Silicon wafer separating device

Abstract

The utility model discloses a silicon wafer separating device which comprises a support and a separating mechanism arranged on the support, the support comprises two first supporting parts which are arranged in parallel, the first supporting parts are provided with transmission mechanisms used for moving silicon wafers, one end of the support is provided with an adsorption sheet, and the adsorption sheet is obliquely arranged from the back to the support to the towards the support from top to bottom; the wafer separating mechanism is arranged on the support and comprises a pair of first spray heads and a pair of second spray heads, the first spray heads and the second spray heads are both opposite to the side edges of silicon wafers, and the two paired spray heads are arranged on the two first supporting parts respectively and are oppositely arranged in the direction perpendicular to the conveying direction. The first nozzles arranged on the same first supporting part are located above the second nozzles, and the first nozzles are located on the side away from the adsorption piece relative to the second nozzles. According to the silicon wafer slicing device, the silicon wafer can be inclined according to the preset position while the slicing effect is ensured, and the silicon wafer can be matched with the adsorption piece, so that the adsorption effect of the adsorption piece on the silicon wafer is ensured.

Description

Technical Field

[0001] The utility model relates to the field of silicon wafer processing, in particular to a silicon wafer slicing device. Background Art

[0002] After the silicon wafers are cut and inserted into the basket for transportation using a wafer inserter, they need to be sliced ​​to prevent them from overlapping. Currently, there are two slicing methods: horizontal slicing and vertical slicing. Vertical slicing is widely used because of its low cost and low fragmentation rate. However, in existing vertical slicing devices, silicon wafers are often placed in a vertical state, and the adsorption sheet used for silicon wafer transmission is tilted, so that the adsorption sheet cannot fit well with the silicon wafer, resulting in poor adsorption effect on the silicon wafer. Summary of the invention

[0003] In order to overcome the defects in the prior art, an embodiment of the utility model provides a silicon wafer slicing device, which can tilt the silicon wafer at a preset position while ensuring the slicing effect, and cooperate with the adsorption sheet to ensure the adsorption effect of the adsorption sheet on the silicon wafer.

[0004] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a silicon wafer slicing device, comprising:

[0005] A bracket, wherein the bracket comprises two first supporting parts arranged in parallel, the first supporting parts are provided with a transmission mechanism for moving the silicon wafer, one end of the bracket is provided with an adsorption sheet, and the adsorption sheet is inclined from the back to the bracket to the bracket from top to bottom;

[0006] A slicing mechanism is arranged on the bracket, and the slicing mechanism includes a pair of first nozzles and a pair of second nozzles. The first nozzles and the second nozzles are opposite to the sides of the silicon wafer. The two paired nozzles are respectively arranged on the two first supporting parts, and are arranged opposite to each other in the vertical transmission direction. The first nozzle arranged on the same first supporting part is located above the second nozzle, and the first nozzle is located on the side away from the adsorption sheet relative to the second nozzle.

[0007] By setting the first nozzle and the second nozzle opposite to the side of the silicon wafer, the nozzle is used to spray water columns on the gap between two adjacent silicon wafers to achieve the separation of silicon wafers. The first nozzle and the second nozzle are staggered in the vertical direction along the transmission direction, so that the upper part of the silicon wafer is separated by the nozzle first, and the lower part of the silicon wafer is separated by the nozzle later, so that the silicon wafer is tilted, which cooperates with the preset position of the adsorption sheet, and improves the adsorption effect between the silicon wafer and the adsorption sheet.

[0008] According to the arrangement of the silicon wafer separation device, it can be imagined that when the tilt direction of the adsorption sheet changes, the position arrangement of the first nozzle and the second nozzle can also be adjusted accordingly to adapt to the state of the adsorption sheet. For example, when the adsorption sheet is tilted from top to bottom from facing the bracket to facing away from the bracket. The first nozzle can be located on the side close to the adsorption sheet relative to the second nozzle, so that the lower part of the silicon wafer is separated first and the upper part is separated later.

[0009] The first nozzle and the second nozzle can be a pair or multiple pairs. For example, multiple first nozzles or multiple second nozzles are arranged along the length direction of the first support portion.

