Mini LED RGB sub-display unit and integrated display unit

Abstract

The utility model discloses a Mini LED RGB sub-display unit and an integrated display unit, which belong to the technical field of LED display and comprise RGB pixels, a shell, an electrode plate and a light isolation plate. The electrode plate covers one opening of the shell so as to define a cavity together with the shell, and the RGB pixel comprises three different chips which are arranged in a triangular shape; the light isolation plate comprises three sub light isolation plates to divide the cavity into three sub cavities, and one chip is placed in each sub cavity; the length directions of the three sub light isolation plates and the transverse light emitted by the chip are located on the same plane and intersect; wherein at least two adjacent sub-cavities are communicated with each other, and transverse light emitted by the chips in the two sub-cavities is not directly emitted to the other sub-cavity; the height of the sub light isolation plate is greater than the maximum height of the chip; on the basis of solving light color crosstalk, the placement space of the chip is increased, the placement convenience is improved, the fluidity of packaging glue is improved, and the occurrence probability of problems of bubbles, cavities and the like in a product during packaging is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of LED display, and in particular to a Mini LED RGB sub-display unit and an integrated display unit. Background Art

[0002] Traditional Mini LED (Mini Light Emitting Diode) generally uses cob (chip on board) packaging, which is to directly package the bare chip on the substrate. Although it can achieve the purpose of compact and fast assembly, the chip has not been screened by photoelectric testing, and abnormalities are prone to occur during packaging, which makes the yield of this packaging method poor. Another method is to package it through patching, that is, first package the chip on the bracket to form a single small-sized lamp bead, and then patch the lamp bead on the substrate. Because this method first packages the chip, normal photoelectric testing can be performed in advance, and the packaging yield is greatly improved.

[0003] However, when the center distance between adjacent pixels of Mini LEDs is 0.X mm (where X is any one of 1, 2, 3...9), the hemispherical light emitted by any pixel RGB chip will directly radiate to the adjacent RGB pixels and mix with the light emitted by the adjacent pixel RGB. The light color information after the mixing has deviated from the original pixel light color information, forming light color crosstalk; the degree of light color crosstalk will become more serious as the pixel spacing of Mini LED becomes smaller.

[0004] High-density Mini LED macro display with a pixel pitch of less than 1.0mm is the future direction of high-definition display. The high-density macro LED display manufacturing process with a pixel pitch of 1.0-0.4mm mostly adopts COB and MIP packaging processes in the industry; because the COB, MIP, and Mini LED spacings increase with the density, the adjacent pixels of Mini LED are very close, and the adjacent RGB chips will seriously cross-light to the surrounding RGB pixels when emitting light, forming light color crosstalk, which affects the quality of Mini LED display images.

[0005] The prior art adopts a structure of a first diamond groove, a second diamond groove, and a third diamond groove for accommodating R, G, and B chips to form a light-isolating bracket at the edge of the diamond groove, and then injection molding forms a light-isolating wall with a honeycomb structure to isolate adjacent chips from each other and solve the problem of light and color crosstalk between adjacent chips; however, this method of solving light and color crosstalk has the following defects: 1) The placement space for the chip is small, the operation is inconvenient, the operation efficiency is low, and the product quality is affected; 2) During the packaging process, when the height of the injected glue is lower than the enclosure, the glue can only flow in the small space surrounded by the enclosure, and the glue is not easy to fill fully, so that after packaging, bubbles, voids, etc. are prone to appear inside the product.

[0006] Therefore, how to design a Mini LED RGB sub-display unit and an integrated display unit that can solve the light and color crosstalk, increase the chip placement space, and reduce the probability of bubbles, voids and other problems inside the product during packaging is a technical problem that technical personnel in this field urgently need to solve. Utility Model Content

[0007] The purpose of the utility model is to provide a Mini LED RGB sub-display unit and an integrated display unit in view of the defects and shortcomings in the prior art, which can increase the placement space of the chip and reduce the probability of problems such as bubbles and voids appearing inside the product during packaging while being able to solve the light and color crosstalk.

