Printed circuit board (PCB) packaging structure of electrolytic capacitor semi-embedded in board

Abstract

The utility model discloses a PCB packaging structure of an electrolytic capacitor semi-embedded in a board, a central point of a capacitor packaging silk-screen, a central point of a distribution forbidding area and a central point of a slotting area are overlapped, the slotting area is located in the distribution forbidding area, and the slotting area is located in an area enclosed by the packaging silk-screen. By means of the design, on one hand, it is ensured that the electrolytic capacitor can accurately correspond to the preset position during installation, the installation problem caused by dislocation is reduced, on the other hand, interference between other elements or circuits and the electrolytic capacitor can be prevented, the electrolytic capacitor can be partially embedded into the PCB body by forming the groove in the PCB body, and the installation efficiency is improved. It is ensured that the electrolytic capacitor does not conflict with other components or external structures due to the size, the shape or the installation position, the problem that some parts possibly exceed the preset installation height during horizontal installation is avoided, and then the risk that the electrolytic capacitor interferes with other components or external structures is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and more specifically to a PCB packaging structure of an electrolytic capacitor semi-embedded in a board. Background Art

[0002] In the design and manufacturing process of electronic products, printed circuit boards (PCBs) are the key carriers for carrying and connecting various electronic components. Among them, electrolytic capacitors, as a common passive component, play an important role in power filtering, signal coupling, energy storage, etc. However, during the design stage of PCB layout and wiring, the installation method and size of electrolytic capacitors often become the focus of special attention.

[0003] In PCB design, electrolytic capacitors are usually installed in two ways: vertical installation and horizontal installation. Although vertical installation is simple and direct, in certain specific scenarios, such as limited space and the need to avoid interference between components, horizontal installation becomes a better choice. Horizontal installation can not only save vertical space, but also optimize the layout and routing of the circuit board to a certain extent.

[0004] However, since the diameter of some electrolytic capacitors is too large, some parts may exceed the predetermined installation height when they are installed horizontally, which may not only increase the overall height of the circuit board, but also cause the electrolytic capacitors to interfere with other components or external structures. Utility Model Content

[0005] In order to overcome the deficiencies of the prior art, the utility model provides a PCB packaging structure of an electrolytic capacitor semi-embedded in a board, so as to solve the problem that the electrolytic capacitor is prone to interfere with other components or external structures.

[0006] The technical solution of the utility model is as follows: A PCB packaging structure of an electrolytic capacitor semi-embedded in a board, comprising a PCB body and an electrolytic capacitor placement area arranged on the PCB body, wherein the electrolytic capacitor placement area is extended along the X-axis direction, and the electrolytic capacitor placement area comprises a capacitor packaging silk screen, a forbidden area and a slotted area, wherein the capacitor packaging silk screen and the forbidden area at least partially overlap, and the center point of the capacitor packaging silk screen, the center point of the forbidden area and the center point of the slotted area coincide, the slotted area is located within the forbidden area, and the slotted area is located within the area surrounded by the packaging silk screen.

[0007] Furthermore, a plurality of electrolytic capacitor placement areas are provided, and the plurality of electrolytic capacitor placement areas are arranged in sequence along the Y-axis direction.

[0008] Furthermore, the width of the capacitor package silk screen is greater than the width of the forbidden area, and the length of the capacitor package silk screen is less than the length of the forbidden area.

[0009] Furthermore, the length of the slotted area is equal to the length of the capacitor package silk screen.

[0010] Furthermore, an electrolytic capacitor is included, and the width of the slotted area is smaller than the diameter of the electrolytic capacitor.

[0011] Furthermore, a first pad and a second pad are provided on one side of the electrolytic capacitor placement area, the first pad is square-shaped, and the second pad is circular-shaped.

[0012] Furthermore, a positive electrode identification portion is provided on the PCB body, the positive electrode identification portion is located on one side of the first pad, and the positive electrode identification portion is provided close to the first pad.

[0013] The utility model according to the above scheme has the following beneficial effects:

[0014] (1) The utility model provides a PCB packaging structure of an electrolytic capacitor semi-embedded in a board, comprising a PCB body and an electrolytic capacitor placement area arranged on the PCB body, wherein the electrolytic capacitor placement area is arranged to extend along the X-axis direction, and the electrolytic capacitor placement area comprises a capacitor packaging silk screen, a forbidden area and a slotted area, wherein the capacitor packaging silk screen and the forbidden area at least partially overlap, and such a design limits the arrangement of other components or the connection of lines in the area, thereby avoiding circuit interference or short circuit problems that may be caused by the installation of the electrolytic capacitor, thereby improving the overall reliability of the circuit board.

