be two, and the two supporting parts 246 can be connected to opposite sides of the fixing part 241 in the width direction. In this embodiment, when the elastic member 24 is extremely compressed by the circuit board 21 and the adapter board 22, the supporting part 246 can abut between the circuit board 21 and the adapter board 22 to prevent the circuit board 21 and the adapter board 22 from further approaching each other to squeeze the elastic member 24, and prevent the elastic member 24 from exceeding the limit of elastic deformation and being unable to recover, thereby preventing the situation where the elastic member 24 cannot maintain abutment against the circuit board 21 when the distance between the circuit board 21 and the adapter board 22 becomes larger, causing the circuit board 21 and the adapter board 22 to be disconnected.

[0084] The first elastic portion 243 is bent and connected to one side of the length direction of the fixing portion 241. The first elastic portion 243 extends from one side of the length direction of the fixing portion 241 to the other side opposite thereto. The first elastic portion 243 may be located between the two supporting portions 246.

[0085] The second elastic portion 244 is bent and connected to a side of the first elastic portion 243 away from the fixing portion 241 . The side of the second elastic portion 244 away from the first elastic portion 243 abuts against the fixing portion 241 .

[0086] The abutting portion 245 is convexly disposed on the surface of the first elastic portion 243 away from the fixing portion 241 and the second elastic portion 244. For example, the surface of the abutting portion 245 may be a spherical surface.

[0087] After the elastic member 24 is assembled to the circuit board assembly 20, the surface of the fixing portion 241 of the elastic member 24 facing away from the first elastic portion 243 is fixedly connected to the second pad of the adapter board 22. The abutting portion 245 of the elastic member 24 abuts against the first pad of the circuit board 21. Both the first elastic portion 243 and the second elastic portion 244 are compressed.

[0088] In this embodiment, the number of the elastic member 24 can be multiple, and the elastic member 24 can be any kind of conductive spring. One end of the elastic member 24 is welded to the second pad of the adapter board 22. The other end of the elastic member 24 abuts against the pad of the circuit board 21, so that the circuit board 21 is connected to the adapter board 22.

[0089] The elastic member 24 may be located between the fixing member 23 and the functional device 25. There are multiple elastic members 24, and the multiple elastic members 24 may surround the functional device 25. The elastic member 24 may be spaced apart from the functional device 25 and the fixing member 23. The orthographic projection of the elastic member 24 onto the circuit board 21 is spaced apart from the through hole 212.

[0090] Please refer to Figure 7 When the elastic member 24 is not in contact with the first pad of the circuit board 21, the height of the elastic member 24 is H1. After the circuit board assembly 20 is assembled, the elastic member 24 is in contact with the first pad of the circuit board 21, and the elastic member 24 is elastically deformed, and the height of the elastic member 24 is H2, H2

[0091] At present, the circuit board and the adapter board are generally electrically connected by welding. During the assembly or use of the circuit board assembly, the circuit board and the adapter board may be deformed due to the installation process or external force, resulting in different degrees of changes in the distance between the multiple second pads of the adapter board and the multiple first pads of the circuit board, thereby causing the welding position to break, resulting in poor electrical connection between the adapter board and the circuit board.

[0092] In this embodiment, since the plurality of elastic members 24 can be pre-compressed between the adapter plate 22 and the circuit board 21, when the spacing between the circuit board 21 and the adapter plate 22 increases, the height of the elastic member 24 can be increased, thereby ensuring that the end of the elastic member 24 away from the adapter plate 22 can abut against the first pad of the circuit board 21. When the spacing between the circuit board 21 and the adapter plate 22 decreases, the elastic member 24 is further compressed and the height can be reduced, and the end of the elastic member 24 away from the adapter plate 22 still abuts against the first pad of the circuit board 21.

[0093] Secondly, when the circuit board assembly 20 is impacted by external force, the relative position of the circuit board 21 and the adapter board 22 may change instantaneously. At this time, the elastic member 24 can adapt to the relative position change of the circuit board 21 and the adapter board 22 through elastic deformation, so as to make the electrical connection between the circuit board 21 and the adapter board 22 more stable.

[0094] The above are exemplary embodiments of the present application. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made thereto without departing from the principles of the present application, and these improvements and modifications are also considered to be within the scope of protection of the present application.​

Claims

1. A circuit board assembly, characterized in that: include: A circuit board is provided with a through hole, wherein the through hole penetrates the circuit board along the thickness direction of the circuit board; An adapter plate, stacked with the circuit board, wherein the orthographic projection of the adapter plate onto the circuit board covers at least a portion of the through hole; A fixing member, fixedly connecting the adapter plate and the circuit board; an elastic member, located between the circuit board and the adapter board, spaced apart from the fixing member, and electrically connected between the circuit board and the adapter board; and a functional device, which is passed through the through hole and mounted on a surface of the adapter plate facing the through hole.

2. The circuit board assembly according to claim 1, characterized in that: One end of the elastic member is fixedly connected to the adapter plate, and the other end of the elastic member abuts against the circuit board.

3. The circuit board assembly according to claim 2, characterized in that: The circuit board is provided with a first connection hole, the first connection hole penetrates the circuit board along the thickness direction of the circuit board and is spaced apart from the through hole; The adapter plate is provided with a second connection hole, the second connection hole penetrates the adapter plate along the thickness direction of the adapter plate and is connected with the first connection hole; The fixing member is inserted into the first connection hole and the second connection hole, and the fixing member abuts against a surface of the circuit board facing away from the adapter board, and a surface of the adapter board facing away from the circuit board.

4. The circuit board assembly according to claim 2, characterized in that: The fixing member includes a connector, a first colloid and a second colloid. The connector is located between the circuit board and the adapter board. The first colloid is bonded between the connector and the circuit board. The second colloid is bonded between the connector and the adapter board.

5. The circuit board assembly according to any one of claims 2 to 4, characterized in that: The number of the fixing members is two, and the two fixing members are respectively located at two opposite sides of the through hole.

6. The circuit board assembly according to any one of claims 2 to 4, characterized in that: The number of the fixing members is more than three, and the plurality of fixing members surround the functional device and are spaced apart from the functional device.

7. The circuit board assembly according to claim 6, characterized in that: There are multiple elastic members, each of which is located in a gap between the fixing member and the functional device, and the multiple elastic members surround the functional device.

8. The circuit board assembly according to any one of claims 1 to 4 or 7, characterized in that: The functional device is protruded relative to the surface of the circuit board away from the adapter board.

9. The circuit board assembly according to claim 8, characterized in that: The projection of the elastic member onto the circuit board is spaced apart from the through hole.

10. An electronic device, characterized in that: It comprises a housing and a circuit board assembly as claimed in any one of claims 1 to 9, wherein the circuit board assembly is installed on the inner side of the housing.

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