LED backlight source with heat dissipation mechanism

Abstract

The utility model discloses a light-emitting diode (LED) backlight source with a heat dissipation mechanism, which relates to the field of LED backlight sources and comprises a main frame shell arranged between two groups of side frame shells and further comprises a backlight source plate, the backlight source plate is mounted on the inner side of the main frame shell, four groups of heat conduction strips are fixedly connected to the inner surface of the backlight source plate, heat conduction columns are fixedly connected among the four groups of heat conduction strips, and the heat conduction columns are fixedly connected with the heat dissipation mechanism. A first heat conduction rod is fixedly connected to the lower end of the heat conduction column, multiple sets of second heat conduction rods are arranged on the two sides of the first heat conduction rod, multiple sets of annular fins are clamped and fixedly connected to the outer sides of the multiple sets of second heat conduction rods in a sleeving mode, and the multiple sets of second heat conduction rods are distributed on the two sides of the first heat conduction rod at equal intervals; the LED backlight source has the advantages that external dust can be prevented from entering the LED backlight source, meanwhile, the backlight source plate is evenly cooled, the dust prevention and heat dissipation effect on the LED backlight source is improved, the step-by-step splitting function of the LED backlight source and the heat dissipation mechanism is achieved, and the heat dissipation mechanism can be conveniently cleaned and overhauled in a barrier-free mode.

Description

Technical Field

[0001] The utility model relates to the field of LED backlight sources, in particular to an LED backlight source with a heat dissipation mechanism. Background Art

[0002] Backlight is a light source located behind the LCD, which is used to provide a uniform, stable and bright plane light source for the LCD, so that the LCD can display images. It has good characteristics of low power consumption, high brightness and long life. The luminous effect of LED backlight will directly affect the visual effect of LCD module.

[0003] After searching, the patent number is CN209486434U, which discloses an LED backlight source. When subjected to impact force, the impact force is evenly distributed through the conduction of the frame, thereby avoiding partial damage caused by excessive local force on the LED backlight source. The buffering effect is good and the protection range is more comprehensive. However, when the existing LED backlight source is in use, the heat dissipation mechanism thereon is generally a single micro fan, which can only locally dissipate heat for the backlight source panel, and dust can easily enter the interior of the LED backlight source during the heat dissipation process, greatly affecting the normal life of the LED backlight source. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide an LED backlight source with a heat dissipation mechanism. When the existing LED backlight source is in use, the heat dissipation mechanism thereon is generally a single micro fan, which can only locally dissipate the heat of the backlight source panel, and dust can easily enter the interior of the LED backlight source during the heat dissipation process, greatly affecting the normal life of the LED backlight source.

[0005] In order to solve the above technical problems, the technical solution of the utility model is a LED backlight source with a heat dissipation mechanism, including a main frame shell arranged between two groups of side frame shells, and also including a backlight source panel, and the backlight source panel is installed on the inner side of the main frame shell, and four groups of thermally conductive strips are fixedly connected to the inner surface of the backlight source panel, and thermally conductive columns are fixedly connected between the four groups of thermally conductive strips, and the lower end of the thermally conductive column is fixedly connected to a first thermally conductive rod, and several groups of second thermally conductive rods are arranged on both sides of the first thermally conductive rod, and several groups of annular fins are fixedly sleeved on the outer sides of the several groups of the second thermally conductive rods.

[0006] As a further solution of the utility model: several groups of the second heat-conducting rods are distributed at equal intervals on both sides of the first heat-conducting rod, several groups of the annular fins are distributed at equal intervals on several groups of the second heat-conducting rods, and several groups of the annular fins are respectively located inside the two groups of side frame shells.

[0007] As a further solution of the utility model: micro fans are installed at both ends of the two groups of side frame shells, and air inlets are opened through the back-to-back sides of the two groups of side frame shells.

[0008] As a further solution of the utility model: a plurality of groups of connecting pipes are fixedly connected at equal intervals on both sides of the first heat-conducting rod, plug-in boards are fixedly connected to the opposite surfaces of the two groups of side frame shells near both ends, and fastening bolts are penetrated through the four groups of plug-in boards.

[0009] As a further solution of the utility model: a plurality of groups of the second heat-conducting rods respectively pass through the main frame shell and the side frame shell and are movably connected to a plurality of groups of connecting pipes.

[0010] As a further solution of the utility model: two groups of plug interfaces are formed through both side surfaces of the main frame shell, and four groups of plug boards are respectively located on the inner sides of the four groups of plug interfaces.

[0011] As a further solution of the utility model: threaded holes are formed through the two inner sides of the main frame shell near the two side edges, and four sets of fastening bolts pass through the matching threaded holes of the plug-in board and are threadedly connected to the main frame shell.

