Substrate structure with coil

Abstract

The utility model relates to and discloses a substrate structure with a coil. Relates to the technical field of microelectronics. The glass substrate is provided with a first surface and a second surface which are opposite to each other; the first conductive coil is arranged on the first surface, and the first conductive coil is provided with a first terminal; the second conductive coil is arranged on the second surface, and the second conductive coil is provided with a second terminal; the TGV hole is filled with the first connecting line, the TGV hole penetrates through the glass substrate, and the second terminal is connected with the first connecting line so as to lead the second terminal to the first surface where the first terminal is located. According to the utility model, the TGV hole is arranged on the glass substrate, and the second terminal of the second conductive coil is guided to the same side as the first terminal of the first conductive coil by the first connecting line filled in the TGV hole, so that the wiring and packaging of the glass substrate of the double-sided coil are easier to realize, and the coil substrate is simpler and more convenient to process; and the processing efficiency of the coil substrate is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of microelectronics, in particular to a substrate structure with a coil. Background Art

[0002] With the rapid development of the electronic information industry, the update and iteration speed of electronic products is relatively fast, and electronic products are developing in the direction of higher speed, miniaturization and intelligence to meet the market's requirements for electronic products with fast response, low cost, low power consumption, light weight and easy to carry. At present, the coil substrate is only made on one side of the glass substrate. When the coil needs to be stacked and used later, the two glass substrates are spliced ​​on the front and back. On the one hand, the thickness of the coil substrate will increase, which is not suitable for the development trend of miniaturization and miniaturization of electronic products; on the other hand, the coil terminals of the two glass substrates are located on both sides of the spliced ​​coil substrate, which makes the wiring and packaging of the double-sided coil more difficult, which in turn leads to low processing efficiency of the coil substrate of the double-sided coil, which cannot meet the current production needs. Utility Model Content

[0003] The purpose of the utility model is to provide a substrate structure with a coil in view of the above-mentioned deficiencies of the prior art, which can make the double-sided coil wiring and packaging of the substrate structure easier to achieve, thereby making the processing of the coil substrate simpler and more convenient, and improving the processing efficiency of the coil substrate.

[0004] The utility model provides a substrate structure with a coil, comprising:

[0005] A glass substrate having a first surface and a second surface opposite to each other;

[0006] A first conductive coil, disposed on the first surface, the first conductive coil having a first terminal;

[0007] A second conductive coil, disposed on the second surface, the second conductive coil having a second terminal;

[0008] A TGV hole and a first connecting line filled in the TGV hole, the TGV hole passes through the glass substrate, and the second terminal is connected to the first connecting line to lead the second terminal to the first surface where the first terminal is located.

[0009] Furthermore, the number of the TGV holes and the number of the first connection lines are respectively two, one first connection line leads the second terminal to the first surface where the first terminal is located, and the other first connection line leads the first terminal to the second surface where the second terminal is located.

[0010] Furthermore, the first terminal and the second terminal are offset in a thickness direction of the glass substrate, and the first connecting line extends to the first surface and is insulated from the first terminal.

[0011] Furthermore, the substrate structure further includes:

[0012] A first pad is disposed on the first surface, the first pad at least covers a portion of the first terminal, and the first pad is used to connect to an external circuit;

[0013] A second pad is provided on the first surface, the second pad at least covers a portion of the TGV hole, one end of the first connecting wire is connected to the second terminal and the other end is connected to the second pad, and the second pad is used to connect to an external circuit.

[0014] Further, the first terminal includes a first inner terminal and a first outer terminal respectively arranged on the inner and outer sides of the first conductive coil, the second terminal includes a second inner terminal and a second outer terminal respectively arranged on the inner and outer sides of the second conductive coil, the number of the TGV holes and the number of the first connecting wires are two respectively, one first connecting wire connects the first inner terminal and the second inner terminal, and the other first connecting wire connects the first outer terminal and the second outer terminal.

[0015] Furthermore, the first terminal comprises:

[0016] Two first pads are provided on the first surface, one of the first pads at least covers a portion of the first inner terminal, and the other first pad at least covers a portion of the first outer terminal, and the two first pads are used to connect to an external circuit;

[0017] And or two second pads are arranged on the second surface, one second pad at least covers a portion of the second inner terminal, and the other second pad at least covers a portion of the second outer terminal, and the two second pads are used to connect to an external circuit.