[0008] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0009] The utility model provides a Mini LED RGB sub-display unit, comprising an RGB pixel, a housing arranged around the RGB pixel, an electrode plate electrically connected to a chip constituting the RGB pixel, and a light-isolating plate for blocking lateral light emitted by each chip constituting the RGB pixel;

[0010] The electrode plate is fixedly connected to the shell, and the electrode plate covers one of the openings of the shell to enclose a cavity for placing the RGB pixels together with the shell, and the RGB pixels include an R chip, a G chip and a B chip arranged in a triangle;

[0011] The light-isolating plate is placed in the cavity, and the light-isolating plate includes a first sub-light-isolating plate, a second sub-light-isolating plate, and a third sub-light-isolating plate. The first sub-light-isolating plate, the second sub-light-isolating plate, and the third sub-light-isolating plate divide the cavity into three sub-cavities, and a chip is placed in each of the sub-cavities; the length directions of the first sub-light-isolating plate, the second sub-light-isolating plate, and the third sub-light-isolating plate all intersect with the lateral light emitted by the chip, and the length directions of the first sub-light-isolating plate, the second sub-light-isolating plate, and the third sub-light-isolating plate are in the same plane as the lateral light emitted by the chip. The first sub-light-isolating plate is seamlessly connected to the second sub-light-isolating plate and the third sub-light-isolating plate at a portion away from the shell side wall, respectively; at least one of the first sub-light-isolating plate, the second sub-light-isolating plate and the third sub-light-isolating plate is not connected to the shell at one end close to the shell side wall, so as to connect two adjacent sub-cavities, and the lateral light emitted by the chip in the two interconnected sub-cavities is not directly emitted to the other sub-cavity connected thereto, and the remaining sub-light-isolating plate is seamlessly connected to the shell at one end close to the shell side wall;

[0012] The height of the sub-light-isolating plate is H1, and the heights of the chips in the two sub-cavities separated by it are H2 and H3 respectively, and H1 is not less than the maximum value of H2 and H3.

[0013] Preferably, the sub-light-isolating plate located between the two interconnected sub-chambers can completely block the lateral light emitted by the chips located in the two sub-chambers.

[0014] Preferably, lines connecting the R chip, the G chip and the B chip form an isosceles triangle.

[0015] Preferably, the housing is a light-proof plastic housing.

[0016] Preferably, a light-proof electrode plate injection molding is provided on the side of the electrode plate facing away from the light-isolating plate.

[0017] Preferably, the shell and the electrode plate, the electrode plate and the electrode plate injection molded body, the light-isolating plate and the shell, and the light-isolating plate and the electrode plate are all connected by injection molding.

[0018] The present application also provides an integrated display unit, comprising a plurality of the Mini LED RGB sub-display units, wherein the plurality of the Mini LED RGB sub-display units are arranged in sequence to form an integrated display unit arranged in an array, wherein two adjacent Mini LED RGB sub-display units in the same column are separated by a transverse partition, and two chips close to the transverse partition in the previous Mini LED RGB sub-display unit and one chip close to the transverse partition in the next adjacent Mini LED RGB sub-display unit constitute an RGB pixel, or one chip close to the transverse partition in the previous Mini LED RGB sub-display unit and two chips close to the transverse partition in the next adjacent Mini LED RGB sub-display unit constitute an RGB pixel, and the R chip, the G chip and the B chip constituting the RGB pixel are arranged in a triangle;

[0019] In the same row, two adjacent Mini LED RGB sub-display units are separated by a vertical partition, and the two chips in the previous Mini LED RGB sub-display unit close to the vertical partition and the one chip in the adjacent next Mini LED RGB sub-display unit close to the vertical partition constitute an RGB pixel, or the one chip in the previous Mini LED RGB sub-display unit close to the vertical partition and the two chips in the adjacent next Mini LED RGB sub-display unit close to the vertical partition constitute an RGB pixel, and the R chip, the G chip and the B chip constituting the RGB pixel are arranged in a triangle.

[0020] Preferably, in an RGB pixel formed by chips in adjacent rows or columns, lines connecting two chips form an isosceles triangle.

[0021] Preferably, the height of the light-isolating plate is H4, the height of the lead for connecting the chip and the electrode plate is H5, the height of the shell is H6, H4<H5<H6, and the top surface of the packaging glue for packaging the integrated display unit is flush with the top surface of the shell.

[0022] Preferably, the electrode plate is in the shape of a long strip, and a plurality of the electrode plates are arranged in an array to form a total electrode plate of the integrated display unit, and the arrangement pattern of the electrode plate corresponds to the arrangement pattern of the R chip, the G chip and the B chip.