[0012] Compared with the prior art, the beneficial effects of the utility model are as follows: the heat on the four groups of heat-conducting strips is transferred to the first heat-conducting rod through the heat-conducting column, and then the heat on the first heat-conducting rod is respectively transferred to several groups of second heat-conducting rods, and then the heat on the second heat-conducting rod is respectively transferred to several groups of ring fins, and the heat on the ring fins is discharged to the outside of the backlight source through the cooperation of the micro fan and the air inlet, which can prevent external dust from entering the interior of the LED backlight source while uniformly dissipating the heat of the backlight source panel, thereby improving the dust-proof and heat dissipation effect of the LED backlight source.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows: first, the backlight source panel is removed from the inner side of the main frame shell, and then the four groups of plug-in boards are separated from the main frame shell respectively through the cooperation of the fastening bolts and the threaded holes, and the two groups of side frame shells are respectively separated from the two sides of the main frame shell through the cooperation of the two groups of plug-in boards and the two groups of plug interfaces. At this time, several groups of second heat-conducting rods are separated from the first heat-conducting rods respectively through the connecting pipes, thereby realizing the step-by-step disassembly function of the LED backlight source and the heat dissipation mechanism, so as to facilitate barrier-free cleaning and maintenance of the heat dissipation mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall structure of an LED backlight source with a heat dissipation mechanism in an embodiment of the utility model;

[0015] Figure 2 This is a schematic diagram of the distribution structure of the second heat conducting rod in the embodiment of the utility model;

[0016] Figure 3This is a schematic diagram of the connection structure between the main frame shell and the side tank shell in the embodiment of the utility model;

[0017] Figure 4 It is an internal top view of an LED backlight source with a heat dissipation mechanism in an embodiment of the utility model.

[0018] In the figure: 1. main frame shell; 2. backlight panel; 3. side frame shell; 4. micro fan; 5. heat-conducting strip; 6. heat-conducting column; 7. first heat-conducting rod; 8. second heat-conducting rod; 9. ring fin; 10. air inlet; 11. plug-in board; 12. plug-in interface; 13. fastening bolt; 14. threaded hole; 15. connecting pipe. DETAILED DESCRIPTION

[0019] The specific implementation methods of the present invention are further described below in conjunction with the accompanying drawings. It should be noted that the description of these implementation methods is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in each implementation method of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0020] Example 1, please refer to Figure 1-Figure 4 A LED backlight source with a heat dissipation mechanism includes a main frame shell 1 arranged between two groups of side frame shells 3, and also includes a backlight source panel 2, and the backlight source panel 2 is installed on the inner side of the main frame shell 1, and the inner surface of the backlight source panel 2 is fixedly connected with four groups of heat-conducting strips 5, and heat-conducting columns 6 are fixedly connected between the four groups of heat-conducting strips 5. The lower end of the heat-conducting column 6 is fixedly connected with a first heat-conducting rod 7, and a plurality of groups of second heat-conducting rods 8 are arranged on both sides of the first heat-conducting rod 7, and a plurality of groups of annular fins 9 are fixedly sleeved on the outer sides of the plurality of groups of second heat-conducting rods 8.

[0021] Several groups of second heat-conducting rods 8 are evenly spaced on both sides of the first heat-conducting rod 7 , several groups of annular fins 9 are evenly spaced on the several groups of second heat-conducting rods 8 , and several groups of annular fins 9 are located inside the two groups of side frame shells 3 .

[0022] In this embodiment, the heat is conducted to a plurality of groups of second heat conducting rods 8 through the first heat conducting rods 7 .

[0023] Micro fans 4 are installed at both ends of the two sets of side frame shells 3, and air inlets 10 are penetrated through the back-to-back sides of the two sets of side frame shells 3.

[0024] In this embodiment, the hot air in the side frame shell 3 is discharged through the cooperation of the micro fan 4 and the air inlet 10.

[0025] Specifically, the heat on the four groups of heat-conducting strips 5 is transferred to the first heat-conducting rod 7 through the heat-conducting column 6, and then the heat on the first heat-conducting rod 7 is respectively transferred to several groups of second heat-conducting rods 8, and then the heat on the second heat-conducting rods 8 is respectively transferred to several groups of ring fins 9, and the heat on the ring fins 9 is discharged to the outside of the backlight source through the cooperation of the micro fan 4 and the air inlet 10, which can prevent external dust from entering the interior of the LED backlight source while uniformly dissipating the heat of the backlight source panel 2, thereby improving the dust-proof and heat dissipation effect of the LED backlight source.

