Solder ball alignment feeding mechanism

Abstract

The utility model discloses a solder ball alignment feeding mechanism. A stock bin (1) is mounted at the tops of two groups of stock bin brackets (2); jacking mechanisms (5) are arranged in the two sets of stock bin supports (2), adsorption mechanisms (6) are arranged at the ends of the jacking mechanisms (5), anti-splashing covers (3) are installed outside the adsorption mechanisms (6), and ejector rod alignment holes (4) are formed in the anti-splashing covers (3). An air blowing mechanism (7) is installed on the top of the stock bin (1), and a plurality of air blowing nozzles (8) are arranged on the front portion of the air blowing mechanism (7). The automatic feeding device is simple in structure, convenient to debug, suitable for solder balls of different sizes, capable of achieving alignment feeding of a plurality of solder ball modules and capable of improving production efficiency.

Description

Technical Field

[0001] The utility model relates to the field of laser solder ball soldering, in particular to a solder ball alignment feeding mechanism with a diameter of 0.5 mm. Background Art

[0002] In the commonly used PCB board welding process, a new process equipment is developed that uses laser welding technology to replace traditional welding methods such as tin soldering and Hotbar welding, so as to achieve more stable and efficient welding between PCB boards and flexible cables.

[0003] In the laser solder ball welding process, due to the small size and stickiness of solder balls, the solder ball feeding mechanism may have too many solder balls or too few solder balls during the automated production process. Too many or too few solder balls will affect the welding quality of the product and ultimately affect the production efficiency of the production line. Utility Model Content

[0004] In order to solve the problem of excessive or insufficient solder balls in the solder ball feeding mechanism, the utility model provides a solder ball alignment feeding mechanism with a diameter of 0.5 mm, comprising a silo 1 for storing solder balls, a silo bracket 2 for installing the silo 1, an anti-splash cover 3 for preventing solder balls from splashing, a feeding port for a feeding nozzle to take materials is designed above the anti-splash cover 3, a lifting mechanism 5 for feeding and conveying solder balls, a vacuum adsorption mechanism 6 is designed at the end of the solder ball ejector rod alignment hole 4 for adsorbing a set number of solder balls, and an air blowing mechanism 7 is used to separate excess solder balls to ensure that there are no excess solder balls on the solder ball ejector rod alignment hole 4 and that the number of solder balls sucked by the end of the feeding nozzle is the set number.

[0005] The technical solution adopted by the utility model to solve its technical problems is:

[0006] A solder ball alignment feeding mechanism comprises a silo 1 for storing solder balls, a silo bracket 2 for installing the silo 1, an anti-splash cover 3 for preventing solder balls from splashing, a push rod alignment hole 4 for solder ball alignment, a lifting mechanism 5 for feeding and conveying solder balls, an adsorption mechanism 6 for lifting solder balls, a blowing mechanism 7 for separating excess solder balls, and an air blowing nozzle 8 installed at the front of the air blowing mechanism 7; wherein: the silo 1 is installed on the top of two groups of the silo brackets 2; the lifting mechanism 5 is arranged inside the two groups of the silo brackets 2, the adsorption mechanism 6 is arranged at the end of the lifting mechanism 5, the anti-splash cover 3 is installed outside the adsorption mechanism 6, and the anti-splash cover 3 is provided with a push rod alignment hole 4; the blowing mechanism 7 is installed on the top of the silo 1, and a plurality of air blowing nozzles 8 are arranged at the front of the blowing mechanism 7.

[0007] The utility model also has the following additional technical features:

[0008] As a further specific optimization of the technical solution of the utility model: the structure of the silo 1 is funnel-shaped, with an open top, which is convenient for solder balls to be put in. The silo 1 is designed with a solder ball placement cavity, and a through hole is designed at the lower end of the placement cavity for the solder ball ejector rod alignment hole 4 to reciprocate up and down.

[0009] As a further specific optimization of the technical solution of the utility model: the silo bracket 2 includes a horizontal fixing plate 201 and a vertical fixing plate 202, the bottom of the vertical fixing plate 202 is vertically welded to the middle of the horizontal fixing plate 201, and the two groups of silo brackets 2 are designed in an inverted T shape as a whole.

