Water pump controller

Abstract

The utility model relates to the technical field of controllers, in particular to a water pump controller which comprises a base, an upper cover, a control circuit board and a heat dissipation assembly, the heat dissipation assembly comprises an installation frame, two installation pieces, an air inlet sleeve, a support, a heat conduction piece and an air exchange piece, the heat conduction piece is used for conducting soaking and heat conduction treatment on heat generated by a capacitor in the control circuit board, airflow generated in the operation process of the water pump motor is blown into the base through the air inlet sleeve, and heat conducted out of the heat conduction piece and heat in a capacitor gap on the control circuit board are taken away, so that the problem that an existing water pump controller is inconvenient to use is solved. The problems that the passive heat dissipation mode of the heat dissipation plate is difficult to effectively and quickly discharge the temperature, and the capacitor in the control circuit board is continuously in a high-temperature state due to long-time operation, so that the control circuit board is damaged and the subsequent normal use is influenced are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of controllers, in particular to a water pump controller. Background Art

[0002] As a tool for water circulation, the new generation of water pumps use permanent magnet synchronous motors as power to save energy and reduce volume and weight. In order to achieve automation of the water pump, a controller will be installed on the water pump to realize automatic control of the water pump.

[0003] The prior art (CN202833065U) discloses a water pump controller, comprising a base, an upper cover, a control circuit board and a first sealing ring, wherein the control circuit board is placed in the base, the first sealing ring is installed at the lower part of the upper cover, and the upper cover is buckled on the base; a heat sink is provided under the base, and a second sealing ring is provided between the base and the heat sink; a third sealing ring is provided under the heat sink; the heat sink is provided to accelerate the release of heat to prevent the controller temperature from being too high; at the same time, a second sealing ring is provided under the base to effectively prevent water from entering the base from under the base.

[0004] However, with the above method, it is difficult to effectively dissipate the temperature quickly through the passive heat dissipation of the heat sink. Long-term operation will cause the capacitors in the control circuit board to be continuously in a high temperature state, causing damage to the control circuit board and affecting subsequent normal use. Utility Model Content

[0005] The utility model aims to provide a water pump controller, aiming to solve the problem that in the existing water pump controller, it is difficult to effectively and quickly discharge the temperature through the passive heat dissipation method of the heat sink, and long-term operation will cause the capacitor in the control circuit board to be continuously in a high temperature state, resulting in damage to the control circuit board and affecting subsequent normal use.

[0006] To achieve the above object, the utility model provides a water pump controller, comprising a base, an upper cover, a control circuit board and a heat dissipation component, wherein the control circuit board is located inside the base; the upper cover is arranged on one side of the base;

[0007] The heat dissipation assembly includes a mounting frame, two mounting parts, an air inlet sleeve, a bracket, a heat conducting part and a ventilation part;

[0008] The mounting frame is fixedly connected to the base and is located on one side of the base; the two mounting parts are respectively arranged on both sides of the mounting frame; the air inlet sleeve is connected to the base and is located on one side of the base; the bracket is fixedly connected to the base and fixedly connected to the control circuit board and is located inside the base; the heat conductor is arranged on one side of the control circuit board; the ventilation part is arranged on one side of the base.

[0009] Wherein, the mounting component includes a mounting frame, a mounting plate and a locking screw, the mounting frame is fixedly connected to the mounting frame and is located on one side of the mounting frame; the mounting plate is fixedly connected to the mounting frame and is located on one side of the mounting frame; the locking screw is threadedly connected to the mounting plate and is located on one side of the mounting plate.

[0010] Wherein, the heat-conducting component includes a heat-conducting frame, a heat-conducting silicon pad, a heat-conducting copper plate and heat-dissipating fins, the heat-conducting frame is fixedly connected to the bracket and is located on one side of the bracket; the heat-conducting silicon pad is located on one side of the control circuit board; the heat-conducting copper plate is fixedly connected to the heat-conducting frame and fixedly connected to the heat-conducting silicon pad, and is located on one side of the heat-conducting frame; the heat-dissipating fins are fixedly connected to the heat-conducting copper plate and are located on one side of the heat-conducting copper plate.

[0011] Wherein, the ventilation component includes a ventilation fan and a dustproof net, the ventilation fan is fixedly connected to the base and is located on one side of the base; the dustproof net is fixedly connected to the ventilation fan and is located on one side of the ventilation fan.

[0012] Wherein, the heat dissipation assembly further includes a sealing member, and the sealing member is arranged inside the air inlet sleeve.

