Single-side light-emitting lamp bead packaging structure

Abstract

The utility model provides a unilateral light-emitting lamp bead packaging structure which comprises a shell, a packaging cavity is arranged above the shell, a positive electrode pin and a negative electrode pin are respectively packaged on two sides of the shell, one part of the positive electrode pin and one part of the negative electrode pin are arranged below the outside of the shell, and the other part of the positive electrode pin and the other part of the negative electrode pin are arranged inside the packaging cavity. A wafer is fixedly installed in the packaging cavity, the wafer is electrically connected with the corresponding positive electrode pin and the corresponding negative electrode pin through gold wires, and the packaging cavity is filled with corresponding fluorescent powder and packaging glue; after the shell is welded on a circuit board, corresponding air holes can be formed between the notch at the bottom of the shell and the circuit board, so that air flows conveniently, and the bottom of the shell is better cooled; and meanwhile, through the arrangement of the upper ring groove, the material consumption of the shell can be reduced, and the contact area between the shell and air can be increased, so that a better heat dissipation effect is achieved.

Description

Technical Field

[0001] The utility model relates to the field of single-side luminous lamp beads, and in particular to a packaging structure of single-side luminous lamp beads. Background Art

[0002] The emitting angle of single-sided emitting lamp beads is smaller and the light is more concentrated, which is suitable for occasions that require directional lighting, such as indicator lights, backlights, etc.

[0003] After searching, the Chinese patent number CN 216902997 U discloses a single-side light-emitting lamp bead packaging structure, including a packaging shell, an inner cavity is opened inside the packaging shell, and the bottom surface of the inner surface of the inner cavity is fixedly connected with a support rod. The utility model connects the lower end of the curved tube with the air inlet. When the temperature in the inner cavity rises, the temperature of the air inside the curved tube in the inner cavity rises, while the temperature of the upper and lower ends of the curved tube is relatively low. The air in the high-temperature area collides and the density decreases, so that the surrounding air flows to the high-temperature area, and the high-temperature air gradually moves upward. By forming a large temperature difference between the middle and the outside of the curved tube, air flow is achieved, so that the surrounding air enters the curved tube from the air inlet, and the hot air is discharged upward, so as to achieve heat exchange in the inner cavity, and effectively dissipate heat inside the packaging shell while ensuring sealing, so as to avoid damage to the chip in an overheated environment and improve working stability.

[0004] However, the bottom of the package shell in the above technical solution is directly in contact with the circuit board, which is not conducive to air circulation and affects the overall heat dissipation; at the same time, the overall structure of the package shell is set, such as the side material is thicker, so a large amount of material needs to be consumed during production.

[0005] Therefore, it is very necessary to invent a single-side luminous lamp bead packaging structure. Utility Model Content

[0006] In order to solve the above technical problems, the utility model provides a technical solution adopted by a packaging structure of a single-sided light-emitting lamp bead: a packaging structure of a single-sided light-emitting lamp bead, comprising a shell, wherein: a packaging cavity is arranged above the shell, and positive electrode pins and negative electrode pins are respectively packaged on both sides of the shell, and a part of the positive electrode pin and the negative electrode pin are located below the outside of the shell, and a part of the positive electrode pin and the negative electrode pin are located inside the packaging cavity; a chip is fixedly installed inside the packaging cavity, and the chip is electrically connected to the corresponding positive electrode pin and the negative electrode pin through a gold wire, and the interior of the packaging cavity is filled with corresponding phosphor and packaging glue;

[0007] Preferably, a plurality of concentric upper annular grooves are evenly distributed on the upper surface of the shell, and the upper annular grooves are coaxial with the packaging cavity;

[0008] Preferably, a plurality of notches are evenly distributed on the bottom of the shell;

[0009] Preferably, a heat dissipation support plate is fixedly installed in the shell, and the heat dissipation support plate is at the bottom of the packaging cavity; the chip is fixed on the heat dissipation support plate by thermal conductive glue; a part of the positive electrode pin and the negative electrode pin in the packaging cavity is fixedly connected to the heat dissipation support plate by thermal conductive glue.

[0010] Preferably, a positioning notch is provided on one side of the upper surface of the shell.

[0011] Preferably, a plurality of honeycomb holes are evenly distributed and penetrated on both sides of the lower side of the shell.

[0012] Preferably, a second honeycomb hole is provided between the shell and the positive electrode pin and the negative electrode pin.

[0013] Preferably, a plurality of lower annular grooves are evenly distributed on the bottom of the shell, and the lower annular grooves are connected with the honeycomb holes, the notches and the second honeycomb hole.

[0014] Compared with the prior art, the advantages of the utility model are:

[0015] The overall setting of the utility model, after being welded to the circuit board, the notch at the bottom of the shell can form corresponding air holes between the circuit board to facilitate air flow, thereby better dissipating the heat of the bottom of the shell; at the same time, through the setting of the upper ring groove, not only the material used in the shell can be reduced, but also the contact area between the shell and the air can be increased, thereby achieving a better heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the internal structure of the packaging cavity of the utility model.

[0017] Figure 2 It is a schematic diagram of the bottom structure of the shell of the utility model.

[0018] Figure 3 It is a schematic diagram of the overall structure of the utility model.

[0019] In the figure:

[0020] Shell 1, packaging cavity 2, chip 3, positive pin 4, negative pin 5, gold wire 6, packaging glue 7, upper ring groove 8, honeycomb hole 9, honeycomb hole II 10, notch 11, lower ring groove 12, positioning notch 13. DETAILED DESCRIPTION

[0021] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be described clearly and completely below. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0022] In the description of the embodiments, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, which are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For ordinary technicians in this field, the specific meanings of the above terms in the utility model can be understood according to specific circumstances.