[0010] Furthermore, the first nozzle includes a plurality of first nozzles arranged along the transmission direction, and the second nozzle includes a plurality of second nozzles arranged along the transmission direction. Specifically, the first nozzle and the second nozzle may have the same structure, and the first nozzle and the second nozzle are circular holes of the same size. For example, the first nozzle and the second nozzle both include a rectangular shell, one end of the rectangular shell is provided with a water inlet, a water inlet main pipe connected to the water inlet is provided in the rectangular shell, and a plurality of water inlet branch pipes are vertically arranged and connected to the water inlet main pipe, and one end of the water inlet branch forms a first nozzle or a second nozzle on the surface of the rectangular shell. Preferably, the number of the first nozzles can be greater than the number of the second nozzles.

[0011] Furthermore, the slicing mechanism further includes a pair of third nozzles, the third nozzles are located on the side of the first nozzle facing the adsorption sheet, and the third nozzles are located above the second nozzles. The number of the third nozzles can be adjusted according to actual conditions. By setting the third nozzles, when the silicon wafer approaches the adsorption sheet, the water flow disturbance relative to the top of the silicon wafer is increased, thereby increasing the slicing speed above the silicon wafer, so that the silicon wafer can be further tilted to cooperate with the adsorption sheet.

[0012] Further preferably, the third nozzle has a third nozzle, the third nozzle is in a strip shape, and the area of ​​the third nozzle is larger than the areas of the first nozzle and the second nozzle. The third nozzle is larger than the first nozzle and the second nozzle, so as to increase the water flow rate of the nozzle and increase the water flow disturbance.

[0013] Furthermore, the slicing mechanism further includes a fourth nozzle, and the fourth nozzle is opposite to the bottom edge of the silicon wafer. By arranging the fourth nozzle at the bottom, the fourth nozzle is used to spray water on the bottom gap between two adjacent silicon wafers to ensure that the two adjacent silicon wafers are separated. In addition, the fourth nozzle increases the upward spraying water flow, exerts an upward force on the silicon wafer, reduces the friction between the silicon wafer and the bottom transmission mechanism, and facilitates the movement of the silicon wafer under the action of the transmission mechanism. The number of the fourth nozzles can be set according to actual conditions. For example, a fourth nozzle can be set relative to the middle of the bottom edge of the silicon wafer, or a plurality of fourth nozzles can be arranged along the length direction of the bottom edge of the silicon wafer. The fourth nozzle can be set with the same structure as the first nozzle and the second nozzle.

[0014] Further preferably, the fourth nozzle is inclined from top to bottom from an end facing away from the adsorption sheet to an end facing the adsorption sheet.

[0015] Furthermore, the wafer separation mechanism further includes a fifth nozzle, and the fifth nozzle is located on the side of the second nozzle facing away from the adsorption sheet. When the number of silicon wafers remaining on the transmission mechanism is small, the silicon wafers are easily tilted toward the side facing away from the adsorption sheet due to resistance. By providing the fifth nozzle, when the number of silicon wafers remaining is small, a thrust can be applied from behind the silicon wafers, thereby preventing the silicon wafers from tilting and being damaged.

[0016] Further preferably, the fifth nozzle is tubular, which has a simple structure and is easy to process.

[0017] Furthermore, the slicing mechanism further includes at least one pair of sixth nozzles, and the sixth nozzles are located between the first nozzle and the second nozzle. The sixth nozzle is arranged between the first nozzle and the second nozzle, so that the silicon wafer is subjected to force from top to bottom in sequence and gradually tilted, which is particularly suitable for the case where the silicon wafer is relatively high.

[0018] Furthermore, the first nozzle and the second nozzle are made of transparent materials, such as polystyrene. The first nozzle and the second nozzle are made of transparent materials, which makes it easier for the staff to observe the internal conditions of the nozzle, and can quickly determine the blockage position in the nozzle, thereby improving the maintenance efficiency.

[0019] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0020] 1. The first and second nozzles are arranged opposite to the sides of the silicon wafers, and the nozzles are used to spray water columns on the gap between two adjacent silicon wafers to achieve the separation of the silicon wafers. The first and second nozzles are staggered in the vertical direction along the transmission direction, so that the upper part of the silicon wafer is separated by the nozzle first, and the lower part of the silicon wafer is separated by the nozzle later, so that the silicon wafer is tilted, which cooperates with the preset position of the adsorption sheet, and improves the adsorption effect between the silicon wafer and the adsorption sheet.