[0018] Further, the first terminal includes a first inner terminal and a first outer terminal respectively arranged on the inner and outer sides of the first conductive coil, the second terminal includes a second inner terminal and a second outer terminal respectively arranged on the inner and outer sides of the second conductive coil, the number of the TGV holes and the number of the first connecting wires are two respectively, one first connecting wire connects the first inner terminal and the second inner terminal, and the other first connecting wire leads the second outer terminal to the first surface where the first outer terminal is located.

[0019] Furthermore, the first connecting line is a hollow structure.

[0020] Further, at least 70% of the projection of the first conductive coil on the first surface overlaps with the projection of the second conductive coil on the first surface.

[0021] Furthermore, the substrate structure further includes:

[0022] A first insulating layer covering the first conductive coil;

[0023] A third conductive coil, disposed on the first insulating layer, the third conductive coil having a third terminal;

[0024] At least two first openings and second connecting wires filled in the first openings, the first openings penetrate the first insulating layer, the first terminal is connected to the second connecting wire to lead the first terminal to the plane where the third terminal is located, and the first connecting wire is connected to the second connecting wire to lead the second terminal to the plane where the third terminal is located.

[0025] The utility model provides a substrate structure with a coil having the following gain effects:

[0026] (1) The substrate structure opens a TGV hole on the glass substrate, so that the first connecting wire filled in the TGV hole guides the second terminal of the second conductive coil to the same side as the first terminal of the first conductive coil, thereby making it easier to connect the glass substrate and package the double-sided coil, thereby making the processing of the coil substrate simpler and more convenient, and improving the processing efficiency of the coil substrate;

[0027] (2) The first terminal and the second terminal of the substrate structure are offset in the thickness direction of the glass substrate, so that the first connecting line extends to one end of the first surface and is offset from the position of the first terminal on the first surface, so that the connection between the first terminal and the external circuit and the connection between the second terminal and the external circuit do not interfere with each other, thereby ensuring the performance of the substrate structure;

[0028] (3) The number of TGV holes and first connection lines in the substrate structure is two respectively. One first connection line leads the second terminal to the first surface where the first terminal is located, and the other first connection line leads the first terminal to the second surface where the second terminal is located, so that the glass substrate can be processed without distinguishing between the front and back sides, further making the processing of the coil substrate simpler and more convenient, and improving the processing efficiency of the coil substrate;

[0029] (4) Two TGV holes are provided on the glass substrate of the substrate structure, and a first connecting wire is filled in each TGV hole, wherein one first connecting wire connects the first inner terminal with the second inner terminal, and the other first connecting wire connects the first outer terminal with the second outer terminal, thereby realizing parallel connection of the first conductive coil and the second conductive coil through the two first connecting wires;

[0030] (5) Two TGV holes are provided on the glass substrate of the substrate structure, and a first connecting wire is filled in each TGV hole, wherein one first connecting wire connects the first inner terminal with the second inner terminal, and the other first connecting wire leads the second outer terminal to the first surface where the first outer terminal is located, thereby realizing the series connection of the first conductive coil and the second conductive coil on both sides of the glass substrate;

[0031] (6) The first connecting line of the substrate structure is set as a hollow structure, so as to prevent the first connecting line from squeezing the inner wall of the TGV hole, causing the glass substrate to break, and affecting the use of the substrate structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the utility model and, together with the description, are used to explain the principle of the utility model. In the accompanying drawings, like reference numerals are used to represent like elements.

[0033] Figure 1 This is a schematic structural diagram of the first embodiment of the present utility model;

[0034] Figure 2 This is a schematic diagram of the structure of the second embodiment of the present utility model;

[0035] Figure 3 This is a schematic diagram of the structure of the second embodiment of the present utility model;

[0036] Figure 4 This is a schematic diagram of the structure of the fourth embodiment of the present utility model;

[0037] Figure 5 This is a structural schematic diagram of Embodiment 5 of the present utility model;

[0038] Figure 6 It is a planar structural diagram of the second conductive coil of the utility model.

[0039] In the figure: 1. glass substrate; 11. first surface; 12. second surface; 13. TGV hole; 2. first conductive coil; 21. first terminal; 211. first inner terminal; 212. first outer terminal; 3. second conductive coil; 31. second terminal; 311. second inner terminal; 312. second outer terminal; 4. first connecting line; 5. first welding pad; 6. second welding pad; 7. third conductive coil; 71. third terminal; 8. first insulating layer; 81. first opening; 9. second connecting line. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0041] Example 1, see Figure 1 :

[0042] In this embodiment, the substrate structure includes a glass substrate 1, a first conductive coil 2, a second conductive coil 3, a TGV hole 13, and a first connecting wire 4 filled in the TGV hole 13. The glass substrate 1 is provided with a first surface 11 and a second surface 12 opposite to each other, the first conductive coil 2 is provided on the first surface 11, and the second conductive coil 3 is provided on the second surface 12.

