Wafer cutting device for semiconductor packaging

Abstract

The utility model discloses a wafer cutting device for semiconductor packaging, which comprises a fixed box body, a movable block and a cutting equipment body, a fixed frame is arranged at the top end in the fixed box body, a wafer body is arranged above the fixed frame, an annular sliding rail is arranged at the top end of the fixed box body, and a movable block is arranged on the annular sliding rail. An annular sliding rail is arranged in the fixed box body, a supporting frame is arranged in the annular sliding rail, a transmission mechanism used for transmitting the supporting frame to rotate is arranged at the top end of the fixed box body, a vertical sliding rail is arranged on the inner wall of the supporting frame, a movable block is arranged in the vertical sliding rail, and a first motor is arranged in the vertical sliding rail; according to the device, the cutting equipment bodies can move front and back, and the two sets of cutting equipment bodies operate synchronously, so that the operation is simple, the use is convenient, the labor force is saved, and the cutting efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafers, in particular to a wafer cutting device for semiconductor packaging. Background Art

[0002] The wafer manufacturing plant then melts a lot of crystalline silicon, plants seed crystals in the melt, and then slowly pulls them out to form a cylindrical single-crystal silicon rod. Since the silicon rod is gradually generated from a seed crystal with a certain crystal plane orientation in the molten silicon raw material, this process is called "crystal growth". The silicon rod is then cut, rolled, sliced, chamfered, polished, laser engraved, and packaged to become the basic raw material of the integrated circuit factory - silicon wafers, which are "wafers". A layer of about 2um of Al2O3 and glycerol mixture is attached to the surface of the wafer to protect it. Chemical etching and surface cleaning must be performed before production.

[0003] However, the existing wafer cutting devices for semiconductor packaging have the following problems during use: the traditional processing method is a single-piece cutting device, but the cutting speed is slow and the cutting time is long, resulting in low work efficiency and low production efficiency, and thus cannot meet market demand. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer cutting device for semiconductor packaging to solve the related problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer cutting device for semiconductor packaging, comprising a fixed box, a moving block and a cutting equipment body, a fixed frame is installed at the top of the fixed box, and a wafer body is arranged above the fixed frame, an annular slide rail is installed at the top of the fixed box, and a support frame is arranged inside the annular slide rail, a transmission mechanism for driving the support frame to rotate is arranged at the top of the fixed box, a vertical slide rail is arranged on the inner wall of the support frame, and a movable block is arranged inside the vertical slide rail, a first motor is arranged inside the vertical slide rail, and a lead screw is installed at the output end of the first motor, a slide rod is arranged between the movable blocks, moving blocks are installed on both sides of the outer wall of the lead screw, and the cutting equipment body is installed at the bottom end of the moving block.

[0006] The technical solution provides a wafer cutting device for semiconductor packaging, wherein a sliding block is installed on the outer wall of the support frame, and the sliding block is matched with the inner wall of the annular slide rail.

[0007] The technical solution provides a wafer cutting device for semiconductor packaging, wherein the transmission machine includes a second motor and a gear, a gear block is installed on the outer wall of the support frame, a second motor is arranged on the top of the fixed box body, and a gear meshing with the outer wall of the gear block is installed on the output end of the second motor.

[0008] The technical solution provides a wafer cutting device for semiconductor packaging, wherein the inner wall of the support frame is provided with a cylinder, and the output end of the cylinder is connected to the top end of the movable block.

[0009] The technical solution provides a wafer cutting device for semiconductor packaging, wherein a vacuum suction cup device body is arranged on the top of the fixing frame, and the top of the vacuum suction cup device body is tightly fitted with the outer wall of the wafer body.

[0010] Compared with the prior art, the utility model provides a wafer cutting device for semiconductor packaging, which has the following beneficial effects:

[0011] 1. The utility model starts the first motor to drive the moving block to move forward and backward on both sides of the screw rod, so that the cutting device body can move forward and backward, and the two groups of cutting device bodies operate synchronously, which makes the operation simple, easy to use, saves labor, and improves cutting efficiency.

[0012] 2. The utility model starts the second motor to drive the gear to mesh with the outer wall of the gear block, so that the support frame slides with the inner wall of the annular slide rail through the slider, which is convenient for the two sets of moving blocks at the support frame to slide. The structure is simple to operate and convenient for adjusting the cutting direction.

[0013] 3. The utility model starts the vacuum suction cup device body above the fixing frame, so that the vacuum suction cup device body and the wafer body are closely fitted, and the wafer body is fixed in position, so as to facilitate unobstructed cutting around and increase the cutting space. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the main cross-sectional structure of the utility model;

[0015] Figure 2 This is a schematic diagram of the main structure of the utility model;

[0016] Figure 3 For the utility model Figure 1 A schematic diagram of the enlarged structure at point A;

[0017] Figure 4 It is a schematic diagram of the top structure of the utility model.

