Ultrathin, flexible and lightweight VC vapor chamber

Abstract

The utility model provides an ultrathin flexible and lightweight VC vapor chamber, which comprises two oppositely arranged alloy layers and a flexible organic layer arranged between the two alloy layers, and the flexible organic layer comprises a plurality of micro-groove capillary structures arranged between the two alloy layers at intervals. A plurality of groups of micro-groove capillary structures are arranged at intervals, a steam cavity is arranged between every two adjacent groups of micro-groove capillary structures, each micro-groove capillary structure comprises a plurality of capillary layers which are arranged at intervals, a fluid cavity is arranged between every two adjacent capillary layers, and sealing layers are arranged on the peripheries of the steam cavities and the peripheries of the fluid cavities. And meanwhile, the flexible organic layer is adopted as the micro-groove capillary structure and the air cavity structure, and the sealing layer is arranged around the steam cavity and the fluid cavity for sealing, so that the volatilization of organic matters in the steam cavity and the fluid cavity can be effectively prevented, and the bending performance is good.

Description

Technical Field

[0001] The utility model belongs to the technical field of vapor chambers, and in particular relates to an ultra-thin, flexible and lightweight VC vapor chamber. Background Art

[0002] The vapor chamber is a steam chamber with a microstructured inner wall, usually made of copper. When heat is transferred from the heat source to the evaporation zone, the coolant in the chamber begins to vaporize after being heated in a low vacuum environment. At this time, it absorbs heat energy and expands rapidly in volume. The gas phase cooling medium quickly fills the entire chamber. When the gas phase medium contacts a relatively cold area, condensation will occur, releasing the heat accumulated during evaporation through condensation. The condensed coolant will return to the evaporation heat source through the microstructured capillary channel. This operation will be repeated in the chamber.

[0003] For the existing heat spreader, its main structure is mainly composed of three layers of materials: a copper alloy upper cover with a support column (forming a steam chamber) structure, a copper mesh capillary and a copper alloy lower cover. This structure and material VC heat spreader has the following disadvantages: 1. The copper mesh capillary and the steam chamber are at different thickness layers. Compared with the gas-liquid separation and parallel structure design of the two at the same thickness layer, it is difficult to achieve ultra-thin and flexible thickness; 2. The multi-layer material structure and the discrete support column structure of the upper cover are prone to interlayer delamination and steam chamber collapse problems during repeated bending; 3. Traditional VC heat spreaders are made of copper alloy or copper, and the overall weight of the product is relatively heavy. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides an ultra-thin, flexible and lightweight VC heat spreader to solve the problems in the above background technology.

[0005] The utility model provides the following technical solution: an ultra-thin, flexible and lightweight VC heat spreader, comprising two oppositely arranged alloy layers and a flexible organic layer arranged between the two alloy layers, the flexible organic layer comprising a plurality of micro-groove capillary structures spaced apart between the two alloy layers, a steam cavity being arranged between two adjacent groups of the micro-groove capillary structures, the micro-groove capillary structure comprising a plurality of spaced apart capillary layers, a fluid cavity being arranged between two adjacent capillary layers, and sealing layers being arranged around the steam cavity and the fluid cavity.

[0006] Compared with the prior art, the beneficial effects of the present application are as follows: the present application adopts etched micro-groove capillaries to replace the traditional copper mesh capillaries and the parallel structure design of gas-liquid separation, so that the product structure is simplified and thinned. At the same time, the present application adopts a flexible organic layer as the capillary structure of the etched micro-groove, so that the product is further reduced in weight and has flexibility. At the same time, a sealing layer is arranged around the steam chamber and the fluid chamber for sealing, which can effectively prevent the volatilization of organic matter therein and has good bending performance.

[0007] Preferably, the material of the alloy layer is one or more of stainless steel, copper alloy, titanium alloy and aluminum alloy.

[0008] Preferably, the material of the flexible organic layer is one or more of polyimide PI, PET, PE, PMMA, ABF, epoxy resin, BT resin, TPU, TPE, and silica gel.

[0009] Preferably, the sealing layer is a PVD / CVD / ALD coating layer, and the material is a coating layer of one or more combinations of metal materials such as copper / copper nickel / nickel barrier / titanium or metals such as silicon dioxide or non-metallic oxides.