[0043] Specifically, the manufacturing method of the first conductive coil 2 is as follows: a first conductive layer is plated on the first surface 11, and the first conductive layer is formed into the first conductive coil 2 by processes such as exposure, development, and photolithography. The manufacturing method of the second conductive coil 3 is the same as above. Since the first conductive coil 2 and the second conductive coil 3 are plated, the first conductive coil 2 and the second conductive coil 3 are more tightly combined with the glass substrate 1.

[0044] A first terminal 21 is provided on the first conductive coil 2, and the first conductive coil 2 is connected to the external circuit by connecting the first terminal 21 to the external circuit; a second terminal 31 is provided on the second conductive coil 3, and the second conductive coil 3 is connected to the external circuit by connecting the second terminal 31 to the external circuit.

[0045] In this embodiment, the first conductive coil 2 and the second conductive coil 3 can be planar spiral coils, see Figure 6 , which is a planar structural diagram of the first conductive coil 2, the planar spiral coil is circular, and the structure of the second conductive coil 3 is the same or similar to that of the first conductive coil 2. In other embodiments, the first conductive coil 2 and the second conductive coil 3 can also be square or square with rounded edges, or elliptical spiral coils. In the present application, the thickness of the glass substrate 1 is preferably in the range of 10 microns to 5 millimeters; the winding pitch of the first conductive coil 2 and the second conductive coil 3 is in the range of 5-200 microns.

[0046] A TGV hole 13 is provided on the glass substrate 1. The TGV hole 13 is a tiny through hole made on the glass substrate using laser processing technology. The shape of the through hole can be circular, square or other shapes, and its size is usually between tens of microns and hundreds of microns. The TGV hole 13 penetrates the glass substrate 1, connecting the first surface 11 and the second surface 12 of the glass substrate 1. The first connecting wire 4 is filled in the TGV hole 13. After the first conductive coil 2 and the second conductive coil 3 are respectively arranged on the first surface 11 and the second surface 12 of the glass substrate 1, the first connecting wire 4 is connected to the second terminal 31 of the second conductive coil 3, thereby leading the second terminal 31 to the first surface 11 where the first terminal 21 is located, so that the connection between the first terminal 21 and the second terminal 31 and the external circuit is carried out on the same surface of the glass substrate 1.

[0047] Compared with the prior art, for a coil substrate with a double-sided coil, the double coils are usually connected to an external circuit on two opposite surfaces of the substrate. However, since only one side of the substrate can face upward, the connection between the coil located on the upper surface of the substrate and the external circuit is easier to achieve, while the connection between the coil located on the lower surface of the substrate and the external circuit is more difficult, which makes the wiring and packaging of the coil substrate of the double-sided coil more difficult, and further leads to lower processing efficiency of the coil substrate of the double-sided coil.

[0048] In the present embodiment, the first surface 11 on which the first conductive coil 2 is disposed on the glass substrate 1 is the upper surface, and the second surface 12 on which the second conductive coil 3 is disposed on the glass substrate 1 is the lower surface. By opening a TGV hole 13 on the glass substrate 1, the first connecting wire 4 filled in the TGV hole 13 guides the second terminal 31 of the second conductive coil 3 to the same side as the first terminal 21 of the first conductive coil 2. Therefore, the first conductive coil 2 and the second conductive coil 3 can be connected to an external circuit on the upper surface of the glass substrate 1, thereby making it easier to connect and package the glass substrate 1 of the double-sided coil, thereby making the processing of the coil substrate simpler and more convenient, thereby improving the processing efficiency of the coil substrate.

[0049] In this embodiment, the first terminal 21 and the second terminal 31 are offset in the thickness direction of the glass substrate 1. The first connecting wire 4 extends to the first surface 11 and is insulated from the first terminal 21. Figure 1 . In the present application, the TGV hole 13 passes through the glass substrate 1 in the vertical direction, and one end of the first connection line 4 filled in the TGV hole 13 is connected to the second terminal 31, and the other end extends to the first surface 11 where the first terminal 21 is located. If the second terminal 31 and the first terminal 21 are at the same position in the thickness direction of the glass substrate 1, the end of the first connection line 4 extending to the first surface 11 will overlap with the first terminal 21, thereby affecting the connection between the first conductive coil 2 and the second conductive coil 3 and the external circuit.

