Wafer cleaning and spin-drying machine

Abstract

The utility model relates to the field of wafer processing equipment, in particular to a wafer cleaning and spin-drying machine. The cleaning and spin-drying machine comprises a cleaning tank, a protective cover, a protective cover switching mechanism, a wafer supporting and positioning seat, a wafer rotating mechanism, a water spraying mechanism and an air spraying mechanism, the protective cover used for sealing the cleaning tank is arranged above the cleaning tank, the protective cover is installed on the protective cover switching mechanism, the wafer supporting and positioning seat is rotatably connected in the cleaning tank, and the wafer rotating mechanism is installed on the wafer supporting and positioning seat. The wafer supporting and positioning seat is connected with a wafer rotating mechanism, and a water spraying mechanism and an air spraying mechanism are installed in the cleaning tank. According to the wafer cleaning device, the wafer is positioned at the cleaning position through the wafer supporting and positioning seat, the wafer is driven to rotate through the wafer rotating mechanism, water is sprayed into the cleaning tank through the water spraying mechanism, and the surface of the wafer is washed through the air spraying mechanism. The structure is simplified, the cost is saved, and the cleaning efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of wafer processing equipment, in particular to a wafer cleaning and drying machine. Background Art

[0002] The processed wafers usually need to have their surfaces cleaned, but existing wafer cleaning equipment has a complex structure, high cost, and insufficient automation, resulting in low cleaning efficiency. Utility Model Content

[0003] The technical problem to be solved by the utility model is: in order to solve the technical problem described in the background technology, the utility model provides a wafer cleaning and drying machine. The wafer is positioned at the cleaning position by a wafer support and positioning seat, the wafer is driven to rotate by a wafer rotating mechanism, water is sprayed in the cleaning tank by a water spraying mechanism, and the surface of the wafer is flushed by an air jet mechanism. The application simplifies the structure, saves costs, and improves cleaning efficiency.

[0004] The technical solution adopted by the utility model to solve its technical problems is:

[0005] A wafer cleaning and drying machine comprises a cleaning tank, a protective cover, a protective cover switch mechanism, a wafer supporting and positioning seat, a wafer rotating mechanism, a water spraying mechanism and an air jetting mechanism. A protective cover for closing the cleaning tank is arranged above the cleaning tank, the protective cover is mounted on the protective cover switch mechanism, a wafer supporting and positioning seat is rotatably connected in the cleaning tank, the wafer supporting and positioning seat is connected to the wafer rotating mechanism, and a water spraying mechanism and an air jetting mechanism are installed in the cleaning tank.

[0006] Specifically, the wafer support and positioning seat includes a turntable, a base block, a connecting rod, a support block, a limit stop column, and a suction hole. The turntable is rotatably connected in the cleaning tank. A base block is fixed at the center of the turntable. Several connecting rods are evenly distributed on the base block. A support block is fixed on the top of the connecting rod. The support block is provided with a limit stop column for blocking the wafer, and the support block is provided with a suction hole.

[0007] Specifically, the wafer rotating mechanism includes a servo motor, a synchronous wheel, and a synchronous belt. The output shaft of the motor and the turntable are both fixed with synchronous wheels, and the two synchronous wheels are both matched on the synchronous belt.

[0008] Specifically, the shield switch mechanism includes a lifting cylinder and a fixed bracket, and the piston rod of the lifting cylinder is fixedly connected to the shield through the fixed bracket.

[0009] Specifically, the water spray mechanism includes a water spray nozzle and a water pump. The water spray nozzle is located in the cleaning tank and is connected to the water pump.

[0010] Specifically, the jet mechanism comprises a rotary cylinder and a jet pipe, the output shaft of the rotary cylinder is fixed on the jet pipe, and the jet pipe is connected to an air pump.

[0011] Specifically, a drain pipe is installed on the cleaning tank, and a valve is installed on the drain pipe.

[0012] The beneficial effects of the utility model are as follows: the utility model provides a wafer cleaning and drying machine. The wafer is positioned at the cleaning position by a wafer support and positioning seat, the wafer is driven to rotate by a wafer rotating mechanism, water is sprayed in and out of the cleaning tank by a water spraying mechanism, and the wafer surface is flushed by an air jet mechanism. The application simplifies the structure, saves costs, and improves cleaning efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0014] Figure 1 It is a structural schematic diagram of the utility model;

[0015] Figure 2 It is a schematic diagram of the structure inside the cleaning tank of the utility model;

[0016] In the figure, 1. cleaning tank, 2. shield, 3. shield switch mechanism, 4. wafer support and positioning seat, 5. wafer rotation

[0017] Rotating mechanism, 6. Water spraying mechanism, 7. Jet mechanism, 8. Drain pipe, 41. Turntable, 42. Base block, 43. Connecting rod, 44. Support block, 45. Limit stop column, 46. Suction hole, 71. Rotating cylinder, 72. Jet pipe. DETAILED DESCRIPTION

[0018] Now the utility model is further described in detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the utility model in a schematic manner, and therefore only show the components related to the utility model.

[0019] Figure 1 It is a structural schematic diagram of the utility model; Figure 2 It is a schematic diagram of the structure inside the cleaning tank of the utility model.

[0020] As attached Figure 1 As shown, a wafer cleaning and drying machine comprises a cleaning tank 1, a protective cover 2, a protective cover switch mechanism 3, a wafer supporting and positioning seat 4, a wafer rotating mechanism 5, a water spraying mechanism 6, and an air jet mechanism 7. A protective cover 2 for closing the cleaning tank 1 is provided above the cleaning tank 1, the protective cover 2 is mounted on the protective cover switch mechanism 3, a wafer supporting and positioning seat 4 is rotatably connected in the cleaning tank 1, the wafer supporting and positioning seat 4 is connected to the wafer rotating mechanism 5, and a water spraying mechanism 6 and an air jet mechanism 7 are installed in the cleaning tank 1.