[0021] 2. By setting a third nozzle, when the silicon wafer is close to the adsorption sheet, the water flow disturbance relative to the top of the silicon wafer is increased, thereby increasing the slice speed above the silicon wafer, so that the silicon wafer can be further tilted to cooperate with the adsorption sheet.

[0022] 3. Use the fourth nozzle to spray water on the bottom gap between two adjacent silicon wafers to ensure that the two adjacent silicon wafers are separated. In addition, the fourth nozzle increases the upward spray flow to give the silicon wafer an upward force, reduce the friction between the silicon wafer and the bottom transmission mechanism, and facilitate the movement of the silicon wafer under the action of the transmission mechanism.

[0023] 4. By setting the fifth nozzle, when the remaining amount of silicon wafer is small, a thrust can be applied from the back of the silicon wafer to prevent the silicon wafer from tipping over and being damaged.

[0024] In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 This is a schematic diagram of the structure of a silicon wafer separation device in an embodiment of the utility model;

[0027] Figure 2 1 is a top view of a silicon wafer separating device in an embodiment of the utility model;

[0028] Figure 3 yes Figure 2 Schematic diagram of the cross section at AA;

[0029] Figure 4 This is a schematic diagram of the structure of the silicon wafer slicing device in the embodiment of the utility model without a slicing plate;

[0030] Figure 5 It is a schematic diagram of the structures of the first nozzle, the second nozzle and the fourth nozzle in the embodiment of the utility model.

[0031] The figure markings of the above drawings are: 1. bracket; 11. first supporting part; 12. second supporting part; 13. base; 21. first transmission mechanism; 22. second transmission mechanism; 3. adsorption sheet; 4. sheet separation mechanism; 41. first nozzle; 42. second nozzle; 43. third nozzle; 44. fourth nozzle; 45. fifth nozzle; 461. rectangular shell; 462. water inlet; 463. water inlet main pipe; 464. water inlet branch; 465. nozzle. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] Example 1: See Figures 1 to 5 As shown, a silicon wafer slicing device includes a bracket 1, a transmission mechanism arranged on the bracket 1, an adsorption sheet 3 located at one end of the bracket 1, and a slicing mechanism 4 arranged on the bracket 1 close to the adsorption sheet 3.

[0034] See also Figure 1 As shown, the bracket 1 includes a base 13, two first supporting parts 11 arranged in parallel, two second supporting parts 12 arranged in parallel, a first transmission mechanism 21 arranged on the first supporting part 11, and a second transmission mechanism 22 arranged on the second supporting part 12. The first transmission mechanism 21 and the second transmission mechanism 22 both include a driving wheel, a driven wheel, and belts sleeved on the driving wheel and the driven wheel. An accommodating space for placing silicon wafers is formed between the two first supporting parts 11 and above the second supporting part 12. The belt on the first supporting part 11 contacts the side of the silicon wafer for clamping and transmitting the silicon wafer. The belt on the second supporting part 12 contacts the bottom edge of the silicon wafer for supporting and transmitting the silicon wafer.

[0035] The adsorption sheet 3 is arranged at one end of the bracket 1, and the silicon wafer is transferred to the inserting mechanism after being transferred to the adsorption sheet 3 by the transmission mechanism and adsorbed by the adsorption sheet 3. Usually, the adsorption sheet 3 is arranged from the back to the bracket 1 to the tilted position toward the bracket 1 from top to bottom.

[0036] See also Figure 3 , 4As shown, the slicing mechanism 4 includes a pair of first nozzles 41 and a pair of second nozzles 42 for pre-slicing and tilting of silicon wafers. The first nozzle 41 and the second nozzle 42 are both opposite to the side of the silicon wafer. The two pairs of first nozzles 41 are respectively arranged on the two first support parts 11, and are arranged opposite to each other in the vertical transmission direction. The two pairs of second nozzles 42 are respectively arranged on the two first support parts 11, and are arranged opposite to each other in the vertical transmission direction. The first nozzle 41 arranged on the same first support part 11 is located above the second nozzle 42, that is, the first nozzle 41 is opposite to the upper part of the silicon wafer, and the second nozzle 42 is opposite to the lower part of the silicon wafer. Preferably, the first nozzle 41 and the second nozzle 42 can be respectively close to the top and bottom of the silicon wafer. In addition, the first nozzle 41 is located on the side away from the adsorption sheet 3 relative to the second nozzle 42. The first nozzle 41 and the second nozzle 42 partially overlap in the transmission direction, that is, when the second nozzle 42 separates the lower part of the silicon wafer, the first nozzle 41 continues to separate the upper part of the silicon wafer.