[0050] Therefore, in the present embodiment, the first terminal 21 and the second terminal 31 are offset in the thickness direction of the glass substrate 1, so that the first connecting line 4 is extended to one end of the first surface 11, and is offset from the position of the first terminal 21 on the first surface 11. At the same time, the first connecting line 4 is extended to one end of the first surface 11 and is insulated from the first terminal 21, so that the connection between the first terminal 21 and the external circuit, and the connection between the second terminal 31 and the external circuit will not interfere with each other, thereby ensuring the performance of the present substrate structure.

[0051] In this embodiment, the substrate structure further includes a first pad 5 and a second pad 6. The second pad 6 and the first pad 5 are both disposed on the first surface 11 of the glass substrate 1. Figure 1 The first pad 5 covers part or all of the first terminal 21, and the wire of the external circuit is connected through the first pad 5, so as to realize the connection between the first conductive coil 2 and the external circuit. The second pad 6 covers part or all of the TGV hole 13, one end of the first connecting wire 4 is connected to the second terminal 31, and the other end is connected to the second pad 6, so as to realize the connection between the wire of the external circuit and the second conductive coil 3, and the connection between the first conductive coil 2 and the second conductive coil 3 and the external circuit is performed on the first surface 11 of the glass substrate 1, thereby making it easier to realize the wiring and packaging of the glass substrate 1 of the double-sided coil.

[0052] In this embodiment, the number of the TGV hole 13 and the number of the first connection wires 4 are two, one first connection wire 4 leads the second terminal 31 to the first surface 11 where the first terminal 21 is located, and the other first connection wire 4 leads the first terminal 21 to the second surface 12 where the second terminal 31 is located. It is foreseeable that: in actual implementation, the first surface 11 on which the first conductive coil 2 is arranged on the glass substrate 1 can be used as the upper surface, and the second conductive coil 3 on the second surface 12 on the glass substrate 1 can be used as the lower surface, or the second conductive coil 3 on the second surface 12 on the glass substrate 1 can be used as the upper surface, and the first surface 11 on which the first conductive coil 2 is arranged on the glass substrate 1 can be used as the lower surface.

[0053] Therefore, in the present embodiment, two TGV holes 13 are provided on the glass substrate 1, and both TGV holes 13 penetrate the glass substrate 1, and each TGV hole 13 is filled with a first connecting wire 4, wherein one of the first connecting wires 4 guides the second terminal 31 of the second conductive coil 3 to the same side of the first terminal 21 of the first conductive coil 2, and the other first connecting wire 4 guides the first terminal 21 of the first conductive coil 2 to the same side of the second terminal 31 of the second conductive coil 3, so that the glass substrate 1 can be packaged or processed (for example, automatically grasped by a robot) in the subsequent packaging or processing, and the first terminal 21 and the second terminal 31 can be connected to the external circuit on any surface, regardless of the front and back sides, so that the processing of the coil substrate is further simplified and convenient, and the processing efficiency of the coil substrate is improved.

[0054] Example 3, see Figure 3 and Figure 6 :

[0055] In this embodiment, the first terminal 21 includes a first inner terminal 211 and a first outer terminal 212 respectively disposed on the inner and outer sides of the first conductive coil 2, and the second terminal 31 includes a second inner terminal 311 and a second outer terminal 312 respectively disposed on the inner and outer sides of the second conductive coil 3. Figure 6 The number of TGV holes 13 and the number of first connecting wires 4 are two respectively, one first connecting wire 4 connects the first inner terminal 211 and the second inner terminal 311 , and the other first connecting wire 4 connects the first outer terminal 212 and the second outer terminal 312 .

[0056] In this embodiment, the first conductive coil 2 and the second conductive coil 3 each include two terminals, namely, the first terminal 21 includes a first inner terminal 211 disposed inside the first conductive coil 2, and a first outer terminal 212 disposed outside the first conductive coil 2. The second terminal 31 includes a second inner terminal 311 disposed inside the second conductive coil 3, and a second outer terminal 312 disposed outside the second conductive coil 3. Two TGV holes 13 are provided on the glass substrate 1, and each TGV hole 13 is filled with a first connecting wire 4, wherein one first connecting wire 4 connects the first inner terminal 211 with the second inner terminal 311, and the other first connecting wire 4 connects the first outer terminal 212 with the second outer terminal 312, so that the first conductive coil 2 and the second conductive coil 3 are connected in parallel through the two first connecting wires 4.