[0010] As a further specific optimization of the technical solution of the utility model: the anti-splash cover 3 is made of a transparent material, and the four sides of the anti-splash cover 3 are fixed to the top of the front part of the silo 1 by bolts; a plurality of groups of hollow push rod alignment holes 4 are arranged in the middle of the anti-splash cover 3, the inner diameter of the push rod alignment hole 4 is equal to the outer diameter of the adsorption mechanism 6, the position of the push rod alignment hole 4 is the same as the position of the adsorption mechanism 6, and the adsorption mechanism 6 can be ejected from the push rod alignment hole 4; the push rod alignment hole 4 serves as a feeding port for a feeding nozzle to take materials, and is located directly above the adsorption mechanism 6.

[0011] As a further specific optimization of the technical solution of the utility model: the jacking mechanism 5 includes a fixed plate 501, a jacking slide rail 502, a jacking slider 503, a jacking plate 504 and a jacking cylinder 505; the two sides of the fixed plate 501 are fixed to the middle of the two groups of silo brackets 2 by bolts, the front part of the fixed plate 501 is installed with a jacking slide rail 502 by bolts, the jacking slider 503 is installed on the jacking slide rail 502, and the top of the jacking slider 503 is installed with a horizontally arranged jacking plate 504 by bolts; the jacking slider 503 is driven to rise or fall by the jacking cylinder 505.

[0012] As a further specific optimization of the technical solution of the utility model: the adsorption mechanism 6 includes a push rod base plate 601, a push rod base 602, a hollow push rod 603 and a solder ball limiting hole 604, and a vacuum adsorption joint 605; the push rod base plate 601 is arranged in a horizontal direction, and the push rod base plate 601 is installed on the top of the lifting plate 504 by bolts, and a plurality of push rod bases 602 are installed on the top of the push rod base plate 601 by bolt intervals, and a hollow push rod 603 is vertically fixedly installed in the middle of the push rod base 602, and the hollow push rod 603 is vertically fixedly installed in the middle of the push rod base 602. A plurality of groups of solder ball limiting holes 604 are arranged on the top of the ejector pin 603; the vacuum adsorption joint 605 is installed on the rear of the ejector pin base plate 601, the vacuum adsorption joint 605 is connected to the vacuum machine, and the vacuum adsorption joint 605 is connected to the hollow ejector pin 603 via the ejector pin base plate 601 and the ejector pin base 602, the aperture of the solder ball limiting hole 604 is smaller than the particle size of the solder ball; the solder ball is located in the solder ball limiting hole 604, and the adsorption mechanism 6 adsorbs a set number of solder balls through the vacuum adsorption joint 605.

[0013] As a further specific optimization of the technical solution of the utility model: the blowing mechanism 7 is used to separate excess solder balls, and a blowing nozzle 8 is provided at the front end of the blowing mechanism 7, and the blowing nozzle 8 blows air toward the material taking port position of the solder ball silo 1.

[0014] As a further specific optimization of the technical solution of the utility model: the blowing mechanism 7 is driven by a sliding cylinder 704 to make a back and forth reciprocating motion; the blowing mechanism 7 includes a horizontal base 701, a horizontal slide 702, a blowing nozzle fixing plate 703 and a sliding cylinder 704, a horizontal slide 702 is installed on the top of the horizontal base 701, a sliding cylinder 704 is installed on the side of the horizontal base 701, a blowing nozzle fixing plate 703 is installed on the front of the horizontal slide 702, and a plurality of the blowing nozzles 8 are installed on the blowing nozzle fixing plate 703.

[0015] As a further specific optimization of the technical solution of the utility model: the air nozzle of the blowing air nozzle 8 is connected to the air pipe through the air joint to the solenoid valve, and the opening and closing of the solenoid valve controls the air nozzle to complete the blowing.

[0016] Compared with the prior art, the utility model has the following advantages:

[0017] The utility model is based on the fact that the solder balls are small in size and sticky, and there may be an excessive or insufficient number of solder balls in the feeding, so as to solve the problem that the product welding quality is affected by the excessive or insufficient number of solder balls. The utility model realizes the alignment and feeding of 0.5mm solder balls, and solves the problem that there are too many or insufficient solder balls in the feeding. The solder ball alignment and feeding mechanism has a simple structure, is easy to debug, and is suitable for solder balls of different sizes. It can realize the alignment and feeding of multiple solder ball modules, and improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the axial side of the solder ball alignment feeding mechanism;

[0019] Figure 2 This is the exploded diagram of the solder ball alignment feeding mechanism;

[0020] Figure 3 This is a schematic diagram of the solder ball adsorption state of the solder ball alignment feeding mechanism (the black arrow indicates the direction of the mechanism's up and down reciprocating motion);

[0021] Figure 4 This is a schematic diagram of the solder ball conveying state of the solder ball alignment feeding mechanism (the black arrow line indicates the direction of vacuum adsorption);

[0022] Figure 5 This is a schematic diagram of the blowing state of the solder ball alignment feeding mechanism (the black arrow indicates the direction of the mechanism's reciprocating motion).