[0015] (2) The utility model provides a PCB packaging structure of an electrolytic capacitor semi-embedded in a board, wherein the center point of the capacitor package silk screen, the center point of the forbidden area and the center point of the slotted area coincide with each other, the slotted area is located in the forbidden area, and the slotted area is located in the area surrounded by the package silk screen. This design, on the one hand, ensures that the electrolytic capacitor can accurately correspond to the predetermined position during installation, reducing installation problems caused by misalignment, and on the other hand, can prevent other components or circuits from interfering with the electrolytic capacitor, providing convenience for setting the slotted area. By slotting the PCB body, the electrolytic capacitor can be partially embedded in the PCB body, reducing the occupancy rate of the horizontally mounted electrolytic capacitor in the height space, ensuring that the electrolytic capacitor will not conflict with other components or external structures due to size, shape or installation position, avoiding the problem that some parts may exceed the predetermined installation height when horizontally installed, thereby avoiding the risk of interference between the electrolytic capacitor and other components or external structures, thereby improving the overall reliability and safety of the circuit board. Moreover, the slotted area not only serves as a hole for embedding the electrolytic capacitor, but also serves as a heat dissipation channel. The heat generated by the electrolytic capacitor during operation can be dissipated through the slotted area, thereby improving the heat dissipation performance of the electrolytic capacitor and extending its service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 This is a schematic structural diagram of a PCB packaging structure of an electrolytic capacitor semi-embedded in a board in an embodiment of the utility model;

[0018] Figure 2 It is a three-dimensional structural schematic diagram of a PCB packaging structure of an electrolytic capacitor semi-embedded in a board in an embodiment of the utility model;

[0019] Figure 3 It is a side view of a PCB packaging structure of an electrolytic capacitor semi-embedded in a board in an embodiment of the utility model.

[0020] In the figure, 1. PCB body; 2. Capacitor package silk screen; 3. Prohibited area; 4. Slotted area; 5. First solder pad; 6. Second solder pad; 7. Positive electrode identification part; 8. Electrolytic capacitor. DETAILED DESCRIPTION

[0021] The following detailed description and drawings of the embodiments of the present invention are used to illustrate the principle of the present invention, but cannot be used to limit the scope of the present invention, that is, the present invention is not limited to the embodiments described.

[0022] In order to better understand the present invention, the present invention is further described below in conjunction with the accompanying drawings and embodiments:

[0023] See also Figure 1 As shown, an embodiment of the utility model provides a PCB packaging structure of an electrolytic capacitor semi-embedded in a board, comprising a PCB body 1 and an electrolytic capacitor placement area arranged on the PCB body 1, the electrolytic capacitor placement area extending along the X-axis direction, the electrolytic capacitor placement area comprising a capacitor packaging silk screen 2, a forbidden area 3 and a slotted area 4, the capacitor packaging silk screen 2 and the forbidden area 3 at least partially overlap, and the center point of the capacitor packaging silk screen 2, the center point of the forbidden area 3 and the center point of the slotted area 4 coincide with each other, the slotted area 4 is located in the forbidden area 3, and the slotted area 4 is located in the area surrounded by the packaging silk screen.

[0024] In this embodiment, the X-axis direction is the length direction of the capacitor package silk screen 2 , and the Y-axis direction is the width direction of the capacitor package silk screen 2 .

[0025] Specifically, the PCB packaging structure of a semi-embedded electrolytic capacitor provided by the embodiment of the utility model is provided by setting an electrolytic capacitor placement area on the PCB body 1, and the electrolytic capacitor placement area includes a capacitor packaging silk screen 2, a forbidden area 3 and a slotted area 4. By setting the forbidden area 3, the arrangement of other components or the connection of lines in the area is effectively restricted, thereby avoiding circuit interference or short circuit problems caused by the installation of the electrolytic capacitor. This physical isolation method greatly reduces the risk of circuit board failure. In this embodiment, the capacitor packaging silk screen 2 provides a clear mark for the installation of the electrolytic capacitor. Since the capacitor packaging silk screen 2 and the forbidden area 3 overlap at least in part, this design ensures that the electrolytic capacitor can be accurately installed in a predetermined position, and at the same time can avoid the arrangement of other components or the connection of lines in a part of the area enclosed by the capacitor packaging silk screen 2, so as to facilitate the setting of the slotted area 4 in the area.

[0026] In the present embodiment, the center point of the capacitor package silk screen 2, the center point of the forbidden cloth area 3 and the center point of the slotted area 4 coincide with each other, the slotted area 4 is located in the forbidden cloth area 3, and the slotted area 4 is located in the area formed by the package silk screen. This design, on the one hand, ensures that the electrolytic capacitor 8 can accurately correspond to the predetermined position when installed, reducing the installation problems caused by misalignment, and on the other hand, it can prevent other components or circuits from interfering with the electrolytic capacitor 8, which provides convenience for setting the slotted area 4. Secondly, by slotting the PCB body 1, the electrolytic capacitor 8 can be embedded in the PCB body 1, ensuring that the electrolytic capacitor 8 will not conflict with other components or external structures due to size, shape or installation position, thereby improving the overall reliability and safety of the circuit board. Moreover, the slotted area 4 is not only used as a hole for the electrolytic capacitor 8 to be embedded, but also as a heat dissipation channel. The heat generated by the electrolytic capacitor 8 during operation can be dissipated through the slotted area 4, thereby improving the heat dissipation performance of the electrolytic capacitor and extending its service life.