[0026] Example 2, please refer to Figure 1-Figure 4 A LED backlight source with a heat dissipation mechanism, a plurality of connecting tubes 15 are evenly and fixedly connected to both sides of a first heat conducting rod 7, plug boards 11 are fixedly connected to opposite surfaces of two groups of side frame shells 3 near both ends, and fastening bolts 13 are penetrated through the four groups of plug boards 11.

[0027] A plurality of groups of second heat-conducting rods 8 respectively pass through the main frame shell 1 and the side frame shell 3 and are movably connected to a plurality of groups of connecting pipes 15 .

[0028] In this embodiment,

[0029] Two groups of plug ports 12 are formed on both sides of the main frame shell 1, and four groups of plug boards 11 are respectively located on the inner sides of the four groups of plug ports 12. Threaded holes 14 are formed on both inner sides of the main frame shell 1 near the edges on both sides, and four groups of fastening bolts 13 pass through the plug boards 11 and cooperate with the threaded holes 14 to be threadedly connected to the main frame shell 1.

[0030] In this embodiment, the plug-in board 11 and the plug-in port 12 cooperate with the fastening bolt 13 and the threaded hole 14 to fix the position of the side frame shell 3 and the main frame shell 1.

[0031] Specifically, the backlight source panel 2 is first removed from the inner side of the main frame shell 1, and then the four groups of plug-in boards 11 are separated from the main frame shell 1 respectively through the cooperation of the fastening bolts 13 and the threaded holes 14, and the two groups of side frame shells 3 are respectively separated from the two sides of the main frame shell 1 through the cooperation of the two groups of plug-in boards 11 and the two groups of plug interfaces 12. At this time, several groups of second heat-conducting rods 8 are separated from the first heat-conducting rods 7 respectively through the connecting tubes 15, realizing the step-by-step disassembly function of the LED backlight source and the heat dissipation mechanism, so as to facilitate barrier-free cleaning and maintenance of the heat dissipation mechanism.

[0032] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions and variations of these embodiments are made without departing from the principles and spirit of the present invention, and still fall within the scope of protection of the present invention.

Claims

1. An LED backlight source with a heat dissipation mechanism, comprising a main frame shell (1) arranged between two sets of side frame shells (3), characterized in that: It also includes a backlight source panel (2), and the backlight source panel (2) is installed on the inner side of the main frame shell (1), the inner surface of the backlight source panel (2) is fixedly connected with four groups of heat-conducting strips (5), the four groups of heat-conducting strips (5) are fixedly connected with heat-conducting columns (6), the lower end of the heat-conducting column (6) is fixedly connected with a first heat-conducting rod (7), both sides of the first heat-conducting rod (7) are provided with a plurality of groups of second heat-conducting rods (8), and the outer sides of the plurality of groups of the second heat-conducting rods (8) are fixedly sleeved with a plurality of groups of annular fins (9).

2. The LED backlight source with a heat dissipation mechanism according to claim 1, characterized in that: A plurality of groups of the second heat-conducting rods (8) are respectively distributed at equal intervals on both sides of the first heat-conducting rod (7), a plurality of groups of the annular fins (9) are respectively distributed at equal intervals on a plurality of groups of the second heat-conducting rods (8), and a plurality of groups of the annular fins (9) are respectively located inside two groups of side frame shells (3).

3. The LED backlight source with a heat dissipation mechanism according to claim 1, characterized in that: Micro fans (4) are installed at both ends of the two sets of side frame shells (3), and air inlets (10) are penetrated through the back-to-back sides of the two sets of side frame shells (3).

4. The LED backlight source with a heat dissipation mechanism according to claim 1, characterized in that: A plurality of groups of connecting pipes (15) are fixedly connected at equal intervals on both sides of the first heat-conducting rod (7); plug-in boards (11) are fixedly connected to the opposite surfaces of the two groups of side frame shells (3) near both ends; and fastening bolts (13) are provided through the four groups of plug-in boards (11).

5. The LED backlight source with a heat dissipation mechanism according to claim 4, characterized in that: A plurality of groups of the second heat-conducting rods (8) respectively pass through the main frame shell (1) and the side frame shell (3) and are movably connected to a plurality of groups of connecting pipes (15).

6. The LED backlight source with a heat dissipation mechanism according to claim 4, characterized in that: Two groups of plug ports (12) are provided through both sides of the main frame shell (1), and four groups of plug boards (11) are respectively located on the inner sides of the four groups of plug ports (12).

7. The LED backlight source with a heat dissipation mechanism according to claim 6, characterized in that: Threaded holes (14) are provided through the two inner sides of the main frame shell (1) near the two side edges, and four groups of fastening bolts (13) respectively pass through the plug-in board (11) and match the threaded holes (14) to be threadedly connected with the main frame shell (1).

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