[0010] Preferably, the thickness of the alloy layer is 10um-200um.

[0011] Preferably, the thickness of the flexible organic layer is 20um-200um.

[0012] Preferably, the thickness of the sealing layer is 10nm-50um.

[0013] Preferably, the four sides of the two alloy layers or one of the alloy layers are bent relative to each other so that the ends of the two alloy layers are respectively fitted together, and the ends of the two alloy layers are welded and connected.

[0014] Preferably, the ends of the two alloy layers are connected by plane welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0016] Figure 1 A structural diagram of an ultra-thin, flexible and lightweight VC vapor chamber provided in an embodiment of the utility model;

[0017] Figure 2 An internal structure diagram of a micro-groove capillary structure provided by an embodiment of the utility model;

[0018] Figure 3 This is a structural diagram of an ultra-thin, flexible and lightweight VC heat spreader provided in another embodiment of the present invention.

[0019] Description of reference numerals:

[0020]

[0021] The present invention will be further described below in conjunction with the accompanying drawings and accompanying drawings. DETAILED DESCRIPTION

[0022] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0023] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0024] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0025] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0026] In one embodiment of the present invention, Figure 1 , 2As shown, an ultra-thin, flexible and lightweight VC vapor chamber comprises two alloy layers 1 arranged opposite to each other and a flexible organic layer 2 arranged between the two alloy layers 1, wherein the flexible organic layer 2 comprises a plurality of micro-groove capillary structures 3 arranged at intervals between the two alloy layers 1, a steam chamber 4 is arranged between two adjacent groups of the micro-groove capillary structures 3, the micro-groove capillary structure 3 comprises a plurality of capillary layers 6 arranged at intervals, a fluid chamber 7 is arranged between two adjacent capillary layers 6, and a sealing layer 5 is arranged around the steam chamber 4 and the fluid chamber 7;

[0027] Specifically, the VC heat spreader mainly includes two parts, namely two relatively arranged alloy layers 1 and a flexible organic layer 2 arranged between the two alloy layers 1, and the flexible organic layer 2 in the present application is specifically composed of a plurality of spaced micro-groove capillary structures 3 and a steam chamber 4 arranged between two adjacent micro-groove capillary structures 3, and the micro-groove capillary structure 3 specifically includes a plurality of spaced capillary layers 6 and a fluid chamber 7 arranged between two adjacent capillary layers 6, and the capillary layer 6 is also arranged along the length direction of the alloy layer 1. It should be noted that the micro-groove capillary structure 3 can be arranged in a specific direction, such as the width direction, and the steam chamber 4 is used for the circulation and transmission of gas, and the fluid chamber 7 is used for the circulation and transmission of fluid. At the same time, in the present application, a sealing layer 5 is arranged around the steam chamber 4 and the fluid chamber 7, and the sealing layer 5 is used to seal the steam chamber 4 and the fluid chamber 7 to prevent the volatilization of organic matter therein, and the alloy layer 1 can bring better thermal conductivity, and the flexible organic layer 2 can make the VC heat spreader have good bending performance.

[0028] In this embodiment, the material of the alloy layer 1 is one or more of stainless steel, copper alloy, titanium alloy, and aluminum alloy;

[0029] Specifically, in this embodiment, the specific material of the alloy layer 1 is a titanium alloy material, which has good strength and also achieves ultra-light weight.

[0030] In this embodiment, the material of the flexible organic layer 2 is one or more of polyimide PI, PET, PE, PMMA, ABF, epoxy resin, BT resin, TPU, TPE, and silica gel;

[0031] Specifically, in this embodiment, the specific material of the flexible organic layer 2 is polyimide PI, which has good bending performance. The flexible organic layer 2 can be manufactured by nanoimprinting or photolithography;

[0032] At the same time, in this embodiment, the flexible organic layer 2 can be a two-layer structure, that is, two layers of flexible organic layers 2, which are prepared on two alloy layers 1 by nanoimprinting or photolithography, and then the two are overlapped, and a sealing layer 5 is also provided at the overlapping position to prevent the volatilization of organic matter.