[0057] In this embodiment, the substrate structure includes: two first pads 5, and / or two second pads 6. The two first pads 5 are arranged on the first surface 11, one first pad 5 at least covers a portion of the first inner terminal 211, and the other first pad 5 at least covers a portion of the first outer terminal 212, and the two first pads 5 are used to connect to an external circuit; the two second pads 6 are arranged on the second surface 12, one second pad 6 at least covers a portion of the second inner terminal 311, and the other second pad 6 at least covers a portion of the second outer terminal 312, and the two second pads 6 are used to connect to an external circuit, see Figure 3 .

[0058] In the above embodiment, on the basis of two first connecting wires 4 connecting the first conductive coil 2 and the second conductive coil 3 in parallel, the substrate structure of the present application further includes two first soldering pads 5, and the two first soldering pads 5 are arranged on the first surface 11 of the glass substrate 1, wherein one first soldering pad 5 covers part or all of the first inner terminal 211, and the other first soldering pad 5 covers part or all of the first outer terminal 212, and the two first soldering pads 5 are respectively connected to the external circuit, thereby realizing the connection between the parallel first conductive coil 2 and the second conductive coil 3 and the external circuit.

[0059] Furthermore, in the present embodiment, the substrate structure may further include two second pads 6, and the two second pads 6 are arranged on the second surface 12 of the glass substrate 1, wherein one of the second pads 6 covers part or all of the second inner terminal 311, and the other second pad 6 covers part or all of the second outer terminal 312. Therefore, in actual production, the two first pads 5 or the two second pads 6 can be selected to be connected to the external circuit according to which of the first surface 11 and the second surface 12 of the glass substrate 1 is the upper surface, so as to realize the connection between the parallel first conductive coil 2 and the second conductive coil 3 and the external circuit, so that the substrate structure does not need to distinguish between the front and back sides during the wiring and packaging process, thereby making the processing of the coil substrate simpler and more convenient, thereby improving the processing efficiency of the coil substrate.

[0060] Example 4, see Figure 4 and Figure 6 :

[0061] In this embodiment, the first terminal 21 includes a first inner terminal 211 and a first outer terminal 212 respectively disposed on the inner and outer sides of the first conductive coil 2, and the second terminal 31 includes a second inner terminal 311 and a second outer terminal 312 respectively disposed on the inner and outer sides of the second conductive coil 3. Figure 6 The number of TGV holes 13 and the number of first connecting wires 4 are two respectively, one first connecting wire 4 connects the first inner terminal 211 and the second inner terminal 311, and another first connecting wire 4 leads the second outer terminal 312 to the surface where the first outer terminal 212 is located.

[0062] In this embodiment, the first conductive coil 2 and the second conductive coil 3 each include two inner and outer terminals, that is, the first terminal 21 includes a first inner terminal 211 disposed inside the first conductive coil 2, and a first outer terminal 212 disposed outside the first conductive coil 2. The second terminal 31 includes a second inner terminal 311 disposed inside the second conductive coil 3, and a second outer terminal 312 disposed outside the second conductive coil 3.

[0063] Two TGV holes 13 are arranged on the glass substrate 1, and each TGV hole 13 is filled with a first connecting wire 4, wherein one of the first connecting wires 4 connects the first inner terminal 211 with the second inner terminal 311, and the other first connecting wire 4 leads the second outer terminal 312 to the first surface 11 where the first outer terminal 212 is located, thereby realizing the series connection of the first conductive coil 2 and the second conductive coil 3 on both sides of the glass substrate 1, and enabling the first conductive coil 2 and the second conductive coil 3 to be connected to an external circuit on the same surface, thereby making the application range of the substrate structure wider and more practical.

[0064] In this embodiment, the first connecting wire 4 is a hollow structure. Since the substrate structure is formed by opening a TGV hole 13 on the glass substrate 1, and the first connecting wire 4 of the hollow structure is formed in the TGV hole, during the metallization and subsequent reflow soldering processes, it is possible to prevent the conductive structure from expanding under high temperature conditions and affecting the structure of the glass. For example, under high temperature conditions, the glass and the conductive structure in the hole may crack due to different strain conditions, causing the glass to crack. Since the first connecting wire 4 is a hollow structure, even if it expands under high temperature conditions, it can ensure the conductive performance without affecting the glass substrate.