[0023] Compared with the prior art, the utility model has achieved the following technical effects:

[0024] 1. The utility model adopts a light-isolating plate composed of three sub-light-isolating plates, in which at least one end of the light-isolating plates close to the side wall of the shell is not connected to the shell, so as to connect two adjacent sub-cavities, and the lateral light emitted by the chip in the two interconnected sub-cavities is not directly emitted to the other sub-cavity connected thereto, and the end of the remaining sub-light-isolating plate close to the side wall of the shell is seamlessly connected to the shell. On the basis of isolating the light emitted by adjacent chips and avoiding light color crosstalk, the two adjacent sub-cavities can be connected so that the injected glue can flow between the connected sub-cavities during the glue dispensing process, thereby improving the fullness of the glue filling in the sub-cavity, reducing the probability of forming voids and bubbles, and improving the quality of the formed sub-display unit; furthermore, compared with the form of first setting a prismatic groove and then injection molding to form a honeycomb light-isolating wall, the present application can increase the area of ​​the sub-cavity for placing the chip, improve the convenience and operating efficiency when placing the chip, and increase the bottom reflective area of ​​the sub-cavity, and can also improve the luminous efficiency of the Mini LED RGB sub-display unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0026] Figure 1 It is a schematic diagram of the main structure of the integrated display unit;

[0027] Figure 2 It is a schematic diagram of the cross-sectional structure at A;

[0028] Figure 3 It is a schematic diagram of the cross-sectional structure at B;

[0029] Figure 4 It is a schematic diagram of the axial structure of the integrated display unit;

[0030] Figure 5 Schematic diagram of the arrangement structure of chips in the same column;

[0031] Figure 6 Schematic diagram of the arrangement structure of chips in the same row;

[0032] Figure 7 A schematic diagram of the arrangement structure of chips in adjacent rows and adjacent columns;

[0033] Figure 8 It is a schematic diagram of the structure from the main electrode plate and the metal substrate to the main electrode plate;

[0034] Fig. 9 This is a schematic diagram of the structure after the chip is connected to the electrode plate and filled with packaging glue.

[0035] Among them, 1. shell; 2. electrode plate; 3. R chip; 4. G chip; 5. B chip; 6. lead; 7. first sub-light-isolating plate; 8. second sub-light-isolating plate; 9. third sub-light-isolating plate; 10. electrode plate injection molding; 11. horizontal partition; 12. vertical partition; 13. first sub-chamber; 14. second sub-chamber; 15. third sub-chamber; 16. total electrode plate; 17. first row of electrode plates; 18. second row of electrode plates; 19. third row of electrode plates; 20. fourth row of electrode plates; 21. fifth row of electrode plates; 22. sixth row of electrode plates; 23. seventh row of electrode plates; 24. eighth row of electrode plates; 25. electrode connecting pins; 26. packaging glue. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0037] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0038] like Figure 1 As shown, the utility model provides a Mini LED RGB sub-display unit, that is, one of the grids in the integrated display unit, see Figure 1 The part in the dotted box includes an RGB pixel, a housing 1, an electrode plate 2 and a light-isolating plate. The housing 1 is a frame-shaped structure surrounded by at least three surfaces. The housing 1 is arranged around the RGB pixel. The housing 1 is made of an opaque material so that when multiple Mini LED RGB sub-display units are integrated together, there will be no light crosstalk between adjacent Mini LED RGB sub-display units; see Figure 5 , Figure 6 , Fig. 9 An RGB pixel includes an R chip 3, a G chip 4 and a B chip 5. The R chip 3, the G chip 4 and the B chip 5 are connected in pairs to form a triangular structure. The R chip 3, the G chip 4 and the B chip 5 are all connected to the electrode plate 2 through the lead 6 to power the R chip 3, the G chip 4 and the B chip 5 through the electrode plate 2; the electrode plate 2 is fixedly connected to the shell 1, and the electrode plate 2 covers one of the openings of the shell 1 to form a cavity for placing the RGB pixel together with the shell 1.