[0037] When the silicon wafer is moved toward the adsorption sheet 3 by the first transmission mechanism 21 and the second transmission mechanism 22, the gap between the upper sides of the two adjacent silicon wafers is first separated by the water column sprayed by the first nozzle 41. As the silicon wafer continues to move toward the adsorption sheet 3, the gap between the lower sides of the two adjacent silicon wafers is separated by the water column sprayed by the second nozzle 42. Since the upper and lower sides of the silicon wafer are separated in sequence, the silicon wafer is tilted, and the tilt direction of the silicon wafer is consistent with the tilt direction of the adsorption sheet 3, so that when the silicon wafer is close to the adsorption sheet 3, it can better fit to the surface of the adsorption sheet 3.

[0038] In a possible implementation manner, the first nozzle 41 and the second nozzle 42 have the same structure. Figure 5 As shown, the first nozzle 41 and the second nozzle 42 both include a rectangular shell 461, one end of the rectangular shell 461 is provided with a water inlet 462, the rectangular shell 461 is provided with a water inlet main pipe 463 connected to the water inlet 462, and a plurality of water inlet manifolds 464 are vertically arranged and connected to the water inlet main pipe 463, and one end of the water inlet manifold 464 forms a nozzle 465 on the surface of the rectangular shell 461. The rectangular shell 461 is made of transparent material, and the staff can directly observe the water inlet main pipe 463 and the water inlet manifold 464 from the outside, and understand the internal situation of the nozzle in real time. When the nozzle is blocked, the blocked position of the nozzle can be quickly determined to improve the maintenance efficiency.

[0039] In a possible embodiment, the first nozzle 41 includes a plurality of first nozzles arranged along the transmission direction. The second nozzle 42 includes a plurality of second nozzles arranged along the transmission direction. The first nozzles and the second nozzles can be arranged in multiple rows. The first nozzles and the second nozzles are circular holes of the same size. The number of the first nozzles on the first nozzle 41 is greater than the number of the second nozzles on the second nozzle 42.

[0040] In a possible embodiment, the slicing mechanism 4 further includes a pair of third nozzles 43, the third nozzles 43 are located on the side of the first nozzle 41 facing the adsorption sheet 3, and the third nozzles 43 are located above the second nozzles 42. By providing the third nozzles 43, when the silicon wafer approaches the adsorption sheet 3, the water flow disturbance relative to the top of the silicon wafer is increased, thereby increasing the slicing speed above the silicon wafer, so that the silicon wafer can be further tilted to cooperate with the adsorption sheet 3.

[0041] The third nozzle 43 includes a first nozzle, a nozzle disposed at one end of the first nozzle, and the end of the nozzle facing away from the first nozzle is deformed into a third nozzle in a strip shape. The area of ​​the third nozzle is larger than the area of ​​the first nozzle and the second nozzle. The water flow rate sprayed from the nozzle is increased to increase the disturbance of the water flow above, thereby accelerating the separation speed above the silicon wafer.

[0042] In one possible embodiment, the slicing mechanism 4 also includes a fourth nozzle 44, and the fourth nozzle 44 has the same structure as the first nozzle 41 and the second nozzle 42. The fourth nozzle 44 is connected to the second support portion 12, and is tilted from the end facing away from the adsorption sheet 3 to the end facing the adsorption sheet 3 from top to bottom, opposite to the bottom edge of the silicon wafer. The angle between the fourth nozzle 44 and the support surface of the second transmission mechanism 22 is 20° to 40°, preferably 30°. By arranging the fourth nozzle 44 at the bottom, the fourth nozzle 44 is used to spray water on the bottom gap between two adjacent silicon wafers to ensure that the two adjacent silicon wafers are separated. In addition, the fourth nozzle 44 increases the upward spraying water flow, applies an upward force to the silicon wafer, reduces the friction between the silicon wafer and the bottom transmission mechanism, and facilitates the movement of the silicon wafer under the action of the transmission mechanism.