[0013] Wherein, the sealing member comprises an elastic layer and a sealing gasket, wherein the elastic layer is fixedly connected to the air inlet sleeve and is located inside the air inlet sleeve; the sealing gasket is fixedly connected to the elastic layer and is located on one side of the elastic layer.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] 1. By setting the installation frame, the two installation parts, the air inlet sleeve, the bracket, the heat conductive part and the ventilation part, the installation frame is used to cooperate with the two installation parts to install the overall controller to the motor of the water pump, so that the air inlet sleeve and the exhaust port of the motor are docked and sleeved, the shape of the air inlet sleeve can be replaced according to the shape of the exhaust port of the water pump motor, the heat conductive part is used to evenly distribute the heat generated by the capacitor in the control circuit board, and the air flow generated during the operation of the water pump motor is blown into the base through the air inlet sleeve to take away the heat derived from the heat conductive part and the heat in the capacitor gap on the control circuit board, and then cooperate with the ventilation part to increase the air interaction inside the base to further reduce the temperature of the control circuit board and its capacitor, thereby solving the problem that the existing water pump controller is difficult to effectively and quickly discharge the temperature through the passive heat dissipation method of the heat sink, and long-term operation will cause the capacitor in the control circuit board to be continuously in a high temperature state, resulting in damage to the control circuit board and affecting subsequent normal use.

[0016] 2. By setting the mounting frame, the mounting plate and the locking screw, the mounting frame is used to support the mounting plate to connect with the motor of the water pump, and then the locking screw is twisted to be threadedly connected with the appropriate position, so that it is more convenient to install the overall controller.

[0017] 3. By setting the thermally conductive frame, the thermally conductive silicon pad, the thermally conductive copper plate and the heat dissipation fins, the thermally conductive frame is used to support the installation of the thermally conductive copper plate, and the thermally conductive silicon pad covers the capacitor in the control circuit board, so as to effectively transfer the heat to the thermally conductive copper plate, and then quickly dissipate the heat through the heat dissipation fins on the thermally conductive copper plate, and cooperate with the wind generated by the water pump motor to take away the heat, thereby further reducing the temperature of the control circuit board and its capacitor.

[0018] 4. By setting the ventilation fan and the dustproof net, the dustproof net is used to prevent external dust from entering the base, and the ventilation fan is set on one side of the base to accelerate the heat discharge from the base and increase the heat discharge speed from the base.

[0019] 5. By providing the elastic layer and the sealing gasket, the elastic layer is used to provide elastic tension so that the sealing gasket has a contraction force, thereby increasing the sealing performance of the connection between the air inlet sleeve and the air outlet of the water pump motor. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0021] Figure 1 It is a schematic diagram of the overall structure of the first embodiment of the utility model.

[0022] Figure 2 This is a front view of the first embodiment of the utility model.

[0023] Figure 3 It is a cross-sectional view of the first embodiment of the utility model excluding the mounting frame and the mounting member.

[0024] Figure 4 It is a schematic diagram of the overall structure of the second embodiment of the utility model.

[0025] 101-base, 102-upper cover, 103-control circuit board, 104-installation frame, 105-installation part, 106-air inlet sleeve, 107-bracket, 108-heat conducting part, 109-ventilation part, 110-mounting frame, 111-mounting plate, 112-locking screw, 113-heat conducting frame, 114-thermal conductive silicon pad, 115-thermal conductive copper plate, 116-heat sink fins, 117-ventilation fan, 118-dustproof net, 201-seal, 202-elastic layer, 203-sealing gasket. DETAILED DESCRIPTION

[0026] The first embodiment of the present application is:

[0027] See also Figure 1-Figure 3 ,in, Figure 1 It is a schematic diagram of the overall structure of the first embodiment of the utility model. Figure 2 It is a front view of the whole of the first embodiment of the utility model. Figure 3 It is a cross-sectional view of the first embodiment of the utility model excluding the mounting frame and the mounting member.

[0028] The utility model provides a water pump controller: including a base 101, an upper cover 102, a control circuit board 103 and a heat dissipation component, wherein the heat dissipation component includes a mounting frame 104, two mounting members 105, an air inlet sleeve 106, a bracket 107, a heat conductive member 108 and a ventilation member 109, wherein the mounting member 105 includes a mounting frame 110, a mounting plate 111 and a locking screw 112, the heat conductive member 108 includes a heat conductive frame 113, a heat conductive silicon pad 114, a heat conductive copper plate 115 and heat dissipation fins 116, and the ventilation member 109 includes a ventilation fan 117 and a dustproof net 118. The above-mentioned solution solves the problem that the existing water pump controller is difficult to effectively and quickly discharge the temperature through the passive heat dissipation mode of the heat dissipation plate, and long-term operation will cause the capacitor in the control circuit board 103 to be continuously in a high temperature state, resulting in damage to the control circuit board 103 and affecting subsequent normal use.