[0023] The utility model is further described below in conjunction with the accompanying drawings: Embodiment 1

[0024] Reference Figure 1-3 , a single-side luminous lamp bead packaging structure, including a shell 1, wherein: a packaging cavity 2 is arranged above the shell 1, and positive electrode pins 4 and negative electrode pins 5 are respectively packaged on both sides of the shell 1, and a part of the positive electrode pins 4 and negative electrode pins 5 are located below the outside of the shell 1, and a part of the positive electrode pins 4 and negative electrode pins 5 are located inside the packaging cavity 2; a chip 3 is fixedly installed inside the packaging cavity 2, and the chip 3 is electrically connected to the corresponding positive electrode pins 4 and negative electrode pins 5 through a gold wire 6, and the interior of the packaging cavity 2 is filled with corresponding phosphors and packaging glue 7;

[0025] The upper surface of the housing 1 is evenly provided with a plurality of concentric upper annular grooves 8, and the upper annular grooves 8 are coaxial with the packaging cavity 2. By providing the upper annular grooves 8, the material used for the housing 1 can be reduced, and the contact area between the housing 1 and the air can be increased, thereby achieving a better heat dissipation effect;

[0026] The bottom of the housing 1 is evenly provided with a plurality of notches 11. Through the provision of the notches 11, after the single-side light-emitting lamp bead packaging structure is welded on the circuit board, an air duct can be generated between the housing 1 and the circuit board, so that air can flow between the housing 1 and the circuit board, thereby achieving a better heat dissipation effect;

[0027] A heat dissipation support plate is fixedly installed in the shell 1, and the heat dissipation support plate is at the bottom of the packaging cavity 2; the chip 3 is fixed on the heat dissipation support plate by thermal conductive adhesive; a part of the positive pin 4 and the negative pin 5 in the packaging cavity 2 is fixedly connected to the heat dissipation support plate by thermal conductive adhesive; through the setting of the heat dissipation support plate, heat can be transferred to the shell 1 during the operation of the chip 3 and the positive pin 4 and the negative pin 5.

[0028] A positioning notch 13 is provided on one side of the upper surface of the housing 1 to facilitate correct installation of the single-side luminous lamp bead packaging structure.

[0029] A plurality of honeycomb holes 9 are evenly distributed on both sides of the lower side of the shell 1 ; a second honeycomb hole 10 is penetrated between the shell 1 and the positive electrode pin 4 and the negative electrode pin 5 , and the honeycomb holes 9 and the second honeycomb holes 10 are arranged so that air can circulate through and take away the heat in the shell 1 .

[0030] A plurality of lower annular grooves 12 are evenly distributed on the bottom of the shell 1. By setting the lower annular grooves 12, the overall material consumption of the shell 1 can be reduced, the contact area between the bottom of the shell 1 and the air can be increased, and the heat dissipation effect of the bottom of the shell 1 can be improved. The lower annular grooves 12 are connected to the honeycomb holes 9, the notches 11 and the honeycomb holes 10.

[0031] Utilizing the technical solution described in the utility model, or those skilled in the art designing similar technical solutions inspired by the technical solution of the utility model to achieve the above-mentioned technical effects, all fall within the protection scope of the utility model.

Claims

1. A single-side luminous lamp bead packaging structure, characterized in that: The invention comprises a shell (1), wherein: a packaging cavity (2) is arranged above the shell (1), and positive electrode pins (4) and negative electrode pins (5) are respectively packaged on both sides of the shell (1), and a part of the positive electrode pins (4) and negative electrode pins (5) are located below the outside of the shell (1), and a part of the positive electrode pins (4) and negative electrode pins (5) are located inside the packaging cavity (2); a chip (3) is fixedly installed inside the packaging cavity (2), and the chip (3) is electrically connected to the corresponding positive electrode pins (4) and negative electrode pins (5) through gold wires (6), and the interior of the packaging cavity (2) is filled with corresponding phosphor and packaging glue (7); The upper surface of the shell (1) is evenly provided with a plurality of concentric upper annular grooves (8), and the upper annular grooves (8) are coaxial with the packaging cavity (2); The bottom of the shell (1) is evenly distributed with a plurality of notches (11); A heat dissipation support plate is fixedly installed in the shell (1), and the heat dissipation support plate is located at the bottom of the packaging cavity (2); the chip (3) is fixed to the heat dissipation support plate by means of thermal conductive adhesive; and a portion of the positive electrode pin (4) and the negative electrode pin (5) located in the packaging cavity (2) is fixedly connected to the heat dissipation support plate by means of thermal conductive adhesive.

2. A single-side luminous lamp bead packaging structure as claimed in claim 1, characterized in that: A positioning notch (13) is provided on one side of the upper surface of the shell (1).

3. A single-side luminous lamp bead packaging structure as claimed in claim 2, characterized in that: A plurality of honeycomb holes (9) are evenly distributed and penetrated on both sides of the lower side of the shell (1).

4. A single-side luminous lamp bead packaging structure as claimed in claim 2, characterized in that: A second honeycomb hole (10) is provided between the shell (1) and the positive electrode pin (4) and the negative electrode pin (5).

5. A single-side luminous lamp bead packaging structure as claimed in claim 4, characterized in that: A plurality of lower annular grooves (12) are evenly distributed on the bottom of the shell (1), and the lower annular grooves (12) are connected to the honeycomb holes (9), the notches (11) and the second honeycomb hole (10).

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