[0043] In actual use, the nozzle pressures of the first nozzle 41, the second nozzle 42, and the third nozzle 43 can be set to 0.125-0.185 MPa. The nozzle pressure of the fourth nozzle 44 can be set to 0.85-0.125 MPa. The pressure of the adsorption sheet 3 can be set to 0.125-0.145 MPa.

[0044] In a possible embodiment, the sheet separation mechanism 4 further includes a fifth nozzle 45, and the fifth nozzle 45 is located on the side of the second nozzle 42 facing away from the adsorption sheet 3. The fifth nozzle 45 includes a tubular second nozzle, and one end of the second nozzle forms a circular fifth nozzle, and the fifth nozzle is larger than the first nozzle and the second nozzle. When the number of silicon wafers remaining on the transmission mechanism is small, the silicon wafers are easily tilted toward the side facing away from the adsorption sheet 3 due to resistance. By setting the fifth nozzle 45, when the number of silicon wafers remaining is small, a thrust can be applied from the back of the silicon wafer, thereby preventing the silicon wafer from tilting and being damaged.

[0045] In a possible implementation, the slicing mechanism 4 further includes a pair of sixth nozzles, and the sixth nozzles are located between the first nozzle 41 and the second nozzle 42. The sixth nozzle is arranged between the first nozzle 41 and the second nozzle 42, so that the silicon wafer is subjected to force from top to bottom in sequence and gradually tilted, which is particularly suitable for the case where the silicon wafer is relatively high.

[0046] The present invention uses specific embodiments to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A silicon wafer slicing device, characterized in that: include: A bracket, wherein the bracket comprises two first supporting parts arranged in parallel, the first supporting parts are provided with a transmission mechanism for moving the silicon wafer, one end of the bracket is provided with an adsorption sheet, and the adsorption sheet is inclined from the back to the bracket to the bracket from top to bottom; A slicing mechanism is arranged on the bracket, and the slicing mechanism includes a pair of first nozzles and a pair of second nozzles. The first nozzles and the second nozzles are opposite to the sides of the silicon wafer. The two paired nozzles are respectively arranged on the two first supporting parts, and are arranged opposite to each other in the vertical transmission direction. The first nozzle arranged on the same first supporting part is located above the second nozzle, and the first nozzle is located on the side away from the adsorption sheet relative to the second nozzle.

2. The silicon wafer separation device according to claim 1, characterized in that: The first nozzle head includes a plurality of first nozzles arranged along a conveying direction, and the second nozzle head includes a plurality of second nozzles arranged along the conveying direction.

3. The silicon wafer separation device according to claim 2, characterized in that: The sheet separation mechanism further includes a pair of third nozzles, wherein the third nozzles are located on a side of the first nozzle facing the adsorption sheet, and the third nozzles are located above the second nozzles.

4. The silicon wafer separation device according to claim 3, characterized in that: The third nozzle has a third nozzle, the third nozzle is in a strip shape, and the area of ​​the third nozzle is larger than the areas of the first nozzle and the second nozzle.

5. The silicon wafer separation device according to claim 1, characterized in that: The slicing mechanism further includes a fourth nozzle, and the fourth nozzle is opposite to the bottom edge of the silicon wafer.

6. The silicon wafer separation device according to claim 5, characterized in that: The fourth nozzle is inclined from top to bottom from an end facing away from the adsorption sheet to an end facing the adsorption sheet.

7. The silicon wafer separation device according to claim 1, characterized in that: The sheet separation mechanism further includes a fifth nozzle, and the fifth nozzle is located on a side of the second nozzle facing away from the adsorption sheet.

8. The silicon wafer separation device according to claim 7, characterized in that: The fifth nozzle is tubular.

9. The silicon wafer separation device according to claim 1, characterized in that: The slicing mechanism further includes at least one pair of sixth nozzles, and the sixth nozzles are located between the first nozzle and the second nozzle.

10. The silicon wafer separation device according to claim 1, characterized in that: The first nozzle and the second nozzle are made of transparent material.

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