DIP semiconductor device capable of improving heat dissipation performance

Abstract

A DIP semiconductor device capable of improving heat dissipation performance relates to the technical field of semiconductor packaging and testing, comprises a packaging body, a chip is arranged in the packaging body, pins are fixedly arranged on two sides of the packaging body, and the pins are connected with the chip through metal wires, and is characterized in that one side of the chip is fixedly provided with a base island, and the other side of the chip is fixedly provided with a metal wire. And the radiating fins of the base island are exposed on the outer side of the encapsulation body. According to the utility model, the heat dissipation performance can be improved, the defects of the current DIP packaging technology can be improved, the application field of the product can be expanded, the reliability of the product can be higher, and the application of the DIP packaging technology product can be wider.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging and testing, in particular to a DIP semiconductor device with improved heat dissipation performance. Background Art

[0002] DIP semiconductor devices are one of the earliest integrated circuit packaging forms. Due to its low cost, simple product structure, easy application and installation, high reliability, easy maintenance and wide application range, it has been widely used and promoted since the beginning. In the early days, due to the limitations of integrated circuit design, wafer processing technology and packaging, the size and volume of the packaged finished product were large, but the reliability against moisture intrusion was good.

[0003] The product structure of DIP packaging technology mainly consists of the DIE PAD carried by the chip, the lead pins for interconnecting with the external circuit, and the EMC material for protecting the internal circuit.

[0004] DIP products are widely used in various electronic products, such as computers, televisions, mobile phones, etc. With the development of electronic technology, DIP dual in-line packaging technology is also constantly developing and improving. In addition, with the development of SMT technology, some products of DIP packaging technology are gradually transforming to SMT technology. The main reason is that the installation method of DIP technology products is mainly the wave soldering process cost is higher than the reflow soldering of SMT technology, and SMT technology is more suitable for large-scale operations of electronic component mounting; due to the low cost, simple product structure, convenient application and installation, high reliability, easy maintenance and wide application range of DIP packaging technology products, they are still widely used and cannot be completely replaced by SMT technology products. Although DIP has the characteristics of stable installation and high reliability, it also has shortcomings in its own heat dissipation. The main surface is that the DIP packaging product package is thicker and larger in volume and has no exposed heat dissipation structure. Utility Model Content

[0005] The utility model aims to improve the heat dissipation performance, to improve the shortcomings of the current DIP packaging technology, to expand the application field of the product and to provide a DIP semiconductor device with improved heat dissipation performance and higher reliability.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A DIP semiconductor device with improved heat dissipation performance comprises an encapsulation body, a chip is arranged inside the encapsulation body, pins are fixedly arranged on both sides of the encapsulation body, and the pins are connected to the chip through metal wires. It is characterized in that a base island is fixedly arranged on one side of the chip, and the heat sink of the base island is exposed on the outside of the encapsulation body.

[0008] According to a preferred technical solution, the chip is fixedly connected to the base island by adhesive.

[0009] According to a preferred technical solution, bent ends are provided on both sides of the base island, and the bent ends are enclosed inside the encapsulation body.

[0010] According to a preferred technical solution, the heat sink of the base island is located on the upper side of the package, and the pins are bent toward the lower side of the package.

[0011] According to a preferred technical solution, the heat sink of the base island is located at the lower side of the package, and the pins are bent toward the lower side of the package.

[0012] According to a preferred technical solution, the material thickness of the pins and the base island is selected to be 0.254 mm-0.50 mm.

[0013] According to a preferred technical solution, the thickness of the encapsulation body is 1.40 mm-3.5 mm.

[0014] According to a preferred technical solution, an E-PIN is provided in the middle of the lower side of the enclosure or between two diagonal positions on the lower side of the enclosure.

[0015] According to a preferred technical solution, an E-PIN is provided between two diagonal positions on the lower side of the encapsulation body.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] The utility model can improve the heat dissipation performance, so as to improve the shortcomings of the current DIP packaging technology, increase the application field of the product and increase the reliability, and at the same time, the application of the DIP packaging technology products can be more extensive. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of the first embodiment of the utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the first embodiment of the utility model;

[0020] Figure 3 The following is a schematic diagram of the structure of the first embodiment of the utility model;

[0021] Figure 4 This is a schematic diagram of the base island structure of the utility model;

[0022] Figure 5 This is a schematic diagram of the structure of the second embodiment of the utility model;

[0023] Figure 6 The following is a schematic diagram of the structure of the second embodiment of the present utility model;

[0024] Figure 7 This is a schematic diagram of the structure of the first embodiment of the utility model;