[0029] For this specific embodiment, the control circuit board 103, the base 101 and the upper cover 102 are used to form a water pump controller. The heat generated by the control circuit board 103 during operation is reduced by the heat dissipation component. The specific structure and usage of the control circuit board 103 refer to the patent document with publication number CN202833065U, which will not be elaborated here.

[0030] Among them, the installation frame 104 is fixedly connected to the base 101 and is located on one side of the base 101; the two installation members 105 are respectively arranged on both sides of the installation frame 104; the air inlet sleeve 106 is communicated with the base 101 and is located on one side of the base 101; the bracket 107 is fixedly connected to the base 101, and is fixedly connected to the control circuit board 103, and is located inside the base 101; the heat conductive member 108 is arranged on one side of the control circuit board 103; the ventilation member 109 is arranged on one side of the base 101, and the installation frame 104 is used to cooperate with the two installation members 105 to install the overall controller to the motor of the water pump, so that the air inlet sleeve 106 is docked with the exhaust port of the motor, and the shape of the air inlet sleeve 106 can be adjusted according to the water pump motor. The shape of the exhaust port of the machine is changed, and the heat conductive member 108 is used to evenly distribute the heat generated by the capacitor in the control circuit board 103. The airflow generated during the operation of the water pump motor is blown into the base 101 through the air inlet sleeve 106, and the heat derived from the heat conductive member 108 and the heat in the capacitor gap on the control circuit board 103 are taken away. Then, the air exchange member 109 is used to increase the air interaction inside the base 101 to further reduce the temperature of the control circuit board 103 and its capacitor, thereby solving the problem that the existing water pump controller is difficult to effectively and quickly discharge the temperature through the passive heat dissipation method of the heat sink, and long-term operation will cause the capacitor in the control circuit board 103 to be continuously in a high temperature state, resulting in damage to the control circuit board 103 and affecting subsequent normal use.

[0031] Secondly, the mounting bracket 110 is fixedly connected to the mounting frame 104 and is located on one side of the mounting frame 104; the mounting plate 111 is fixedly connected to the mounting bracket 110 and is located on one side of the mounting bracket 110; the locking screw 112 is threadedly connected to the mounting plate 111 and is located on one side of the mounting plate 111. The mounting bracket 110 is used to support the mounting plate 111 to connect with the motor of the water pump, and then twist the locking screw 112 to threadably connect it to the appropriate position, thereby making it more convenient to install the overall controller.

[0032] At the same time, the heat-conducting frame 113 is fixedly connected to the bracket 107 and is located on one side of the bracket 107; the heat-conducting silicon pad 114 is located on one side of the control circuit board 103; the heat-conducting copper plate 115 is fixedly connected to the heat-conducting frame 113, and is fixedly connected to the heat-conducting silicon pad 114, and is located on one side of the heat-conducting frame 113; the heat-dissipating fins 116 are fixedly connected to the heat-conducting copper plate 115 and are located on one side of the heat-conducting copper plate 115. The heat-conducting frame 113 is used to support the installation of the heat-conducting copper plate 115. The heat-conducting silicon pad 114 covers the capacitor in the control circuit board 103, which is convenient for effectively transferring heat to the heat-conducting copper plate 115. The heat is quickly dissipated through the heat-dissipating fins 116 on the heat-conducting copper plate 115, and the wind generated by the water pump motor takes away the heat, further reducing the temperature of the control circuit board 103 and its capacitor.

[0033] In addition, the ventilation fan 117 is fixedly connected to the base 101 and is located on one side of the base 101; the dustproof net 118 is fixedly connected to the ventilation fan 117 and is located on one side of the ventilation fan 117. The dustproof net 118 is used to prevent external dust from entering the base 101. The ventilation fan 117 is arranged on one side of the base 101 to accelerate the heat discharge from the base 101 and increase the heat discharge speed from the base 101.

