Gripping device of semiconductor packaging machine

Abstract

The utility model discloses a grabbing device of a semiconductor packaging machine. The grabbing device comprises a mounting base, a pneumatic inserting disc and a bearing base. The pneumatic inserting disc is fixedly connected to one side of the mounting base, an annular sleeve frame is arranged on one side of the pneumatic inserting disc, and an annular ring corresponding to the annular sleeve frame is arranged in the bearing base; wherein a plurality of groups of pneumatic ejection beads are arranged on the outer ring of the annular sleeve frame. The mounting base is used for being connected with the end of a carrying assembly such as a mechanical arm, so that the annular sleeve frame of the pneumatic inserting disc is connected with the bearing base of the tray in an embedded mode, and the pneumatic ejecting beads are used for fixing, the tray is grabbed, and chips of the whole tray can be packaged and transported conveniently.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor packaging technology, and specifically relates to a grasping device for a semiconductor packaging machine. Background Art

[0002] During the semiconductor packaging process, the product must go through the processes of loading, operation, and unloading in each process.

[0003] Most of the current fully automatic loading and unloading equipment adopts the method of suction plate loading and unloading, sucking the product from the basket or track and sending it to the designated location. Due to the wide variety of semiconductor products and different frame sizes, different suction plates need to be replaced when the equipment changes varieties, resulting in an increase in spare parts and cumbersome variety changes. The suction nozzle is a consumable part that needs to be replaced frequently, with a high cost of use. In addition, the suction plate has high requirements for the position of the product when sucking the product. A slight deviation in the position will cause suction failure. With the development of semiconductors, products are getting smaller and smaller, making it more difficult to suck products. Failures of product suction occur frequently, which greatly reduces the stability and efficiency of equipment operation.

[0004] For example, patent CN109616436B provides a chip grabbing device and a vertical rotating multi-head packaging device. The system reduces the load of the grabbing head by setting the R-direction external positioning device and the Z-direction external positioning device outside the multiple grabbing heads. However, the above patent can only grab and transport chips, and cannot transport the trays storing chips together, so the grabbing capacity is limited. Utility Model Content

[0005] The present application provides a semiconductor packaging machine grasping device to solve the above-mentioned technical problems.

[0006] In order to solve the above technical problems, a technical solution adopted in the present application is: a semiconductor packaging machine grasping device, comprising: a mounting seat, a pneumatic plug-in disk and a receiving seat; the pneumatic plug-in disk is fixedly connected to one side of the mounting seat, a rotating disk is provided on one side of the pneumatic plug-in disk, an annular sleeve is provided in the middle of the rotating disk, and an annular ring corresponding to the annular sleeve is provided inside the receiving seat; wherein, a plurality of groups of pneumatic top beads are provided on the outer ring of the annular sleeve.

[0007] Furthermore, the pneumatic plug-in disk also includes a solenoid valve and a plurality of air ports, and the valve port of the solenoid valve is connected to the air port.

[0008] Furthermore, a pair of inserting posts is provided on one side of the pneumatic inserting plate close to the receiving seat.

[0009] Furthermore, a socket corresponding to the plug column is provided on one side of the receiving seat close to the pneumatic plug disc.

[0010] Furthermore, a slot head is provided on one side of the solenoid valve close to the receiving seat.

[0011] Furthermore, a packaging tray is connected to one side of the outer ring of the receiving seat, and a socket groove corresponding to the slot head is provided on the other side.

[0012] The beneficial effect of the present application is that the mounting seat in the present application is used to connect the end of a handling component such as a robotic arm, so that the receiving seat of the pallet is embedded through the annular sleeve of the pneumatic plug-in plate and fixed by a pneumatic top ball, thereby completing the grasping of the pallet, making it easy to package and transport the chips on the entire pallet. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural schematic diagram of an embodiment of a semiconductor packaging machine grasping device of the present application;

[0014] Figure 2 yes Figure 1 A schematic structural diagram of an embodiment of a pneumatic insert disc;