[0025] In the figure: 1. package; 2. chip; 3. pin; 4. metal wire; 5. base island; 6. adhesive; 7. E-PIN; 51. bent end. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0027] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0028] Embodiment 1

[0029] like Figure 1 As shown, a DIP semiconductor device with improved heat dissipation performance includes an encapsulation body 1, a chip 2 is arranged inside the encapsulation body 1, pins 3 are fixedly arranged on both sides of the encapsulation body 1, the pins 3 are connected to the chip 2 through metal wires 4, a base island 5 is fixedly arranged on one side of the chip 2, and the heat sink of the base island 5 is exposed on the outside of the encapsulation body 1. The chip 2 is fixedly connected to the base island 5 through an adhesive 6. The bent end 51 is encapsulated inside the encapsulation body 1. The heat sink of the base island 5 is located on the upper side of the encapsulation body 1, and the pins 3 are bent toward the lower side of the encapsulation body 1. The material thickness of the pins and the base island is selected to be 0.254mm-0.50mm; the thickness of the encapsulation body is 1.40mm-3.5mm.

[0030] like Figure 2 and 3 As shown, E-PIN 7 is arranged between two diagonal positions on the lower side of the encapsulation body.

[0031] like Figure 4 As shown, bent ends 51 are provided on both sides of the base island 5 to facilitate fixing the base island.

[0032] Embodiment 1

[0033] like Figure 5 , 6As shown in FIG. 7 , the heat sink of the base island 5 is located at the lower side of the package 1, and the pin 3 is bent toward the lower side of the package 1. An E-PIN 7 is provided between two diagonal positions at the lower side of the package. Other structures are consistent with those of the first embodiment.

[0034] The utility model designs and manufactures a base island, so that the base island can be exposed in the structure of a DIP package product to form a heat sink, and the heat sink is connected to the back of a chip through silver glue to form a heat dissipation channel; the DIP package is appropriately thinned and adjusted in thickness to match the concave depth of the DIP base island, so that the base island can be exposed on the surface of the DIP package; there are two methods for plastic encapsulation of the DIP product: encapsulation with the heat sink facing upward; encapsulation with the heat sink facing downward; there are two methods for cutting and forming the DIP product: forming with the heat sink facing upward and the pins bending downward; forming with the heat sink facing downward and the pins bending downward; the semiconductor package device product structure design technology, material molding technology and product pin bending mold molding technology are used to successfully realize that the base island of the DIP package product is exposed on the surface of the package, so that the heat dissipation performance of the product can be greatly improved, and at the same time, the application of the DIP package technology product can be more extensive.

[0035] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A DIP semiconductor device with improved heat dissipation performance, comprising an encapsulation body (1), a chip (2) is arranged inside the encapsulation body (1), pins (3) are fixedly arranged on both sides of the encapsulation body (1), and the pins (3) are connected to the chip (2) through metal wires (4), characterized in that: A base island (5) is fixedly arranged on one side of the chip (2), and a heat sink of the base island (5) is exposed on the outside of the encapsulation body (1).

2. A DIP semiconductor device with improved heat dissipation performance according to claim 1, characterized in that: The chip (2) is fixedly connected to the base island (5) via an adhesive (6).

3. A DIP semiconductor device with improved heat dissipation performance according to claim 1 or 2, characterized in that: The base island (5) is provided with bent ends (51) on both sides, and the bent ends (51) are enclosed inside the encapsulation body (1).

4. A DIP semiconductor device with improved heat dissipation performance according to claim 1, characterized in that: The heat sink of the base island (5) is located on the upper side of the encapsulation body (1), and the pins (3) are bent toward the lower side of the encapsulation body (1).

5. A DIP semiconductor device with improved heat dissipation performance according to claim 1, characterized in that: The heat sink of the base island (5) is located on the lower side of the encapsulation body (1), and the pins (3) are bent toward the lower side of the encapsulation body (1).

6. A DIP semiconductor device with improved heat dissipation performance according to claim 1, characterized in that: The material thickness of the pins and the base island is selected to be 0.254mm-0.50mm.

7. A DIP semiconductor device with improved heat dissipation performance according to claim 1, characterized in that: The thickness of the encapsulation body is 1.40mm-3.5mm.

8. A DIP semiconductor device with improved heat dissipation performance according to claim 4, characterized in that: An E-PIN (7) is arranged at the middle position of the lower side of the enclosure or between two diagonal positions of the enclosure.

9. A DIP semiconductor device with improved heat dissipation performance according to claim 5, characterized in that: An E-PIN (7) is arranged between two diagonal positions on the lower side of the enclosure.

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