[0023] Figure 6 It is a schematic diagram of the structure of a silo 1 for storing solder balls;

[0024] Figure 7 It is a schematic diagram of the structure of a silo bracket 2 used to install a silo 1;

[0025] Figure 8 It is a schematic diagram of the structure of an anti-splash cover 3 for preventing solder balls from splashing and a push rod alignment hole 4 for solder ball alignment;

[0026] Fig. 9 It is a schematic diagram of the structure of a lifting mechanism 5 for feeding and conveying solder balls and an adsorption mechanism 6 for lifting solder balls;

[0027] Fig.10 It is a schematic diagram of the structure of the air blowing mechanism 7 used to separate the excess solder balls;

[0028] Explanation of the reference numerals: a silo 1 for storing solder balls, a silo bracket 2 for installing the silo 1, an anti-splash cover 3 for preventing solder balls from splashing, a push rod alignment hole 4 for aligning solder balls, a lifting mechanism 5 for feeding and transporting solder balls, an adsorption mechanism 6 for lifting solder balls, an air blowing mechanism 7 for separating excess solder balls, and an air blowing nozzle 8 installed at the front of the air blowing mechanism 7. DETAILED DESCRIPTION

[0029] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings.

[0030] Example 1

[0031] A solder ball alignment feeding mechanism comprises a silo 1 for storing solder balls, a silo bracket 2 for installing the silo 1, an anti-splash cover 3 for preventing solder balls from splashing, a push rod alignment hole 4 for solder ball alignment, a lifting mechanism 5 for feeding and conveying solder balls, an adsorption mechanism 6 for lifting solder balls, a blowing mechanism 7 for separating excess solder balls, and an air blowing nozzle 8 installed at the front of the air blowing mechanism 7; wherein: the silo 1 is installed on the top of two groups of the silo brackets 2; the lifting mechanism 5 is arranged inside the two groups of the silo brackets 2, the adsorption mechanism 6 is arranged at the end of the lifting mechanism 5, the anti-splash cover 3 is installed outside the adsorption mechanism 6, and the anti-splash cover 3 is provided with a push rod alignment hole 4; the blowing mechanism 7 is installed on the top of the silo 1, and a plurality of air blowing nozzles 8 are arranged at the front of the blowing mechanism 7.

[0032] The structure of the silo 1 is funnel-shaped, with an open top for easy placement of solder balls. The silo 1 is designed with a solder ball placement cavity, and a through hole is designed at the lower end of the placement cavity for the solder ball ejector rod alignment hole 4 to reciprocate up and down.

[0033] The silo bracket 2 includes a transverse fixing plate 201 and a vertical fixing plate 202. The bottom of the vertical fixing plate 202 is vertically welded to the middle of the transverse fixing plate 201. The two groups of silo brackets 2 are designed in an inverted T shape as a whole.

[0034] The anti-splash cover 3 is made of a transparent material, and the four sides of the anti-splash cover 3 are fixed to the top of the front part of the silo 1 by bolts; a plurality of groups of hollow push rod alignment holes 4 are arranged in the middle of the anti-splash cover 3, the inner diameter of the push rod alignment hole 4 is equal to the outer diameter of the adsorption mechanism 6, the position of the push rod alignment hole 4 is the same as the position of the adsorption mechanism 6, and the adsorption mechanism 6 can be ejected from the push rod alignment hole 4; the push rod alignment hole 4 serves as a feeding port for the feeding nozzle to take materials, and is located directly above the adsorption mechanism 6.

[0035] The lifting mechanism 5 includes a fixed plate 501, a lifting rail 502, a lifting slider 503, a lifting plate 504 and a lifting cylinder 505; the two sides of the fixed plate 501 are fixed to the middle of the two groups of silo brackets 2 by bolts, the front part of the fixed plate 501 is installed with a lifting rail 502 by bolts, the lifting slider 503 is installed on the lifting rail 502, and the top of the lifting slider 503 is installed with a horizontally arranged lifting plate 504 by bolts; the lifting slider 503 is driven to rise or fall by the lifting cylinder 505.