[0015] Figure 3 yes Figure 1 A structural schematic diagram of an embodiment of a receiving seat in FIG. DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0017] like Figure 1-3 As shown, a semiconductor packaging machine grasping device includes: a mounting seat 1, a pneumatic insert plate 2 and a receiving seat 3; the pneumatic insert plate 2 is fixedly connected to one side of the mounting seat 1, a rotating plate 4 is provided on one side of the pneumatic insert plate 2, an annular sleeve 41 is provided in the middle of the rotating plate 4, and an annular ring 31 corresponding to the annular sleeve 4 is provided inside the receiving seat 3; wherein, a plurality of groups of pneumatic top balls 5 are provided on the outer ring of the annular sleeve 4. The pneumatic insert plate 2 in the above design is embedded in the annular ring 31 of the receiving seat 3 through the annular sleeve 4, and then the pneumatic top balls 5 are clamped with the annular ring 31, so that the pneumatic insert plate 2 is firmly connected to the receiving seat 3, and the grasping operation is completed. The rotation of the rotating plate 4 can drive the receiving seat 3 to rotate.

[0018] The pneumatic plug-in plate 2 also includes a solenoid valve 21 and a plurality of air ports 22, and the valve port of the solenoid valve 21 is connected to the air ports 22. The solenoid valve 21 in the above design controls the opening and closing of the air ports 22, thereby completing the extension and retraction of the pneumatic top ball 5. A pair of plug posts 23 are provided on one side of the pneumatic plug-in plate 2 close to the receiving seat 3. The plug posts 23 in the above design are used to locate and plug the receiving seat 3, thereby completing the positioning.

[0019] A socket 32 ​​corresponding to the plug post 23 is provided on one side of the socket 3 close to the pneumatic plug disc 2. The socket 32 ​​corresponds to the plug post 23, and the plug post 23 can be plugged into the corresponding socket 32, so that the pneumatic plug disc 2 is connected to the socket 3.

[0020] A slot head 24 is provided on one side of the solenoid valve 21 close to the receiving seat 3. The slot head 24 in the above design is used to transmit electrical signals.

[0021] The outer side of the receiving seat 3 is connected with a packaging tray 6, and the other side is provided with a socket slot 33 corresponding to the slot head 24. The tray 6 in the above design is used to store multiple groups of chips, and the socket slot 33 can be connected and receive electrical signals to control the start and stop of the solenoid valve 21.

[0022] The specific working method is to embed the required chips on the tray 6, then connect the tray 6 to the receiving seat 3, and the mounting seat 1 at the end of the robot arm drives the pneumatic insert plate 2 to the side end of the receiving seat 3, and then determine the insertion angle through the plug column 23, insert the annular sleeve 4 into the annular ring 31, and then start the pneumatic top ball 5, which is clamped on the inner side of the annular ring 31, thereby completing the clamping with the receiving seat 3 and clamping the tray 6. The tray 6 is transported to the packaging assembly by the robot arm, and then the pneumatic top ball 5 is released to make the tray 6 detach.

[0023] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A semiconductor packaging machine grasping device, characterized in that: include: A mounting seat, a pneumatic plug-in disc and a receiving seat; the pneumatic plug-in disc is fixedly connected to one side of the mounting seat, a rotating disc is provided on one side of the pneumatic plug-in disc, an annular sleeve is provided in the middle of the rotating disc, and an annular ring corresponding to the annular sleeve is provided inside the receiving seat; wherein, a plurality of groups of pneumatic top beads are provided on the outer ring of the annular sleeve.

2. A semiconductor packaging machine grasping device according to claim 1, characterized in that: The pneumatic plug-in disk further includes a solenoid valve and a plurality of air ports, wherein the valve port of the solenoid valve is in communication with the air ports.

3. A semiconductor packaging machine grasping device according to claim 1, characterized in that: A pair of inserting posts is arranged on one side of the pneumatic inserting plate close to the receiving seat.

4. A semiconductor packaging machine grasping device according to claim 3, characterized in that: A plug hole corresponding to the plug column is provided on one side of the receiving seat close to the pneumatic plug disc.

5. The semiconductor packaging machine grasping device according to claim 2, characterized in that: A slot head is provided on one side of the solenoid valve close to the receiving seat.

6. The semiconductor packaging machine grasping device according to claim 5, characterized in that: The outer side of the receiving seat is connected with a packaging tray, and the other side is provided with a plug-in slot corresponding to the slot head.

Images