[0065] In this embodiment, at least 70% of the projection of the first conductive coil 2 on the first surface 11 overlaps with the projection of the second conductive coil 3 on the first surface 11. In this embodiment, the overlap mentioned here refers to the overlap of the projected area. For the conductive coils, it refers to the projected area of ​​the shape surrounded by the outermost circle of the coils, and the outermost circle defines the projected area of ​​each coil.

[0066] In the foregoing embodiments, it is mentioned that the first terminal 21 and the second terminal 31 are misaligned in the thickness direction of the glass substrate 1 in order to prevent the first connecting wire 4 from overlapping with the position of the first terminal 21 on the first surface 11 when leading the second terminal 31 to the first surface 11 where the first terminal 21 is located, thereby affecting the connection between the first terminal 21 and the second terminal 31 and the external circuit.

[0067] However, if the first conductive coil 2 and the second conductive coil 3 are completely misaligned in the thickness direction of the glass substrate 1, on the one hand, the first conductive coil 2 and the second conductive coil 3 will not be arranged compactly on both sides of the glass substrate 1, thereby increasing the size of the glass substrate 1, which increases the processing cost and affects the installation of the substrate structure.

[0068] On the other hand, when the first conductive coil 2 and the second conductive coil 3 are completely misaligned in the thickness direction of the glass substrate 1, the first terminal 21 of the first conductive coil 2 and the second terminal 31 of the second conductive coil 3 are also completely misaligned in the thickness direction of the glass substrate 1. In the above embodiment, when the first conductive coil 2 and the second conductive coil 3 are connected in series or in parallel, it is necessary to obliquely open the TGV hole 13 on the glass substrate 1, which increases the difficulty of processing.

[0069] Therefore, in the present embodiment, at least 70% overlap is ensured between the projection of the first conductive coil 2 on the first surface 11 and the projection of the second conductive coil 3 on the first surface 11. On the one hand, the first conductive coil 2 and the second conductive coil 3 are arranged more compactly on both sides of the glass substrate 1, thereby reducing the processing cost and facilitating the installation of the present substrate structure. On the other hand, the overlap of the projections of the first conductive coil 2 and the second conductive coil 3 can improve the strength of power transmission or signal transmission. The higher the overlap, the higher the power or signal transmission strength.

[0070] In the fourth embodiment, when the first conductive coil 2 and the second conductive coil 3 are connected in series, it is preferred that the first conductive coil 2 and the second conductive coil 3 are coils of different sizes, and the projection of the first conductive coil 2 on the first surface 11 overlaps with the projection of the second conductive coil 3 on the first surface 11 by at least 70%, so that the second inner terminal 311 of the second conductive coil 3 overlaps with the projection of the first inner terminal 211 of the first conductive coil 2 on the first surface 11, and the second outer terminal 312 of the second conductive coil 3 is misaligned with the projection of the first inner terminal 211 of the first conductive coil 2 on the first surface 11, so that the multiple TGV holes 13 on the glass substrate 1 are opened in the vertical direction, and when the second outer terminal 312 is led to the first surface 11 through the first connecting line 4, it will not overlap with the first inner terminal 211.

[0071] In the third embodiment, when the first conductive coil 2 and the second conductive coil 3 are connected in parallel, it is preferred that the first conductive coil 2 and the second conductive coil 3 are coils of the same size, and the projection of the first conductive coil 2 on the first surface 11 and the projection of the second conductive coil 3 on the first surface 11 are 100% overlapped, so that the second inner terminal 311 of the second conductive coil 3 and the projection of the first inner terminal 211 of the first conductive coil 2 on the first surface 11 are overlapped, and the second outer terminal 312 of the second conductive coil 3 and the projection of the first outer terminal 212 of the first conductive coil 2 on the first surface 11 are overlapped, so that the multiple TGV holes 13 on the glass substrate 1 are opened in the vertical direction, thereby reducing the processing difficulty.

[0072] Example 5, see Figure 5 :

[0073] In this embodiment, the substrate structure further includes: a first insulating layer 8, a third conductive coil 7, at least two first openings 81, and a second connecting wire 9 filled in the first openings 81. The first insulating layer 8 covers the first conductive coil 2, the third conductive coil 7 is disposed on the first insulating layer 8, and the third conductive coil 7 has a third terminal 71. The first opening 81 penetrates the first insulating layer 8, the first terminal 21 is connected to the second connecting wire 9 to lead the first terminal 21 to the plane where the third terminal 71 is located, and the first connecting wire 4 is connected to the second connecting wire 9 to lead the second terminal 31 to the plane where the third terminal 71 is located.