[0036] The adsorption mechanism 6 includes a push rod base plate 601, a push rod base 602, a hollow push rod 603, a solder ball limiting hole 604, and a vacuum adsorption joint 605; the push rod base plate 601 is arranged in a horizontal direction, and the push rod base plate 601 is installed on the top of the lifting plate 504 by bolts, and a plurality of push rod bases 602 are installed on the top of the push rod base plate 601 by bolts, and a hollow push rod 603 is vertically fixedly installed in the middle of the push rod base 602, and the top of the hollow push rod 603 is arranged There are multiple groups of solder ball limiting holes 604; the vacuum adsorption joint 605 is installed on the rear part of the push rod base plate 601, the vacuum adsorption joint 605 is connected to the vacuum machine, and the vacuum adsorption joint 605 is connected to the hollow push rod 603 via the push rod base plate 601 and the push rod base 602, the aperture of the solder ball limiting hole 604 is smaller than the particle size of the solder ball; the solder ball is located in the solder ball limiting hole 604, and the adsorption mechanism 6 adsorbs a set number of solder balls through the vacuum adsorption joint 605.

[0037] The blowing mechanism 7 is used to separate excess solder balls. The front end of the blowing mechanism 7 is provided with a blowing nozzle 8, and the blowing nozzle 8 blows air toward the material taking port of the solder ball bin 1. The blowing mechanism 7 is driven by a slide cylinder 704 to make a forward and backward reciprocating motion; the blowing mechanism 7 includes a horizontal base 701, a horizontal slide 702, a blowing nozzle fixing plate 703 and a slide cylinder 704. The top of the horizontal base 701 is provided with a horizontal slide 702, the side of the horizontal base 701 is provided with a slide cylinder 704, the front of the horizontal slide 702 is provided with a blowing nozzle fixing plate 703, and a plurality of the blowing nozzles 8 are installed on the blowing nozzle fixing plate 703.

[0038] The air nozzle of the blowing air nozzle 8 is connected to the air pipe through the air joint to the solenoid valve, and the opening and closing of the solenoid valve controls the air nozzle to complete the blowing.

[0039] Example 2

[0040] An operation method of a solder ball alignment feeding mechanism is:

[0041] The solder ball silo 1 is filled with solder balls for production. The anti-splash cover 3 above closes the silo 1 to protect the solder balls used in production from being oxidized. The push rod alignment hole 4 for conveying solder balls is in the standby position, and the vacuum is turned on to make the nozzle surface absorb a set number of solder balls. Driven by the slide cylinder, the push rod alignment hole 4 for conveying solder balls moves vertically upward in the solder ball silo 1. At this time, there are a large number of solder balls above the push rod 4 for conveying solder balls. The blowing mechanism 7 is in the standby position and is driven by the slide cylinder to move forward. The blowing nozzle reaches the top of the solder ball conveying push rod alignment hole 4. At this time, the solenoid valve is pneumatically operated and connected to the blowing nozzle by the air pipe to blow and separate the excess solder balls. (After a few seconds, the excess solder balls are blown away by the gas. At this time, only the set number of solder balls remain on the push rod alignment hole 4 of the solder ball) and is driven by the slide cylinder to move backward, and the blowing mechanism 7 returns to the standby position. The robot pick-up suction head module moves to the pick-up port, penetrates into the solder ball bin 1 through the pick-up port, reaches the position of the push rod alignment hole 4 of the solder ball, turns on the vacuum, and takes away the set number of solder balls that have been aligned.

[0042] The above detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention but merely represents selected embodiments of the present invention.

Claims

1. A solder ball alignment feeding mechanism, characterized in that: The invention comprises a silo (1) for storing solder balls, a silo bracket (2) for mounting the silo (1), an anti-splash cover (3) for preventing solder balls from splashing, a push rod alignment hole (4) for aligning the solder balls, a lifting mechanism (5) for feeding and conveying the solder balls, an adsorption mechanism (6) for lifting the solder balls, and an air blowing mechanism (7) for separating excess solder balls, and an air blowing nozzle (8) mounted at the front of the air blowing mechanism (7); wherein: the silo (1) is mounted on the top of two groups of silo brackets (2); the lifting mechanism (5) is arranged inside the two groups of silo brackets (2), the adsorption mechanism (6) is arranged at the end of the lifting mechanism (5), the anti-splash cover (3) is mounted outside the adsorption mechanism (6), and the anti-splash cover (3) is arranged with a push rod alignment hole (4); the air blowing mechanism (7) is mounted on the top of the silo (1), and a plurality of air blowing nozzles (8) are arranged at the front of the air blowing mechanism (7).