[0039] See also Figure 1 , the light-isolating plate is placed in the cavity, and the light-isolating plate is made of opaque material, and the light-isolating plate includes a first sub-light-isolating plate 7, a second sub-light-isolating plate 8 and a third sub-light-isolating plate 9, and the first sub-light-isolating plate 7, the second sub-light-isolating plate 8 and the third sub-light-isolating plate 9 divide the cavity into three sub-cavities, and a chip is placed in each sub-cavity; the length directions of the first sub-light-isolating plate 7, the second sub-light-isolating plate 8 and the third sub-light-isolating plate 9 are all intersected with the transverse light emitted by the chip, and the length directions of the first sub-light-isolating plate 7, the second sub-light-isolating plate 8 and the third sub-light-isolating plate 9 are in the same plane as the transverse light emitted by the chip; wherein, the directions of the transverse light emitted by the R chip 3, the G chip 4 and the B chip 5 are consistent, and are all parallel to the top surface of the electrode plate 2. By such a setting, the light-isolating plate can block the transverse light emitted by the chips in the two adjacent sub-cavities, so that the transverse light emitted by the chips in the two adjacent sub-cavities will not directly shoot to another chip, causing light color crosstalk.

[0040] The part of the first sub-light-isolating plate 7 away from the side wall of the shell 1 is seamlessly connected to the second sub-light-isolating plate 8 and the third sub-light-isolating plate 9 respectively, and at least one end of the first sub-light-isolating plate 7, the second sub-light-isolating plate 8 and the third sub-light-isolating plate 9 close to the side wall of the shell 1 is not connected to the shell 1, so as to connect two adjacent sub-cavities, and the lateral light emitted by the chip located in the two interconnected sub-cavities is not directly emitted to the other sub-cavity connected thereto, and the end of the remaining sub-light-isolating plate close to the side wall of the shell 1 is seamlessly connected to the shell 1. Among them, the lateral light emitted by the chip located in the two interconnected sub-chambers does not directly shoot toward the other sub-chamber connected thereto, which means that: the lateral light emitted by the chip first shoots toward the inner wall surface of the shell 1, and then the light is reflected multiple times and then shot toward the other sub-chamber. After multiple reflections, the light intensity is greatly weakened, and the effect on the crosstalk between adjacent light colors is small and can be ignored; or by adjusting the placement position of the chip and / or the length and angle of the light isolation plate, the lateral light emitted by the chip can be completely blocked by the light isolation plate and will not shoot toward the other sub-chamber connected thereto.

[0041] The height of the sub-light-isolating plate is H1, and the heights of the chips in the two sub-cavities separated by it are H2 and H3 respectively, and H1 is not less than the maximum value of H2 and H3, wherein H1 refers to the distance from the electrode plate 2 to the top surface of the sub-light-isolating plate, and H2 and H3 refer to the distance from the electrode plate 2 to the top surface of the chip, so as to isolate the vertical light emitted by adjacent chips in the height direction, that is, the technical solution of the present application can isolate the lateral light and vertical light emitted by adjacent chips to avoid light color crosstalk; in addition, by connecting the two adjacent sub-chambers, the injected glue can flow between the connected sub-chambers during the glue dispensing process, thereby improving the fullness of the glue filling in the sub-chamber, reducing the probability of forming voids and bubbles, and improving the quality of the formed sub-display unit; furthermore, compared with first setting a prismatic groove and then injection molding to form a honeycomb light-isolating wall, the present application can increase the area of ​​the sub-chamber for placing the chip, improve the convenience and operating efficiency when placing the chip, and increase the bottom reflective area of ​​the sub-chamber, and can also improve the luminous efficiency of the Mini LED RGB sub-display unit.

[0042] It is possible that only one of the first sub-light-isolating plate 7, the second sub-light-isolating plate 8 and the third sub-light-isolating plate 9 is not connected to the shell 1, or two of the first sub-light-isolating plate 7, the second sub-light-isolating plate 8 and the third sub-light-isolating plate 9 are not connected to the shell 1, or all three sub-light-isolating plates are not connected to the shell 1. As a preferred embodiment of the present application, only one end of the third sub-light-isolating plate 9 close to the side wall of the shell 1 is not connected to the shell 1, and the ends of the other two sub-light-isolating plates close to the side wall of the shell 1 are seamlessly connected to the shell 1.