[0033] In this embodiment, the sealing layer 5 is a coating layer formed by PVD / CVD / ALD or the like, and the material is a coating layer formed by one or more metal materials such as copper / copper-nickel / nickel barrier / titanium or metal or non-metal oxides such as silicon dioxide;

[0034] Specifically, the sealing layer 5 can also be formed by wet copper growth, and the surface of the sealing layer 5 is treated by hydrophilic treatment such as H2 reduction, micro-etching, and surface deposition of micro-nano particles to enhance the capillary capacity of the micro-grooves.

[0035] In this embodiment, the thickness of the alloy layer 1 is 10um-200um.

[0036] In this embodiment, the thickness of the flexible organic layer 2 is 20 um-200 um.

[0037] In this embodiment, the thickness of the sealing layer 5 is 10 nm-50 um.

[0038] In this embodiment, the four sides of the two alloy layers 1 or one of the alloy layers 1 are bent relative to each other so that the ends of the two alloy layers 1 are respectively attached to each other, and the ends of the two alloy layers 1 are welded and connected;

[0039] Specifically, by bending the four sides of the two alloy layers 1 or one of the alloy layers 1 , the two ends of the two alloy layers 1 can be respectively attached, and then welded to form a sealed VC structure.

[0040] like Figure 3 As shown, in another embodiment of the present invention, the ends of the two alloy layers 1 are connected by plane welding;

[0041] Specifically, in another embodiment, the ends of the two alloy layers 1 may be connected by plane welding without bending.

[0042] In summary, the ultra-thin, flexible and lightweight VC heat spreader in the above-mentioned embodiments of the utility model, the present application adopts the alloy layer 1 as the air cavity wall, which has better thermal conductivity than the traditional PI copper clad board as the air cavity wall. At the same time, the present application adopts the flexible organic layer 2 as the micro-groove capillary structure 3 and the air cavity structure, and adopts the parallel structure design of etching micro-groove capillary to replace the traditional copper mesh capillary and gas-liquid separation, so that the product structure is simplified and thinned; at the same time, the present application adopts the flexible organic layer 2 as the capillary structure of etching micro-groove, so that the product is further reduced in weight and flexible, and a sealing layer 5 is arranged around the steam cavity 4 and the fluid cavity 7 for sealing, which can effectively prevent the volatilization of organic matter therein and has good bending performance.

[0043] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An ultra-thin, flexible and lightweight VC vapor chamber, characterized in that: It comprises two alloy layers arranged opposite to each other and a flexible organic layer arranged between the two alloy layers. The flexible organic layer comprises a plurality of micro-groove capillary structures arranged at intervals between the two alloy layers. A steam cavity is arranged between two adjacent groups of the micro-groove capillary structures. The micro-groove capillary structure comprises a plurality of capillary layers arranged at intervals. A fluid cavity is arranged between two adjacent capillary layers. A sealing layer is arranged around the steam cavity and the fluid cavity.

2. The ultra-thin, flexible and lightweight VC vapor chamber according to claim 1, characterized in that: The material of the alloy layer is one or more of stainless steel, copper alloy, titanium alloy and aluminum alloy.

3. The ultra-thin, flexible and lightweight VC vapor chamber according to claim 1, characterized in that: The material of the flexible organic layer is one or more of polyimide PI, PET, PE, PMMA, ABF, epoxy resin, BT resin, TPU, TPE, and silica gel.

4. The ultra-thin, flexible and lightweight VC vapor chamber according to claim 1, characterized in that: The sealing layer is a coating layer formed by PVD / CVD / ALD.

5. The ultra-thin, flexible and lightweight VC vapor chamber according to claim 1, characterized in that: The thickness of the alloy layer is 10um-200um.

6. The ultra-thin, flexible and lightweight VC vapor chamber according to claim 1, characterized in that: The thickness of the flexible organic layer is 20um-200um.

7. The ultra-thin, flexible and lightweight VC vapor chamber according to claim 1, characterized in that: The thickness of the sealing layer is 10nm-50um.

8. The ultra-thin, flexible and lightweight VC vapor chamber according to claim 1, characterized in that: The four sides of the two alloy layers or one of the alloy layers are bent relative to each other so that the ends of the two alloy layers are respectively attached to each other, and the ends of the two alloy layers are welded and connected.

9. The ultra-thin, flexible and lightweight VC vapor chamber according to claim 1, characterized in that: The end portions of the two alloy layers are connected by plane welding.

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