[0074] The substrate structure of this embodiment further includes a first insulating layer 8 and a third conductive coil 7. The first insulating layer 8 covers the first conductive coil 2, and the third conductive coil 7 is arranged on the first insulating layer 8, so that the first conductive coil 2 is separated from the third conductive coil 7 by the first insulating layer 8, and the first conductive coil 2 and the third conductive coil 7 are insulated.

[0075] A third terminal 71 is provided on the third conductive coil 7, and at least two first openings 81 are provided on the first insulating layer 8. The two first openings 81 both penetrate the first insulating layer 8, and the two first openings 81 are filled with second connecting wires 9, one end of one of the second connecting wires 9 is connected to the first terminal 21, and the other end extends to the plane where the third terminal 71 is located, thereby leading the first terminal 21 to the plane where the third terminal 71 is located; the other second connecting wire 9 is connected to the first connecting wire 4 extending to the first surface 11, thereby leading the second terminal 31 to the plane where the third terminal 71 is located.

[0076] Through this method, three conductive coils can be arranged on the glass substrate 1 of the substrate structure, and the connection terminals of the three conductive coils are located in the same plane, which not only makes the application range of the substrate wider and the practicality stronger, but also makes the connection and packaging of multiple conductive coils on the glass substrate 1 easier to achieve, thereby making the processing of the coil substrate simpler and more convenient, and improving the processing efficiency of the coil substrate.

[0077] Further, based on the above embodiment, the substrate structure may further include: a second insulating layer, a fourth conductive coil, a second opening, and a third connecting wire filled in the second opening. The second insulating layer covers the second conductive coil 3, the fourth conductive coil is arranged on the second insulating layer, and the fourth conductive coil has a fourth terminal. The second opening penetrates the second insulating layer, and the fourth terminal is connected to the third connecting wire to lead the fourth terminal to the plane where the third terminal 71 is located.

[0078] In the above embodiment, the third conductive coil 7 is stacked on the first conductive coil 2. It is foreseeable that: in the present substrate structure, the fourth conductive coil may also be stacked on the second conductive coil 3. Specifically, the second conductive coil 3 may be covered with a second insulating layer, and the fourth conductive coil may be disposed on the second insulating layer, so that the fourth conductive coil is separated from the second conductive coil 3 by the second insulating layer, and the fourth conductive coil and the second conductive coil 3 are insulated.

[0079] A fourth terminal is provided on the fourth conductive coil, a second opening is provided on the second insulating layer, the second opening penetrates the second insulating layer, a third connecting wire is filled in the second opening, and the fourth terminal is connected to the third connecting wire, so that the fourth terminal is led to the second surface 12 where the second terminal 31 is located through the third connecting wire. It can be foreseen that: a third TGV hole 13 is also provided on the glass substrate 1, and one end of the third connecting wire extending to the second surface 12 is connected to the first connecting wire 4 filled in the TGV hole 13, so that the fourth terminal is led to the first surface 11 where the first terminal 21 is located; a third first opening 81 is also provided on the first insulating layer 8, and the other end of the first connecting wire 4 filled in the third TGV hole 13 is connected to the second connecting wire 9 filled in the first opening 81, so that the fourth terminal is led to the plane where the third terminal 71 is located.

[0080] Through the above method, four conductive coils can be set on the glass substrate 1 of the substrate structure, and the connection terminals of the four conductive coils are located in the same plane, thereby further making the application range of the substrate wider and the practicality stronger, and the connection and packaging of multiple conductive coils on the glass substrate 1 are easier to achieve, thereby making the processing of the coil substrate simpler and more convenient, and improving the processing efficiency of the coil substrate.

[0081] Specifically, the manufacturing method of the third conductive coil 7 and the fourth conductive coil is the same as the above-mentioned conductive coil manufacturing method. It can be foreseen that: through the method of the above-mentioned embodiment, five, six or more conductive coils can be stacked on the glass substrate 1, so that the substrate structure can be suitable for use environments requiring different numbers of conductive coils, thereby making the substrate structure more applicable.

[0082] The contents described above can be implemented individually or in combination in various ways, and these variations are all within the protection scope of the present utility model.

[0083] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device comprising the elements.

[0084] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model is described in detail with reference to the above embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the above embodiments, or replace some of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the utility model.