[0043] In order to further improve the anti-light color crosstalk effect of the Mini LED RGB sub-display unit, the present application preferably has a sub-light-isolating plate between two interconnected sub-chambers that can completely block the lateral light emitted by the chips in the two sub-chambers. For example, the G chip and the B chip are placed in two interconnected chambers respectively. The lateral light emitted by the G chip is completely blocked by the third sub-light-isolating plate 9 and will not be emitted to the sub-chamber where the B chip is placed, and the lateral light emitted by the B chip is completely blocked by the third sub-light-isolating plate 9 and will not be emitted to the sub-chamber where the G chip is placed. In order to further improve the display effect of the Mini LED RGB sub-display unit, the present application preferably has the lines connecting the R chip 3, the G chip 4 and the B chip 5 in pairs to form an isosceles triangle; an opaque electrode plate injection molding 10 is set on the side of the electrode plate 2 facing away from the light-isolating plate to prevent light leakage from the bottom. The connection between the shell 1 and the electrode plate 2, the electrode plate 2 and the electrode plate injection molding 10, the light isolation plate and the shell 1, and the light isolation plate and the electrode plate 2 can be snap-on, screw-on, adhesive, injection molding, etc. In the present application, the shell 1 and the electrode plate 2, the electrode plate 2 and the electrode plate injection molding 10, the light isolation plate and the shell 1, and the light isolation plate and the electrode plate 2 are preferably connected by injection molding.

[0044] See also Figure 1 , Figures 4 to 7 The present application also provides an integrated display unit, comprising a plurality of Mini LED RGB sub-display units, wherein the plurality of Mini LED RGB sub-display units are arranged in sequence to form an integrated display unit arranged in an array, wherein two adjacent Mini LED RGB sub-display units in the same column are separated by a transverse partition 11, and two chips close to the transverse partition 11 in the previous Mini LED RGB sub-display unit and one chip close to the transverse partition 11 in the next adjacent Mini LED RGB sub-display unit constitute an RGB pixel, or one chip close to the transverse partition 11 in the previous Mini LED RGB sub-display unit and two chips close to the transverse partition 11 in the next adjacent Mini LED RGB sub-display unit constitute an RGB pixel, and the R chip 3, G chip 4 and B chip 5 constituting the RGB pixel are arranged in a triangle; wherein the transverse partition 11 can be one of the side walls of the shell 1, or can be a separately arranged component, and if the transverse partition 11 is one of the side walls of the shell 1, the transverse side walls of the overlapping parts of the shell 1 of the two adjacent Mini LED RGB sub-display units can be cancelled, that is, when two adjacent Mini LEDs are separated by a light isolation structure, LEDRGB sub-display unit can be used.

[0045] In the same row, two adjacent Mini LEDRGB sub-display units are separated by a vertical partition 12, and the two chips in the previous Mini LEDRGB sub-display unit close to the vertical partition 12 and the one chip in the adjacent next Mini LEDRGB sub-display unit close to the vertical partition 12 constitute an RGB pixel, or the one chip in the previous Mini LEDRGB sub-display unit close to the vertical partition 12 and the two chips in the adjacent next Mini LEDRGB sub-display unit close to the vertical partition 12 constitute an RGB pixel, and the R chip 3, G chip 4 and B chip 5 constituting the RGB pixel are arranged in a triangle. Similarly, the vertical partition 12 can be another side wall of the shell 1, or it can be a separately provided component, and if the vertical partition 12 is one of the side walls of the shell 1, the vertical side walls of the overlapping parts of the shell 1 of the two adjacent Mini LEDRGB sub-display units can be eliminated, that is, the two adjacent Mini LEDRGB sub-display units can be separated by a light isolation structure.

[0046] For details, see Figures 5 to 7The sub-cavities formed by the separation are respectively the first sub-cavity 13, the second sub-cavity 14 and the third sub-cavity 15, the R chip 3, the G chip 4 and the B chip 5 are respectively located in any one of the three sub-cavities, and the arrangement of the chips in the integrated display unit is described by taking the G chip 4 located in the first sub-cavity 13, the R chip 3 located in the second sub-cavity 14, and the B chip 5 located in the third sub-cavity 15 as an example, see Figure 5 , in the same column, the two-by-two lines of the G chip 4, R chip 3 and B chip 5 in the Mini LEDRGB sub-display unit in the first row form an isosceles triangle, the two-by-two lines of the G chip 4, R chip 3 and B chip 5 in the Mini LEDRGB sub-display unit in the second row also form an isosceles triangle, the two-by-two lines of the R chip 3 and B chip 5 in the Mini LEDRGB sub-display unit in the first row and the G chip 4 in the Mini LEDRGB sub-display unit in the second row also form a triangle, preferably, the formed triangle is also an isosceles triangle, the arrangement form of the G chip 4, R chip 3 and B chip 5 in the Mini LEDRGB sub-display unit in the third row is the same as that in the first row, the arrangement form of the G chip 4, R chip 3 and B chip 5 in the Mini LEDRGB sub-display unit in the fourth row is the same as that in the second row, and so on;