2. The solder ball alignment feeding mechanism according to claim 1, characterized in that: The structure of the material bin (1) is funnel-shaped, with an open top to facilitate the placement of solder balls; the material bin (1) is designed with a solder ball placement cavity, and the lower end of the placement cavity is designed with a through hole for the solder ball ejector pin alignment hole (4) to reciprocate up and down.

3. The solder ball alignment feeding mechanism according to claim 1, characterized in that: The silo bracket (2) comprises a transverse fixing plate (201) and a vertical fixing plate (202), the bottom of the vertical fixing plate (202) is vertically welded to the middle of the transverse fixing plate (201), and the two groups of silo brackets (2) are designed in an inverted T shape as a whole.

4. The solder ball alignment feeding mechanism according to claim 1, characterized in that: The anti-splash cover (3) is made of a transparent material, and the four sides of the anti-splash cover (3) are fixed to the top of the front part of the silo (1) by bolts; a plurality of groups of hollow push rod alignment holes (4) are arranged in the middle of the anti-splash cover (3), the inner diameter of the push rod alignment hole (4) is equal to the outer diameter of the adsorption mechanism (6), the position of the push rod alignment hole (4) is the same as the position of the adsorption mechanism (6), and the adsorption mechanism (6) can be ejected from the push rod alignment hole (4); the push rod alignment hole (4) serves as a material taking port for a material taking nozzle to take materials, and is located directly above the adsorption mechanism (6).

5. The solder ball alignment feeding mechanism according to claim 1, characterized in that: The lifting mechanism (5) comprises a fixed plate (501), a lifting rail (502), a lifting slider (503), a lifting plate (504) and a lifting cylinder (505); the two sides of the fixed plate (501) are fixed to the middle of the two groups of silo brackets (2) by bolts, the front part of the fixed plate (501) is installed with a lifting rail (502) by bolts, the lifting slider (503) is installed on the lifting rail (502), and the top of the lifting slider (503) is installed with a horizontally arranged lifting plate (504) by bolts; the lifting slider (503) is driven to rise or fall by the lifting cylinder (505).

6. The solder ball alignment feeding mechanism according to claim 1, characterized in that: The adsorption mechanism (6) includes a push rod base plate (601), a push rod base (602), a hollow push rod (603), a solder ball limiting hole (604), and a vacuum adsorption joint (605); the push rod base plate (601) is arranged in a horizontal direction, the push rod base plate (601) is installed on the top of the lifting plate (504) by bolts, a plurality of push rod bases (602) are installed on the top of the push rod base plate (601) by bolts, a hollow push rod (603) is vertically fixedly installed in the middle of the push rod base (602), and the top of the hollow push rod (603) A plurality of groups of solder ball limiting holes (604) are provided; the vacuum adsorption joint (605) is installed at the rear of the ejector base plate (601); the vacuum adsorption joint (605) is connected to a vacuum machine, and the vacuum adsorption joint (605) is connected to the hollow ejector (603) via the ejector base plate (601) and the ejector base (602); the aperture of the solder ball limiting hole (604) is smaller than the particle size of the solder ball; the solder ball is located in the solder ball limiting hole (604); the adsorption mechanism (6) adsorbs a set number of solder balls through the vacuum adsorption joint (605).

7. The solder ball alignment feeding mechanism according to claim 1, characterized in that: The blowing mechanism (7) is used to separate excess solder balls. A blowing nozzle (8) is provided at the front end of the blowing mechanism (7). The blowing nozzle (8) blows air toward the material taking port of the solder ball bin (1).

8. The solder ball alignment feeding mechanism according to claim 7, characterized in that: The blowing mechanism (7) is driven by a slide cylinder (704) to perform a forward and backward reciprocating motion; the blowing mechanism (7) comprises a horizontal base (701), a horizontal slide (702), a blowing nozzle fixing plate (703) and a slide cylinder (704); the horizontal slide (702) is installed on the top of the horizontal base (701); the slide cylinder (704) is installed on the side of the horizontal base (701); the blowing nozzle fixing plate (703) is installed on the front of the horizontal slide (702); and a plurality of the blowing nozzles (8) are installed on the blowing nozzle fixing plate (703).

9. The solder ball alignment feeding mechanism according to claim 1, characterized in that: The air nozzle of the blowing air nozzle (8) is connected to the air pipe through an air joint and connected to the electromagnetic valve, and the electromagnetic valve opens and closes to control the air nozzle to complete the blowing.

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