[0018] In the figure: 1. fixed box; 2. fixed frame; 3. wafer body; 4. annular slide rail; 5. support frame; 6. vertical slide rail; 7. movable block; 8. screw rod; 9. first motor; 10. moving block; 11. cutting equipment body; 12. gear block; 13. second motor; 14. gear; 15. cylinder; 16. slide rod; 17. vacuum suction cup equipment body. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Embodiment 1, as Figure 1-2 As shown, the utility model provides a technical solution: a wafer cutting device for semiconductor packaging, comprising a fixed box 1, a moving block 10 and a cutting device body 11, a fixed frame 2 is installed at the top of the fixed box 1, and a wafer body 3 is arranged above the fixed frame 2, an annular slide rail 4 is installed at the top of the fixed box 1, and a support frame 5 is arranged inside the annular slide rail 4, a transmission mechanism for driving the support frame 5 to rotate is arranged at the top of the fixed box 1, a slider is installed on the outer wall of the support frame 5, and the slider and the annular slide are connected. The inner wall of the rail 4 is adapted, the transmission machine includes a second motor 13 and a gear 14, the outer wall of the support frame 5 is installed with a gear block 12, the top of the fixed box 1 is provided with a second motor 13, and the output end of the second motor 13 is installed with a gear 14 meshing with the outer wall of the gear block 12. By starting the second motor 13, the gear 14 is driven to mesh with the outer wall of the gear block 12, so that the support frame 5 slides with the inner wall of the annular slide rail 4 through the slider, which is convenient for the two groups of moving blocks 10 at the support frame 5 to slide. The structure is simple to operate and convenient for adjusting the cutting direction.

[0021] Embodiment 2, as Figure 1-4 As shown, the utility model provides a technical solution: a wafer cutting device for semiconductor packaging, comprising a support frame 5 having an inner wall provided with a vertical slide rail 6, and a movable block 7 is provided inside the vertical slide rail 6, a first motor 9 is provided inside the vertical slide rail 6, and a screw rod 8 is installed at the output end of the first motor 9, a slide rod 16 is provided between the movable blocks 7, moving blocks 10 are installed on both sides of the outer wall of the screw rod 8, and a cutting device body 11 is installed at the bottom end of the moving block 10, a cylinder 15 is provided on the inner wall of the support frame 5, and the output end of the cylinder 15 is connected to the top of the movable block 7, and the fixed A vacuum suction cup device body 17 is provided at the top of the frame 2, and the top of the vacuum suction cup device body 17 is tightly fitted with the outer wall of the wafer body 3. By starting the vacuum suction cup device body 17 above the fixed frame 2, the vacuum suction cup device body 17 is tightly fitted with the wafer body 3. Then, after the wafer body 3 is fixed in position, the first motor 9 can be started to drive the moving block 10 to move forward and backward on both sides of the screw rod 8, so that the cutting device body 11 can move forward and backward. The two groups of cutting device bodies 11 operate synchronously, which makes the operation simple, easy to use, saves labor, and improves the cutting efficiency.

[0022] Working principle: first, turn on the external power supply, and the operator places the wafer body 3 on the top of the vacuum suction cup equipment body 17, and then starts the vacuum suction cup equipment body 17 on the fixed frame 2 to make the vacuum suction cup equipment body 17 and the wafer body 3 fit tightly together. Then, after the wafer body 3 is fixed in position, the first motor 9 can be started to drive the moving block 10 to move forward and backward on both sides of the screw rod 8, so that the cutting equipment body 11 can move forward and backward. The synchronous operation of the two groups of cutting equipment bodies 11 improves the cutting efficiency, reduces the processing time, and improves the production efficiency. In addition, starting the cylinder 15 can drive the cutting equipment body 11 to move up and down at the vertical slide rail 6 through the movable block 7, which is convenient for adjusting the up and down positions. By starting the second motor 13, the gear 14 is driven to engage with the outer wall of the gear block 12, so that the support frame 5 slides with the inner wall of the annular slide rail 4 through the slider, which is convenient for the two groups of moving blocks 10 at the support frame 5 to slide. This structure is simple to operate and convenient for adjusting the cutting direction.

[0023] Finally, it should be noted that the above content is only used to illustrate the technical solution of the utility model, rather than to limit the protection scope of the utility model. Simple modifications or equivalent substitutions of the technical solution of the utility model by ordinary technicians in this field do not deviate from the essence and scope of the technical solution of the utility model.

Claims

1. A wafer cutting device for semiconductor packaging, comprising a fixed box (1), a moving block (10) and a cutting device body (11), characterized in that: A fixed frame (2) is installed at the top of the fixed box (1), and a wafer body (3) is arranged above the fixed frame (2); an annular slide rail (4) is installed at the top of the fixed box (1), and a support frame (5) is arranged inside the annular slide rail (4); a transmission mechanism for driving the support frame (5) to rotate is arranged at the top of the fixed box (1); a vertical slide rail (6) is arranged on the inner wall of the support frame (5), and a movable block (7) is arranged inside the vertical slide rail (6); a first motor (9) is arranged inside the vertical slide rail (6), and a lead screw (8) is installed at the output end of the first motor (9); a slide rod (16) is arranged between the movable blocks (7); moving blocks (10) are installed on both sides of the outer wall of the lead screw (8), and a cutting device body (11) is installed at the bottom end of the moving block (10).

2. A wafer cutting device for semiconductor packaging according to claim 1, characterized in that: A sliding block is installed on the outer wall of the support frame (5), and the sliding block is matched with the inner wall of the annular slide rail (4).

3. The wafer cutting device for semiconductor packaging according to claim 1, characterized in that: The transmission machine comprises a second motor (13) and a gear (14); a gear block (12) is installed on the outer wall of the support frame (5); a second motor (13) is arranged on the top end of the fixed box (1); and a gear (14) meshing with the outer wall of the gear block (12) is installed at the output end of the second motor (13).

4. The wafer cutting device for semiconductor packaging according to claim 1, characterized in that: The inner wall of the support frame (5) is provided with a cylinder (15), and the output end of the cylinder (15) is connected to the top end of the movable block (7).

5. The wafer cutting device for semiconductor packaging according to claim 1, characterized in that: A vacuum suction cup device body (17) is arranged at the top of the fixing frame (2), and the top of the vacuum suction cup device body (17) is tightly fitted to the outer wall of the wafer body (3).

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