[0047] See also Figure 6 In the same row, the lines connecting the G chip 4, R chip 3 and B chip 5 in the Mini LED RGB sub-display unit in the first column form an isosceles triangle, the lines connecting the G chip 4, R chip 3 and B chip 5 in the Mini LED RGB sub-display unit in the second column also form an isosceles triangle, the lines connecting the B chip 5 in the Mini LED RGB sub-display unit in the first row and the first column and the G chip 4 and R chip 3 in the Mini LED RGB sub-display unit in the first row and the second column also form a triangle. Preferably, the formed triangle is also an isosceles triangle.

[0048] In the four Mini LED RGB sub-display units in two adjacent rows and two adjacent columns, the G chip, R chip and B chip that are close to each other also form a triangle. Preferably, the formed triangle is also an isosceles triangle.

[0049] See also Figure 7, the two-way connection of the B chip 5 in the first row and first column, the R chip 3 in the first row and second column, and the G chip 4 in the second row and first column also form a triangle, preferably, the triangles formed are all isosceles triangles; the two-way connection of the R chip 3 in the first row and second column, the G chip 4 in the second row and first column, and the B chip 5 in the second row and second column also form a triangle, preferably, the triangles formed are all isosceles triangles. The arrangement of the G chip 4, R chip 3, and B chip 5 in the Mini LED RGB sub-display unit in the first column is the same as the arrangement of the G chip 4, R chip 3, and B chip 5 in the Mini LED RGB sub-display unit in the second column, and so on.

[0050] The heights of the first sub-light-isolating plate 7, the second sub-light-isolating plate 8 and the third sub-light-isolating plate 9 are consistent, collectively referred to as the height H4 of the light-isolating plate. The maximum height of the lead 6 used to connect the chip and the electrode plate 2 is H5, that is, H5 is the maximum value of the height of the lead 6 connecting the B chip and the electrode plate 2, the height of the lead 6 connecting the G chip and the electrode plate 2, and the height of the lead 6 connecting the R chip and the electrode plate 2. The minimum height of the side wall of the shell 1 is H6, that is, H6 is the lowest height value of the four side walls constituting the shell 1, and H4<H5 <H6, and the starting and ending positions of the height of the light-isolating plate, the lead 6, and the side wall of the shell 1 are all from the top surface of the electrode plate 2 to the top surface of the component, and the top surface of the packaging glue 26 used to encapsulate the integrated display unit is flush with the top surface of the lowest side wall in the shell 1, so that the packaging glue 26 will not overflow from the shell 1. The chip can be cured and protected through packaging, thereby improving the production quality of the display unit. As a preferred embodiment of the present application, the heights of the four side walls that make up the shell 1 are consistent, and the packaging glue 26 is made of epoxy resin glue with a dispersion agent added.

[0051] The electrode plate 2 is in the shape of a long strip, and a plurality of electrode plates 2 are arranged in an array to form a total electrode plate 16 of the integrated display unit. The arrangement pattern of the electrode plate 2 corresponds to the arrangement pattern of the R chip 3, G and B chips 5, so that the R chip 3, G and B chips 5 of the integrated display unit are powered by the electrode plate 2.