[0027] Preferably, there are multiple electrolytic capacitor placement areas, and the multiple electrolytic capacitor placement areas are arranged in sequence along the Y-axis direction. This design can significantly improve the space utilization of the circuit board, so that more electrolytic capacitors 8 can be arranged on a limited PCB board area to meet the needs of electronic equipment for the number and function of electrolytic capacitors. Secondly, the slotted area 4 in each electrolytic capacitor placement area can be used as a heat dissipation channel, and the heat generated by the electrolytic capacitor 8 during operation can be dissipated through the slotted area 4. This design helps to improve the overall heat dissipation performance of the circuit board and maintain the stable operation of the electrolytic capacitor 8 and the circuit board.

[0028] In this embodiment, the width of the capacitor package silk screen 2 is greater than the width of the forbidden area 3, and the length of the capacitor package silk screen 2 is less than the length of the forbidden area 3. This design ensures that the electrolytic capacitor 8 will not completely cover the forbidden area 3 when installed, thereby forming a certain safety area around the electrolytic capacitor. This safety area helps prevent circuit short circuits or interference caused by improper installation of the electrolytic capacitor or external factors, thereby enhancing the reliability and safety of the circuit board.

[0029] Preferably, the length of the slotted area 4 is equal to the length of the capacitor package screen 2. In this embodiment, the PCB package structure of a semi-embedded electrolytic capacitor provided by the utility model embodiment also includes an electrolytic capacitor 8, and the width of the slotted area 4 is less than the diameter of the electrolytic capacitor 8. This design allows the electrolytic capacitor 8 to be partially embedded in the PCB board body and can ensure that the electrolytic capacitor 8 and the slotted area 4 are snap-fitted, reducing the risk of the electrolytic capacitor 8 falling off, so that there is a stable connection between the electrolytic capacitor and the circuit board, avoiding the electrolytic capacitor from falling off or shifting due to vibration or impact.

[0030] Preferably, a first pad 5 and a second pad 6 are provided on one side of the electrolytic capacitor placement area, the first pad 5 is square, and the second pad 6 is round. Specifically, a positive electrode identification portion 7 is provided on the PCB body 1, and the positive electrode identification portion 7 is located on one side of the first pad 5, and the positive electrode identification portion 7 is provided close to the first pad 5.

[0031] The indicated orientation or position relationship is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the product of the application is usually placed when used, or the orientation or position relationship commonly understood by technical personnel in this field, or the orientation or position relationship in which the product of the application is usually placed when used. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0032] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.

[0033] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. A PCB packaging structure of an electrolytic capacitor semi-embedded in a board, characterized in that: The invention comprises a PCB body (1) and an electrolytic capacitor placement area arranged on the PCB body (1), wherein the electrolytic capacitor placement area is arranged to extend along the X-axis direction, wherein the electrolytic capacitor placement area comprises a capacitor package silk screen (2), a forbidden area (3) and a slotted area (4), wherein the capacitor package silk screen (2) and the forbidden area (3) at least partially overlap, and the center point of the capacitor package silk screen (2), the center point of the forbidden area (3) and the center point of the slotted area (4) coincide with each other, and the slotted area (4) is located within the forbidden area (3), and the slotted area (4) is located within the area enclosed by the package silk screen.

2. A PCB packaging structure of a semi-embedded electrolytic capacitor as claimed in claim 1, characterized in that: There are multiple electrolytic capacitor placement areas, and the multiple electrolytic capacitor placement areas are arranged in sequence along the Y-axis direction.

3. The PCB packaging structure of a semi-embedded electrolytic capacitor as claimed in claim 1, characterized in that: The width of the capacitor encapsulation silk screen (2) is greater than the width of the forbidden area (3), and the length of the capacitor encapsulation silk screen (2) is less than the length of the forbidden area (3).

4. The PCB packaging structure of a semi-embedded electrolytic capacitor as claimed in claim 1, characterized in that: The length of the slotted area (4) is equal to the length of the capacitor package silk screen (2).

5. The PCB packaging structure of a semi-embedded electrolytic capacitor as claimed in claim 1, characterized in that: It also includes an electrolytic capacitor (8), wherein the width of the slotted area (4) is smaller than the diameter of the electrolytic capacitor (8).

6. The PCB packaging structure of a semi-embedded electrolytic capacitor as claimed in claim 1, characterized in that: A first soldering pad (5) and a second soldering pad (6) are provided on one side of the electrolytic capacitor placement area; the first soldering pad (5) is square in shape, and the second soldering pad (6) is circular in shape.

7. A PCB packaging structure of a semi-embedded electrolytic capacitor as claimed in claim 6, characterized in that: The PCB body (1) is provided with a positive electrode identification portion (7), the positive electrode identification portion (7) is located on one side of the first soldering pad (5), and the positive electrode identification portion (7) is arranged close to the first soldering pad (5).

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