[0021] As attached Figure 2As shown, the wafer support and positioning seat 4 includes a turntable 41, a base block 42, a connecting rod 43, a support block 44, a limit stop column 45, and a suction hole 46. The turntable 41 is rotatably connected in the cleaning tank 1. The base block 42 is fixed at the center of the turntable 41. Several connecting rods 43 are evenly distributed on the base block 42. The top of the connecting rod 43 is fixed with a support block 44. The support block 44 is provided with a limit stop column 45 for blocking the wafer, and the support block 44 is provided with a suction hole 46. The vacuum pump drives the suction hole 46 to generate negative pressure suction through the airway between the base block 42, the connecting rod 43, and the support block 44.

[0022] The wafer is placed on a plurality of centrally symmetrical support blocks 44, and the limit stopper 45 can limit the wafer to the center of the turntable 41. The suction force generated on the suction hole 46 can fix the wafer and the support block 44 together. The wafer rotating mechanism 5 drives the turntable 41 to rotate, and the turntable 41 can rotate synchronously with the wafer.

[0023] The wafer rotating mechanism 5 includes a servo motor, a synchronous wheel, and a synchronous belt. The output shaft of the motor and the turntable 41 are both fixed with synchronous wheels, and the two synchronous wheels are both matched on the synchronous belt. The servo motor drives the synchronous wheel on the output shaft to rotate, and the synchronous wheel on the turntable 41 and the turntable 41 can be driven to rotate through the synchronous belt.

[0024] The shield switch mechanism 3 includes a lifting cylinder and a fixed bracket, and the piston rod of the lifting cylinder is fixedly connected to the shield 2 through the fixed bracket. The lifting cylinder can drive the shield 2 to move up and down.

[0025] The water spray mechanism 6 includes a water spray nozzle and a water pump. The water spray nozzle is located in the cleaning tank 1 and is connected to the water pump.

[0026] The jet mechanism 7 comprises a rotating cylinder 71 and a jet pipe 72. The output shaft of the rotating cylinder 71 is fixed on the jet pipe 72, and the jet pipe 72 is connected to an air pump. The rotating cylinder 71 can drive the jet pipe 72 to swing back and forth above the wafer.

[0027] A drain pipe 8 is installed on the cleaning tank 1, and a valve is installed on the drain pipe 8.

[0028] The working method of the present application is as follows: first, the wafer is placed on the wafer support and positioning seat 4, and then the shield switch mechanism 3 drives the shield 2 to close the cleaning tank 1. Then the wafer rotation mechanism 5 drives the wafer to rotate, and the water spray mechanism 6 starts to spray water to clean the wafer. After cleaning for a period of time, the water pump is turned off, and the spray pipe 72 of the spray mechanism 7 sprays nitrogen to the wafer. After cleaning is completed, the shield 2 is raised and the wafer is taken out.

[0029] Based on the above ideal embodiments of the utility model, the relevant staff can make various changes and modifications without deviating from the technical concept of the utility model through the above description. The technical scope of the utility model is not limited to the content of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A wafer cleaning and drying machine, characterized in that: The invention comprises a cleaning tank (1), a protective cover (2), a protective cover switch mechanism (3), a wafer support and positioning seat (4), a wafer rotating mechanism (5), a water spray mechanism (6), and an air jet mechanism (7). A protective cover (2) for closing the cleaning tank (1) is arranged above the cleaning tank (1); the protective cover (2) is mounted on the protective cover switch mechanism (3); a wafer support and positioning seat (4) is rotatably connected in the cleaning tank (1); the wafer support and positioning seat (4) is connected to the wafer rotating mechanism (5); and a water spray mechanism (6) and an air jet mechanism (7) are mounted in the cleaning tank (1).

2. The wafer cleaning and drying machine according to claim 1, characterized in that: The wafer support and positioning seat (4) comprises a turntable (41), a base block (42), a connecting rod (43), a supporting block (44), a limit stop column (45), and a suction hole (46); the turntable (41) is rotatably connected in the cleaning tank (1); a base block (42) is fixed at the center of the turntable (41); a plurality of connecting rods (43) are evenly distributed on the base block (42); a supporting block (44) is fixed at the top of the connecting rod (43); a limit stop column (45) for blocking the wafer is provided on the supporting block (44); and a suction hole (46) is provided on the supporting block (44).

3. The wafer cleaning and drying machine according to claim 2, characterized in that: The wafer rotating mechanism (5) comprises a servo motor, a synchronous wheel and a synchronous belt. The output shaft of the motor and the turntable (41) are both fixed with synchronous wheels, and the two synchronous wheels are both matched on the synchronous belt.

4. The wafer cleaning and drying machine according to claim 1, characterized in that: The shield switch mechanism (3) comprises a lifting cylinder and a fixed bracket, and the piston rod of the lifting cylinder is fixedly connected to the shield (2) via the fixed bracket.

5. The wafer cleaning and drying machine according to claim 1, characterized in that: The water spray mechanism (6) comprises a water spray nozzle and a water pump. The water spray nozzle is located in the cleaning tank (1) and is connected to the water pump.

6. The wafer cleaning and drying machine according to claim 1, characterized in that: The jet mechanism (7) comprises a rotary cylinder (71) and a jet pipe (72). The output shaft of the rotary cylinder (71) is fixed on the jet pipe (72), and the jet pipe (72) is connected to an air pump.

7. The wafer cleaning and drying machine according to claim 1, characterized in that: A drain pipe (8) is installed on the cleaning tank (1), and a valve is installed on the drain pipe (8).

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