[0052] To match Figures 5 to 7 The integrated display unit shown, such as Fig. 9As shown, taking the integrated display unit including four rows and two columns of Mini LED RGB sub-display units as an example, the structure of the total electrode plate 16 is explained. The total electrode plate 16 is also composed of an array structure of rows and columns, including a first row electrode plate 17, a second row electrode plate 18, a third row electrode plate 19, a fourth row electrode plate 20, a fifth row electrode plate 21, a sixth row electrode plate 22, a seventh row electrode plate 23 and an eighth row electrode plate 24, wherein the first row electrode plate 17, the third row electrode plate 19, the fifth row electrode plate 21 and the seventh row electrode plate 23 are disconnected structures, that is, an electrode plate is not connected from left to right, and at least two electrode plates are required to be arranged in the same row. In this embodiment, four electrode plates are arranged in the first row, and two electrode plates are arranged in the third row, the fifth row and the seventh row respectively. The first row electrode plate 17, the third row electrode plate 19, the fifth row electrode plate 21 and the seventh row electrode plate 23 correspond to Figures 5 to 7 The electrodes of the G chip 4 are connected. The second row of electrode plates 18, the fourth row of electrode plates 20, the sixth row of electrode plates 22 and the eighth row of electrode plates 24 are through-type, that is, one electrode plate is through-type from left to right. The second row of electrode plates 18, the fourth row of electrode plates 20, the sixth row of electrode plates 22 and the eighth row of electrode plates 24 correspond to Figures 5 to 7 The electrodes of the R chip and the B chip are connected. Of course, if the electrode of the G chip 4 is set as the positive electrode, the first row electrode plate 17, the third row electrode plate 19, the fifth row electrode plate 21 and the seventh row electrode plate 23 are the electrical connection paths of the positive electrode, and the remaining second row electrode plate 18, the fourth row electrode plate 20, the sixth row electrode plate 22, the eighth row electrode plate 24 and the surrounding electrode connection pins 25 are the negative electrode connection electrode plates (i.e., the negative electrode electrical connection paths). This row and column design of the grid electrode plate not only meets Figures 5 to 7 The arrangement pattern of the integrated display unit shown can achieve good integration while ensuring more electrode connection pins 25. In this embodiment, at least 18 electrode connection pins 25 can be arranged on the grid electrode plate.

[0053] Among them, a total electrode plate 16 in a grid-like form is punched out through a metal substrate, the metal substrate is a copper sheet, the circuit part connected to the lead 6 is silver-plated, and an electrode connecting pin 25 is arranged on the electrode plate constituting the edge part of the total electrode plate 16; the shell 1, the first sub-light-isolating plate 7, the second sub-light-isolating plate 8, the third sub-light-isolating plate 9 and the electrode plate injection molding 10 are formed by simultaneously injecting the upper and lower parts of the total electrode plate 16, wherein the material of the shell 1, the first sub-light-isolating plate 7, the second sub-light-isolating plate 8, the third sub-light-isolating plate 9 and the electrode plate injection molding 10 is a polymer high-temperature resistant material, preferably an opaque black PPA; the R chip 3 is glued with conductive silver glue, and the B chip 5 and the G chip 4 are glued with insulating glue. The positive electrode leads 6 of the B chip 5 and the G chip 4 are welded to the electrical connection area of ​​the same electrode plate as the positive electrode of the R chip 3 by an ultrasonic gold wire bonding machine, and serve as the common row electrode leads of the R chip 3, the G chip 4, and the B chip 5 in the row; the negative electrode leads of the R chip 3, the G chip 4, and the B chip 5 in the same column are bonded to the electrode sheet of the chip in the same column, and serve as the independent negative electrode leads of the monochrome R chip 3, the G chip 4, and the B chip 5 in the column; as an extension, the present invention can also select any single or two flip-chip chip groups of LED flip-chip chips or RGB three-color chips as RGB pixels; the flip-chip chip electrodes are directly fixedly welded on two adjacent electrode plates to serve as the positive and negative electrode leads of the chip;

[0054] In this embodiment, preferably, R chip 3, G chip 4, and B chip 5 are upright chips, and the electrode leads of R chip 3, G chip 4, and B chip 5 are gold wire bonding; preferably, the positive electrodes of R chip 3, G chip 4, and B chip 5 are shared as row lines; and the negative electrode leads of R chip 3, G chip 4, and B chip 5 are column leads.

[0055] It should be noted that, for those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, so it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the present invention, and any figure mark in the claims should not be regarded as limiting the claims involved.