[0034] When using a water pump controller described in this embodiment, the installation frame 104 is docked with the motor of the water pump through the mounting plates 111 on the two mounting frames 110, and the locking screws 112 are twisted to threadably connect with the appropriate position to complete the installation of the overall controller. The air inlet sleeve 106 is docked with the exhaust port of the motor, and the shape of the air inlet sleeve 106 can be replaced according to the shape of the exhaust port of the water pump motor. The thermal conductive silicon pad 114 covers the capacitor in the control circuit board 103, which is convenient for effectively transferring heat to the thermal conductive copper plate 115, and the heat is quickly dissipated through the heat dissipation fins 116 on the thermal conductive copper plate 115. The airflow generated during the operation of the water pump motor is blown into the base 101 through the air inlet sleeve 106, taking away the heat derived from the heat sink fins 116 and the heat in the capacitor gap on the control circuit board 103, and then cooperates with the ventilation fan 117 to accelerate the air interaction inside the base 101 to further reduce the temperature of the control circuit board 103 and its capacitor, thereby solving the problem that the existing water pump controller is difficult to effectively and quickly discharge the temperature through the passive heat dissipation method of the heat sink, and long-term operation will cause the capacitor in the control circuit board 103 to be continuously in a high temperature state, resulting in damage to the control circuit board 103 and affecting subsequent normal use.

[0035] The second embodiment of the present application is:

[0036] See also Figure 4 ,in, Figure 4 It is a schematic diagram of the overall structure of the second embodiment of the utility model.

[0037] On the basis of the first embodiment, the utility model provides a water pump controller, wherein the heat dissipation assembly further includes a sealing member 201 , and the sealing member 201 includes an elastic layer 202 and a sealing gasket 203 .

[0038] The sealing member 201 is disposed inside the air inlet sleeve 106 , and the sealing member 201 is used to increase the sealing performance of the connection between the air inlet sleeve 106 and the air outlet of the water pump motor.

[0039] Secondly, the elastic layer 202 is fixedly connected to the air inlet sleeve 106 and is located inside the air inlet sleeve 106; the sealing gasket 203 is fixedly connected to the elastic layer 202 and is located on one side of the elastic layer 202. The elastic layer 202 is used to provide elastic tension so that the sealing gasket 203 has a contraction force, thereby increasing the sealing performance of the connection between the air inlet sleeve 106 and the exhaust port of the water pump motor.

[0040] When using a water pump controller described in this embodiment, the elastic layer 202 is used to provide elastic tension so that the sealing gasket 203 has a contraction force, thereby increasing the sealing performance of the connection between the air inlet sleeve 106 and the air outlet of the water pump motor.

[0041] What is disclosed above is only one or more preferred embodiments of the present application, and cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A water pump controller, comprising a base, an upper cover and a control circuit board, wherein the control circuit board is located inside the base; the upper cover is arranged on one side of the base; characterized in that: Also included is a heat dissipation assembly; The heat dissipation assembly includes a mounting frame, two mounting parts, an air inlet sleeve, a bracket, a heat conducting part and a ventilation part; The mounting frame is fixedly connected to the base and is located on one side of the base; the two mounting parts are respectively arranged on both sides of the mounting frame; the air inlet sleeve is connected to the base and is located on one side of the base; the bracket is fixedly connected to the base and fixedly connected to the control circuit board and is located inside the base; the heat conductor is arranged on one side of the control circuit board; the ventilation part is arranged on one side of the base.

2. A water pump controller as claimed in claim 1, characterized in that: The mounting member includes a mounting frame, a mounting plate and a locking screw. The mounting frame is fixedly connected to the mounting frame and is located on one side of the mounting frame; the mounting plate is fixedly connected to the mounting frame and is located on one side of the mounting frame; the locking screw is threadedly connected to the mounting plate and is located on one side of the mounting plate.

3. A water pump controller as claimed in claim 2, characterized in that: The heat-conducting component includes a heat-conducting frame, a heat-conducting silicon pad, a heat-conducting copper plate and heat-dissipating fins. The heat-conducting frame is fixedly connected to the bracket and is located on one side of the bracket; the heat-conducting silicon pad is located on one side of the control circuit board; the heat-conducting copper plate is fixedly connected to the heat-conducting frame and fixedly connected to the heat-conducting silicon pad and is located on one side of the heat-conducting frame; the heat-dissipating fins are fixedly connected to the heat-conducting copper plate and are located on one side of the heat-conducting copper plate.

4. A water pump controller as claimed in claim 3, characterized in that: The ventilation component includes a ventilation fan and a dustproof net. The ventilation fan is fixedly connected to the base and is located at one side of the base; the dustproof net is fixedly connected to the ventilation fan and is located at one side of the ventilation fan.

5. A water pump controller as claimed in claim 1, characterized in that: The heat dissipation assembly also includes a sealing member, and the sealing member is arranged inside the air inlet sleeve.

6. A water pump controller as claimed in claim 5, characterized in that: The sealing member comprises an elastic layer and a sealing gasket, wherein the elastic layer is fixedly connected to the air inlet sleeve and is located inside the air inlet sleeve; the sealing gasket is fixedly connected to the elastic layer and is located on one side of the elastic layer.

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