Claims

1. A substrate structure with a coil, characterized in that: include: A glass substrate (1) having a first surface (11) and a second surface (12) opposite to each other; A first conductive coil (2) is disposed on the first surface (11), and the first conductive coil (2) has a first terminal (21); A second conductive coil (3) is disposed on the second surface (12), and the second conductive coil (3) has a second terminal (31); A TGV hole (13) and a first connecting line (4) filled in the TGV hole (13), the TGV hole (13) passing through the glass substrate (1), and the second terminal (31) connected to the first connecting line (4) to lead the second terminal (31) to the first surface (11) where the first terminal (21) is located.

2. A substrate structure with a coil as claimed in claim 1, characterized in that: The number of the TGV holes (13) and the number of the first connecting wires (4) are respectively two; one of the first connecting wires (4) leads the second terminal (31) to the first surface (11) where the first terminal (21) is located, and the other of the first connecting wires (4) leads the first terminal (21) to the second surface (12) where the second terminal (31) is located.

3. A substrate structure with a coil as claimed in claim 1, characterized in that: The first terminal (21) and the second terminal (31) are offset in the thickness direction of the glass substrate (1), and the first connecting line (4) extends to the first surface (11) and is insulated from the first terminal (21).

4. A substrate structure with a coil as claimed in claim 1, characterized in that: The substrate structure further comprises: A first solder pad (5) is provided on the first surface (11), the first solder pad (5) at least covers a portion of the first terminal (21), and the first solder pad (5) is used to connect to an external circuit; A second solder pad (6) is provided on the first surface (11), the second solder pad (6) at least covering a portion of the TGV hole (13), one end of the first connecting wire (4) being connected to the second terminal (31) and the other end being connected to the second solder pad (6), the second solder pad (6) being used to connect to an external circuit.

5. A substrate structure with a coil as claimed in claim 1, characterized in that: The first terminal (21) comprises a first inner terminal (211) and a first outer terminal (212) respectively arranged on the inner and outer sides of the first conductive coil (2); the second terminal (31) comprises a second inner terminal (311) and a second outer terminal (312) respectively arranged on the inner and outer sides of the second conductive coil (3); the number of the TGV holes (13) and the number of the first connecting wires (4) are two respectively; one first connecting wire (4) connects the first inner terminal (211) and the second inner terminal (311); and the other first connecting wire (4) connects the first outer terminal (212) and the second outer terminal (312).

6. A substrate structure with a coil as claimed in claim 5, characterized in that: The first terminal (21) comprises: Two first solder pads (5) are provided on the first surface (11), one of the first solder pads (5) at least covering a portion of the first inner terminal (211), and the other of the first solder pads (5) at least covering a portion of the first outer terminal (212), the two first solder pads (5) being used to connect to an external circuit; and or two second solder pads (6), arranged on the second surface (12), one second solder pad (6) at least covering a portion of the second inner terminal (311), the other second solder pad (6) at least covering a portion of the second outer terminal (312), the two second solder pads (6) being used to connect to an external circuit.

7. A substrate structure with a coil as claimed in claim 1, characterized in that: The first terminal (21) comprises a first inner terminal (211) and a first outer terminal (212) respectively arranged on the inner and outer sides of the first conductive coil (2); the second terminal (31) comprises a second inner terminal (311) and a second outer terminal (312) respectively arranged on the inner and outer sides of the second conductive coil (3); the number of the TGV holes (13) and the number of the first connecting wires (4) are two respectively; one of the first connecting wires (4) connects the first inner terminal (211) and the second inner terminal (311); and the other of the first connecting wires (4) leads the second outer terminal (312) to the first surface (11) where the first outer terminal (212) is located.

8. A substrate structure with a coil as claimed in claim 1, characterized in that: The first connecting line (4) is a hollow structure.

9. A substrate structure with a coil as claimed in claim 3, characterized in that: At least 70% of the projection of the first conductive coil (2) on the first surface (11) overlaps with the projection of the second conductive coil (3) on the first surface (11).

10. A substrate structure with a coil as claimed in claim 1, characterized in that: The substrate structure further comprises: A first insulating layer (8) covering the first conductive coil (2); A third conductive coil (7) is provided on the first insulating layer (8), and the third conductive coil (7) has a third terminal (71); At least two first openings (81) and a second connecting line (9) filled in the first openings (81), the first opening (81) passing through the first insulating layer (8), the first terminal (21) connected to the second connecting line (9) to lead the first terminal (21) to the plane where the third terminal (71) is located, and the first connecting line (4) connected to the second connecting line (9) to lead the second terminal (31) to the plane where the third terminal (71) is located.

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