Claims

1. A Mini LED RGB sub-display unit, characterized in that: It includes an RGB pixel, a housing surrounding the RGB pixel, an electrode plate electrically connected to the chip constituting the RGB pixel, and a light-isolating plate for blocking lateral light emitted by each chip constituting the RGB pixel; The electrode plate is fixedly connected to the shell, and the electrode plate covers one of the openings of the shell to enclose a cavity for placing the RGB pixels together with the shell, and the RGB pixels include an R chip, a G chip and a B chip arranged in a triangle; The light-isolating plate is placed in the cavity, and the light-isolating plate includes a first sub-light-isolating plate, a second sub-light-isolating plate and a third sub-light-isolating plate. The first sub-light-isolating plate, the second sub-light-isolating plate and the third sub-light-isolating plate divide the cavity into three sub-cavities, and a chip is placed in each of the sub-cavities; the length directions of the first sub-light-isolating plate, the second sub-light-isolating plate and the third sub-light-isolating plate all intersect with the lateral light emitted by the chip, and the length directions of the first sub-light-isolating plate, the second sub-light-isolating plate and the third sub-light-isolating plate are located in the same plane; the portion of the first sub-light-isolating plate away from the side wall of the shell is seamlessly connected to the second sub-light-isolating plate and the third sub-light-isolating plate respectively, and at least one of the first sub-light-isolating plate, the second sub-light-isolating plate and the third sub-light-isolating plate has an end close to the side wall of the shell and is not connected to the shell, so as to connect the two adjacent sub-cavities, and the lateral light emitted by the chip in the two interconnected sub-cavities is not directly emitted to the other sub-cavity connected thereto, and the end of the remaining sub-light-isolating plate close to the side wall of the shell is seamlessly connected to the shell; The height of the sub-light-isolating plate is H1, and the heights of the chips in the two sub-cavities separated by it are H2 and H3 respectively, and H1 is not less than the maximum value of H2 and H3.

2. The Mini LED RGB sub-display unit according to claim 1, characterized in that: The sub-light-isolating plate located between the two interconnected sub-chambers can completely block the lateral light emitted by the chips located in the two sub-chambers.

3. The Mini LED RGB sub-display unit according to claim 2, characterized in that: The connecting lines of the R chip, the G chip and the B chip form an isosceles triangle.

4. The Mini LED RGB sub-display unit according to any one of claims 1 to 3, characterized in that: The shell is a light-proof plastic shell.

5. The Mini LED RGB sub-display unit according to claim 4, characterized in that: A light-proof electrode plate injection molding is provided on the side of the electrode plate facing away from the light-isolating plate.

6. The Mini LED RGB sub-display unit according to claim 5, characterized in that: The shell and the electrode plate, the electrode plate and the electrode plate injection molding, the light-isolating plate and the shell, and the light-isolating plate and the electrode plate are all connected by injection molding.

7. An integrated display unit, characterized in that: Comprising a plurality of MiniLEDRGB sub-display units according to any one of claims 1 to 6, wherein the plurality of MiniLEDRGB sub-display units are arranged in sequence to form an integrated display unit arranged in an array, wherein two adjacent MiniLEDRGB sub-display units in the same column are separated by a transverse partition, and two chips close to the transverse partition in the previous MiniLEDRGB sub-display unit and one chip close to the transverse partition in the next adjacent MiniLEDRGB sub-display unit constitute an RGB pixel, or one chip close to the transverse partition in the previous MiniLEDRGB sub-display unit and two chips close to the transverse partition in the next adjacent MiniLEDRGB sub-display unit constitute an RGB pixel, and the R chip, the G chip and the B chip constituting the RGB pixel are arranged in a triangle; In the same row, two adjacent Mini LED RGB sub-display units are separated by a vertical partition, and the two chips in the previous Mini LED RGB sub-display unit close to the vertical partition and the one chip in the adjacent next Mini LED RGB sub-display unit close to the vertical partition constitute an RGB pixel, or the one chip in the previous Mini LED RGB sub-display unit close to the vertical partition and the two chips in the adjacent next Mini LED RGB sub-display unit close to the vertical partition constitute an RGB pixel, and the R chip, the G chip and the B chip constituting the RGB pixel are arranged in a triangle.

8. The integrated display unit according to claim 7, characterized in that: In an RGB pixel formed by chips in adjacent rows or columns, the lines connecting two chips form an isosceles triangle.

9. The integrated display unit according to claim 8, characterized in that: The height of the light-isolating plate is H4, the height of the lead for connecting the chip and the electrode plate is H5, the height of the shell is H6, H4<H5<H6, and the top surface of the packaging glue for packaging the integrated display unit is flush with the top surface of the shell.

10. The integrated display unit according to claim 9, characterized in that: The electrode plate is in the shape of a long strip, and a plurality of the electrode plates are arranged in an array to form a total electrode plate of the integrated display unit, and the arrangement pattern of the electrode plates corresponds to the arrangement pattern of the R chip, the G chip, and the B chip.

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